EP1SGX40DF1020C6ES - 41,250-Cell Stratix GX FPGA | Intel
料号: EP1SGX40DF1020C6ES ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP1SGX40DF1020C6ES 概述
A field-programmable gate array is a programmable logic device whose configurable logic blocks, routing resources, and input/output elements implement digital circuits after manufacturing. An FPGA occupies the broader hierarchy of semiconductor, programmable logic, and digital integrated circuit products. Unlike a fixed-function application-specific integrated circuit, the same FPGA can be configured for interfaces, protocol processing, control, digital filtering, and other parallel functions. Stratix GX devices are associated with high-density programmable logic and integrated transceiver-oriented system designs.
The headline parameters are 41,250 cells, 4,125 logic array blocks or configurable logic blocks as separately described by the retrieved sources, and a 1020-ball package. The device uses CMOS logic and a 130 nm process technology. It operates from a 1.5 V supply and is specified for an ambient operating range of 0 °C to 85 °C. The package’s 1.00 mm pitch supports a substantial ball grid while still requiring a controlled surface-mount assembly process.
Architecturally, the part combines programmable logic with configurable routing and I/O resources, allowing parallel datapaths and interface logic to be customized for a target system. The supplied results also characterize the package as 1020-ball PBGA with JESD-30 code S-PBGA-B1020, while other results identify FC-FBGA. Engineering review should therefore use the complete ordering information and the manufacturer family datasheet to resolve package nomenclature and confirm the exact pin and ball assignments before layout release.
Typical applications include communications equipment, high-throughput digital systems, protocol bridging, and industrial processing platforms requiring many programmable logic resources. The device can host parallel control and data-path functions, while its high pin count provides broad physical connectivity for multi-bank designs. Suitability depends on the exact configuration, I/O standards, power integrity, timing constraints, and transceiver support verified in the original family documentation.
Designers should preserve continuous power and ground references, follow the family datasheet decoupling and ball-map guidance, and validate all high-speed routes against the selected I/O standard. Because the target is a 1020-ball BGA, assembly, via-in-pad policy, solder-mask definition, escape routing, and inspection must be agreed with the PCB fabricator before production. A 5,000 MHz figure appears in search metadata, but no device-wide operating-frequency conclusion should be drawn without the relevant manufacturer timing definition.
This product record consolidates verified package, process, density, temperature, and supply information, while marking unsupported electrical and lifecycle fields instead of guessing. It also distinguishes confirmed device facts from package-label terminology and cross-reference-search results that did not establish any verified drop-in replacement.
直接替换替代料: EP1SGX40DF1020C6ES ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号: EP1SGX40DF1020C6ES (相同外形与封装尺寸) ——差异在于 Operating Temperature, Package, Package Dimensions, Package Type, Supply Voltage.
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请求替代料EP1SGX40DF1020C6ES 最大额定值与电气特性
| Product Type | Field Programmable Gate Array |
| Device Family | Stratix GX |
| Logic Cells | 41,250 cells |
| Logic Array Blocks | 4,125 LABs |
| Configurable Logic Blocks | 4,125 CLBs |
| Maximum Frequency | 5,000 MHz |
| Process Technology | 130 nm |
| Logic Family | CMOS |
| 电源电压 | 1.5 V |
| Number of Inputs | 624 |
| 输出数量 | 624 |
| 工作温度 | 0 °C to 85 °C |
| 封装 | 1020-ball FC-FBGA |
| Package Body | 33 mm × 33 mm |
| Terminal Pitch | 1.00 mm |
| 引脚数量 | 1020 |
| JESD-30 Package Code | S-PBGA-B1020 |
| 安装类型 | Surface Mount |
EP1SGX40DF1020C6ES s-pbga-b1020 引脚配置指南
EP1SGX40DF1020C6ES(s-pbga-b1020 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据: EP1SGX40DF1020C6ES.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1SGX40DF1020C6ES 适用于 6 应用s: Communications Infrastructure, High-Throughput Digital Processing, Protocol Bridge and Interface Aggregation, Industrial Control Platforms, Test and Measurement Equipment, Legacy Platform Maintenance.
Communications Infrastructure
EP1SGX40DF1020C6ES is relevant to communications infrastructure that needs substantial programmable datapath capacity and many physical connections. Its verified 41,250 logic cells provide resources for parallel packet processing, framing, buffering control, protocol adaptation, and interface management. The device exposes a reported 624 inputs and 624 outputs, which can help when many control, status, and data signals must be aggregated. A 1020-ball package, however, makes board planning critical: every bank, voltage, clock, and transceiver requirement must be reconciled with the exact family documentation. The part is most suitable when an existing Stratix GX design is being maintained and its configuration, timing, and assembly flow are already qualified.
推荐
High-Throughput Digital Processing
EP1SGX40DF1020C6ES fits high-throughput digital processing where parallel RTL structures can benefit from 41,250 programmable logic cells. Designers can use the FPGA for fixed-latency datapaths, state machines, channel aggregation, filtering, and control functions that benefit from hardware concurrency. Its 4,125 logic array or configurable logic blocks provide a large implementation field, while the 1.5 V supply defines a legacy low-voltage design context. The retrieved 5,000 MHz value is a parametric listing, not a validated system-clock target, so timing closure must use the selected configuration, device speed grade, and manufacturer timing model. The 0 °C to 85 °C range also requires explicit system-level thermal analysis.
推荐
Protocol Bridge and Interface Aggregation
EP1SGX40DF1020C6ES can support systems that bridge parallel, serialized, or vendor-specific interfaces through programmable logic. The 624 reported inputs and 624 reported outputs are useful for consolidating address, data, control, and status paths around an FPGA, while the 41,250-cell architecture offers room for conversion, adaptation, and supervisory logic. Engineers must verify whether the target configuration supports the required interface standards, clocking resources, I/O voltages, and any integrated serial functions in the family documentation. A 1020-ball BGA is appropriate for a connection-rich design only when signal-integrity, escape-routing, decoupling, and assembly constraints are controlled from schematic capture through fabrication.
推荐
Industrial Control Platforms
EP1SGX40DF1020C6ES can serve in industrial control platforms requiring deterministic parallel processing, numerous I/O connections, and configurable timing behavior. The 41,250-cell capacity supports motor-control sequencing, machine-state handling, sensor aggregation, and protocol conversion, while the reported 624 inputs and 624 outputs provide a high physical I/O count for a complex controller. The verified commercial operating range of 0 °C to 85 °C does not establish suitability for an uncontrolled enclosure; exact power, junction temperature, reliability, and environmental requirements must be reviewed. A legacy 130 nm CMOS FPGA is most attractive when existing Stratix GX IP, tool flow, and board design reduce migration and requalification costs.
推荐
Test and Measurement Equipment
EP1SGX40DF1020C6ES is applicable to test and measurement equipment that needs configurable acquisition control, pattern generation, timing sequencing, and result processing. Its 41,250 logic cells can host parallel measurement engines, while the reported 624 inputs and 624 outputs support extensive fixture, trigger, status, and data connectivity. The 1.5 V supply and 130 nm process identify the device’s technology context, but they do not specify ADC, DAC, comparator, memory, or measurement accuracy. Those companion functions require separate components and verified interfaces. System planning must also address the 33 mm by 33 mm 1020-ball package, including power delivery, signal integrity, heat removal, programming access, and production testability.
推荐
Legacy Platform Maintenance
EP1SGX40DF1020C6ES is especially relevant to maintaining an existing Stratix GX platform where changing FPGA density, package, or vendor would force extensive PCB and firmware rework. The target is verified as a 41,250-cell device with 4,125 logic array or configurable logic blocks, a 1.5 V supply, and a 1020-ball package. Retaining the established architecture can preserve investment in RTL, timing constraints, board layout, qualification records, and production test procedures. The 130 nm technology also implies a review of tool availability, lifecycle planning, and counterfeit-risk controls. Engineers should compare exact ordering-code suffixes and documented ball assignments before authorizing an engineering replacement; similarly named family MPNs are not automatically drop-in compatible.
推荐
推荐产品汇总
工程参考数据: EP1SGX40DF1020C6ES ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 |
|---|---|
| Package | 1020-ball FC-FBGA, 33 mm × 33 mm, 1.00 mm pitch |
| Brand | Intel |
| Device Family | Stratix GX |
| Logic Cells | 41,250 cells |
| Logic Array or Configurable Logic Blocks | 4,125 blocks |
| Process Technology | 130 nm CMOS |
| Supply Voltage | 1.5 V |
| Operating Temperature | 0 °C to 85 °C |
| Reported Inputs and Outputs | 624 inputs and 624 outputs |
关键差异点
- Verified high-density resource profile (对比 EP1SGX40DF1020C5ES)
- Explicit 1020-ball package context (对比 EP1SGX40DF1020C6BN)
- Established Stratix GX ordering variant (对比 EP1SGX40DF1020C6)
设计说明
Treat the 1020-ball package as a package-specific implementation rather than a generic high-pin-count BGA. Use the manufacturer’s exact land pattern, ball map, escape recommendations, and board-stackup constraints. The verified body size is 33 mm by 33 mm and pitch is 1.00 mm. Confirm whether the design uses through-via, via-in-pad, or sequential-build structures with the PCB fabricator, because these choices affect yield, inspection, rework, and cost. Do not infer a package drawing from the FC-FBGA or PBGA labels without resolving the exact manufacturer package designation.
The verified supply specification is 1.5 V, but total current, rail tolerances, auxiliary supplies, power-up sequence, and decoupling values are not provided. Use the Stratix GX family datasheet and applicable design guidelines to select regulator transient response, bulk capacitance, local ceramic bypassing, and plane geometry. Separate noisy and sensitive return paths where practical, and keep high-current transitions away from precision interfaces. Exact power estimates require configuration utilization, clock rates, toggle rates, I/O loading, and environmental conditions; no junction-temperature conclusion should be made from the 1.5 V value alone.
Do not assume that similarly named Stratix GX ordering codes are drop-in replacements. The supplied web data does not prove that any alternative shares the target’s ball map, speed grade, temperature grade, supply requirements, configuration interface, timing, or reliability controls. The 5,000 MHz value appears in a parametric search result but lacks enough context to define a system clock target. Treat it as a listing fact only and use the applicable family timing tables. Before procurement or redesign, compare full ordering information, land pattern, errata, supported tool version, and qualification evidence.
合规信息
The verified web data does not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. The target is a Stratix GX FPGA; no AEC-Q100 claim is present in the supplied data.