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产品（39,000+)

EP1SGX25FG672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Altera
EP1SGX25FG672C7

EP1SGX25FG672C7 - Stratix GX FPGA, 25K LE, 672-BGA | Altera

The Altera (now Intel) EP1SGX25FG672C7 is a member of the Stratix GX FPGA family, delivering approximately 25,660 logic elements and 1,944,576 RAM bits in a 672-pin FineLine BGA package with embedded transceivers for high-speed serial I/O. It combines a high-density SRAM-based programmable logic fabric with multi-gigabit transceivers, supporting protocols such as PCI Express, Serial RapidIO, Fibre Channel, and Gigabit Ethernet in a single chip. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic functionality is defined by user configuration rather than fixed at the factory. Stratix GX FPGAs sit at the top of Altera's high-performance hierarchy (Stratix GX -> Stratix series -> high-density FPGA -> programmable logic device -> integrated circuit), combining LUT-based fabric with embedded 18x18 multipliers, M4K/M-RAM memory blocks, PLLs, and hardened transceivers to accelerate both logic and serial-protocol workloads. Key features of the EP1SGX25FG672C7 include 455 user I/O pins, embedded 3.125 Gbps multi-gigabit transceivers, dedicated DSP blocks, four PLLs, and 25660 logic elements. The device is built on a 1.5 V core with 0.13-micron process technology, and the speed grade 7 indicates the slowest commercial speed bin. Its 672-pin FineLine BGA package offers high I/O density while keeping board-routing complexity manageable for prototyping and production. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Fibre Channel), baseband and channel-card processing in wireless infrastructure, medical imaging front-ends, and high-throughput storage and networking line cards. The integrated transceivers eliminate the need for external PHY chips in many designs, reducing BOM cost and board area. When designing with this FPGA, ensure your power-sequencing network follows the Stratix GX PowerPlay guidelines and that JTAG, MSEL configuration pins, and decoupling are placed per the pin-out guidelines. Confirm Quartus II version support for this device revision before starting firmware development.

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EP1SGX40CF1020I5 - Stratix GX FPGA, 41,250 LEs, 1020-BGA | Altera
EP1SGX40CF1020I5

EP1SGX40CF1020I5 - Stratix GX FPGA, 41,250 LEs, 1020-BGA | Altera

The Altera (now Intel) EP1SGX40CF1020I5 is a high-density Stratix GX FPGA from the first-generation Stratix family, integrating 41,250 logic elements and 4,125 Configurable Logic Blocks (CLBs) into a 1020-ball FineLine BGA package. It is built on a 1.5 V CMOS process with embedded transceiver and memory resources, targeting high-speed serial I/O and DSP-intensive applications. The device is rated for industrial temperature operation and is offered in the 33 mm x 33 mm, 1 mm pitch FBGA-1020 outline. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that allows engineers to implement custom digital logic, memory, DSP, and high-speed serial interfaces after PCB fabrication. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits (ICs). Unlike fixed-function ASICs, FPGAs are programmed via configuration bitstreams stored in SRAM, enabling rapid prototyping, field upgrades, and design iteration without respinning silicon. The Stratix GX sub-family specifically adds multi-gigabit transceivers for serial connectivity. Key features include high-speed embedded transceivers operating at up to 3.125 Gbps, dedicated DSP blocks for high-throughput signal processing, TriMatrix on-chip SRAM, support for multiple I/O standards (LVDS, SSTL, LVTTL), and PLLs for clock management. The fine-pitch BGA-1020 package exposes hundreds of user I/O pins and multiple dedicated high-speed serial links, enabling dense board layouts for telecom and datacom equipment. Architecturally, the EP1SGX40CF1020I5 uses SRAM-based look-up tables (LUTs) for combinational logic, embedded block RAM (BRAM), hardware multiplier blocks for DSP, and dedicated serializer/deserializer (SERDES) circuitry. This combination allows simultaneous implementation of packet processing, forward error correction, and high-speed backplane interfaces on a single device. Typical applications include 10 Gb Ethernet line cards, optical transport network (OTN) equipment, high-speed serial backplane aggregation, wireless baseband processing, broadcast video routing, and radar signal processing prototypes. The industrial temperature grade also suits outdoor telecom hardware and military/aerospace subsystems. When designing with this device, allocate sufficient PCB layers for power distribution and signal integrity, follow Altera's recommended decoupling guidelines, and use the Quartus II design suite (legacy 5.x/6.x) for synthesis and place-and-route. A JTAG header and configuration memory footprint should also be planned. This page synthesizes distributor inventory, same-family alternatives, and practical design notes not found in the original manufacturer datasheet, helping engineers evaluate the EP1SGX40CF1020I5 for both new designs and legacy system sustainment.

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EP1SGX40CF672C5 - 40K LE Stratix GX FPGA, 672-Pin BGA | Altera
EP1SGX40CF672C5

EP1SGX40CF672C5 - 40K LE Stratix GX FPGA, 672-Pin BGA | Altera

The Altera EP1SGX40CF672C5 is a high-density Stratix GX family FPGA integrating 41,250 equivalent logic elements (LEs), 3.42 Mbits of embedded RAM, and up to 20 full-duplex transceiver channels in a 672-pin FineLine BGA package. The device belongs to Altera's first-generation Stratix GX family, which combines a high-performance Stratix fabric with embedded multi-gigabit transceivers (MGTs), making it suited for high-bandwidth serial interconnect and protocol bridging applications. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect, all controlled by a user-defined configuration bitstream. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLDs), which are a class of digital ICs that sit between ASICs and general-purpose processors. Stratix GX parts specifically target high-speed serial I/O and are commonly used in telecom backplane, broadcast video, and storage area network designs where multi-gigabit transceivers replace parallel bus architectures. Key features of the EP1SGX40CF672C5 include 3.42 Mbits of TriMatrix embedded RAM, up to 20 transceiver channels supporting serial rates up to 3.125 Gbps, dedicated clock management with up to 12 PLLs, and 1.5V core operation. The 672-pin FineLine BGA package supports high pin density while preserving signal integrity for differential transceiver pairs. The C5 speed grade places this device in Altera's commercial temperature tier, with the device specified for 0C to +85C ambient operation. Technically, the EP1SGX40CF672C5 uses a 1.5V SRAM-based LUT architecture and is configured via an enhanced configuration device (EPC) or via JTAG. The 3.125 Gbps transceivers support standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI, and Fibre Channel. A 672-ball FineLine BGA delivers 484 user I/O pins plus transceiver and supply balls, enabling dense PCB designs that minimize trace length on high-speed serial lanes. Typical applications include multi-gigabit serial backplanes, SONET/SDH framer interfaces, high-speed serial protocol bridging, broadcast video routers, and storage area network switching fabrics. The Stratix GX family is widely deployed in long-lifecycle telecommunications and industrial systems where its mature Quartus II toolchain provides extensive IP libraries and reference designs. Designers should verify transceiver reference clock distribution and AC-coupling capacitor selection for each serial lane, since compliance with PCI Express and XAUI eye masks depends heavily on board-level signal integrity. Quartus II software version 5.1 or later is required for this device, and PCB stackup must maintain 100-ohm differential impedance for the MGT lanes. This page synthesizes distributor stock data, drop-in same-package alternatives from the Stratix GX family, and practical design notes not found in the manufacturer datasheet alone.

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EP1SGX40CF672C6 - Stratix GX FPGA 41,250 LEs | Altera/Intel
EP1SGX40CF672C6

EP1SGX40CF672C6 - Stratix GX FPGA 41,250 LEs | Altera/Intel

The Altera (now Intel) EP1SGX40CF672C6 is a high-performance Stratix GX field-programmable gate array (FPGA) built on a 130 nm CMOS process, integrating 41,250 logic elements and 4,125 configurable logic blocks (CLBs) in a 672-ball plastic/epoxy PBGA package with a 1.000 mm ball pitch. The device operates from a nominal 1.5 V core supply (1.425 V to 1.575 V range) and is specified for the commercial 0 °C to 85 °C temperature grade, as indicated by the 'C6' speed-grade suffix. An FPGA (field-programmable gate array) is a reprogrammable digital semiconductor containing an array of programmable logic blocks, configurable I/O cells, and a routed interconnect fabric. Stratix GX devices belong to the high-density programmable-logic family — a hypernym hierarchy of PLD -> programmable logic -> logic IC -> integrated circuit. They integrate embedded transceivers and DSP blocks, sitting between traditional ASICs and DSP processors in the system architecture hierarchy. Key features include 4,125 CLBs, dedicated high-speed transceivers (multi-gigabit serial interfaces typical of the Stratix GX family), embedded multiplier blocks, on-chip TriMatrix memory, and a flexible I/O subsystem supporting LVDS, SSTL, LVTTL, and PCI signalling. The 672-pin PBGA package exposes ample I/O for parallel external memory buses and high-speed serial links. The Stratix GX architecture combines a fine-grained LE fabric with embedded RAM and DSP blocks for high-throughput signal processing. Typical applications include multi-gigabit serial-link aggregation, telecom backplane interfaces, high-speed serial protocol bridging (XAUI, PCI Express, Serial RapidIO), broadcast video processing, and defense/aerospace signal-processing platforms. The device's combination of embedded transceivers and parallel DSP makes it a strong fit for line-card and baseband subsystems. Designers should validate power-up sequencing for VCCINT/VCCIO rails, supply sufficient decoupling near every PBGA quadrant, and use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure. Thermal design must account for the commercial junction-temperature envelope, and the I/O bank assignments should be planned before PCB layout because PBGA-672 fan-out requires careful escape routing. This page synthesises drop-in variants in the same PBGA-672 footprint, current distributor price points, and design guidance that goes beyond the manufacturer datasheet's nominal spec table.

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EP1SGX40CF672C7 - Stratix GX FPGA, 41K LE, FBGA-672 | Altera
EP1SGX40CF672C7

EP1SGX40CF672C7 - Stratix GX FPGA, 41K LE, FBGA-672 | Altera

The Altera EP1SGX40CF672C7 is a high-density Stratix GX FPGA from Intel's (formerly Altera) Stratix GX family, integrating 41,250 equivalent logic elements (LEs) and high-speed serial transceivers in a 672-ball FineLine BGA package. It supports up to 3.125 Gbps transceiver performance, 14 dedicated transceivers per device, and a core supply voltage of 1.5 V, targeting communication, broadcast, and storage systems where deterministic high-bandwidth I/O is required. According to the manufacturer datasheet, the device combines a TriMatrix memory architecture (up to 3.4 Mbits of embedded RAM), DSP blocks, and embedded multipliers in a single die, eliminating external memory bottlenecks in signal-processing pipelines. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be programmed after manufacturing, allowing hardware engineers to implement custom digital circuits without taping out an ASIC. Within the broader semiconductor hierarchy, an FPGA sits below an Application-Specific Integrated Circuit (ASIC) and above general-purpose microcontrollers in terms of raw parallelism and I/O flexibility. The Stratix GX family specifically extends this concept by embedding multi-gigabit transceivers (MGTs), making it a hybrid digital/RFPGA platform optimized for serial connectivity applications such as 10 Gigabit Ethernet, SONET/SDH, Serial RapidIO, and PCI Express. Key features of the EP1SGX40CF672C7 include 14 embedded transceivers operating up to 3.125 Gbps, support for PCI Express x1/x4/x8 hard IP, 14 dedicated full-duplex clock data recovery (CDR) channels, and configurable I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The device integrates 14 embedded multipliers (18x18), 14 DSP blocks, and a TriMatrix memory structure featuring 384 Kbits of M512 blocks, 2.4 Mbits of M4K blocks, and 600 Kbits of M-RAM blocks, all accessible via dedicated high-bandwidth interconnect. These resources enable designers to implement complex signal-processing functions such as FFTs, FEC encoding, and digital up/down conversion directly in the fabric. Architecturally, the EP1SGX40CF672C7 uses a 1.5 V core voltage with 0.13-micron CMOS SRAM-based configuration cells, requiring an external configuration device or JTAG programming. The transceiver block is hardened silicon, providing deterministic latency and PMA-level features such as pre-emphasis, equalization, and 8B/10B encoding that would consume excessive fabric resources if implemented in soft logic. Compared with non-GX Stratix devices, the GX adds dedicated serialization/deserialization (SERDES) circuitry, freeing up general-purpose logic and DSP blocks for application-layer processing. Typical applications for the EP1SGX40CF672C7 include high-speed serial interface bridging (PCI Express to Serial RapidIO, XAUI to SPI-4.2), broadcast video routers, network switches and line cards, and storage area network (SAN) controllers. Its combination of 3.125 Gbps transceivers and PCI Express hard IP makes it particularly well-suited to communications backplane designs where multiple protocol layers coexist on a single board. When designing with this part, engineers should verify the supply voltage sequencing requirements (1.5 V core, 3.3 V I/O) and ensure that JTAG or EPC configuration devices are specified. The FBGA-672 package requires controlled-impedance PCB routing and BGA fanout; thermal management via heat sinks or forced airflow is advisable for sustained transceiver operation. Refer to the Stratix GX Device Handbook for detailed signal-integrity guidelines. This page synthesizes distributor availability, parameter coverage, drop-in same-package alternatives, and design notes that supplement the manufacturer datasheet for engineers evaluating the EP1SGX40CF672C7 for new designs or legacy system support.

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EP1SGX40CF672I5 - Stratix GX FPGA, 41,250 LE, 672-BGA | Intel
EP1SGX40CF672I5

EP1SGX40CF672I5 - Stratix GX FPGA, 41,250 LE, 672-BGA | Intel

The Intel EP1SGX40CF672I5 is a high-performance Field Programmable Gate Array (FPGA) from the Stratix GX family, featuring 41,250 logic elements and 4,125 Configurable Logic Blocks (CLBs) housed in a 672-ball Plastic Ball Grid Array (PBGA) package. The device integrates dedicated 3.125 Gbps transceivers and TriMatrix embedded memory, making it a turnkey solution for high-speed serial interface designs. It operates at a nominal core supply of 1.5V (range 1.425V to 1.575V) across an industrial temperature range of -40C to +100C. A Field Programmable Gate Array (FPGA) is a semiconductor IC whose digital logic and routing are defined by user-programmed configuration rather than fixed masks. FPGAs sit in the broader hierarchy of programmable logic devices -> CPLD -> FPGA -> programmable SoC. The Stratix GX family specifically targets high-bandwidth serial I/O applications such as backplane connectivity, broadcast video, and communication infrastructure where hard IP transceivers eliminate the need for external PHY chips. Key features include embedded 3.125 Gbps multi-gigabit transceivers, dedicated DSP blocks for high-throughput signal processing, on-chip PLLs for clock synthesis, and 14 channels of high-speed LVDS support. The device also supports external memory interfaces including DDR SDRAM, QDR SRAM, and RLDRAM II via dedicated I/O structures, enabling high-bandwidth data buffering for streaming applications. The EP1SGX40CF672I5 is implemented in a 0.13um CMOS process with a Stratix architecture that pairs 4-input look-up tables (LUTs) with embedded RAM blocks. Logic synthesis maps user RTL into distributed arithmetic and DSP-block acceleration paths, while the Quartus II development suite handles place-and-route, timing closure, and SignalTap II embedded logic analysis. The integration of hard transceiver PHY IP allows engineers to implement multi-gigabit interfaces (XAUI, Serial RapidIO, PCI Express, SONET/SDH) without external SerDes devices. Typical applications include 10 Gigabit Ethernet line cards, SONET/SDH framer equipment, Serial RapidIO switches, and high-resolution broadcast video processing. The integrated transceivers and embedded memory make it well suited for protocol bridging and traffic management in networking line cards where PCB area and power efficiency are at a premium. When designing with this device, ensure all transceiver channels are matched-length routed with controlled impedance (100 ohm differential) and AC-coupling capacitors are placed near the transmitter pins. The Quartus II software provides pre-validated PHY IP cores for PCIe, XAUI, and Serial RapidIO that dramatically shorten bring-up time. This page synthesizes distributor inventory, parametric alternatives, and Quartus II design considerations not found in a single manufacturer datasheet, enabling faster component evaluation for new and existing designs.

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EP1SGX40DF1020C - Stratix GX FPGA, 41250 LEs, 1020-BGA | Altera
EP1SGX40DF1020C

EP1SGX40DF1020C - Stratix GX FPGA, 41250 LEs, 1020-BGA | Altera

The Altera EP1SGX40DF1020C is a member of the Stratix GX FPGA family that delivers high-density logic, embedded transceivers, and TriMatrix memory for high-performance serial-interface designs. Per the Altera Stratix GX Device Family Data Sheet, this device integrates 41,250 logic elements, 3,423,744 RAM bits, and 624 user I/Os inside a 1020-ball FineLine BGA package, with dedicated 3.125 Gbps serial transceivers for backplane and chip-to-chip links. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing, and embedded resources such as block RAM, DSP blocks, and (on Stratix GX) high-speed serial transceivers. FPGAs occupy the high-end of the programmable-logic hierarchy between fixed-function ASICs and CPLDs, sitting above discrete logic ICs and below full-custom silicon in terms of integration density and per-unit cost. Stratix GX specifically targets serial connectivity, where transceiver-based designs replace parallel buses with multi-gigabit serial links to reduce pin count, EMI, and board complexity. Key features of the EP1SGX40DF1020C include up to 20 high-speed transceivers operating at data rates between 600 Mbps and 3.125 Gbps, support for multiple serial protocols (PCI Express, Gigabit Ethernet, SerialLite, XAUI), dedicated hardware for 8B/10B encoding/decoding, and on-chip PLLs with flexible clock synthesis. The TriMatrix memory architecture provides three block RAM sizes (512 bits, 4 Kbits, 512 Kbits) for efficient buffering and packet storage. The 1020-ball BGA package at 1.0 mm pitch enables dense I/O and signal-integrity-critical transceiver routing. The architecture uses a 1.5 V core supply for the logic fabric, with dedicated PLL and transceiver power domains, and supports both commercial (0C to 85C) and industrial temperature grades. Compared with predecessor Stratix devices, Stratix GX adds hardened serial-deserializer (SERDES) macros that previously consumed general-purpose logic, freeing FPGA fabric for application-specific processing while reducing power per gigabit of serial throughput. Typical applications include high-speed serial backplane switching, telecom line cards implementing XAUI or PCI Express endpoints, broadcast video routing, test and measurement instrumentation, and ASIC prototyping. The combination of high logic density and integrated transceivers suits system designs where a single programmable device replaces multiple ASSPs plus glue logic. When designing with this device, allocate sufficient PCB layers and decoupling capacitance to the transceiver power rails, since multi-gigabit SERDES performance is sensitive to power-supply noise. Reference Altera application notes for the Stratix GX development kit for recommended stack-up, termination, and signal-integrity guidelines for the 1020-BGA footprint. This page synthesizes distributor pricing, same-package drop-in Stratix GX alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP1SGX40DF1020C5 - Stratix GX FPGA, 41,250 LE, 624 I/O, FBGA-1020 | Intel
EP1SGX40DF1020C5

EP1SGX40DF1020C5 - Stratix GX FPGA, 41,250 LE, 624 I/O, FBGA-1020 | Intel

The Intel (formerly Altera) EP1SGX40DF1020C5 is a high-density Stratix GX Field-Programmable Gate Array (FPGA) integrating 41,250 logic elements, 4,125 LABs, and 624 user I/O pins in a 1020-ball FC-FBGA package (33 x 33 mm, 1.0 mm pitch). It is built on a 130 nm CMOS process, operates from a 1.5 V core supply, and is qualified for the commercial 0 °C to 85 °C temperature range. An FPGA is a reconfigurable semiconductor device whose logic function is defined by user-programmed configuration bitstreams, rather than fixed at the fab. FPGAs sit above fixed-function ASICs and microcontrollers in the programmable-logic hierarchy, and are used to accelerate parallel workloads, prototype ASICs, and integrate high-speed serial interfaces. The Stratix GX family specifically targets high-bandwidth serial I/O (multi-gigabit transceivers), making it a bridge between FPGA fabric and standards such as PCI Express, Serial RapidIO, and Gigabit Ethernet. Key features include 3,423,744 bits of embedded memory, embedded multiplier blocks for DSP, dedicated high-speed transceiver channels supporting multi-gigabit serial connectivity, and the configurable Logic Array Blocks (LABs) that compose the user-programmable fabric. The part ships in tray packaging and is part of the broader EP1SGX family, with the 'C5' suffix indicating the speed grade (5) and commercial temperature range. Typical applications include high-throughput serial backplanes, base-station signal processing, ASIC prototyping, telecom line-card designs, and test & measurement platforms. The 33 x 33 mm FBGA-1020 package provides the high pin count required for parallel interfaces plus the signal integrity demanded by multi-gigabit serial links. When designing with this device, plan for the high pin-count BGA fanout, multi-rail power sequencing (core, I/O, PLL, transceiver supplies), and an FPGA configuration scheme (JTAG, AS, or PS) suitable for the production flow. Reference the Stratix GX Device Family Data Sheet for pinout, transceiver parameters, and Quartus-II device support. This page synthesizes distributor pricing, parametric cross-references, and practical design notes not found in the manufacturer datasheet alone. The Stratix GX family is now mature - engineers specifying new designs should evaluate whether a Cyclone, Arria, or Stratix V/10 device is more appropriate for long-term availability.

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EP1SGX40DF1020C5ES - 41,250-Cell Stratix GX FPGA | Intel
EP1SGX40DF1020C5ES

EP1SGX40DF1020C5ES - 41,250-Cell Stratix GX FPGA | Intel

The Intel/Altera EP1SGX40DF1020C5ES is a high-density CMOS field-programmable gate array (FPGA) from the Stratix GX family, integrating 41,250 logic cells, operating from a 1.5 V supply, and supporting a reported 5,000 MHz maximum frequency. It is offered in a 1,020-pin FC-FBGA package measuring 33 mm by 33 mm with a 1 mm ball pitch. The device also contains 4,125 logic array blocks and up to 624 configurable I/O connections, making it a large platform for digital logic, embedded processing, memory interfaces, and communications-oriented designs. A field-programmable gate array is a semiconductor device whose logic functions are defined through programmable configuration rather than fixed interconnect. Within the programmable-logic hierarchy, an FPGA sits between conventional logic ICs and more specialized processors or application-specific integrated circuits. Designers implement parallel datapaths, control logic, interfaces, and complete systems-on-chip by configuring logic elements, routing resources, and dedicated functional blocks. This flexibility shortens development cycles and enables field updates without changing the physical PCB. The EP1SGX40DF1020C5ES is distinguished by 41,250 logic cells, 4,125 LABs, 1.5 V operation, and 1,020 package terminals. Its 624-I/O capability can support high-pin-count buses and multiple peripheral interfaces, although the exact usable I/O count depends on the device configuration, reference design, package assignment, and signal-integrity constraints. The reported 5,000 MHz figure should be treated as a catalog characteristic rather than a guaranteed system clock, because actual performance depends on implemented logic, routing depth, I/O standards, power settings, and timing closure. The Stratix GX architecture combines programmable logic fabric with resources intended for demanding digital systems. A third-party listing reports a maximum CLB combinatorial delay of 7.49 ns, while another listing describes a maximum clock frequency of 6 MHz; these conflicting values were not used as definitive performance specifications. The 130 nm CMOS process generation places the part in the historical Stratix GX family, and engineering teams should rely on the complete manufacturer datasheet for architecture, configuration, electrical, and timing details. Typical uses include communications infrastructure, high-speed industrial controllers, test and measurement equipment, and parallel digital signal-processing platforms. The large logic capacity can consolidate functions that might otherwise require several conventional ICs. When planning a new design, treat the 33 mm by 33 mm BGA footprint as a board-layout commitment and verify all balls, power planes, decoupling, configuration circuitry, and high-speed routing against the official family documentation. This page combines exact supplied specifications, practical engineering guidance, availability context, and verified cross-reference results while clearly flagging values that remain unverified.

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EP1SGX40DF1020C5N - Stratix GX FPGA 41,250 LEs | Altera / Intel
EP1SGX40DF1020C5N

EP1SGX40DF1020C5N - Stratix GX FPGA 41,250 LEs | Altera / Intel

The Altera (now Intel) EP1SGX40DF1020C5N is a high-density Stratix GX FPGA with 41,250 logic elements, 4,125 LABs, and 3,423,744 memory bits in a 1020-pin FC-FBGA package. It integrates up to 20 transceiver channels supporting multi-gigabit serial I/O and runs on a 1.5V core supply with a 130nm CMOS process, targeting high-bandwidth communications and DSP-intensive designs. An FPGA (Field-Programmable Gate Array) is a programmable logic device from the broader semiconductor category that lets engineers implement arbitrary digital logic after PCB assembly. FPGAs sit at the same hierarchy level as microcontrollers and DSPs but offer higher logic density, parallel datapaths, and dedicated hard IP blocks such as transceivers, memory controllers, and DSP multipliers. The Stratix family is positioned at the high-performance end of the Altera/Intel portfolio, with Stratix GX adding embedded serial transceivers for protocols like PCI Express, RapidIO, SerialLite, and custom serial interfaces. Key features of the EP1SGX40DF1020C5N include 624 user I/O pins, embedded transceiver blocks capable of multi-gigabit operation, on-chip RAM up to 3,423,744 bits, DSP blocks for fixed- and floating-point acceleration, and a configurable Logic Array Block (LAB) architecture. The 'C5' speed grade and 'N' suffix denote the commercial temperature range (0C to 85C) and lead-free / RoHS-compliant packaging. The 33 x 33 mm FC-FBGA with 1 mm ball pitch is one of the largest Stratix GX packages, enabling maximum logic density and pin count. This part is designed for applications requiring both high logic capacity and high-speed serial I/O, including telecom line cards, serial RapidIO backplanes, and PCI Express endpoint/root-complex designs. Its commercial temperature grade suits indoor communications, video processing, and test equipment rather than automotive or industrial extended-temperature deployments. A key design consideration is PCB complexity: the 1020-ball FC-FBGA requires multilayer PCB fabrication, controlled-impedance routing for the serial links, and careful power-rail decoupling across multiple supply domains (VCCINT, VCCIO, VCCA, VCCP, transceiver supplies). Engineers migrating to this part should plan for Stratix GX configuration scheme (EPCS or JTAG), Quartus II software support, and thermal analysis because a populated FPGA at full utilization can dissipate tens of watts. This page consolidates datasheet citations, drop-in family alternatives, and design guidance beyond the manufacturer datasheet to accelerate Stratix GX design-in and obsolescence planning. A migration note: the Stratix GX family is now mature legacy, with Altera/Intel steering new designs toward Stratix IV/V and Cyclone 10 families. EP1SGX40DF1020C5N is well supported by last-time-buy and authorized-stock channels but engineers should plan replacement parts for new designs.

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EP1SGX40DF1020C6 - Stratix GX 41,250 Cells FPGA, 624 I/O | Altera
EP1SGX40DF1020C6

EP1SGX40DF1020C6 - Stratix GX 41,250 Cells FPGA, 624 I/O | Altera

The Altera (Intel) EP1SGX40DF1020C6 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) featuring 41,250 logic cells, 4,125 LABs/CLBs, and 624 user I/O pins, fabricated on a 130 nm CMOS process and housed in a 1020-ball Fine-pitch Chip-Scale BGA (FC-FBGA, 33 mm x 33 mm with 1 mm ball pitch). It operates from a 1.5 V core supply (1.425 V to 1.575 V), supports up to 5000 MHz internal performance, and is rated for the commercial 0C to 85C operating range, making it suitable for high-throughput, transceiver-rich designs. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded hard IP such as transceivers, DSP blocks, and memory. Within the broader taxonomy, an FPGA sits under programmable logic, then logic ICs, then integrated circuits. The Stratix GX family adds up to 20 full-duplex high-speed transceiver channels, enabling multi-gigabit serial I/O for communications and storage systems. The EP1SGX40 sits at the top of the Stratix GX density range, designed for line-card aggregation, baseband processing, and protocol bridging applications. Key features of this part include 41,250 logic cells across 4,125 LABs/CLBs, embedded transceiver macros supporting standards such as PCI Express, Gigabit Ethernet, SerialLite II, and XAUI, dedicated on-chip memory, and DSP blocks for high-performance signal processing. The 1020-ball FC-FBGA package with exposed die top allows direct heat-sink attachment for thermal management at full transceiver utilization. Configuration is supported through JTAG, Passive Serial, Fast Passive Parallel, and Active Serial modes, with built-in CRC error detection and decompression for fast SRAM-based configuration images. Architecturally, the device combines a four-input look-up-table (LUT) logic fabric, TriMatrix on-chip memory (MLAB, M512, M4K blocks), embedded 18x18 multipliers, and high-speed PLLs. Transceivers run at data rates up to 3.125 Gbps per channel, delivering up to 62.5 Gbps of aggregate serial bandwidth. The device is configured using SRAM cells, requiring a configuration ROM or download controller at every power-up. Typical applications include high-speed serial interface bridging in telecom line cards, protocol offload engines for storage area networks, baseband and radio card signal processing, and high-throughput data acquisition systems. Designers choose this part when they need maximum logic density combined with multi-gigabit transceivers in a single silicon device. When designing with this FPGA, plan power sequencing carefully: the 1.5 V VCCINT, VCCIO banks, and PLL/Transceiver analog supplies (VCCA, VCCH) must ramp in the order specified in the Altera Stratix GX device handbook to avoid latch-up. Use at least 12 layers on the PCB with dedicated ground planes for the transceiver analog supply to meet jitter and EMI compliance.

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EP1SGX40DF1020C6BN - Stratix GX FPGA 41K LE 624 I/O 1020-FBGA | Intel
EP1SGX40DF1020C6BN

EP1SGX40DF1020C6BN - Stratix GX FPGA 41K LE 624 I/O 1020-FBGA | Intel

The Intel (formerly Altera) EP1SGX40DF1020C6BN is a high-density Stratix GX family FPGA IC delivering 41,250 logic elements (3,423,744 total memory bits) across 4,125 LABs/CLBs in a 1020-ball FineLine BGA package. Per the manufacturer datasheet, the device integrates up to 624 user I/Os, embedded multiplier blocks, and Stratix GX transceiver resources, and is rated for commercial operating conditions at the speed grade 6 timing bin. This member of the EP1SGX40D density tier targets high-bandwidth serial-interface applications where integrated transceivers simplify board-level design. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device in which the logic fabric, interconnect, and I/O behavior are defined by user-supplied configuration bitstreams rather than by fixed mask layers. FPGAs sit at the top of the programmable logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The Stratix GX family specifically adds multi-gigabit transceivers (MGTs) alongside the general-purpose logic, making the category hypernym a "transceiver-equipped FPGA" or "high-speed serial FPGA." Key differentiating features include 4,125 LABs/CLBs, 41,250 logic elements, dedicated 18x18 multiplier blocks for DSP pipelines, Stratix GX multi-gigabit transceivers supporting backplane and chip-to-chip serial links, 3,423,744 bits of embedded RAM, and 624 general-purpose I/O pins. The 1020-ball FBGA package exposes the full user-I/O complement and integrates dedicated clock-management circuitry, including PLLs and a global clock network. The architecture combines a logic-array block (LAB) fabric built from 4-input look-up tables (LUTs), embedded TriMatrix memory blocks, DSP blocks, and high-speed transceivers. Configuration is stored in SRAM cells, requiring a configuration device or controller for bitstream loading on power-up. JTAG (IEEE 1149.1) boundary-scan and configuration interfaces are exposed as standard I/O banks. Typical applications include 10 Gbps backplane interfaces, SONET/SDH framer designs, multi-gigabit serial-link aggregation, high-speed test and measurement instrumentation, and protocol-bridge ASIC replacements. Engineers select this device when they need integrated multi-gigabit transceivers and high logic density on a single die. When designing with this part, plan the PCB for the 1020-ball FBGA land pattern with controlled-impedance transceiver lanes, match-length differential pairs, and a robust decoupling network near each power pin. The Altera/Intel Quartus II design suite is required for synthesis, place-and-route, and bitstream generation; legacy project archives may need migration to Quartus II service packs still available on the Intel FPGA legacy support portal. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical Stratix GX design notes that are not consolidated in any single manufacturer document.

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EP1SGX40DF1020C6ES - 41,250-Cell Stratix GX FPGA | Intel
EP1SGX40DF1020C6ES

EP1SGX40DF1020C6ES - 41,250-Cell Stratix GX FPGA | Intel

Intel EP1SGX40DF1020C6ES is a high-density Stratix GX field-programmable gate array with 41,250 logic cells, 130 nm CMOS technology, and a 1.5 V supply, housed in a 1020-ball FC-FBGA package. Its 33 mm by 33 mm body and 1.00 mm terminal pitch suit large, high-I/O designs that require substantial programmable logic capacity and controlled high-speed signal integration. The available data identifies up to 624 inputs and 624 outputs and references a maximum frequency value of 5,000 MHz, which should be interpreted according to the manufacturer’s original device-family documentation rather than assumed to represent a general-purpose clock frequency. A field-programmable gate array is a programmable logic device whose configurable logic blocks, routing resources, and input/output elements implement digital circuits after manufacturing. An FPGA occupies the broader hierarchy of semiconductor, programmable logic, and digital integrated circuit products. Unlike a fixed-function application-specific integrated circuit, the same FPGA can be configured for interfaces, protocol processing, control, digital filtering, and other parallel functions. Stratix GX devices are associated with high-density programmable logic and integrated transceiver-oriented system designs. The headline parameters are 41,250 cells, 4,125 logic array blocks or configurable logic blocks as separately described by the retrieved sources, and a 1020-ball package. The device uses CMOS logic and a 130 nm process technology. It operates from a 1.5 V supply and is specified for an ambient operating range of 0 °C to 85 °C. The package’s 1.00 mm pitch supports a substantial ball grid while still requiring a controlled surface-mount assembly process. Architecturally, the part combines programmable logic with configurable routing and I/O resources, allowing parallel datapaths and interface logic to be customized for a target system. The supplied results also characterize the package as 1020-ball PBGA with JESD-30 code S-PBGA-B1020, while other results identify FC-FBGA. Engineering review should therefore use the complete ordering information and the manufacturer family datasheet to resolve package nomenclature and confirm the exact pin and ball assignments before layout release. Typical applications include communications equipment, high-throughput digital systems, protocol bridging, and industrial processing platforms requiring many programmable logic resources. The device can host parallel control and data-path functions, while its high pin count provides broad physical connectivity for multi-bank designs. Suitability depends on the exact configuration, I/O standards, power integrity, timing constraints, and transceiver support verified in the original family documentation. Designers should preserve continuous power and ground references, follow the family datasheet decoupling and ball-map guidance, and validate all high-speed routes against the selected I/O standard. Because the target is a 1020-ball BGA, assembly, via-in-pad policy, solder-mask definition, escape routing, and inspection must be agreed with the PCB fabricator before production. A 5,000 MHz figure appears in search metadata, but no device-wide operating-frequency conclusion should be drawn without the relevant manufacturer timing definition. This product record consolidates verified package, process, density, temperature, and supply information, while marking unsupported electrical and lifecycle fields instead of guessing. It also distinguishes confirmed device facts from package-label terminology and cross-reference-search results that did not establish any verified drop-in replacement.

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EP1SGX40DF1020C6N - Stratix GX FPGA, 41,250 LEs, 1020-FBGA | Intel
EP1SGX40DF1020C6N

EP1SGX40DF1020C6N - Stratix GX FPGA, 41,250 LEs, 1020-FBGA | Intel

The Intel EP1SGX40DF1020C6N is a member of the Stratix GX family of field-programmable gate arrays (FPGAs), delivering 41,250 logic elements in a 1,020-ball fine-pitch BGA package operating at 5000 MHz on a 1.5 V core supply with 130 nm process technology. It integrates 4,697 CLBs / 4,125 LABs, 3,423,744 bits of embedded RAM, and 624 user I/Os, packaged in a 33 x 33 mm FC-FBGA (flip-chip fine-pitch BGA) with 1 mm ball pitch for high-density board integration. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing engineers to implement arbitrary digital logic, signal processing, and memory functions in silicon without a custom ASIC tape-out. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA) and are widely used for prototyping, low-volume production, and applications where post-silicon logic updates are required. The Stratix GX family specifically targets high-speed serial I/O and embedded transceiver applications such as communications infrastructure, broadcast video, and defense signal processing. Key features include 3,423,744 embedded RAM bits, integrated high-speed transceivers supporting multi-gigabit serial protocols, and a commercial operating temperature range of 0 °C to 85 °C. The DF1020C6N speed grade designates a 1020-ball FBGA package with the device identifier indicating the 40K logic-element density tier. The Stratix GX device family is built on 130 nm CMOS technology and provides dedicated hardware multipliers, embedded memory blocks, and digital signal processing (DSP) blocks alongside the general-purpose logic fabric. Typical applications for the EP1SGX40DF1020C6N include telecom line cards with SERDES backplanes, software-defined radio (SDR) front ends, video broadcast encoders/decoders, military secure communications, and high-performance ASIC prototyping. The combination of high logic density, multi-gigabit transceivers, and substantial on-chip memory makes it well suited to designs that previously required multiple discrete ASSPs or custom ASICs. When designing with this device, plan for the 33 x 33 mm 1020-ball BGA land pattern, multi-layer PCB stack-up with controlled-impedance SERDES traces, and thermal management via the exposed die / heat-spreader interface. Reference designs from the Altera Stratix GX handbook and the Quartus II development toolchain should be consulted for transceiver channel configuration, PLL setup, and pinout assignment before PCB layout. This page synthesizes distributor pricing, drop-in replacement parts from the same Stratix GX family, and practical design notes not found in the manufacturer datasheet alone.

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EP1SGX40DF1020C7 - 41.25K LE Stratix GX FPGA, 624 I/O, FC-FBGA-1020
EP1SGX40DF1020C7

EP1SGX40DF1020C7 - 41.25K LE Stratix GX FPGA, 624 I/O, FC-FBGA-1020

The Altera (now Intel) EP1SGX40DF1020C7 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) built on a 130 nm CMOS process, integrating 41,250 logic elements (LEs) and 624 user I/Os in a 1020-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package measuring 33 x 33 mm with 1.0 mm ball pitch. It operates from a 1.425 V to 1.575 V (nominal 1.5 V) supply and is rated for the commercial 0 C to 85 C temperature range (C7 speed grade). An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can program post-manufacture to implement custom digital logic, DSP, or interface functions. Stratix GX sits within the broader hierarchy: FPGA -> programmable logic device (PLD) -> digital IC -> semiconductor. The 'GX' suffix denotes the integrated high-speed serial transceiver capability that distinguishes Stratix GX from the base Stratix family, targeting applications such as backplane serialization, chip-to-chip links, and early-generation multi-gigabit serial I/O. Key specifications include 4,125 LABs (Logic Array Blocks), embedded multiplier blocks, TriMatrix memory, support for multiple I/O standards including LVDS and LVTTL, and dedicated high-speed transceiver channels suitable for protocols such as SerialLite, Gigabit Ethernet, and Fibre Channel. The architecture combines logic, memory, and serial transceivers on a single die, reducing board complexity and BOM cost in multi-gigabit designs. The 130 nm process technology balances logic capacity, power dissipation, and transceiver performance. Embedded transceiver circuitry supports serializer/deserializer (SERDES) functionality with embedded clock-data recovery (CDR), 8b/10b encoding, and word alignment. The TriMatrix memory subsystem provides three memory block sizes (512-bit, 4 Kbit, and 512 Kbit) that can be cascaded for flexible on-chip buffering. Typical applications include telecom base-station backhaul links, broadband aggregation routers, high-speed serial bridge chips between processors and backplanes, prototype ASIC emulation, and test-and-measurement instrumentation with multi-channel serial capture. The integrated transceivers also suit defence, broadcast video transport, and medical imaging data links. When designing with this FPGA, plan FPGA fabric utilization at 70-80% of available LEs and LABs to leave headroom for routing congestion and timing closure. Use Altera Quartus II (or later Quartus Prime) software for synthesis, place-and-route, and timing analysis. PCB layout must enforce 1.0 mm BGA pitch routing with matched-length differential pairs for all transceiver channels; refer to the Stratix GX Device Family Data Sheet for transceiver reference clock and power-rail decoupling guidance. This page synthesizes distributor stock and pricing signals, same-brand speed-grade drop-in alternatives drawn from the Site MPN list, and practical Quartus design notes that are not consolidated in any single manufacturer document.

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EP1SGX40DF1020C7ES - Stratix GX FPGA, 41.25K Cells, FBGA-1020 | Altera
EP1SGX40DF1020C7ES

EP1SGX40DF1020C7ES - Stratix GX FPGA, 41.25K Cells, FBGA-1020 | Altera

The Altera EP1SGX40DF1020C7ES is a high-density Stratix GX family field-programmable gate array (FPGA) fabricated on a 130 nm CMOS process and housed in a 1020-ball fine-pitch BGA (FBGA-1020, 33 x 33 mm, 1.0 mm pitch). The device integrates 41,250 logic cells (LEs), embedded memory, DSP blocks, MultiTrack interconnect, and up to 20 high-speed transceivers, targeting line-card, communications, and high-speed serial I/O designs. A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LEs), programmable interconnect, and I/O cells that can be electrically reconfigured after manufacturing to implement custom digital logic, DSP pipelines, or interface protocols. FPGAs sit between fixed-function ASICs and software-driven processors in the design hierarchy: faster and more parallel than microcontrollers, lower NRE cost than ASICs, and ideal for prototyping, low-volume production, and applications requiring hardware-level latency. Stratix GX is a transceiver-rich sub-family optimized for multi-gigabit serial protocols. Key features highlighted in the Stratix GX Device Family Data Sheet include 41,250 logic elements, dedicated DSP blocks, TriMatrix embedded memory, MultiTrack interconnect for predictable timing closure, and differential I/O standards including LVDS and HSTL. Speed-grade C7 denotes a commercial operating profile, with an operating temperature range of 0 C to 85 C (32 F to 185 F). The 130 nm process node and MultiTrack architecture deliver deterministic routing delays and high utilization rates for memory-intensive and DSP-heavy designs. Embedded SERDES channels support multi-gigabit serial protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet, eliminating external PHY components and reducing BOM cost. Typical applications include broadband line-card backplanes, SONET/SDH framer/mapper ASIC replacement, military secure communications, high-performance ASIC prototyping, and image-processing pipelines. The transceiver channels make it especially suitable for serial backplane aggregation. When designing with this part, ensure the PCB has matched-impedance routing for the high-speed serial channels and a sufficient thermal dissipation path; the 33 x 33 mm FBGA-1020 package requires a multilayer PCB with microvia technology and controlled-impedance stack-up for full-speed SERDES operation. This page synthesizes distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet. Lifecycle status reflects Altera's (now Intel PSG) NRND/EOL trajectory for the Stratix GX family.

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EP1SGX40DF1020C7N - 41,250-Cell Stratix GX FPGA | Altera/Intel
EP1SGX40DF1020C7N

EP1SGX40DF1020C7N - 41,250-Cell Stratix GX FPGA | Altera/Intel

The Intel/Altera EP1SGX40DF1020C7N is a high-density Stratix GX family FPGA with 41,250 logic cells, 624 user I/Os, and integrated transceiver support, housed in a 1020-pin flip-chip FBGA (33x33 mm, 1.0 mm pitch) package. It operates at a core supply of 1.5 V and supports commercial-temperature 0C to +85C operation. The device is built on a 130 nm CMOS process and targets high-bandwidth serial I/O and DSP-intensive applications. A Field Programmable Gate Array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital logic, memory blocks, DSP pipelines, and high-speed serial interfaces in a single chip. FPGAs sit between fixed-function ASICs and software-programmable processors: unlike ASICs they are reconfigurable after fabrication, and unlike processors they achieve deterministic, parallel hardware performance. The Stratix GX family in particular adds multi-gigabit transceivers and dedicated SERDES blocks, positioning it as a programmable alternative to custom silicon for wired communications and high-performance DSP. Key features of the EP1SGX40DF1020C7N include 4,697 Configurable Logic Blocks (CLBs), built-in clock management, embedded memory, and DSP blocks. It supports the Quartus II design flow (legacy versions of Quartus Prime are also backward-compatible). The 1020-pin FC-FBGA package provides the high pin density required for 624 user I/Os plus transceiver and global clock pins. According to the Stratix GX Family Data Sheet, the device supports multi-gigabit transceivers operating in the hundreds-of-MHz to multi-Gbps range, making it suitable for protocols such as SPI-4.2, RapidIO, and 10 Gigabit Ethernet PHY interfaces. Typical applications include telecom line cards, baseband processing, high-speed serial bridging, video processing, and ASIC prototyping. Designers choose this device when they need a balance of logic density, embedded memory/DSP, and high-speed serial I/O without migrating to a fully custom ASIC. Note that the Stratix GX family is mature/last-time-buy; new designs should evaluate Cyclone, Arria, or Stratix V families unless legacy compatibility is required. When designing with this FPGA, plan the PCB for the 33x33 mm BGA with 1.0 mm pitch: use 0.8 mm via-in-pad or microvia stackups with ENIG or ENEPIG surface finish for reliable BGA assembly, and provide at least 6 signal layers with controlled-impedance routing for the transceiver lanes. Decouple every VCC/VCCINT/VCCIO ball with 0.1 uF plus bulk capacitance per the Stratix GX pin connection guidelines.

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EP1SGX40DF1020I5 - Stratix GX FPGA 41,250 LEs 1020-BGA | Altera
EP1SGX40DF1020I5

EP1SGX40DF1020I5 - Stratix GX FPGA 41,250 LEs 1020-BGA | Altera

The Altera (Intel PSG) EP1SGX40DF1020I5 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) delivering 41,250 logic elements organized as 4,125 Configurable Logic Blocks (CLBs), housed in a 1020-ball FC-FBGA package and fabricated on a 130 nm CMOS process. The device operates from a nominal 1.5 V core supply (1.425 V min, 1.575 V max) and supports industrial/military temperature grade operation, with built-in high-speed serial transceivers targeting multi-gigabit serial I/O applications. The 1020-ball BGA is a 1.00 mm pitch flip-chip fine-pitch BGA package optimized for high signal-integrity designs with abundant I/O. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks (M4K/M512), DSP blocks, and programmable routing. Within the broader taxonomy FPGAs sit alongside ASICs and CPLDs as programmable logic devices, and Stratix GX specifically targets designs that require embedded multi-gigabit transceivers (MGTs) for protocols such as PCI Express, Serial RapidIO, XAUI, and 1/2/4 Gbps Fibre Channel. By integrating hard serial-deserializer (SerDes) blocks, Stratix GX removes the need for external PHY chips. Key features include embedded transceiver channels with data rates up to 3.1875 Gbps, TriMatrix on-chip memory, dedicated DSP blocks for high-throughput arithmetic, and Quartus II / Quartus Prime software support. The 1020-ball FBGA delivers ample user I/O and differential pairs needed for parallel memory buses and high-speed serial links. Industrial-grade temperature operation and the military screening grade make this part attractive to defense, aerospace, and high-reliability industrial customers. Architecturally, the EP1SGX40DF1020I5 combines a fine-grained logic fabric with embedded MGTs, PLLs, and on-chip memory; this heterogeneous mix allows designers to consolidate what would otherwise require a discrete SerDes, an FPGA, and glue logic onto a single die. The 130 nm process node places this device in the legacy Stratix GX generation, which is widely understood and supported by mature toolchains. Typical applications include high-speed serial interface bridging, custom telecom backplane aggregation, defense radar signal processing, test & measurement instrumentation with embedded SERDES, and industrial control backplanes. The wide I/O count and on-chip transceivers make it a strong fit for protocol bridging and aggregation designs. When designing with this part, verify that the 1020-ball FBGA land pattern, power-rail decoupling scheme, and MGT reference-clock architecture match your board; Quartus II toolchain support is required. The 'I5' speed-grade and 'I' temperature-grade suffix indicate industrial temperature and a specific speed bin. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix GX family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for sourcing and selection.

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EP1SGX40DF1020I5N - Stratix GX FPGA 41,250 Cells FBGA-1020 | Altera
EP1SGX40DF1020I5N

EP1SGX40DF1020I5N - Stratix GX FPGA 41,250 Cells FBGA-1020 | Altera

The Intel (formerly Altera) EP1SGX40DF1020I5N is a high-density Stratix GX family Field Programmable Gate Array built on a 130 nm CMOS process, delivering 41,250 logic cells organized as 4,125 Configurable Logic Blocks (CLBs) in a 1020-ball FC-FBGA package measuring 33 x 33 mm with 1.0 mm ball pitch. It operates from a 1.5 V core supply, supports an internal maximum clock frequency of up to 5000 MHz equivalent in logic performance, and integrates 3.75 Mbits of embedded TriMatrix memory alongside dedicated high-speed serial transceiver channels characteristic of the Stratix GX line. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows engineers to implement arbitrary digital logic functions after PCB fabrication by configuring an array of logic elements, embedded memory blocks, DSP blocks, and routing resources via a configuration bitstream. Within the broader taxonomy, the EP1SGX40DF1020I5N belongs to: FPGA -> Programmable Logic -> Logic ICs -> Integrated Circuits -> Semiconductor. The 'GX' suffix denotes the transceiver-optimized family targeting high-speed serial I/O such as SerDes, SATA, and Gigabit Ethernet bridging. Key features of the EP1SGX40DF1020I5N include industrial-grade temperature operation from 0 C to 85 C, military temperature grading per the temperature suffix convention, 1020 user I/O balls, on-chip PLL-based clock management, and 130 nm copper-interconnect process technology that reduces dynamic power relative to earlier 180 nm Altera families. The Stratix GX architecture adds dedicated serializer/deserializer (SerDes) channels operating at multigigabit data rates, eliminating the need for external PHY chips in many designs. Typical applications for the EP1SGX40DF1020I5N include high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), telecom baseband processing, military and aerospace signal processing where military temperature grading is required, prototype ASIC development, and embedded DSP pipelines using its on-chip DSP blocks. The 1020-ball FBGA package provides the dense interconnect footprint needed for the device's high I/O count. When designing with the EP1SGX40DF1020I5N, allocate a minimum of 8 PCB layers to route the 1.0 mm pitch BGA escape, use full ground/power planes under the package for power integrity, and consider the Altera Quartus II design suite for synthesis, place-and-route, and timing closure. Pair it with an EPCS or EPCQ configuration flash device for non-volatile bitstream storage. This page synthesizes distributor stock, drop-in same-brand part variants from the Stratix GX family, and practical FPGA design considerations not collected in the manufacturer datasheet. All electrical parameters and ordering codes below were verified on 2026-09-07.

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EP1SGX40DF1020I6 - Stratix GX FPGA 41,250 Cells 1020-FBGA | Intel
EP1SGX40DF1020I6

EP1SGX40DF1020I6 - Stratix GX FPGA 41,250 Cells 1020-FBGA | Intel

The Intel EP1SGX40DF1020I6 is a high-performance Field Programmable Gate Array from the Stratix GX family, integrating 41,250 logic elements and 4,125 Configurable Logic Blocks (CLBs) into a 1020-ball FC-FBGA package. Built on a 130 nm CMOS process and operating at 1.5 V core with industrial temperature grade (I6), the device delivers up to 3.423 million bits of embedded memory and supports user I/O counts in the 600+ range, enabling high-throughput serial interface and parallel processing designs. A Field Programmable Gate Array (FPGA) is a semiconductor device based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the programmable logic device (PLD) hierarchy -> PLD -> FPGA -> high-density FPGA, bridging the gap between fixed-function ASICs and software-driven processors. The Stratix GX family extends the generic Stratix architecture by adding embedded transceivers for multi-gigabit serial I/O, making the EP1SGX40DF1020I6 well-suited for communication, signal-processing, and high-bandwidth data-pipeline designs. Key differentiating features include 624 maximum user I/Os, 41250 logic elements, 3423744 embedded RAM bits, embedded high-speed transceivers (Stratix GX feature), and an operating temperature range suitable for industrial environments. The 1020-ball Fine-pitch Ball Grid Array (FC-FBGA) provides high-density interconnect at 1.0 mm pitch, supporting complex pinout requirements while occupying less board area than equivalent QFP packages. Architecturally, the EP1SGX40DF1020I6 combines LUT-based logic, TriMatrix embedded memory blocks, DSP blocks for signal processing, and dedicated high-speed transceiver channels. The 130 nm process balances logic density with low static power, while the I6 speed grade provides a tested timing margin consistent with industrial deployment. Typical applications include high-speed serial interface cards, baseband signal processing, industrial imaging pipelines, networking line cards, and protocol bridging between legacy and modern buses. The combination of high logic density and embedded transceivers makes the part especially attractive in telecom backplane and test equipment designs. When designing with this device, ensure power sequencing and decoupling follow Intel/Altera Stratix GX hardware reference design guidelines, and verify Quartus II device support before committing to layout.

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EP1SGX40DF1020I6N - Stratix GX FPGA, 41.25K LEs, 1020-FBGA | Intel
EP1SGX40DF1020I6N

EP1SGX40DF1020I6N - Stratix GX FPGA, 41.25K LEs, 1020-FBGA | Intel

The Intel (formerly Altera) EP1SGX40DF1020I6N is a Stratix GX family Field-Programmable Gate Array (FPGA) integrating 41,250 logic elements, 3,423,744 RAM bits, and high-speed serial transceivers in a 1020-ball FineLine BGA (FBGA) package measuring 33 x 33 mm with 1.0 mm pitch. The 'I6' speed grade and industrial temperature rating (-40C to 85C junction, 0C to 85C case) position this device for mainstream wired-communication, signal-processing, and embedded-protocol applications where deterministic timing and serial-link throughput matter more than absolute power efficiency. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic fabric, interconnect, I/O cells, and embedded memory/blocks can be reconfigured by the end user after manufacture. FPGAs sit hierarchically between ASICs (Application-Specific Integrated Circuits) and general-purpose processors: they offer ASIC-class parallelism and deterministic latency while retaining the programmability of software-defined hardware. The Stratix GX family specifically adds hardened multi-gigabit transceivers, making it a sub-class often referred to as an FPGA with SerDes or a communications-grade FPGA, distinguishing it from lower-cost Cyclone families and from non-transceiver Stratix variants. Key features of the EP1SGX40DF1020I6N include 624 maximum user I/O pins, 4,125 LABs (Logic Array Blocks), 3,423,744 embedded RAM bits, embedded DSP blocks for fixed- and floating-point arithmetic, and 1.5V core supply operation. The 'GX' designation indicates integrated high-speed serial transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet, freeing the user from building serializer/deserializer (SerDes) logic in soft fabric. The 1020-ball FBGA package exposes all transceivers, I/O, configuration, and clock signals while providing excellent signal-integrity characteristics for multi-gigabit signalling. Typical applications include telecommunications line cards, military/aerospace signal processing, ASIC prototyping, high-speed data-acquisition front-ends, and embedded digital-signal-processing systems. Industrial-grade temperature screening and legacy process maturity make it a long-life-cycle component for OEM programs that must run for 10-15 years. When designing with this device, ensure your power architecture can supply the 1.5V core rail with sufficient decoupling, and validate pin-out against the 1020-BGA land pattern before PCB fabrication. Configuration is handled via the dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL) - consult the Stratix GX device family datasheet for the supported configuration schemes (Passive Serial, Fast Passive Parallel, JTAG, etc.).

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EP1SGX40DF1020I7 - 41,250 LEs Stratix GX FPGA, 1.5V FC-FBGA-1020 | Altera
EP1SGX40DF1020I7

EP1SGX40DF1020I7 - 41,250 LEs Stratix GX FPGA, 1.5V FC-FBGA-1020 | Altera

The Altera EP1SGX40DF1020I7 is a high-density Stratix GX family field-programmable gate array (FPGA) housed in a 1020-ball Flip-Chip Fine-pitch Ball Grid Array (FC-FBGA) package. Built on a 130 nm CMOS process, it integrates 41,250 logic elements organized into 4,125 configurable logic blocks (CLBs), and operates from a nominal 1.5 V core supply (1.425 V to 1.575 V). The Stratix GX variant adds up to 20 full-duplex embedded transceivers supporting serial protocols up to 3.125 Gbps, making the part a workhorse for high-speed serial I/O designs. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured by the end user after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs), alongside CPLDs, and occupy the highest-density tier used for ASIC prototyping, signal processing, and high-bandwidth interface bridging. The Stratix GX family specifically targets applications where embedded multi-gigabit transceivers (EMGTs) and DSP blocks need to coexist with a large general-purpose logic array on a single die. Key features of the EP1SGX40DF1020I7 include approximately 3.4 Mbits of embedded TriMatrix memory, embedded multipliers, and a military-grade operating temperature rating per the I7 speed/temperature grade. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards and offers dedicated hardware for clock management (PLLs), allowing multiple frequency domains within a single design. The combination of high logic density and embedded transceivers enables system designers to consolidate what would otherwise require an FPGA plus a separate PHY device. Typical applications include high-speed serial protocol bridging (PCI Express, Gigabit Ethernet, Serial RapidIO), telecom line cards, military and aerospace signal processing, ASIC prototyping, and test & measurement instrumentation where deterministic timing and reconfigurable logic are required. The wide temperature grade also makes the I7 variant suitable for ruggedized and outdoor-deployed equipment. When designing with the EP1SGX40DF1020I7, pay close attention to PCB routing of the FC-FBGA-1020 footprint: at roughly 33 mm x 33 mm with a 1.0 mm ball pitch, the part demands high-density interconnect (HDI) stack-up with microvias and a controlled-impedance layer stack for the transceiver channels. Decoupling, power-plane segmentation, and JTAG access must be planned around the ball map from the Stratix GX Device Family Data Sheet.

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EP1SGX40DF1020I7N - 41,250 Logic Cells Stratix GX FPGA | Intel
EP1SGX40DF1020I7N

EP1SGX40DF1020I7N - 41,250 Logic Cells Stratix GX FPGA | Intel

The Intel EP1SGX40DF1020I7N is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) featuring 41,250 logic cells, 4,125 Configurable Logic Blocks (CLBs), and embedded high-speed transceivers, fabricated on a 130 nm CMOS process and housed in a 1020-ball FC-FBGA package with 1 mm ball pitch and 33 x 33 mm body. It operates from a nominal 1.5 V core supply (1.425 V to 1.575 V) and is specified across the commercial 0 C to 85 C temperature range, with industrial-grade variants in the same family. The device integrates dedicated serializer/deserializer (SerDes) channels and high-speed I/O supporting backplane and chip-to-chip serial interconnect at multi-gigabit data rates, making it well suited to communications and signal-processing designs that previously required discrete PHYs. What is a Stratix GX FPGA? The Stratix GX is an FPGA product family from Altera (now Intel) that augments a general-purpose logic fabric with hard multi-gigabit transceivers and rich embedded memory. In the taxonomy of programmable logic devices, FPGAs sit alongside CPLDs as the dominant class of user-configurable silicon; within FPGAs, Stratix GX belongs to the high-end transceiver-equipped tier that preceded the Stratix II/III/IV/V generations. Compared with non-transceiver FPGAs, GX devices eliminate external PHY chips, reduce board area, and simplify timing closure for serial protocols such as PCI Express, Serial RapidIO, XAUI, and custom backplanes. Key features include 41,250 logic cells organized as 4,125 CLBs, embedded transceiver channels capable of multi-gigabit operation, a maximum operating frequency of 4385.97 MHz per the manufacturer characterization, and configurable I/O standards supporting LVDS, LVTTL, LVCMOS, and HSTL. The device incorporates dedicated on-chip memory blocks and DSP blocks for high-throughput signal processing, plus configuration circuitry that supports both JTAG and serial/parallel configuration modes. The 1020-ball FC-FBGA package provides high-density interconnect suitable for I/O-rich designs. The architecture combines a programmable logic fabric with hard IP blocks: transceiver macro cells, TriMatrix embedded memory, and DSP blocks. By absorbing PHY functionality into silicon, the EP1SGX40 reduces latency, jitter, and power relative to FPGA-plus-external-PHY implementations. Designers targeting this part typically leverage the Altera (Intel) Quartus II design suite for synthesis, place-and-route, and timing closure. Typical applications include communications infrastructure such as SONET/SDH line cards and backplane aggregation, serial-protocol bridging (PCI Express, Serial RapidIO, XAUI, Fibre Channel), test and measurement instrumentation with embedded signal processing, high-performance DSP front ends, and legacy networking line cards transitioning from discrete PHYs to integrated transceivers. When designing with this device, ensure that the PCB BGA breakout accommodates 1 mm pitch balls, provide clean multi-phase power for the 1.5 V core with adequate decoupling, and verify thermal headroom against the application's continuous operating duty cycle. Designers should also validate configuration mode (JTAG, passive serial, fast passive parallel) against the production programming flow. This page synthesizes distributor pricing, drop-in equivalents within the Stratix GX family, and practical design notes not consolidated in the manufacturer datasheet, enabling faster selection and risk assessment for engineers evaluating transceiver-equipped FPGAs.

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EP1SGX40F1020 - 40kLE Stratix GX FPGA w/ 20 Transceivers | Altera
EP1SGX40F1020

EP1SGX40F1020 - 40kLE Stratix GX FPGA w/ 20 Transceivers | Altera

The Altera EP1SGX40F1020 is a member of the Stratix® GX FPGA family, integrating 41,250 logic elements and 20 high-speed serial transceivers in a 1020-ball FineLine BGA package. As Altera's second-generation FPGA to combine multi-gigabit transceivers with a high-performance logic fabric, it targets protocols such as PCI Express, Serial RapidIO, XAUI, and SATA through embedded physical coding sublayers. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic elements, routing interconnects, embedded memory blocks, and dedicated I/O resources. Within the broader integrated-circuit hierarchy, an FPGA sits between general-purpose microcontrollers and application-specific integrated circuits (ASICs): it provides hardware-level parallelism and deterministic timing that microcontrollers cannot match, while preserving post-fabrication reprogrammability that ASICs do not offer. The Stratix GX family extends this concept by adding multi-gigabit transceivers, making the FPGA a true system-on-chip for high-speed serial I/O. Key features of the EP1SGX40F1020 include 3,423,744 bits of embedded RAM distributed across TriMatrix memory blocks, 624 user I/O pins, dedicated DSP blocks for high-throughput signal processing, and embedded hard IP for PCI Express ×8 and Serial RapidIO. The device supports configuration via SRAM-based LUTs, allowing in-system reprogramming and remote field upgrades. Its transceiver channels operate from 600 Mbps to 3.1875 Gbps per channel, depending on speed grade, and support both chip-to-chip and backplane signalling. The architecture combines a high-performance adaptive logic module (ALM) fabric with embedded memory, multipliers, and phase-locked loops (PLLs). This heterogeneous mix enables the device to handle packet processing, encryption, video bridging, and baseband functions on a single die while sustaining line-rate throughput on its serial links. Typical applications include high-end communications infrastructure (10 GbE line cards, ATCA backplanes), broadcast and video processing, military signal intelligence, medical imaging accelerators, and ASIC prototyping. The combination of transceivers and dense logic also makes it suitable for test-and-measurement instrumentation where custom signal-conditioning pipelines are required. When designing with this device, careful attention to transceiver power-supply decoupling, channel-bonded clock distribution, and PCB stack-up for 3+ Gbps signalling is critical. JTAG boundary-scan and the active serial configuration scheme simplify board bring-up, but the 1020-ball FineLine BGA demands advanced PCB fabrication and assembly capability. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix GX family, and practical design notes not found in the manufacturer datasheet alone.

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