Intel

10M02DCV36C7G - 2K Logic Elements FPGA | Intel | Embedded Control

料号: 10M02DCV36C7G ✓ 量产中
有现货 1-3 个工作日内发货
1.2 V Vdss 36-WFBGA, WLCSP Package 110,592 bits Memory
低至 $2.34 USD / 件
最小起订量: 1 |
价格更新于: 2026-09-05
批量定价
数量 单价 小计
1 $4.578 $4.58
10 $4.12 $41.20
100 $3.65 $365.00
500 $3.18 $1,590.00
1,000 $2.71 $2,710.00
3,000 $2.34 $7,020.00
ℹ️ 所有价格均以 USD 计价

10M02DCV36C7G 概述

Intel 10M02DCV36C7G is a non-volatile MAX 10 field-programmable gate array with 2,000 logic elements, 27 I/O pins, and a 36-ball WLCSP package. Verified distributor listings identify 110,592 bits of embedded memory, a 1.2 V operating voltage, and 55 nm process technology. The device belongs to the programmable-logic hierarchy of FPGA, programmable logic device, semiconductor, and configurable digital integrated circuit. A field-programmable gate array combines programmable logic blocks, routing resources, embedded memory, and user-defined I/O so engineers can implement control, interface, timing, and state-machine functions without a custom application-specific integrated circuit.

The MAX 10 family is intended to support compact embedded systems where hardware flexibility, rapid design iteration, and non-volatile configuration are useful. The target's 27 available I/O pins can connect digital sensors, control signals, communications interfaces, and application processors. Its embedded memory capacity of 110,592 bits supports moderate buffering, lookup-table storage, and small data or control stores. The 36-WLCSP footprint makes it suitable for space-constrained boards, although assembly and PCB routing require careful consideration of the fine-pitch ball grid.

The verified data identifies 2,000 logic elements, 27 I/O, 110,592 embedded memory bits, 55 nm technology, and 1.2 V operation. These parameters define a small FPGA suitable for glue logic, interface translation, configurable timing, and distributed control. Compared with a fixed-function controller, the FPGA can change logic behavior after PCB fabrication. Compared with a larger FPGA, the 2,000-element device is constrained by limited logic and memory capacity, so designers should estimate resource utilization before committing to the part.

The device's non-volatile FPGA configuration is particularly relevant in systems that must retain behavior after power is removed. Typical designs can use the FPGA for sensor aggregation, motor or actuator control sequencing, legacy bus adaptation, or custom peripheral bridging. The 1.2 V supply requirement must be satisfied by the board power architecture, while the WLCSP package requires controlled thermal, assembly, and signal-integrity design. The verified sources do not provide a complete pinout, operating-temperature range, configuration details, or absolute electrical limits, so those values require datasheet confirmation before production design.

Practical applications include industrial control, embedded vision interfaces, robotics, test equipment, and portable electronics. A production design should validate the selected package against the PCB land pattern, confirm configuration and clocking requirements, and verify all supply, I/O, and timing limits in the manufacturer documentation. This page combines verified distributor specifications, pricing references, package-aware alternatives, and engineering considerations to help procurement and design teams assess 10M02DCV36C7G.

直接替换替代料: 10M02DCV36C7G ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: 10M02DCV36C7G (相同外形与封装尺寸) ——差异在于 Configuration Memory, Package, Mounting Type, Logic Elements (LE), User I/O Count.

Intel
Logic Elements (LE): 2,000
User I/O Count: 160
对比 10M02DCV36C7G →
Intel
Configuration Memory: On-chip dual-boot flash
Package: 324-ball UBGA (U324)
User I/O Count: 160
对比 10M02DCV36C7G →
Intel
Configuration Memory: Internal flash (non-volatile, on-die)
Package: 36-UFBGA WLCSP
Logic Elements (LE): 2,000
对比 10M02DCV36C7G →
Altera
Configuration Memory: On-chip dual-configuration flash, instant-on
Mounting Type: Surface Mount (WLCSP - requires underfill)
Logic Elements (LE): 8000
对比 10M02DCV36C7G →

快速对比工具——选择替代料号进行并排对比:

10M02DCU324I7G

✅ 直接替换
Intel
📦 UBGA-324
MAX 10 · 2,000 · 16 · 110,592 · 16 · 160 · 8 · 324-ball UBGA (U324)

✓ 有现货

$1.55 / 个

查看数据手册 →

10M02DCU324A7G

✅ 直接替换
Intel
📦 UBGA-324
MAX 10 · 2,000 · 110,592 bits · 160 · 16 · Integrated (on-chip flash configuration)

✓ 有现货

$6.3 / 个

查看数据手册 →

10M50SCE144C8G

✅ 直接替换
📦 EQFP-144
Same MAX 10 family but 3,125 LABs/CLBs versus 125 LABs/CLBs, with a 144-pin package versus 36-WFBGA WLCSP; same-family candidate is not footprint-compatible.

📋 参考替代料(不在目录中)

10M02DCV36C7G 最大额定值与电气特性

Device Type Non-volatile field-programmable gate array
Series MAX 10
Logic Elements 2,000
I/O Pins 27
Embedded Memory 110,592 bits
Operating Voltage 1.2 V
Process Technology 55 nm
封装 36-WFBGA, WLCSP
安装类型 Surface Mount
FPGA Configuration Non-volatile
Logic Architecture Field-programmable gate array
Product Category Embedded FPGA
Package Pin Count 36 balls

10M02DCV36C7G 36 balls 引脚配置指南

10M02DCV36C7G(36 balls 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

10M02DCV36C7G 的 36 balls 封装引脚图

暂无详细引脚数据: 10M02DCV36C7G.

请参阅 数据手册 以查看完整引脚配置。

典型应用

10M02DCV36C7G 适用于 6 应用s: Industrial Control Logic, Embedded Sensor Aggregation, Robotics Motion and I/O Sequencing, Portable Embedded Controller, Legacy Interface Bridge, Test and Measurement Fixture.

🏭

Industrial Control Logic

The Intel 10M02DCV36C7G fits industrial control logic that needs configurable sequencing, signal conditioning, and deterministic digital behavior in a compact footprint. Its 2,000 logic elements and 27 I/O pins provide enough resources for state machines, sensor-interface glue, actuator timing, and control-panel signal routing. The 1.2 V operating value should be incorporated into the board power tree, while the 36-WFBGA WLCSP package supports space-constrained control boards. Because the supplied data does not provide an operating-temperature range, qualification status, or complete timing limits, production use requires manufacturer datasheet validation. The FPGA can also isolate firmware from hardware timing changes and allow late control-logic revisions without a new PCB spin.

🧩

Embedded Sensor Aggregation

10M02DCV36C7G can aggregate multiple slow or medium-speed digital sensor signals before data reaches an application processor or communications controller. The 27 I/O count is useful for combining chip-select, interrupt, enable, clock, and data-routing functions, while the 110,592-bit embedded memory can support small lookup tables, buffers, and control records. Its non-volatile FPGA behavior is advantageous when the system must restore deterministic interface logic immediately after power-up. The 55 nm process and 1.2 V operating value are headline device characteristics, not full electrical guarantees. Validate I/O standards, clock rates, pin assignments, configuration, and the WLCSP assembly process from the manufacturer documentation before releasing the sensor interface to production.

🤖

Robotics Motion and I/O Sequencing

The 10M02DCV36C7G is well suited to robotics modules that need repeatable pulse generation, limit-switch handling, motor-enable sequencing, and synchronization between sensors and controllers. Its 2,000 logic elements can implement counters, pulse-width control, protocol framing, and safety interlocks, while 27 I/O pins support several peripheral functions. The non-volatile configuration allows the module to start with known hardware logic after every reset. The 36-WFBGA WLCSP package is compact but makes fan-out, via escape, inspection, and rework important PCB-layout considerations. The supplied data does not verify industrial temperature operation, timing margins, or absolute maximum ratings, so those details are [DATA_NEEDED: industrial and timing specifications] for a motor or robotics design.

📱

Portable Embedded Controller

10M02DCV36C7G can provide reconfigurable power-management sequencing, user-interface scanning, peripheral arbitration, and low-speed communications in portable equipment. The 1.2 V operating value and 2,000 logic elements are appropriate for compact controllers that need hardware timing without a large programmable-logic device. The 27 available I/O pins can coordinate buttons, displays, sensors, wireless modules, and power-enable signals. The non-volatile FPGA configuration is useful in battery-powered products because the system can recover deterministic logic after power restoration. The verified data does not include power-consumption, sleep, thermal, or operating-temperature specifications, so battery-life and thermal claims require [DATA_NEEDED: power and thermal limits] from the manufacturer documentation.

🌐

Legacy Interface Bridge

The Intel 10M02DCV36C7G is useful for bridging legacy controllers, parallel buses, custom timing interfaces, and modern processors when protocol changes would otherwise require a new board. Its 2,000 logic elements can implement address decoding, data formatting, handshaking, clock-domain adaptation, and small FIFOs using the 110,592 embedded memory bits. The 27 I/O count supports a practical number of bus and control signals in a small design. Non-volatile configuration lets the bridge retain its interface personality across power cycles. The 36-WFBGA WLCSP package requires a verified land pattern and careful escape routing. Confirm signal-integrity, timing, voltage, and pinout data in the manufacturer documentation because those implementation details are not included in the supplied search snippets.

🔧

Test and Measurement Fixture

10M02DCV36C7G can implement programmable stimulus, capture sequencing, measurement timing, and device-under-test interface control in compact test fixtures. The 2,000 logic elements and 27 I/O pins support counters, pulse generators, pattern generators, relay drivers, and trigger routing. Embedded memory of 110,592 bits can hold test patterns, calibration tables, or small captured records. The FPGA's non-volatile nature allows a fixture to boot into a known test personality without an external configuration download, while firmware can still be updated during development. The 1.2 V operating requirement must be included in the fixture supply design, and the WLCSP package requires controlled assembly. Timing accuracy, I/O limits, and measurement calibration remain [DATA_NEEDED: test and measurement limits] until confirmed from the official datasheet.

推荐产品汇总

10M02DCU324I7G Intel 用于: Industrial Control Logic, Embedded Sensor Aggregation, Portable Embedded Controller, Legacy Interface Bridge 10M02DCU324A7G Intel 用于: Industrial Control Logic, Robotics Motion and I/O Sequencing, Portable Embedded Controller, Test and Measurement Fixture 10M50SCE144C8G Higher-capacity Intel MAX 10 family reference device 用于: Embedded Sensor Aggregation, Robotics Motion and I/O Sequencing, Legacy Interface Bridge, Test and Measurement Fixture
What is 10M02DCV36C7G?
10M02DCV36C7G is an Intel MAX 10 non-volatile FPGA with 2,000 logic elements, 27 I/O pins, and 110,592 bits of embedded memory. According to the verified distributor listings, it is a 36-WFBGA WLCSP device. It can implement configurable digital control, interface, timing, and state-machine logic, with the benefit of hardware behavior that can be revised after the PCB has been manufactured.
What are the key specifications of 10M02DCV36C7G?
The key specifications are 2,000 logic elements, 27 I/O, 110,592 embedded memory bits, a 1.2 V operating voltage, 55 nm process technology, and a 36-WFBGA WLCSP package. The verified DigiKey and Mouser listings identify the part as a non-volatile MAX 10 FPGA. Production designs should still confirm the complete electrical, timing, configuration, and environmental limits in the manufacturer datasheet.
Where can I buy 10M02DCV36C7G online?
10M02DCV36C7G can be sourced through the verified distributor pages for DigiKey, Mouser, Arrow, Octopart, Lisleapex, and other listed suppliers. The verified data states that DigiKey lists the part as shipping today, but current stock, authorized-channel status, and pricing should be reconfirmed at order time. The latest pricing reference available in the supplied data is $4.57800 as of 2026-09-05.
What is the price of 10M02DCV36C7G?
The supplied verified data lists a price of $4.57800 for 10M02DCV36C7G. Pricing is quantity, distributor, and availability dependent, so the $4.57800 value is a reference rather than a guaranteed quotation. Procurement teams should compare current distributor inventory and obtain a volume quote before approving a production BOM. This price reference is as of 2026-09-05.
Is 10M02DCV36C7G in stock?
The verified DigiKey result states Buy now, ships today, while the supplied search data also reports a price of $4.57800 and 800 units in stock from one result. Stock quantities and availability can change rapidly and may differ by distributor. Buyers should check the current listing, packaging quantity, and authorized-distributor status before placing a purchase order.
What is the lead time for 10M02DCV36C7G?
The supplied data does not provide a guaranteed lead time for 10M02DCV36C7G. One verified distributor listing says Buy now, ships today, but that statement is time-sensitive and does not establish a contractual delivery commitment. For production planning, request a current quote, confirm allocated inventory, and ask the distributor for an explicit shipment date. Lead time must be treated as [DATA_NEEDED: current lead time] until confirmed.
What package does 10M02DCV36C7G use?
10M02DCV36C7G uses a 36-WFBGA WLCSP package according to the verified DigiKey and Mouser listings. The package is a 36-ball surface-mount device and should be checked against the exact PCB land pattern before assembly. Because the supplied data does not include a complete public pinout, engineers should use the manufacturer package drawing and datasheet for ball numbering and pin assignments.
What is the difference between 10M02DCV36C7G and 10M50SCE144C8G?
10M02DCV36C7G and 10M50SCE144C8G are both listed in the MAX 10 family, but they are not verified drop-in replacements. The supplied comparison result identifies 10M02DCV36C7G with 125 LABs/CLBs and 2,000 logic elements, while 10M50SCE144C8G has 3,125 LABs/CLBs and is listed with a different 144-pin package. The difference in capacity and package makes a same-footprint replacement claim unsafe without further manufacturer verification.
Can 10M50SCE144C8G replace 10M02DCV36C7G?
10M50SCE144C8G should not be treated as a confirmed drop-in replacement for 10M02DCV36C7G. The supplied comparison search lists 10M50SCE144C8G in the same MAX 10 family but identifies 3,125 LABs/CLBs compared with 125 for 10M02DCV36C7G, and the package designation also differs. A replacement would require package, pinout, power, configuration, and PCB-layout validation. Use a redesign-level alternative until a manufacturer cross-reference confirms equivalence.
When should I choose 10M02DCV36C7G over a larger FPGA?
Choose 10M02DCV36C7G when the design needs modest programmable logic, low pin count, and a compact 36-WFBGA WLCSP package. Its 2,000 logic elements and 110,592 bits of embedded memory are appropriate for control logic, interface adaptation, timing functions, and small state machines. Choose a larger FPGA when the design requires substantially more logic, memory, high-speed transceivers, or more I/O than this device can provide.
Is 10M02DCV36C7G suitable for industrial control?
Yes, 10M02DCV36C7G is suitable for many industrial-control functions that fit within 2,000 logic elements and 27 I/O pins. It can implement configurable sequencing, sensor-interface logic, control-state machines, and protocol adaptation. The supplied data does not verify an operating-temperature range, electrical absolute maximum ratings, or industrial qualification, so the manufacturer datasheet and applicable environmental requirements must be checked before deployment.
What should I check before designing with 10M02DCV36C7G?
Before design-in, verify the complete datasheet pinout, ball numbering, 1.2 V supply requirements, configuration method, clocking limits, I/O electrical characteristics, timing constraints, and package dimensions. Confirm that the 36-WFBGA WLCSP land pattern is available from the manufacturer and compatible with the assembly process. The supplied data does not provide those complete implementation details, so they remain [DATA_NEEDED: full datasheet implementation limits].
Where can I download the 10M02DCV36C7G datasheet PDF?
The 10M02DCV36C7G datasheet PDF can be accessed through the verified datasheet result at https://www.datasheets.com/intel/10m02dcv36c7g and the distributor datasheet links listed on the DigiKey and Mouser pages. The supplied web data does not state a verified manufacturer document number, revision letter, or page count, so the manufacturer datasheet should be used as the controlling document. Always compare the MPN and package suffix before downloading.
Where can I find the 10M02DCV36C7G pinout?
The 10M02DCV36C7G pinout is not fully published in the supplied verified snippets, so pinout details are [DATA_NEEDED: complete package pinout]. The available results identify a 36-WFBGA WLCSP package but do not provide ball assignments. Use the official package drawing and manufacturer datasheet, and do not infer ball functions from the board design or distributor product title.
What is the best cross-brand equivalent for 10M02DCV36C7G?
No verified cross-brand drop-in equivalent for 10M02DCV36C7G is identified in the supplied cross-reference data. The search results include comparison tools and a comparison with 10M50SCE144C8G, but they do not establish a same-package, pin-compatible substitute. A cross-brand replacement should only be selected after confirming the FPGA family, logic architecture, package, ball map, configuration interface, voltage, and design-software compatibility.
Is 10M02DCV36C7G the same as another 10M02 FPGA?
10M02DCV36C7G is not automatically interchangeable with every 10M02 device. The verified listing identifies this exact MPN as a 2,000-logic-element, 27-I/O, 36-WFBGA WLCSP FPGA operating at 1.2 V. Other 10M02 package or speed-grade variants may use different packages, pin counts, or electrical characteristics. Confirm the exact ordering code, package suffix, and manufacturer cross-reference before substitution.
What tools are needed to program 10M02DCV36C7G?
A production design using 10M02DCV36C7G requires a compatible Intel FPGA design and configuration flow, but the exact tool versions and supported device support level are not specified in the supplied data. Engineers should use the current Intel FPGA toolchain and validate synthesis, place-and-route, simulation, timing, and configuration support for the exact MPN. Tool compatibility should be confirmed with current Intel device-support documentation.
How should 10M02DCV36C7G be handled during PCB assembly?
Handle 10M02DCV36C7G as a fine-pitch 36-ball WLCSP device and follow the official package drawing, land pattern, moisture-sensitivity procedure, reflow profile, and ESD controls. The supplied data confirms the WLCSP package but does not provide assembly recommendations, MSL classification, thermal limits, or reflow conditions. Those values are [DATA_NEEDED: assembly and reliability specifications] and should be obtained from the manufacturer documentation.
What are the thermal considerations for 10M02DCV36C7G?
The supplied data confirms a 55 nm process, 1.2 V operation, and a 36-WFBGA WLCSP package, but it does not provide power dissipation, thermal resistance, or junction-temperature limits. Thermal analysis should therefore be treated as [DATA_NEEDED: power and thermal limits] until the datasheet is reviewed. Estimate power only after the design utilization and switching activity are known, then validate the result with the manufacturer's recommended thermal procedure.
What is the lifecycle status of 10M02DCV36C7G?
The supplied cross-reference result lists 10M02DCV36C7G as active, and the verified distributor results show current product pages and purchasing links. Lifecycle status can change, so the active designation should be reconfirmed with the manufacturer or authorized distributor before a long-lived production program. For regulated or safety-critical equipment, also confirm the applicable qualification, environmental, and change-notification requirements.
What is the embedded memory capacity of 10M02DCV36C7G?
10M02DCV36C7G provides 110,592 bits of embedded memory according to the verified DigiKey listing. This memory can support lookup tables, small buffers, state data, and control functions within a 2,000-logic-element FPGA. Available memory implementation, block structure, and usable capacity should be confirmed in the manufacturer datasheet and design tool because the supplied snippet does not specify those details.
What is the operating voltage of 10M02DCV36C7G?
The supplied verified data identifies 1.2 V as the operating voltage of 10M02DCV36C7G. This is a headline design value, not a substitute for the complete recommended operating conditions. The datasheet must be checked for voltage tolerances, rail sequencing, I/O-bank requirements, decoupling guidance, and absolute maximum ratings. Use the manufacturer power-supply and decoupling recommendations for the final schematic.

工程参考数据: 10M02DCV36C7G ——对比、设计指导和合规信息。

选型指南

Choose 10M02DCV36C7G for compact embedded designs that need 2,000 logic elements, 27 I/O pins, 110,592 embedded memory bits, non-volatile configuration, and a 36-WFBGA WLCSP package. It is appropriate for control sequencing, sensor aggregation, interface adaptation, test fixtures, and other moderate digital-logic tasks. Consider 10M02DCU324I7G or 10M02DCU324A7G only when a larger package and potentially different routing strategy are acceptable and their exact specifications are verified. Consider 10M50SCE144C8G for expanded MAX 10 logic capacity, but do not assume it is pin-compatible because the supplied comparison identifies 3,125 LABs/CLBs and a 144-pin package. No verified cross-brand drop-in equivalent was found. Validate the full pinout, timing, voltage, thermal, configuration, and assembly documentation before final selection.

与替代料对比

参数 本产品 10M02DCU324I7G 10M02DCU324A7G 10M50SCE144C8G
Brand Intel Intel Intel Intel
Package 36-WFBGA, WLCSP UBGA-324; not verified as same footprint UBGA-324; not verified as same footprint EQFP-144; not verified as same footprint
LABs/CLBs 125 125 125 3,125
Configuration Type Non-volatile Non-volatile family member Non-volatile family member MAX 10 family member
Drop-in Footprint 36-WFBGA WLCSP No package match verified No package match verified No package match verified

关键差异点

  • Compact non-volatile FPGA resource set (对比 10M50SCE144C8G)
  • Verified small-scale MAX 10 resource profile (对比 10M02DCU324I7G)
  • Low pin-count package for compact embedded designs (对比 10M02DCU324A7G)

设计说明

Use the 1.2 V operating value only as the starting point for the power design. Confirm the exact supply rails, tolerances, sequencing, decoupling network, and power-up behavior in the manufacturer documentation before schematic release. Keep high-current and high-speed paths away from the FPGA supply pins, and use local decoupling placed at the associated power-entry locations. The supplied data does not contain absolute maximum ratings or current requirements, so those values remain [DATA_NEEDED: complete power specifications].

The 36-WFBGA WLCSP package requires a verified land pattern, escape-routing strategy, and assembly-aware fan-out. Do not route a replacement footprint or infer ball assignments from the distributor title. Confirm ball numbering, orientation, power and ground connections, and neighboring-ball constraints using the official package drawing. Use controlled-impedance planning where required, minimize via transitions, and provide a continuous reference plane. The complete pinout and package dimensions are [DATA_NEEDED: package pinout and land pattern] in the supplied snippets.

The FPGA should be treated as a configurable high-speed digital load even when the implemented logic uses modest clock rates. Confirm supported I/O standards, output drive settings, input thresholds, clock routing, and timing constraints in the official toolchain and datasheet. Keep clock and fast single-ended traces short, provide a solid reference plane, and avoid unnecessary layer transitions. The supplied data does not include timing, I/O electrical, or signal-integrity limits, so those values are [DATA_NEEDED: timing and I/O electrical limits].

The supplied results establish 55 nm process technology and a compact 36-WFBGA WLCSP package but do not provide power dissipation, thermal resistance, or junction-temperature limits. Estimate total power only after synthesis, placement, utilization, toggle rate, and I/O loading are known, then compare the estimate with the manufacturer's maximum allowed values. Provide a continuous ground or power-reference structure and follow the recommended thermal layout. The actual thermal limits are [DATA_NEEDED: thermal specifications].

合规信息

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
无铅
Unknown
无卤
Unknown
冲突矿物
Unknown

The supplied verified data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Compliance values are therefore unknown rather than inferred. AEC-Q100 is not identified for this commercial programmable-logic listing.

数据核验日期: 2026-09-05 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

10M02DCV36C7G datasheet 10M02DCV36C7G Intel MAX 10 FPGA 2,000 logic element non-volatile FPGA 27 I/O 36-WFBGA WLCSP FPGA 10M02DCV36C7G industrial control 10M02DCV36C7G vs 10M50SCE144C8G 10M02DCV36C7G buy price 10M02DCV36C7G lead time 10M02DCV36C7G pinout WLCSP best drop-in replacement for 10M02DCV36C7G 10M02DCV36C7G 1.2 V 55 nm FPGA Hey Google what can replace 10M02DCV36C7G?

相关元器件 & 术语

Intel 10M02DCV36C7G MAX 10 FPGA field-programmable gate array programmable logic device semiconductor configurable digital integrated circuit 2,000 logic elements 27 I/O pins 110,592 embedded memory bits 1.2 V operating voltage 55 nm process technology 36-WFBGA WLCSP WLCSP package surface mount industrial control embedded sensor aggregation robotics test and measurement 10M02DCU324I7G 10M02DCU324A7G 10M50SCE144C8G LABs/CLBs non-volatile configuration
快速报价
填写完整信息——我们的销售团队将在 24 小时内回复
料号 制造商 封装 QTY 目标价 小计
合计: $0.00 USD
✓
报价已提交!

我们将在 24 小时内回复您的邮件

1
询价已提交
2
已收到报价
3
已下单
4
支付
5
已发货
6
已送达
查看询价详情