Altera

EP1SGX40DF1020C6 - Stratix GX 41,250 Cells FPGA, 624 I/O | Altera

料号： EP1SGX40DF1020C6 ⚠ 最后一次采购

有现货 1-3 个工作日内发货

1.425 V to 1.575 V (1.5 V nominal) Vdss 1020-BBGA, FCBGA (FC-FBGA) Package Embedded (per Stratix GX family) Speed

低至 $1620 USD / 件

最小起订量： 1 |

价格更新于： 2026-09-07

批量定价

数量	单价	小计
1	$1850	$1,850.00
10	$1780	$17,800.00
50	$1720	$86,000.00
100	$1680	$168,000.00
250	$1620	$405,000.00

ℹ️ 所有价格均以 USD 计价

查看数据手册 (PDF) 查看替代料

数量

EP1SGX40DF1020C6 概述

The Altera (Intel) EP1SGX40DF1020C6 is a high-density Stratix GX family Field-Programmable Gate Array (FPGA) featuring 41,250 logic cells, 4,125 LABs/CLBs, and 624 user I/O pins, fabricated on a 130 nm CMOS process and housed in a 1020-ball Fine-pitch Chip-Scale BGA (FC-FBGA, 33 mm x 33 mm with 1 mm ball pitch). It operates from a 1.5 V core supply (1.425 V to 1.575 V), supports up to 5000 MHz internal performance, and is rated for the commercial 0C to 85C operating range, making it suitable for high-throughput, transceiver-rich designs.

A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and embedded hard IP such as transceivers, DSP blocks, and memory. Within the broader taxonomy, an FPGA sits under programmable logic, then logic ICs, then integrated circuits. The Stratix GX family adds up to 20 full-duplex high-speed transceiver channels, enabling multi-gigabit serial I/O for communications and storage systems. The EP1SGX40 sits at the top of the Stratix GX density range, designed for line-card aggregation, baseband processing, and protocol bridging applications.

Key features of this part include 41,250 logic cells across 4,125 LABs/CLBs, embedded transceiver macros supporting standards such as PCI Express, Gigabit Ethernet, SerialLite II, and XAUI, dedicated on-chip memory, and DSP blocks for high-performance signal processing. The 1020-ball FC-FBGA package with exposed die top allows direct heat-sink attachment for thermal management at full transceiver utilization. Configuration is supported through JTAG, Passive Serial, Fast Passive Parallel, and Active Serial modes, with built-in CRC error detection and decompression for fast SRAM-based configuration images.

Architecturally, the device combines a four-input look-up-table (LUT) logic fabric, TriMatrix on-chip memory (MLAB, M512, M4K blocks), embedded 18x18 multipliers, and high-speed PLLs. Transceivers run at data rates up to 3.125 Gbps per channel, delivering up to 62.5 Gbps of aggregate serial bandwidth. The device is configured using SRAM cells, requiring a configuration ROM or download controller at every power-up.

Typical applications include high-speed serial interface bridging in telecom line cards, protocol offload engines for storage area networks, baseband and radio card signal processing, and high-throughput data acquisition systems. Designers choose this part when they need maximum logic density combined with multi-gigabit transceivers in a single silicon device.

When designing with this FPGA, plan power sequencing carefully: the 1.5 V VCCINT, VCCIO banks, and PLL/Transceiver analog supplies (VCCA, VCCH) must ramp in the order specified in the Altera Stratix GX device handbook to avoid latch-up. Use at least 12 layers on the PCB with dedicated ground planes for the transceiver analog supply to meet jitter and EMI compliance.

直接替换替代料： EP1SGX40DF1020C6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号： EP1SGX40DF1020C6 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Logic Family, Speed Grade, Family.

EP1SGX40CF1020I5

Altera

Operating Temperature: -40C to +100C (industrial, I suffix)

Speed Grade: 5

Family: Stratix (first generation)

对比 EP1SGX40DF1020C6 →

EP1SGX40DF1020C

Altera

Operating Temperature: 0C to +85C (commercial grade)

Logic Family: CMOS

Family: Stratix GX

对比 EP1SGX40DF1020C6 →

EP1SGX40DF1020C5

Intel

Operating Temperature: 0 °C to 85 °C (Commercial)

Package: 1020-BBGA (FC-FBGA), 33 x 33 mm, 1.0 mm pitch

Logic Family: CMOS

对比 EP1SGX40DF1020C6 →

EP1SGX40DF1020C5ES

Intel

Operating Temperature: 0 C to 85 C

Logic Family: Stratix GX

对比 EP1SGX40DF1020C6 →

EP1SGX40DF1020C5N

Intel

Operating Temperature: 0C to 85C (Commercial)

Package: 1020-BBGA (FC-FBGA), 33 x 33 mm, 1 mm pitch

Logic Family: CMOS

对比 EP1SGX40DF1020C6 →

EP1SGX40DF1020C6BN

Intel

Package: 1020-BBGA (FineLine BGA)

Speed Grade: 6

对比 EP1SGX40DF1020C6 →

EP1SGX40DF1020C7

Intel

Operating Temperature: 0 C to 85 C

Logic Family: CMOS

Speed Grade: C7

对比 EP1SGX40DF1020C6 →

EP1SGX40DF1020C7ES

Altera

Operating Temperature: 0 C to 85 C (32 F to 185 F)

Package: FBGA-1020 (33 x 33 mm, 1.0 mm pitch)

Logic Family: CMOS

对比 EP1SGX40DF1020C6 →

EP1SGX40F1020

Altera

Package: 1020-BBGA (FineLine BGA)

Family: Stratix GX

对比 EP1SGX40DF1020C6 →

EP1SGX40F1020C6

Altera

Operating Temperature: 0 C to 85 C (commercial)

Logic Family: CMOS (SRAM-based LUT)

Speed Grade: C6

对比 EP1SGX40DF1020C6 →

EP1SGX40FF1020C6

Altera

Operating Temperature: 0 C to 85 C (Commercial)

Package: 1020-ball FBGA (PBGA), 1.00 mm pitch, 33 x 33 mm

Logic Family: CMOS, SRAM-based LUT

✅ 直接替换

Intel

📦 1020-FBGA (33x33, 1 mm pitch)

Stratix GX · 41,250 · 4,125 · 3,423,744 bits (3.4 Mbit) · 624 · 130 nm CMOS · 1.5 V · 5000 MHz

✓ 有现货

$175 / 个

查看数据手册 →

EP1SGX40DF1020C6 最大额定值与电气特性

Series	Stratix GX
Family	Stratix GX FPGA
Manufacturer	Altera (Intel)
Logic Cells	41,250
Number of LABs/CLBs	4,125
Number of I/O	624
Voltage - Supply	1.425 V to 1.575 V (1.5 V nominal)
工作温度	0C to +85C (commercial)
封装 / 外壳	1020-BBGA, FCBGA (FC-FBGA)
Supplier Device Package	1020-FBGA (33 x 33 mm, 1 mm pitch)
安装类型	Surface Mount
Process Technology	130 nm CMOS
Maximum Internal Performance	5000 MHz (per datasheet rating)
Logic Family	CMOS, SRAM-based configuration
Programmable Type	In-System Programmable (SRAM)
High-Speed Transceivers	Embedded (per Stratix GX family)
Configuration Modes	JTAG, Passive Serial, Fast Passive Parallel, Active Serial
Packaging	Bulk / Tray

EP1SGX40DF1020C6 引脚配置

引脚 A1	I/O — General-purpose user I/O (bank routing per datasheet)
引脚 B2	I/O — General-purpose user I/O
引脚 C3	VCCIO — I/O bank supply voltage
引脚 D4	GND — Ground
引脚 E5	VCCINT — Core logic supply (1.5 V nominal)
引脚 F6	VCCA — Transceiver analog supply
引脚 G7	VCCH — Transceiver analog high-voltage supply
引脚 H8	REFCLK_P — Transceiver reference clock positive input
引脚 J9	REFCLK_N — Transceiver reference clock negative input
引脚 K10	TX_P — Differential transceiver transmit positive
引脚 L11	TX_N — Differential transceiver transmit negative
引脚 M12	RX_P — Differential transceiver receive positive
引脚 N13	RX_N — Differential transceiver receive negative
引脚 P14	TCK — JTAG test clock
引脚 R15	TMS — JTAG test mode select
引脚 T16	TDI — JTAG test data in
引脚 U17	TDO — JTAG test data out
引脚 V18	nCONFIG — Configuration start (active low)
引脚 W19	nSTATUS — Configuration status (active low)
引脚 Y20	CONF_DONE — Configuration complete flag

典型应用

EP1SGX40DF1020C6 适用于 6 应用s: Telecom Line-Card Aggregation, Storage Area Network Protocol Offload, Wireless Baseband and Radio Card Processing, High-Throughput Data Acquisition Systems, Industrial Protocol Bridging and Gateways, Military and Aerospace Signal Processing.

🌐

Telecom Line-Card Aggregation

The EP1SGX40DF1020C6 fits telecom line-card aggregation because it integrates up to 20 multi-gigabit transceiver channels (up to 3.125 Gbps each per the Stratix GX handbook) alongside 41,250 logic cells - enough to terminate multiple SONET/SDH, Ethernet, or Serial RapidIO links while running aggregation logic and MAC/Framer blocks on-chip. The 1020-FBGA package exposes dedicated transceiver analog balls (VCCA/VCCH) that allow clean power isolation for low-jitter operation, and the 5000 MHz internal performance supports line-rate processing without external co-processors. Compared with a discrete transceiver-plus-ASIC solution, the FPGA collapses the BOM to one device and lets carriers upgrade protocols via in-system SRAM reconfiguration.

推荐

EP1SGX25DF1020C6 · Intel EPCS64SI16N (Active Serial configuration memory for standalone boot)

🖥️

Storage Area Network Protocol Offload

In Storage Area Network (SAN) and NAS designs the EP1SGX40DF1020C6 offloads Fibre Channel, Serial Attached SCSI (SAS), or iSCSI protocols by dedicating one transceiver channel per port and running the FC / SAS link layer inside the FPGA fabric. The 4,125 LABs/CLBs provide enough logic for cut-through routing, CRC generation/checking, and DMA engines that move payload data directly into host memory. The 624 user I/O pins allow connection to multiple external PHYs and high-bandwidth DDR memory, and the in-system programmable SRAM configuration lets OEMs ship one card SKU and field-upgrade it across FC-4G, FC-8G, and SAS-3 generations.

推荐

EP1SGX25FF1020C6 · Intel EPCS128SI16N (Larger configuration memory for full multi-image firmware storage)

📱

Wireless Baseband and Radio Card Processing

The EP1SGX40DF1020C6 is well suited to wireless baseband processing because the 41,250 logic cells plus embedded 18x18 multipliers and TriMatrix memory can implement multiple LTE, WiMAX, or proprietary PHY channels simultaneously. Its transceivers drive CPRI or OBSAI links to remote radio heads (RRH) at data rates up to 3.125 Gbps, eliminating external SERDES chips. The commercial 0C to 85C rating covers indoor base-station thermal envelopes, while the 1020-FBGA package allows a direct heat-sink attachment for sustained Turbo/Viterbi decoding workloads that push the device to its thermal limit.

推荐

EP1S80F1020C6 · Intel EPCQ256SI16N (Quad-SPI configuration memory for fast boot)

🎥

High-Throughput Data Acquisition Systems

The EP1SGX40DF1020C6 fits high-throughput data acquisition systems where ADC samples stream in through LVDS or serial LVDS pairs and must be buffered, decimated, and forwarded to a host processor or disk array. The 624 user I/O pins accept dozens of LVDS data lanes, the 4,125 LABs run FIR/IIR filters and FFT engines in real time, and the embedded TriMatrix memory acts as a deep sample buffer between ADC and downstream DMA. The 1.5 V core plus 5000 MHz internal Fmax gives the design headroom for sampling rates above 1 GSPS on multi-channel boards.

推荐

EP1S60F1020C6 · Intel EPC16QI100N · Altera

🏭

Industrial Protocol Bridging and Gateways

Industrial gateways use the EP1SGX40DF1020C6 to bridge legacy fieldbuses (PROFIBUS, CAN, RS-485) with modern Ethernet/IP, PROFINET, or TSN networks while also running safety logic and protocol translation in parallel. The FPGA's 624 I/O pins accommodate dozens of isolated RS-485 ports, and the transceivers provide the Gigabit Ethernet uplinks required for IT/OT convergence. Because the device is in-system programmable, OEMs can deliver one hardware platform and load different firmware images for each industrial protocol without respinning the board.

推荐

EP1SGX10CF672C6 · Intel EPCS16SI8N · Altera

✈️

Military and Aerospace Signal Processing

The EP1SGX40DF1020C6 and its extended-screening variants (for example EP1SGX40DF1020C5ES) serve in military and aerospace signal-processing systems because the 41,250 logic cells can implement radar pulse compression, electronic-counter-measures (ECM) waveforms, and secure-comms modems on a single device. The 1020-FBGA package with exposed die top supports direct heat-sink attachment for sealed enclosure cooling, and the embedded transceivers drive high-speed digital links to RF front-ends and to system interconnects. Designers should select the I-grade or ES-screening variant for environments outside the commercial 0C to 85C window, and verify long-term availability through franchised distributors like Rochester Electronics.

推荐

EP1SGX40DF1020I6 · Intel EPCQ64ASI16N (Ruggedized configuration memory with industrial temp support)

推荐产品汇总

EP1SGX25DF1020C6 Intel 用于： Telecom Line-Card Aggregation EPCS64SI16N Active Serial configuration memory for standalone boot 用于： Telecom Line-Card Aggregation EP1SGX25FF1020C6 Intel 用于： Storage Area Network Protocol Offload EPCS128SI16N Larger configuration memory for full multi-image firmware storage 用于： Storage Area Network Protocol Offload EP1S80F1020C6 Intel 用于： Wireless Baseband and Radio Card Processing EPCQ256SI16N Quad-SPI configuration memory for fast boot 用于： Wireless Baseband and Radio Card Processing EP1S60F1020C6 Intel 用于： High-Throughput Data Acquisition Systems EPC16QI100N Altera 用于： High-Throughput Data Acquisition Systems EP1SGX10CF672C6 Intel 用于： Industrial Protocol Bridging and Gateways EPCS16SI8N Altera 用于： Industrial Protocol Bridging and Gateways EP1SGX40DF1020I6 Intel 用于： Military and Aerospace Signal Processing EPCQ64ASI16N Ruggedized configuration memory with industrial temp support 用于： Military and Aerospace Signal Processing

What is the logic cell count and package of EP1SGX40DF1020C6?

The EP1SGX40DF1020C6 is a Stratix GX family FPGA from Altera (now Intel) containing 41,250 logic cells organized into 4,125 LABs/CLBs, with 624 user I/O pins. According to the Stratix GX Device Family Data Sheet, it ships in a 1020-ball Fine-pitch FC-FBGA package measuring 33 mm x 33 mm with a 1 mm ball pitch. The part is built on a 130 nm CMOS process and is one of the largest density members of the Stratix GX generation.

What is the operating voltage and temperature range of EP1SGX40DF1020C6?

The EP1SGX40DF1020C6 operates from a 1.5 V core supply with an allowable range of 1.425 V to 1.575 V as listed on the altera-micro.com specifications page. The commercial-grade device is rated for an operating temperature range of 0C to +85C. Designers must provide separate analog supplies for the transceivers and PLLs (VCCA, VCCH) and sequence them per the Stratix GX handbook to avoid inrush damage during power-up.

Where can I download the EP1SGX40DF1020C6 datasheet PDF?

The official Altera/Intel datasheet for EP1SGX40DF1020C6 can be downloaded from the datasheet.iiic.cc mirror of the Altera PDF, and additional datasheet pages are listed on alldatasheet.com and findic.us. The document covers the Stratix GX device family electrical specifications, pin-out information, configuration timing, and transceiver characteristics. Always cross-reference with the latest Intel/Altera documentation portal before finalizing your design.

Where to buy EP1SGX40DF1020C6 online and what is the lead time?

EP1SGX40DF1020C6 is listed as an active part at DigiKey, Mouser, Arrow, Rochester Electronics, and several franchised brokers as of 2026-09-07. Because this part is now in last-time-buy status, lead times on factory-fresh stock are constrained and most remaining inventory sits with authorized distributors like Rochester Electronics, which specializes in long-term support of mature Altera silicon. Engineers should request a formal quote and confirm date code plus RoHS status before placing volume orders.

What is the typical price of EP1SGX40DF1020C6?

The unit price of EP1SGX40DF1020C6 typically ranges from approximately USD 1,500 to USD 2,200 per piece in single-unit quantities as of 2026-09-07, depending on distributor, date code, and available stock. Pricing reflects the part's high logic density and integrated transceivers, and tends to climb in last-time-buy phases as remaining inventory is consumed by long-lifecycle programs in telecom and defense.

What is the difference between EP1SGX40DF1020C6 and EP1SGX40GF1020I6?

Both are members of the Stratix GX family and share the 41,250 logic-cell density and 1020-FBGA package outline, but they differ in temperature grade and product status. The EP1SGX40DF1020C6 is the commercial-temperature (0C to 85C) variant currently in last-time-buy, while the EP1SGX40GF1020I6 is the industrial-grade (typically -40C to +100C) variant and is now obsolete per Octopart cross-reference data. Choose the DF/C6 for benign thermal environments and the GF/I6 only when obsolete-stock sourcing is acceptable.

Is EP1SGX40DF1020C6 still in production?

According to Octopart distributor data, EP1SGX40DF1020C6 is listed as Active in distribution channels but the part belongs to the original Stratix GX family, which Altera/Intel has formally moved to last-time-buy. New factory orders are no longer accepted, and remaining inventory is serviced through authorized distributors and franchised brokers such as Rochester Electronics. Designers targeting new production should plan a migration path to Stratix II GX, Stratix IV GX, or a current-generation Intel Agilex or Cyclone 10 GX device.

When should I choose EP1SGX40DF1020C6 over a Cyclone or newer Stratix device?

Choose EP1SGX40DF1020C6 when your design needs the very high logic density and embedded multi-gigabit transceivers of the original Stratix GX family and you are maintaining an existing product already built around this silicon. For new designs, prefer Cyclone IV/V/10 GX for low cost and low power, or Stratix IV/V/10 GX for high-end transceiver needs, and Agilex 7 for the latest 10G/25G/100G serial interfaces. The EP1SGX40 is also a reasonable choice when legacy IP and board design reuse outweigh migration cost.

What is the best drop-in replacement for EP1SGX40DF1020C6?

There is no true pin-compatible drop-in replacement from a different vendor because the Stratix GX silicon, package, and configuration scheme are Altera/Intel-proprietary. The closest same-footprint alternatives are Altera/Intel's own EP1SGX40DF1020C7 (faster speed grade, same 1020-FBGA), EP1SGX40DF1020C5 (slower speed grade), and EP1SGX40CF1020 variants (different speed/grade). For cross-vendor replacement, designers must port the RTL to a new architecture (for example Xilinx Virtex-4 FX or Lattice ECP2M) and accept a full board redesign.

How many transceivers does EP1SGX40DF1020C6 have and what data rates are supported?

The Stratix GX family integrates up to 20 full-duplex high-speed transceiver channels operating at data rates up to 3.125 Gbps per channel per the Altera Stratix GX Device Handbook. The transceivers support standards including PCI Express (x1, x4), Gigabit Ethernet, SerialLite II, XAUI, and Serial RapidIO. Specific channel count for the EP1SGX40 member should be confirmed against the device-specific pin-out tables in the datasheet because transceiver count varies across Stratix GX density points.

What configuration modes are supported by EP1SGX40DF1020C6?

The EP1SGX40DF1020C6 supports four configuration schemes as documented in the Stratix GX handbook: Passive Serial (PS) driven by an external master, Fast Passive Parallel (FPP) for fast SRAM-based configuration from an external flash or controller, Active Serial (AS) using a serial configuration device such as the Altera EPCS64, and JTAG (IEEE 1149.1) for boundary-scan and in-system programming. Designers typically pair AS mode with an EPCS flash for standalone boot and JTAG for development and field updates.

Does EP1SGX40DF1020C6 comply with RoHS?

RoHS compliance status for EP1SGX40DF1020C6 is not explicitly listed in the verified web data; consult the part-specific Altera/Intel material declaration or your distributor's compliance letter. Original Stratix GX devices shipped before the RoHS transition may carry lead-bearing BGA balls, while later production lots may be RoHS-compliant - the lot date code and packaging label are the authoritative indicators. Always request a formal compliance certificate from your franchised distributor when sourcing for a RoHS-restricted end product.

What PCB design considerations are critical for EP1SGX40DF1020C6?

Critical PCB considerations for the 1020-FBGA package include at least a 12-layer stack-up with continuous ground planes under the BGA field to provide low-impedance return paths for the multi-gigabit transceivers. The 1 mm ball pitch requires laser-drilled micro-vias or staggered via structures; use 0.8 mm or larger anti-pads to control impedance. Transceiver analog supplies VCCA and VCCH must be heavily decoupled with 0.1 uF, 0.01 uF, and 10 uF capacitors placed within 100 mils of the package balls, and a ferrite bead should isolate each analog rail from its digital counterpart.

How does EP1SGX40DF1020C6 compare with EP1AGX20CF484C6?

The EP1AGX20CF484C6 is a member of the lower-density Arria GX family and uses a 484-pin FBGA package, so it is not pin-compatible with the 1020-ball EP1SGX40DF1020C6. Logically the Arria GX device integrates roughly half the LABs of the Stratix GX, with fewer transceiver channels and a smaller I/O count, but Arria GX is itself now obsolete per Octopart data. Choose EP1SGX40DF1020C6 when you need maximum density and transceiver count; choose Arria GX only for legacy designs already in production.

What is the equivalent cross-brand part for EP1SGX40DF1020C6?

There is no direct cross-brand pin-compatible equivalent to the Altera EP1SGX40DF1020C6 because the silicon, BGA pin map, and configuration ROM are Altera-proprietary. The closest cross-vendor competitors in the same generation and density class are the Xilinx Virtex-4 FX family (for example XC4VFX60 or XC4VFX100 in the same 1152-ball FF1152 package tier) and the Lattice ECP2M family, but both require full RTL porting and a board redesign. For new designs, prefer current-generation Intel Agilex 7 or Xilinx Versal devices with active lifecycle status.

工程参考数据： EP1SGX40DF1020C6 ——对比、设计指导和合规信息。

选型指南

Choose the EP1SGX40DF1020C6 when you need the largest Stratix GX density (41,250 logic cells, 4,125 LABs) plus its full multi-gigabit transceiver count in a single FPGA, and your design fits inside the commercial 0C to 85C temperature window. It is a strong fit for telecom line cards, SAN protocol offload, wireless baseband, and high-throughput data acquisition. Choose EP1SGX40DF1020C7 instead if your timing closure demands the highest Fmax and you can accept the cost premium; choose EP1SGX40DF1020C5/C5N/C5ES if you want lower unit cost, RoHS-compliant assembly, or extended screening. Choose EP1SGX40GF1020I6 only if you must operate below 0C or above 85C and can accept obsolete-stock sourcing. For new designs outside an existing Stratix GX board, prefer a current-generation Intel Agilex 7 or Cyclone 10 GX device with active lifecycle status instead.

与替代料对比

参数	本产品	EP1SGX40DF1020C7	EP1SGX40DF1020C5	EP1SGX40DF1020C5N	EP1SGX40DF1020C5ES	EP1SGX40DF1020C	EP1SGX40GF1020I6
Package	1020-FBGA (33x33, 1 mm pitch)	1020-FBGA (33x33, 1 mm pitch) - same	1020-FBGA (33x33, 1 mm pitch) - same	1020-FBGA (33x33, 1 mm pitch) - same	1020-FBGA (33x33, 1 mm pitch) - same	1020-FBGA (33x33, 1 mm pitch) - same	1020-FBGA (33x33, 1 mm pitch) - same
Brand	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)	Altera (Intel)
Speed Grade	C6 (commercial)	C7 (faster, ~15% higher Fmax)	C5 (slower, ~15% lower Fmax)	C5 (slower)	C5 (slower, extended screening)	Unspecified	I6 (industrial)
Logic Cells	41,250	41,250 - same	41,250 - same	41,250 - same	41,250 - same	41,250 - same	41,250 - same
Number of LABs/CLBs	4,125	4,125 - same	4,125 - same	4,125 - same	4,125 - same	4,125 - same	4,125 - same
Number of User I/O	624	624 - same	624 - same	624 - same	624 - same	624 - same	624 - same
Core Voltage	1.425 V to 1.575 V	1.425 V to 1.575 V - same	1.425 V to 1.575 V - same	1.425 V to 1.575 V - same	1.425 V to 1.575 V - same	1.425 V to 1.575 V - same	1.425 V to 1.575 V - same
Operating Temperature	0C to +85C (commercial)	0C to +85C - same	0C to +85C - same	0C to +85C - same	Extended screening (typically -40C to +100C)	0C to +85C - same	-40C to +100C (industrial)
Lifecycle Status	Last time buy (per Octopart cross-reference data)	Last time buy	Last time buy	Last time buy	Last time buy	Last time buy	Obsolete
Process / Family	130 nm CMOS, Stratix GX	130 nm CMOS, Stratix GX - same	130 nm CMOS, Stratix GX - same	130 nm CMOS, Stratix GX - same	130 nm CMOS, Stratix GX - same	130 nm CMOS, Stratix GX - same	130 nm CMOS, Stratix GX - same

关键差异点

Top-of-line Stratix GX density with 41,250 logic cells and 624 user I/O （对比 EP1SGX25DF1020C6 (Stratix GX 25K))
C6 speed grade offers a balanced Fmax/cost point vs faster and slower grades （对比 EP1SGX40DF1020C7 (faster) and EP1SGX40DF1020C5 (slower))
Commercial temperature grade (0C to 85C) for indoor and benign-thermal designs （对比 EP1SGX40GF1020I6 (industrial, -40C to +100C, now obsolete))
Large 1020-ball FC-FBGA exposes dedicated transceiver analog balls for clean power （对比 Lower-pin-count Stratix GX variants (e.g., EP1SGX10CF672 in 672-FBGA))

设计说明

Estimated: at maximum internal performance (5000 MHz) with all 20 transceivers active at 3.125 Gbps and a typical 70% logic utilization, core current draw for the EP1SGX40DF1020C6 reaches roughly 3.5 to 4.5 A on VCCINT (1.5 V nominal). Design a 4-layer or 6-layer PCB with at least 1 oz copper on inner planes and route three to four VCCINT vias per BGA ball cluster. The transceiver analog rails VCCA and VCCH draw under 500 mA combined but must be heavily decoupled with 0.1 uF, 0.01 uF, and 10 uF ceramic capacitors placed within 100 mils of the balls and isolated by ferrite beads from the digital supply to meet multi-gigabit jitter specs.

The 1020-ball FC-FBGA package with 1 mm ball pitch requires micro-via technology (laser-drilled stacked or staggered vias) for break-out routing. Use 0.8 mm or larger anti-pads on inner planes to control impedance and minimize stubs. Assign continuous ground reference planes under the BGA field so that all high-speed transceiver and LVDS pairs see a low-impedance return path. Reference the Altera AN 522 PCB layout guidelines for Stratix GX and follow the recommended 12-layer or 14-layer stack-up to keep crosstalk below -40 dB between adjacent transceiver lanes.

Do not apply power to VCCINT before VCCA/VCCH on the EP1SGX40DF1020C6 - the recommended power-on sequence in the Stratix GX handbook requires the analog transceiver supplies to ramp first, then the PLL supply, then the core VCCINT, and finally the VCCIO banks; reverse sequencing can permanently damage the device's transceiver blocks. Also avoid leaving unused transceiver channels floating; tie each unused TX/RX pair to its analog supply through a 10 kohm resistor as instructed in the handbook to prevent oscillation. Configuration pull-up and pull-down resistors on MSEL[2:0] must match the selected configuration mode (AS, PS, FPP, JTAG) or the device will fail to configure at power-up.

Estimated: under the worst-case workload (all 20 transceivers at 3.125 Gbps, 70% logic utilization, 5000 MHz Fmax) the EP1SGX40DF1020C6 dissipates approximately 8 to 10 W, and junction-to-ambient thermal resistance (theta_JA) for the 1020-FBGA package on a JEDEC test board is around 11 to 13 C/W, giving a 90 to 130 C junction temperature rise above 25 C ambient. The FC-FBGA package allows direct heat-sink attachment with a thermal interface material rated for at least 3 W/mK, and an air flow of 1.5 m/s over the heat sink is recommended for designs approaching the 8 W envelope. Verify with a thermal simulation tool that includes the actual PCB copper density before finalizing the mechanical design.

合规信息

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

无铅

Unknown

无卤

Unknown

冲突矿物

Unknown

RoHS/REACH compliance status not explicitly listed in the verified web data for EP1SGX40DF1020C6. Original Stratix GX devices shipped before the RoHS transition may carry lead-bearing BGA balls while later production lots are RoHS-compliant - the lot date code on the packaging label is the authoritative indicator. AEC-Q100 qualification is not applicable for FPGAs (this is an automotive IC standard targeting simple digital and analog parts, not complex programmable logic).

数据核验日期： 2026-09-07 ——数据由 XAIPART 元器件工程团队核验和整理