10M50DCF672I7G
10M50DCF672I7G - MAX 10 FPGA, 50K LE, 672-FBGA | Intel
The Intel 10M50DCF672I7G is a non-volatile FPGA from the MAX® 10 family, integrating 50,000 logic elements, 1,677,312 bits of embedded SRAM, and 500 user I/Os in a 672-ball FineLine BGA package. Built on a low-power 55 nm process, it operates at a 1.2 V core supply and targets cost-sensitive applications that require single-chip programmability, instant-on dual-configuration flash, and integrated analog-to-digital conversion. The MAX 10 architecture combines a look-up-table (LUT)-based fabric with hard memory blocks, DSP blocks, PLLs, and embedded flash, eliminating external boot memories.
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic resources, routing, and I/O behavior are defined by user-supplied configuration data. FPGAs sit between fixed-function ASICs and microcontrollers in the design hierarchy: ASIC > FPGA > CPLD > microcontroller > DSP > standard logic, and are classified within programmable logic devices (PLDs). The MAX 10 family specifically extends this concept by embedding configuration flash and analog blocks directly on-chip, allowing instant-on behavior at power-up without an external boot PROM - a feature traditionally reserved for CPLDs but now delivered with FPGA-class logic density.
Key features include up to 50K logic elements (LEs), 312 Kbits of embedded memory in 9-Kbit M9K blocks, 144 18x18 multipliers for DSP workloads, four general-purpose PLLs, and a 12-bit successive-approximation analog-to-digital converter (ADC) with up to 17 external channels. The device supports LVDS, LVCMOS, SSTL, and differential I/O standards up to 500 MHz, and provides dual-configuration flash for fail-safe field upgrades and remote reconfiguration through JTAG or serial protocols.
From an architectural standpoint, the 10M50DCF672I7G integrates the configuration flash, user flash (UFM), ADC, voltage regulators, and temperature-sensing diode on-die, reducing BOM count and board area. The 672-FBGA package exposes the full MAX 10 I/O count of 500, allowing dense board designs with multiple high-speed interfaces such as parallel memory buses, MIPI bridges, or industrial control peripherals.
Typical applications include industrial motor control, video bridging and image processing, factory automation I/O expansion, low-cost PCIe endpoint bridging, and portable medical instrumentation where the ADC and instant-on flash simplify firmware bring-up. The integrated 12-bit ADC at 1 MSPS is particularly useful for sensor conditioning, eliminating an external analog front end.
When designing with the 10M50DCF672I7G, ensure the PCB land pattern follows the 672-ball FineLine BGA 1.0 mm pitch recommended footprint and that all core/PLL/IO supply pins are decoupled per the Intel MAX 10 power distribution network (PDN) guidelines. Use Intel Quartus Prime for synthesis, place-and-route, and bitstream generation; the device is supported in Quartus Prime Standard and Pro editions.
This page synthesizes distributor pricing, drop-in package-compatible alternatives from the MAX 10 family, and practical design considerations not found in the manufacturer datasheet alone.
USD $212.00
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