10CX220YF780E5G - Cyclone 10 GX 220K LE FPGA | Intel | F780
料号： 10CX220YF780E5G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $790 | $7,900.00 |
| 100 | $720 | $72,000.00 |
| 250 | $685 | $171,250.00 |
| 500 | $650 | $325,000.00 |
| 1,000 | $615 | $615,000.00 |
10CX220YF780E5G 概述
An FPGA is a reconfigurable digital integrated circuit that allows designers to implement arbitrary logic, DSP, memory, and high-speed serial interfaces by programming look-up tables, routing, and hardened IP blocks. The Cyclone 10 GX family sits in the Intel FPGA hierarchy below Arria 10 and Stratix 10, optimized for mid-range transceiver-rich designs such as industrial vision, broadcast, machine vision, and motor control. The 10CX220YF780E5G integrates transceivers that operate up to 12.5 Gbps, hardened PCI Express Gen2/Gen3 controllers, hardened memory controllers, and variable-precision DSP blocks.
Key features of the 10CX220YF780E5G include up to 12.5 Gbps transceiver data rates, integrated PCI Express Gen3 x4 hard IP, 156 18x19 multipliers for DSP, partial reconfiguration support, and a hardened memory controller subsystem supporting DDR3/DDR4/LPDDR3 external memory. Security features include bitstream encryption using AES-256, JTAG, and configuration via serial flash. The device supports both commercial (0C to 85C) and industrial (-40C to 100C) temperature grades; the E5G suffix denotes the commercial speed grade 5.
The 10CX220YF780E5G is typically deployed in industrial machine vision frame grabbers, broadcast video processing (SDI/HDMI bridges), motor control and drives, low-cost 10G Ethernet aggregation, and PCI Express add-in cards. Its combination of transceivers, DSP, and low power makes it well suited for cost-constrained designs that previously required mid-range FPGAs. Compared with the older Cyclone V and Cyclone IV families, the 10CX220YF780E5G offers up to 2x higher transceiver bandwidth and significantly higher logic density at comparable power.
When designing with this device, ensure Quartus Prime software support matches the device speed grade, plan power sequencing for the multiple supply rails (core, transceiver, I/O, auxiliary), and provide matched-impedance routing for high-speed serial links. The F780 package has a 29 mm x 29 mm body and requires a multilayer PCB with microvia or via-in-pad technology for reliable assembly.
直接替换替代料： 10CX220YF780E5G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10CX220YF780E5G （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Embedded Memory (bits), Logic Elements, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
10CX220YF780I5G
✅ 直接替换✓ 有现货
$1995 / 个
查看数据手册 →10CX220YF780E6G
✅ 直接替换✓ 有现货
$1720 / 个
查看数据手册 →10CX220YF780I6G
✅ 直接替换✓ 有现货
$121.83 / 个
查看数据手册 →10CX220YF780E7G
✅ 直接替换📋 参考替代料（不在目录中）
10CX150YF780E5G
✅ 直接替换✓ 有现货
$160 / 个
查看数据手册 →10CX105YF780E5G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$350 / 个
查看数据手册 →10CX220YF780E5G 最大额定值与电气特性
| Family | Cyclone 10 GX |
| Logic Elements | 220,000 |
| Embedded Memory Bits | 13,752,320 |
| 18x19 Multipliers | 156 |
| User I/O Pins | 284 |
| Transceiver Max Data Rate | 12.5 Gbps |
| Hard Memory Controllers | Yes (DDR3 / DDR4 / LPDDR3) |
| PCI Express Hard IP | PCIe Gen3 x4 |
| Process Technology | 20 nm |
| 封装 | 780-ball FCBGA (F780), 29 mm x 29 mm |
| Speed Grade | 5 (commercial, fast) |
| Temperature Grade | E (0C to +85C, commercial) |
| Configuration Method | Serial / Parallel flash, JTAG, AES-256 bitstream encryption |
| RoHS 状态 | Compliant |
10CX220YF780E5G 780-ball fcbga (f780), 29 mm x 29 mm 引脚配置指南
10CX220YF780E5G（780-ball fcbga (f780), 29 mm x 29 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10CX220YF780E5G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10CX220YF780E5G 适用于 6 应用s: Industrial Machine Vision Frame Grabber, Broadcast Video Processing (SDI / HDMI Bridges), PCI Express Add-in Card / Industrial I/O Board, Motor Control and Industrial Drive, Low-Cost 10 Gigabit Ethernet Aggregation, Test & Measurement Instrumentation Front-End.
Industrial Machine Vision Frame Grabber
The 10CX220YF780E5G suits machine vision frame grabbers where 220K logic elements accommodate CoaXPress, GigE Vision, or Camera Link aggregation pipelines, and the 12.5 Gbps transceivers carry serialized sensor data with low deterministic latency. Its hardened PCIe Gen3 x4 IP enables direct plug-in to host PCs at line rates above 3 GB/s, while the embedded memory (13.75 Mbits) provides line buffers for image preprocessing. The 284 user I/O pins expose multiple parallel sensor interfaces, GPIO for trigger and strobe lines, and DDR3/DDR4 controller outputs for high-capacity frame storage, all within the same F780 package footprint.
推荐
Broadcast Video Processing (SDI / HDMI Bridges)
For broadcast video routers and SDI-to-HDMI bridges, the 10CX220YF780E5G delivers up to 12.5 Gbps per lane to handle 12G-SDI and UHD HDMI 2.0 streams. Its 156 18x19 multipliers provide ample DSP capacity for color space conversion, scaling, and frame-rate conversion, while the hardened DDR4 controller maintains smooth buffering of 4K video. The commercial temperature grade (0C to 85C) and BGA package suit controlled-environment broadcast head-end equipment, and Quartus Prime IP cores simplify integration of SMPTE ST 2082 and HDMI transport layers.
推荐
PCI Express Add-in Card / Industrial I/O Board
The 10CX220YF780E5G's integrated PCIe Gen3 x4 hard IP enables cost-effective PCIe add-in cards for data acquisition, FPGA co-processing, and protocol offload. Its 220K LEs handle user logic, DMA engines, and protocol stacks such as 10 Gigabit Ethernet or CAN-FD aggregation, while the 12.5 Gbps transceivers support external SFP+ or QSFP modules. The F780 package's 284 user I/O pins route directly to high-density mezzanine connectors, and partial reconfiguration allows in-field firmware updates without disrupting PCIe link state.
推荐
Motor Control and Industrial Drive
Industrial servo drives and high-end motor controllers leverage the 10CX220YF780E5G's combination of fast transceivers for EtherCAT or SERCOS III fieldbuses, DSP blocks for field-oriented control (FOC) algorithms, and 284 I/O pins for encoder, resolver, and power-stage feedback. Hardened PCIe Gen3 simplifies integration with industrial PC controllers, while the commercial temperature range suits enclosed cabinet installations. Quartus Prime DSP Builder accelerates development of high-bandwidth current and torque loops running at sub-microsecond intervals.
推荐
Low-Cost 10 Gigabit Ethernet Aggregation
For top-of-rack or industrial aggregation switches, the 10CX220YF780E5G's transceivers natively support 10GBASE-R (10 Gigabit Ethernet), and its 220K LEs plus 13.75 Mbits of embedded memory handle MAC, PCS, and basic L2 switching. The hardened DDR4 controller supports large packet buffers, while PCIe Gen3 x4 uplinks to a host CPU or switch fabric ASIC. Compared with full ASIC solutions, this FPGA-based approach accelerates time-to-market for custom aggregation features and protocol extensions.
推荐
Test & Measurement Instrumentation Front-End
Test instruments such as protocol analyzers, BERT testers, and high-speed logic analyzers benefit from the 10CX220YF780E5G's reconfigurable logic and multi-gigabit transceivers. Engineers can implement custom serial protocol decoders (PCIe, USB 3.0, SATA) or parallel pattern generation using the FPGA's DSP and memory resources. The 284 user I/O pins expose dedicated probe interfaces, while the F780 BGA package with 1.0 mm pitch supports fine-pitch PCB layouts typical of high-bandwidth instrumentation front-ends.
推荐
推荐产品汇总
工程参考数据： 10CX220YF780E5G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10CX220YF780I5G | 10CX220YF780E6G | 10CX220YF780I6G | 10CX220YF780E7G | 10CX150YF780E5G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA (F780), 29 x 29 mm | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same |
| Logic Elements | 220,000 | 220,000 | 220,000 | 220,000 | 220,000 | 150,000 (-32%) |
| Speed Grade | 5 (fastest) | 5 (fastest) | 6 (slower) | 6 (slower) | 7 (slowest) | 5 (fastest) |
| Temperature Grade | E (Commercial 0C to 85C) | I (Industrial -40C to 100C) | E (Commercial) | I (Industrial) | E (Commercial) | E (Commercial) |
| Embedded Memory Bits | 13,752,320 | 13,752,320 | 13,752,320 | 13,752,320 | 13,752,320 | 9,500,000 approx (-31%) |
| Transceiver Max Data Rate | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps | 12.5 Gbps |
| PCI Express Hard IP | Gen3 x4 | Gen3 x4 | Gen3 x4 | Gen3 x4 | Gen3 x4 | Gen3 x4 |
| User I/O Pins | 284 | 284 | 284 | 284 | 284 | 284 |
关键差异点
- Industrial temperature grade variant available in same package （对比 10CX220YF780I5G)
- Slowest speed grade option for power-constrained designs （对比 10CX220YF780E7G)
- Higher-density logic in same F780 package （对比 10CX150YF780E5G)
- Integrated 12.5 Gbps transceivers absent in Cyclone 10 LP family （对比 10CL120YF780I7G)
设计说明
The 10CX220YF780E5G requires multiple power rails (core, transceiver PLLs, transceiver channels, I/O banks, auxiliary). Per Intel's Cyclone 10 GX power management user guide, designers must sequence the rails in the order specified to avoid latch-up. Typical core current at full utilization is approximately 3-5 A and a high-efficiency buck regulator with remote sensing is recommended. The transceiver supply (VCCR_GXB / VCCT_GXB) is sensitive to noise - place ferrite beads and bulk capacitors within 1 cm of the package balls.
In dense transceiver-rich designs, the 10CX220YF780E5G can dissipate 8-15 W. The F780 FCBGA package uses a heat-spreader lid; attach a heatsink with thermal interface material (TIM) or use a forced-air cooling solution. Estimated: at 12 W dissipation with theta_JA of approximately 12 C/W (with heatsink), junction-to-ambient rise is 144 C - verify against the device's maximum junction temperature (100C for commercial grade). Always perform thermal simulation with the actual PCB stack-up and airflow.
The F780 package has a 1.0 mm ball pitch and 29 mm x 29 mm body, requiring a multilayer PCB with microvia or stacked-via technology to fan out signal and power balls. All 780 balls are present even if some are unused - unused power balls must still be connected to their rails to maintain package coplanarity and current capacity. Matched-impedance routing (85 ohm differential for transceivers, 50 ohm single-ended for general I/O) must be verified with a 3D field solver.
Transceiver channels must be routed with controlled-impedance differential pairs, length matching within the budget specified in the Cyclone 10 GX transceiver user guide, and DC-blocking capacitors placed close to the package balls. AC-coupling capacitor selection must consider the transceiver's pre-emphasis and equalization capabilities. Use IBIS-AMI models from Intel for channel simulation, including crosstalk from adjacent aggressor traces.
A common pitfall is selecting the wrong speed grade: speed grade 5 is the fastest, while grade 7 is the slowest; mixing grades between prototypes and production may break timing closure. Another pitfall is ignoring configuration scheme selection - the device supports AS (active serial), PS (passive serial), JTAG, and fast passive parallel, each with different bitstream width and boot time implications. Always verify bitstream compatibility for revision changes with Quartus Prime.
合规信息
RoHS compliant and lead-free per Intel's Cyclone 10 GX material declarations. AEC-Q100 not applicable (industrial FPGAs are not automotive-qualified by default; Intel offers automotive-grade Cyclone 10 GX variants under separate part numbers). Verify halogen-free and REACH status against the latest Intel product declaration documents.
