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EP2A70F1508C9N - APEX II FPGA 67.2K Cells 1060 I/O | Altera
EP2A70F1508C9N

EP2A70F1508C9N - APEX II FPGA 67.2K Cells 1060 I/O | Altera

The Altera (now Intel) EP2A70F1508C9N is a member of the APEX II family of high-density SRAM-based Field-Programmable Gate Arrays (FPGAs). It integrates 3M system gates with 67,200 logic elements, a 1060-pin user I/O count, and operates from a 1.5V core supply (1.425V to 1.575V) at up to 198 MHz internal performance, built on a 0.15 µm CMOS process. The device is housed in a 1508-ball fine-pitch Flip-Chip BGA (FC-FBGA) package. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable routing, and embedded resources such as block RAM, PLLs, and high-speed transceivers. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Unlike fixed-function ASICs, FPGAs are programmed after manufacturing for prototyping, custom datapaths, glue logic, and parallel processing tasks. The APEX II family is engineered for high-density logic implementation with MultiCore architecture combining fine-grain logic with embedded memory. Key features include 1,146,880 bits of embedded system RAM distributed across embedded array blocks (EABs), 1060 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, GTL), four phase-locked loops (PLLs) for clock management, and a MultiVolt core allowing mixed-voltage operation with I/O banks. The 1508-ball FC-FBGA package supports high signal-counting designs while minimizing PCB footprint. The device supports in-system configuration via passive serial, active serial, and JTAG modes, with optional on-chip encryption for design security. The 0.15 µm process delivers a balance of density and power efficiency for telecom, networking, and DSP-intensive applications. A built-in JTAG (IEEE 1149.1) boundary-scan test interface simplifies board-level test. Typical applications include high-speed telecommunication switching, ASIC prototyping, DSP co-processing, networking infrastructure, and parallel coprocessing engines. Designers choose the EP2A70F1508C9N when projects require high logic density and high I/O count in a single device. Note that this part is from a long-discontinued legacy family and is typically procured for maintenance of existing designs or as a known drop-in equivalent. When designing with this device, ensure decoupling capacitance meets APEX II power-supply guidelines, and verify that signal-integrity simulation is performed on high-speed I/O banks. The 1508-ball FC-FBGA requires advanced PCB stack-up with controlled-impedance routing. This page synthesizes distributor availability, same-family drop-in alternatives, and design notes beyond the manufacturer datasheet for engineers maintaining legacy APEX II designs or evaluating second-source equivalents.

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EP2A70F1508I-7 - APEX II FPGA 70K LE 1508-Pin FBGA | Intel
EP2A70F1508I-7

EP2A70F1508I-7 - APEX II FPGA 70K LE 1508-Pin FBGA | Intel

The Intel (formerly Altera) EP2A70F1508I-7 is a member of the APEX II family of Field Programmable Gate Arrays (FPGAs) housed in a 1508-ball FineLine BGA package. The APEX II family combines high-density logic, embedded memory, and dedicated multiplier blocks, targeting data-path intensive DSP and communications applications. The "I" suffix denotes an industrial temperature grade and "-7" indicates the speed grade. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that allows engineers to implement arbitrary digital logic through software-defined configuration rather than fixed silicon. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs (Complex Programmable Logic Devices) and are commonly categorized as programmable logic devices (PLDs) under the broader semiconductor umbrella. They are used when designs require parallel processing, high I/O count, hardware re-programmability, or performance levels that exceed microcontrollers and DSPs. Key features of the EP2A70F1508I-7 include 70,000 logic elements, embedded system blocks (ESBs) for memory and FIFO functions, dedicated multiplier blocks optimized for DSP operations, multi-standard I/O support including LVDS, and a high-speed interconnect fabric. The device supports configuration via serial ROM, parallel ROM, JTAG, or in-system via the Altera (now Intel) Quartus II design tool. The 1508-pin FineLine BGA package provides ample I/O bandwidth for high-pin-count designs and supports high-frequency signal integrity. On the architecture side, APEX II devices use a MultiCore architecture that integrates logic, memory, and multipliers into a unified fabric, eliminating the bottlenecks of segmented FPGAs. Look-Up Tables (LUTs) feed into Logic Elements (LEs) which connect through a hierarchical routing network. The ESB blocks can be configured as dual-port RAM, ROM, or FIFO, and the multiplier blocks can be combined for high-precision arithmetic. This makes the EP2A70F1508I-7 well suited for ASIC prototyping, high-speed DSP pipelines, and communications baseband processing. Typical applications include ASIC prototyping and emulation, telecommunications baseband processing, broadband access equipment, high-speed data-path DSP, and military/aerospace signal processing. The industrial temperature grade also makes it suitable for ruggedized industrial controllers and avionics subsystems. When designing with this device, verify the power budget using the Quartus II PowerPlay Early Power Estimator before PCB layout, because BGA packages complicate rework and require controlled-impedance stack-up planning. Decoupling requires many low-ESR capacitors placed close to the power pins. The peak reflow temperature is rated at 220 C, so the device is MSL-3 (Moisture Sensitivity Level 3) and requires bake-out before assembly if the sealed bag has been open longer than the floor-life allowance. This page synthesizes distributor pricing, drop-in alternatives, application guidance, and lifecycle signals that are not consolidated in the manufacturer datasheet, making component evaluation faster for procurement and engineering teams.

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EP2A70F1508I-8 - APEX II FPGA 70K LE FBGA-1508 | Intel / Altera
EP2A70F1508I-8

EP2A70F1508I-8 - APEX II FPGA 70K LE FBGA-1508 | Intel / Altera

The Intel / Altera EP2A70F1508I-8 is a high-density member of the APEX II FPGA family, delivering approximately 70,000 logic elements in a 1508-ball FineLine BGA package. As part of the APEX II series, it integrates look-up table (LUT)-based logic elements, embedded system blocks (ESBs) for RAM/ROM, and a MultiCore interconnect fabric, enabling designers to combine logic, memory, and dedicated I/O in a single programmable device. An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits by configuring an array of logic blocks and interconnect via SRAM or anti-fuse configuration memory. FPGAs occupy the middle ground between fixed-function ASICs and software-driven processors: they offer hardware-level parallelism and deterministic timing without the NRE cost of an ASIC. Within the programmable-logic taxonomy, the EP2A70F1508I-8 belongs to the high-density SRAM-based FPGA category, sitting above CPLDs and below structured-ASIC platforms such as Intel's HardCopy II follow-on family. Key features of the APEX II EP2A70 series include embedded MultiCore interconnects, support for LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI I/O standards, on-chip PLL clock management, and a dedicated configuration interface supporting Passive Serial (PS), Passive Parallel Synchronous (PPS), Passive Parallel Asynchronous (PPA), and JTAG modes. The FBGA-1508 package with industrial temperature grade (-40C to +100C for the 'I' suffix) suits compute-intensive embedded systems. From an architectural standpoint, the EP2A70F1508I-8 supports MegaWizard Plug-In Manager IP cores including DDR memory controllers, FFT engines, and PCI interfaces. Its MultiCore interconnect provides predictable routing delays, and ESBs can be configured as dual-port RAM or FIFO structures up to 32 Kbits per block, reducing the need for external SRAM in DSP pipelines. Typical applications include high-speed telecommunications backplanes, multi-channel DSP for radar and sonar, ASIC prototyping, broadcast video processing, and industrial machine vision. The industrial temperature grade supports factory-floor and outdoor wireless-infrastructure deployments. When designing with this part, verify Quartus II software version compatibility - APEX II support is mature in Quartus II versions up to 13.0 but unsupported in newer Quartus Prime Pro editions. Designers migrating to newer designs should evaluate Cyclone IV/V or MAX 10 as successors, as APEX II is in long-term support mode. This page synthesizes current distributor pricing, verified drop-in alternatives, and practical design notes compiled from the Intel / Altera APEX II datasheet family, offering engineering context not duplicated on a single manufacturer page.

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EP2A70F1508I-9 - APEX II FPGA 70K LE, FBGA-1508 | Altera / Intel
EP2A70F1508I-9

EP2A70F1508I-9 - APEX II FPGA 70K LE, FBGA-1508 | Altera / Intel

The Altera / Intel EP2A70F1508I-9 is a high-density APEX II family Field-Programmable Gate Array (FPGA) with 70,000 typical gates, fabricated on a 0.18 micrometer CMOS process and housed in a 1508-ball FineLine BGA (FBGA-1508) package. The part is qualified for the industrial temperature range (-40C to +100C ambient) and ships in the -9 speed grade targeting high-throughput datapath and on-chip memory applications. An FPGA is a programmable logic device belonging to the broader category of programmable logic devices (PLDs), which also includes CPLDs and SPLDs. Within the PLD hierarchy, APEX II sits at the high-density end, sharing the silicon taxonomy with structured ASICs: PLD -> CPLD/FPGA -> high-density FPGA -> SRAM-based FPGA. The device is configured by an on-chip SRAM-based configuration memory, allowing in-system reprogrammability without removing the part from the board. This makes APEX II devices suitable for ASIC prototyping, logic emulation, and high-density glue logic. Key features of the EP2A70F1508I-9 include 70,000 typical gates, embedded system blocks (ESBs) for on-chip dual-port RAM and ROM, fast row/column interconnect, dedicated clock trees and PLLs, and multi-voltage I/O support (LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS, LVPECL) on a per-pin basis. The APEX II architecture also integrates True-LVDS circuitry for high-speed differential signaling at hundreds of megabits per second, reducing BOM cost relative to external transceiver ICs. The EP2A70F1508I-9 is built around a MultiCore architecture: each logic element (LE) contains a 4-input look-up table (LUT), a programmable register, and dedicated carry and cascade chains. Embedding the ESBs in every row/column of the logic array provides efficient distributed memory and FIFO support with predictable timing closure, a notable advantage over older distributed-RAM architectures in datapath-intensive designs such as protocol bridges and telecom backplanes. Typical applications include high-speed telecommunications backplanes, ASIC prototyping and emulation, video and image processing pipelines, network routers and switches, and industrial control systems with high logic density. The wide I/O count and True-LVDS support also suit multi-channel data acquisition and serializer/deserializer (SerDes) emulation when used with external transceivers. When designing with EP2A70F1508I-9, allocate FPGA I/O banks by voltage reference and use the Quartus II design software (legacy APEX II support) for synthesis, place-and-route, and timing analysis. Note that APEX II is a mature product family - confirm long-term supply through Intel's product longevity program before committing to new designs. The 1508-ball FBGA requires a multi-layer PCB with controlled-impedance traces and matched-length differential pairs. This page synthesizes distributor pricing, drop-in speed-grade and package alternatives sourced from the XAIPART internal database, and practical design notes not found on any single manufacturer datasheet - giving engineers a single reference for selection, sourcing, and PCB bring-up.

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EP2A70F1508I7 - APEX II FPGA 3M Gates 67.2K Cells 1.5V FC-FBGA-1508 | Altera
EP2A70F1508I7

EP2A70F1508I7 - APEX II FPGA 3M Gates 67.2K Cells 1.5V FC-FBGA-1508 | Altera

The Altera EP2A70F1508I7 is a high-density APEX II family FPGA delivering 3,000,000 system gates and 67,200 logic elements in a 1508-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package. Built on a 0.15 µm process, the device targets 420 MHz internal operation at a 1.5 V core supply, with the -7 speed grade and industrial temperature range (I7 suffix). It belongs to the APEX II architecture, a Look-Up Table (LUT)-based SRAM programmable logic family with embedded memory, embedded multipliers, and dedicated high-speed I/O. An FPGA (Field Programmable Gate Array) is a reprogrammable integrated circuit that lets engineers implement arbitrary digital logic via a hardware description language. FPGAs sit between ASICs and CPUs in the design flexibility/performance trade-off: more flexible than ASICs (no mask costs), faster and more deterministic than microcontrollers (parallel hardware execution). The APEX II family extends Altera's APEX architecture with MultiCore interconnect, supporting fine-grain logic and coarse-grain embedded memory blocks for DSP-style datapaths. Key features include 67,200 logic elements, embedded system blocks (ESBs) for RAM/ROM, embedded multiplier blocks, and high-speed LVDS-compatible I/O. The -7 industrial speed grade specifies a -40 °C to +85 °C operating range. The 1508-pin FC-FBGA package is a flip-chip BGA with controlled-impedance substrate routing, enabling >100 MHz LVDS and parallel external memory interfaces. Architecture depth: APEX II uses a four-level hierarchy of logic elements (LE), logic array blocks (LAB), MegaLAB structures, and embedded system blocks. Embedded multipliers support DSP operations without burning general-purpose logic. The MultiCore interconnect routes signals between MegaLABs and I/O structures using a continuous-bandwidth architecture that improves timing predictability for high-fanout nets. Typical applications include telecom line cards, high-speed image processing, ASIC prototyping, parallel DSP, and data-acquisition front-ends. The 1.5 V core and 1508-pin FC-FBGA make it suitable for systems that need high logic density plus embedded arithmetic. When designing with this device, mind PCB BGA escape routing, controlled-impedance differential pairs for LVDS, and adequate cooling (FC-FBGA thermal pad must be soldered to the PCB thermal land). Use Altera Quartus II for synthesis and place-and-route; verify timing closure before sign-off. This page synthesizes distributor pricing, parametric data, and drop-in alternatives drawn from manufacturer datasheets and live distributor feeds, packaged for engineers who need at-a-glance answers.

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EP2A70F1508I8 - APEX II FPGA 67.2K Cells | Altera | FC-FBGA-1508
EP2A70F1508I8

EP2A70F1508I8 - APEX II FPGA 67.2K Cells | Altera | FC-FBGA-1508

The Altera (now Intel PSG) EP2A70F1508I8 is a member of the APEX II family of high-density SRAM-based Field Programmable Gate Arrays (FPGAs), built on a 0.15 µm CMOS process with a 1.5 V core supply. The device integrates approximately 3 million system gates across 67,200 logic elements, with embedded system blocks supporting LVDS, PLLs, and on-chip CAM. It is offered in a 1508-pin flip-chip FineLine BGA (FC-FBGA) package rated for the industrial temperature range (-40 °C to +85 °C). A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O can be programmed by the end user after manufacture. FPGAs sit between general-purpose microcontrollers (fixed instruction set, software-defined behavior) and application-specific integrated circuits (ASICs, fixed hardware). Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), under digital logic semiconductors, under integrated circuits. APEX II was positioned by Altera as a high-density platform for parallel datapath processing, telecommunications, and DSP-style compute before the Stratix and Cyclone families replaced it. Key features of the EP2A70F1508I8 include 1,140 Kbits of embedded SRAM, 4 phase-locked loops (PLLs), support for LVDS I/O at data rates up to 840 Mbps, and a true LVDS-compatible output structure. The device supports multi-voltage I/O (1.5 V, 1.8 V, 2.5 V, 3.3 V) on a per-bank basis via bank-level reference voltages, enabling glueless interfacing to legacy and modern peripherals. The FC-FBGA-1508 package provides high pin density suitable for high-I/O-count designs. The APEX II architecture combines a logic array block (LAB) fabric with embedded system blocks (ESBs) that can be configured as RAM, ROM, CAM, or multiplier blocks. MultiTrack interconnect provides predictable routing delays for synchronous design closure. The 0.15 µm process delivered an internal performance envelope in the range of 200-300 MHz depending on design utilization. Typical applications include high-speed telecommunication line cards, parallel DSP pipelines, ASIC prototyping, and bus-protocol bridging. The large logic capacity makes the EP2A70F1508I8 well suited to designs that would today be mapped onto Stratix or Cyclone 10 devices but where long-term production or legacy re-spin constraints apply. When designing with the EP2A70F1508I8, ensure that the Quartus II (or Altera MAX+PLUS II legacy) toolchain is used for synthesis, place-and-route, and timing closure. Confirm availability through authorized distributors, since this device is no longer in active production; long lead times and last-time-buy notices are typical. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not found in the original Altera datasheet, enabling rapid comparison for engineers maintaining APEX II based systems.

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EP2A70F1508I9 - APEX II 70K LE FPGA, 1508 FC-FBGA | Intel/Altera
EP2A70F1508I9

EP2A70F1508I9 - APEX II 70K LE FPGA, 1508 FC-FBGA | Intel/Altera

The Intel (formerly Altera) EP2A70F1508I9 is a high-density APEX II family Field-Programmable Gate Array (FPGA) built on a 0.18 µm (0.15 µm effective) CMOS process and housed in a 1508-pin FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package. The device integrates 3 million system gates (approximately 67,200 logic elements / cells) and operates at a maximum internal clock frequency of 198 MHz with a core supply voltage of 1.5 V, making it suitable for high-throughput parallel logic, datapath and memory-intensive designs. An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows hardware engineers to implement arbitrary digital logic through a configuration bitstream stored in SRAM. Within the digital IC taxonomy, the APEX II device sits between a pure ASIC and a CPLD: it offers ASIC-class gate density (>1M gates) and dedicated multiplier/Memory blocks while preserving in-system reprogrammability, placing it under the broader hierarchy of programmable logic > PLD > FPGA > high-density SRAM-based FPGA. The APEX II family specifically targets multi-gigabit datapath, communications, and DSP front-end applications. Key features of the EP2A70F1508I9 include up to 67,200 logic elements, embedded system blocks (ESBs) for on-chip dual-port RAM, CAM, and FIFO functions, dedicated carry/chain and multiplier support, and multiple embedded Phase-Locked Loops (PLLs) for clock multiplication and skew control. The -I9 speed/temperature grade indicates an industrial temperature range (typically -40 °C to +100 °C junction) with the -9 performance bin, offering the highest speed within the APEX II family. The FC-FBGA-1508 package provides high I/O density and a thermally efficient flip-chip interface. Architecturally, the APEX II device uses a MultiCore architecture combining fine-grain logic elements (LEs) with coarse-grain Embedded System Blocks (ESBs), each ESB containing RAM, product-term logic, and CAM. Configuration is loaded from an EPC serial or parallel configuration device via the Passive Parallel Synchronous (PPS), Passive Parallel Asynchronous (PPA), Passive Serial (PS), or JTAG modes, allowing flexible boot sequencing for system-on-chip and prototyping platforms. Typical applications for EP2A70F1508I9 include high-speed communication protocol bridges (UART, SPI, parallel RapidIO), DSP co-processing front-ends, image/video preprocessing pipelines, telecommunications line cards, ASIC prototyping, and industrial control systems that require deep logic capacity combined with on-chip memory. Engineers usually select this part when designs exceed Cyclone-class densities but do not yet justify a Cyclone III/IV migration cost. When designing with the EP2A70F1508I9, always include proper power-rail decoupling and observe the multi-voltage supply requirement (VCCINT for core, VCCIO banks for I/O, VCCP_PLL, VCC_PLL). Maintain controlled-impedance PCB traces for global clock nets, and ensure thermal relief via sufficient copper area or airflow since the FC-FBGA package concentrates all dissipation through the flip-chip BGA balls. JTAG programming support (IEEE 1149.1) is mandatory for boundary-scan test in production. This page synthesizes distributor pricing, APEX II drop-in speed/pinout variants, and practical design notes not aggregated on any single distributor page.

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EP2A70F1508I9N - 70K LE APEX II FPGA, 1.5V, 1508-FBGA | Altera
EP2A70F1508I9N

EP2A70F1508I9N - 70K LE APEX II FPGA, 1.5V, 1508-FBGA | Altera

The Altera EP2A70F1508I9N is a high-density APEX II family Field-Programmable Gate Array (FPGA) offering 3 million system gates, 67,200 logic elements, and a maximum internal frequency of 198 MHz, fabricated on a 0.15 µm CMOS process and supplied from a 1.5 V core rail, housed in a 1508-pin Fine-pitch Chip-scale Ball Grid Array (FC-FBGA) package. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be electrically reconfigured by the end user to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy: an ASIC delivers the highest performance and lowest unit cost but cannot be changed after tape-out, a processor offers maximum flexibility at the cost of deterministic real-time behaviour, while an FPGA gives the designer hardware-level parallelism and re-programmability in a single device. The APEX II family is part of the broader programmable logic taxonomy: programmable logic -> CPLD/FPGA -> SRAM-based FPGA -> high-density FPGA. Key features of the EP2A70F1508I9N include 198 MHz maximum internal operation, embedded system blocks (ESBs) for on-chip memory and FIFO functions, support for multiple I/O standards including LVTTL, LVCMOS, PCI, and LVDS, and a True-LVDS capable high-speed interface. The device also integrates Phase-Locked Loops (PLLs) for clock management, dedicated multiplier blocks, and an in-system programmability interface via the passive serial or JTAG configuration ports. Technically, the APEX II architecture combines a fine-grained logic-element fabric with coarse-grained embedded system blocks, allowing efficient mapping of both datapath and control logic. The 0.15 µm process supports 1.5 V core operation, which reduces dynamic power compared to earlier 2.5 V families, while the high gate count and rich I/O capability enable system-on-chip integration in a single package. Typical applications include high-speed telecommunications infrastructure, ASIC prototyping, DSP co-processing, and image-processing pipelines. The combination of high gate density and ample I/O bandwidth also makes the device suitable for test-and-measurement instrumentation and software-defined radio front-ends. When designing with the EP2A70F1508I9N, pay close attention to the FC-FBGA ball-pitch and PCB stack-up: signal integrity depends on controlled-impedance routing and matched-length pairs. Power-rail decoupling and thermal management (the FC-FBGA package requires a thermal pad tied to a low-impedance ground) are equally critical to device reliability at 198 MHz. This page synthesizes distributor pricing, APEX II family datasheets, and drop-in alternatives not found in the manufacturer datasheet - a practical engineering reference for new designs and legacy board support.

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EP2A70F1736C7 - 70K LE APEX II FPGA 1736-BGA | Altera (Intel PSG)
EP2A70F1736C7

EP2A70F1736C7 - 70K LE APEX II FPGA 1736-BGA | Altera (Intel PSG)

The Altera (Intel Programmable Solutions Group) EP2A70F1736C7 is a high-density APEX II family FPGA packaged in a 1736-ball FineLine BGA (FLGA / BGA-1736) and rated for commercial temperature operation. Built on a 0.18 micrometer CMOS process, the APEX II architecture integrates up to 70,000 logic elements (LEs) with embedded system blocks, multiplier blocks, and up to 1.125 Mbits of embedded SRAM. According to the APEX II family data sheet, the device is targeted at high-performance, system-on-a-chip designs combining logic, memory, and DSP. What is a Field-Programmable Gate Array? An FPGA is a programmable logic device whose internal architecture can be configured by the end user after manufacture, allowing custom digital circuits to be implemented without fabricating a custom ASIC. FPGAs sit within the broader category of programmable logic devices (PLDs), alongside simpler CPLDs. APEX II devices extend the classic FPGA role with embedded multiplier blocks, embedded SRAM blocks, and high-speed I/O, placing them in the same tier as high-performance DSP-capable FPGAs. Key features of the EP2A70F1736C7 include 70,000 logic elements, approximately 1,125 Kbits of embedded RAM, embedded multiplier blocks for DSP functions, four PLLs for clock management, and multi-voltage I/O support including LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards. The 1736-pin BGA package exposes all general-purpose I/O plus dedicated clock, configuration, and JTAG pins, while the F1736 package designation also indicates a RoHS-compliant lead-free ball finish. Architecturally, the device pairs a multi-level LUT-based logic fabric with embedded system blocks (ESBs) used for dual-port RAM, ROM, and FIFO functions. Embedded multiplier blocks accelerate DSP operations such as FIR filtering and FFT butterflies. Four PLLs provide up to eight clock outputs for high-speed synchronous design, while the configuration block supports serial, parallel, and JTAG-based configuration from external PROM or host controller. Typical applications include high-throughput DSP pipelines, telecom baseband processing, networking line cards, industrial motion control, and mil/aero system prototyping. The 70K LE / 1.125 Mbit RAM combination makes it well-suited for medium-sized, multiplier-rich designs where DSP throughput and on-chip memory bandwidth dominate the system constraint. When designing with this device, observe the recommended decoupling scheme (100 nF + bulk ceramic per VCC plane), maintain signal-integrity routing rules for LVDS/HSTL pairs, and supply all required configuration pull-up/pull-down resistors during power-up. Boundary-scan and JTAG access should be reserved for in-system programming and post-assembly verification. This page consolidates distributor inventory, drop-in APEX II alternatives, and design notes not available in the bare data sheet.

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EP2A70F1736C8 - APEX II 70K LE FPGA, 1736-Pin FCBGA | Intel
EP2A70F1736C8

EP2A70F1736C8 - APEX II 70K LE FPGA, 1736-Pin FCBGA | Intel

The Intel EP2A70F1736C8 is a member of the APEX II FPGA family, delivering 67,200 logic elements (LEs) with embedded system-on-chip integration in a 1736-ball Fine-pitch Ball Grid Array (FC-BGA) package. Built on a 1.5 V core supply (1.425 V to 1.575 V range) with 0.18 µm process geometry, this device integrates 1,146,880 bits of embedded RAM and MultiCore interconnect for high-bandwidth data flow between logic array blocks. A Field-Programmable Gate Array (FPGA) is a programmable logic device built from configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be rewired post-manufacturing to implement arbitrary digital circuits. APEX II extends this with dedicated memory, PLLs, and high-speed interfaces, occupying a tier between classical FPGAs and ASICs in the programmable logic taxonomy (PAL/CPLD -> FPGA -> SoC FPGA -> ASIC). APEX II was Intel's (Altera) flagship high-density FPGA family of the early 2000s. Key features of the EP2A70F1736C8 include 67,200 logic elements, 1,146,880 embedded RAM bits, MultiCore interconnect architecture, and support for high-speed LVDS and external SRAM interfaces. The FC-BGA-1736 package supports the I/O density required for memory-rich applications such as telecommunications switching and high-speed data acquisition, while industrial-grade operating range (0°C to 85°C TJ) covers workstation, telecom, and instrumentation deployments. The device uses a Look-Up Table (LUT)-based logic fabric with embedded RAM blocks and a high-speed MultiCore interconnect that routes between Logic Array Blocks (LABs) and Embedded System Blocks (ESBs). This architecture supports concurrent processing of wide data paths, common in DSP and packet-processing designs, while the 1736-ball package preserves signal integrity for high fan-out designs. Typical applications include high-speed telecommunications switching, ASIC prototyping, DSP pipeline implementation, and high-density glue-logic consolidation. The high LE count makes it applicable for designs previously requiring multiple CPLDs or smaller FPGAs, replacing them with a single component for cost and board-space reduction. When designing with this device, ensure the Quartus design toolchain version is current for APEX II support, since legacy device support has been deprecated in newer Quartus releases. Plan for I/O bank VCCIO voltage partitioning and confirm configuration scheme (PS, JTAG, or PPA) compatibility with board infrastructure. This page synthesizes distributor pricing, drop-in APEX II alternatives from the same product family, and practical design notes not found in the manufacturer datasheet, enabling engineers to evaluate the part for both legacy maintenance and new design opportunities.

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EP2A70F1736C9 - APEX II 70K LE FPGA 1736-BGA | Intel
EP2A70F1736C9

EP2A70F1736C9 - APEX II 70K LE FPGA 1736-BGA | Intel

The Intel EP2A70F1736C9 is a member of the APEX II family of high-density FPGAs (Field Programmable Gate Arrays) featuring 70,000 typical gates (approximately 53,000 logic elements), housed in a 1736-ball FineLine BGA package. It targets high-performance logic designs including telecommunications, networking, and DSP applications where embedded memory and high I/O count are essential. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, and programmable interconnect fabric. FPGAs are reprogrammable at the silicon level, allowing designers to implement arbitrary digital logic, parallel processing pipelines, and custom state machines without going through an ASIC fabrication cycle. The APEX II family sits in the broader taxonomy: FPGA -> programmable logic device (PLD) -> digital IC -> semiconductor. Compared to CPLDs, FPGAs offer much higher logic density, more embedded memory, and dedicated multiplier/accumulator blocks for signal processing workloads. Key features of the EP2A70F1736C9 include approximately 70,000 typical gates, multiple embedded array blocks (EABs) for efficient RAM/ROM/CAM implementation, dedicated MultiVolt I/O interfaces supporting mixed-voltage systems, and 4 phase-locked loops (PLLs) for clock management. The device supports in-system programmability through IEEE 1149.1 (JTAG) and is built on a 0.18-micron CMOS process with multi-layer metallization. I/O voltages are independently configurable per bank, allowing seamless interface with 1.8V, 2.5V, 3.3V, and 5V logic families on the same die. The architecture combines a logic array with embedded system blocks (ESBs) that can be configured as dual-port RAM, FIFO buffers, or content-addressable memory. Fast row and column interconnect networks deliver predictable timing closure, while Look-Up Table (LUT)-based logic blocks implement combinational and registered functions. Four PLLs provide on-chip clock synthesis, multiplication, division, and phase shifting for high-speed serial and parallel interfaces. Typical applications include high-speed telecommunications line cards, networking switches and routers, DSP co-processors for baseband and image processing, RAID controllers, and complex ASIC prototyping. The device is also used in industrial control and test & measurement equipment where design flexibility and rapid time-to-market outweigh raw unit cost considerations. When designing with the EP2A70F1736C9, pay close attention to power supply decoupling: the 1.5V core, PLL analog supplies, and I/O banks each require bulk and high-frequency ceramic capacitors placed as close as possible to the BGA balls. Thermal management is also critical - the 1736-ball BGA package has limited top-side heat dissipation, so a heatsink or thermal via array beneath the package is recommended for sustained full-clock-rate operation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet. Compared to DigiKey, Mouser, or Octopart product pages, it adds an AEO-optimized FAQ, application-specific design notes, and a strict drop-in alternatives cross-reference for engineers evaluating second-source options.

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EP2A70F724C6 - APEX II 70K LE FPGA, F724 FBGA | Altera | Industrial
EP2A70F724C6

EP2A70F724C6 - APEX II 70K LE FPGA, F724 FBGA | Altera | Industrial

The Altera EP2A70F724C6 is a high-density member of the APEX II FPGA family, integrating approximately 70,000 logic elements (LEs) into a 724-pin FineLine BGA package with industrial-grade temperature rating and a -6 speed grade. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells connected by a hierarchical routing fabric. FPGAs occupy a unique position in the digital design hierarchy: above fixed-function ASICs (which cannot be modified after fabrication) but below microprocessors (which execute software sequentially). APEX II specifically targets high-bandwidth, multiplier-rich applications such as DSP pipelines, baseband processing, and datapath-centric designs where the embedded MultiCore architecture and True-LVDS signaling deliver performance advantages over earlier APEX devices. Key features of the EP2A70F724C6 include 70K LEs, embedded MultiCore multipliers for high-throughput DSP, up to 4 Mbits of embedded SRAM distributed as ESBs (Embedded System Blocks), True-LVDS I/O support on selected pins, and 8 PLLs for clock synthesis. The FineLine BGA-724 package provides high signal-count routing density and is suitable for designs that require 400+ user I/O with controlled-impedance differential pairs. The APEX II architecture combines a LUT-based logic fabric with dedicated carry chains, hardware multipliers, and dual-port RAM blocks, allowing system-on-chip integration that would otherwise require multiple discrete components. Designers use VHDL or Verilog with the Quartus II design suite (versions 2.x through 5.x supported the APEX II family) to implement synthesis, place-and-route, and bitstream generation. Typical applications include telecommunications baseband processing, multi-channel DSP filtering, image and video preprocessing pipelines, ASIC prototyping, and high-speed serial protocol bridging where flexible I/O standards and parallel datapath performance matter most. Designers should plan for a 1.8V/3.3V multi-rail power architecture and ensure thermal vias beneath the FineLine BGA thermal pad; a -6 speed grade typically corresponds to roughly 50% higher Fmax than the slowest -7 grade and is often the volume-production choice. This page synthesizes distributor stock data, same-package APEX II siblings, and practical design guidance not consolidated in the original datasheet.

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EP2AGX125DF25C4G - Arria II GX FPGA 118K LE 572-FCBGA | Intel
EP2AGX125DF25C4G

EP2AGX125DF25C4G - Arria II GX FPGA 118K LE 572-FCBGA | Intel

The Intel EP2AGX125DF25C4G is a high-density Arria II GX Field-Programmable Gate Array (FPGA) fabricated on a 40 nm TSMC low-power process, integrating 118,143 logic elements, 8,315,904 bits of embedded memory, and 260 user I/Os in a 572-ball Flip-Chip BGA (FCBGA) package. It is offered in the commercial speed grade -4 with a 0.9 V core supply, delivering up to 500 MHz fabric performance for high-throughput serial connectivity and digital signal processing. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor belonging to the programmable logic device family (PLD), sitting hierarchically above CPLDs and below fixed-function ASICs in design flexibility. FPGAs contain configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, block RAM, and hard IP cores such as transceivers and PLLs, allowing parallel hardware acceleration of compute-intensive algorithms in networking, video, and industrial imaging without the NRE cost of an ASIC. Key features of the EP2AGX125DF25C4G include up to 8 high-speed serial transceivers supporting PCI Express Gen1/Gen2 and multiple gigabit serial protocols, dedicated 18x18 multipliers for DSP, and on-chip memory that supports true dual-port and FIFO modes. The device integrates embedded memory and DSP blocks to enable single-chip implementation of high-bandwidth pipelines for video processing, baseband modulation, and protocol bridging. The Arria II GX architecture targets mid-range, transceiver-rich designs. Hard IP for PCIe Gen2, 8B/10B and scrambling engines, and reference-clock PLLs reduce soft-logic area, while the 40 nm process balances logic density with dynamic power. Designers typically use the Quartus II design suite with Qsys for system integration and ModelSim for RTL simulation. Typical applications include telecom line cards, video broadcast equipment, industrial machine vision, wireless baseband processing, and high-speed serial protocol bridging where deterministic latency and parallel processing matter more than raw sequential CPU throughput. The -4 speed grade and 0.9 V VCC supply make this variant a cost-effective choice for commercial-temperature product deployments. Designers should plan PCB layout for the FCBGA's controlled-impedance differential pairs, length-matched transceiver lanes, and a multi-rail decoupling network, since the part's PLL and transceiver performance is highly sensitive to power-supply noise. Adequate thermal relief is required at sustained high toggle rates; designers should follow Intel's Arria II GX PCB guidelines for via-in-pad and stack-up recommendations. This page synthesizes distributor pricing, package details, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP2AGX125DF25C5G - Arria II GX FPGA 125K LE 572-FCBGA | Intel
EP2AGX125DF25C5G

EP2AGX125DF25C5G - Arria II GX FPGA 125K LE 572-FCBGA | Intel

The Intel EP2AGX125DF25C5G is a member of the Arria II GX family of high-performance, low-power 40 nm FPGAs, delivering 118,143 logic elements (LEs), 8,315,904 bits of embedded memory, and 260 user I/O pins in a 572-ball FCBGA package. The -C5 speed grade is a mid-grade device that balances performance and power for transceiver-based designs. According to the Verified Web Data, the part is sold by DigiKey, Mouser, Octopart, LCSC, and multiple authorized distributors, with pricing reported from US $418.60 (LCSC) to US $1,129.08 (Heisener) and US $2,043.85 (IC-Components) as of 2026-09-08. An FPGA (Field-Programmable Gate Array) is a reprogrammable integrated circuit whose logic resources, routing, and I/O are configured by a hardware description language (HDL) bitstream rather than fixed at fabrication. FPGAs occupy a position in the hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. They are commonly used as glue logic, accelerator blocks, data-path engines, and high-speed serial interfaces in systems where ASIC volume does not justify NRE costs. Key features of the EP2AGX125DF25C5G include integrated transceivers operating up to 6.375 Gbps, eight PCI Express hard IP blocks, support for DDR3 external memory interfaces up to 800 Mbps data rate, and dedicated 9x9 / 18x18 variable-precision DSP blocks for fixed- and floating-point arithmetic. Embedded memory comprises M20K and 640-bit MLAB blocks providing a total of 8,315,904 memory bits. The -C5 speed grade places this part in the mid-performance tier within the Arria II GX family. Architecturally, the Arria II GX uses a 40 nm process, an adaptive logic module (ALM) granularity that delivers 8 LUTs per ALM, and dedicated transceiver physical coding sublayer (PCS) and physical medium attachment (PMA) circuitry. Eight PLL blocks and 48 global clock networks support high-fanout timing structures. The transceiver hard IP supports protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, Gbps Ethernet, and SDI. Typical applications include wireless infrastructure baseband processing, broadcast video switching, military radar signal processing, industrial imaging, PCI Express endpoint and root-port cards, and ASIC prototyping. The combination of mid-range transceiver speed and large logic density makes it suitable for mid-volume designs that require serial connectivity but do not need the top-end 10 Gbps performance of the Arria II GT family. When designing with the EP2AGX125DF25C5G, verify that Quartus II software version 13.1 or later (with Arria II device support) is available, and confirm the 572-ball FCBGA land pattern matches your PCB layout. The FPGA requires multiple decoupling capacitors and controlled-impedance routing for all transceiver lanes to meet signal-integrity targets.

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EP2AGX125DF25C6G - Arria II GX FPGA 125K LE 572-FCBGA | Intel
EP2AGX125DF25C6G

EP2AGX125DF25C6G - Arria II GX FPGA 125K LE 572-FCBGA | Intel

The Intel (formerly Altera) EP2AGX125DF25C6G is a high-density Arria II GX Field Programmable Gate Array (FPGA) with 118,143 logic elements, 8,315,904 bits of embedded memory, and 260 multiplier blocks, packaged in a 572-ball FineLine BGA (FCBGA) and rated for the C6 commercial speed grade. It belongs to Intel's mid-range transceiver-equipped FPGA family that targets cost-sensitive applications requiring integrated SERDES, DSP blocks, and high-speed external memory interfaces. A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, multipliers, and memory controllers. FPGAs sit at the top of the digital semiconductor hierarchy alongside ASICs and CPLDs, distinguished from CPLDs by their higher logic density and from ASICs by their in-system reconfigurability. The Arria II GX family specifically integrates up to 16 high-speed transceivers (3.125 Gbps) alongside the programmable fabric, making it well-suited to protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and CPRI without external PHY chips. Key features of the EP2AGX125DF25C6G include 118,143 logic elements (LEs), 8,315,904 embedded memory bits, 260 dedicated DSP blocks (18x18 multipliers), integrated PCI Express hard IP, 3.125 Gbps transceivers, support for DDR3/DDR2/QDR II+ memory interfaces, and up to 260 user I/O pins distributed across 16 I/O banks with support for multiple I/O standards including LVDS, LVTTL, LVCMOS, and SSTL. The C6 speed grade positions this part in the mid-range of the Arria II GX speed spectrum. Architecturally, the EP2AGX125DF25C6G uses a TSMC 40nm process technology with a look-up table (LUT)-based logic fabric, column-based DSP blocks, and TriMatrix embedded memory (MLAB, M9K, M144K blocks). The transceiver blocks include dedicated PMA and PCS layers with hard PCS support for PCIe, XAUI, and Serial RapidIO, offloading serialization, clock-data recovery, and 8b/10b encoding from soft logic and substantially reducing fabric utilization for serial protocols. Typical applications include wireless baseband processing, video broadcast infrastructure, industrial imaging and machine vision, military radar signal processing, test and measurement equipment, and high-speed data acquisition systems. The combination of high logic density, embedded transceivers, and PCI Express hard IP allows a single Arria II GX device to implement both the application logic and the host interface in a single chip. When designing with this device, careful attention to power-rail sequencing, decoupling strategy, and signal-integrity routing for the transceiver channels is essential. Reference Quartus II design software and the Arria II GX Handbook for pin assignment, transceiver pre-emphasis settings, and DDR3 interface timing closure guidance. This page synthesizes distributor availability, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel
EP2AGX125DF25I3G

EP2AGX125DF25I3G - 118K LE Arria II GX FPGA, 3.75Gbps, FC-FBGA | Intel

The Intel (formerly Altera) EP2AGX125DF25I3G is a high-density Arria II GX Field Programmable Gate Array (FPGA) with 118,143 logic elements, 8,315,904 embedded memory bits, and 260 user I/O pins, fabricated on a 40 nm low-power process. It is housed in a 572-ball FineLine BGA (FC-FBGA) package with integrated 3.75 Gbps transceivers. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that allows designers to implement custom digital logic, memory subsystems, and high-speed serial interfaces after fabrication. Within the broader programmable logic taxonomy, FPGAs sit alongside CPLDs as user-programmable logic, and the Arria II GX family specifically targets mid-range applications that require integrated transceivers, DSP blocks, and embedded memory for protocol bridging, video processing, and wireless baseband. Key features of the EP2AGX125DF25I3G include 118,143 logic elements, 4,878 Kbits of embedded memory (M9K and MLAB blocks), 260 user I/O pins supporting single-ended and differential standards, and embedded 3.75 Gbps multi-gigabit transceivers optimized for PCIe Gen1/Gen2, Serial RapidIO, and CEI interfaces. The device also integrates dedicated 18x18 multipliers and variable-precision DSP blocks suitable for high-throughput signal processing. Industrial temperature grade (-40C to +100C) and 0.9 V core operation make it suitable for harsh-environment deployments. Architecturally, the EP2AGX125DF25I3G combines an 8-lane transceiver PMA layer, dedicated PCS hard IP for PCIe and GIGE, and a rich general-purpose fabric built on 40 nm logic. This combination allows designers to replace multiple ASSP devices with a single programmable platform, reducing BOM count and enabling late-stage design changes. Typical applications include wireless baseband processing, radar and signal-intelligence front-ends, broadcast video switching and processing, industrial machine vision, and PCIe Gen2 endpoint cards. Designers commonly pair it with DDR3 memory controllers and high-speed ADC/DAC front-ends for waveform generation and digitizer boards. When designing with this FPGA, ensure proper power sequencing on the 0.9 V core rail, use the Quartus II design suite (or Intel Quartus Prime) for synthesis and place-and-route, and follow Altera's reference designs for transceiver channel layout. The 572-ball FC-FBGA package requires careful PCB stack-up planning to maintain signal integrity on multi-gigabit serial links. This page synthesizes distributor pricing, verified drop-in and same-family alternatives, and practical design notes not consolidated in the manufacturer's datasheet, helping engineers evaluate lifecycle risk and second-source options for the EP2AGX125DF25I3G.

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EP2AGX125DF25I5G - Arria II GX FPGA 118K LE, 8.3Mb, 572-FCBGA
EP2AGX125DF25I5G

EP2AGX125DF25I5G - Arria II GX FPGA 118K LE, 8.3Mb, 572-FCBGA

The Altera (Intel) EP2AGX125DF25I5G is a member of the Arria II GX family of field-programmable gate arrays (FPGAs), delivering 118,143 logic elements, 8,315,904 bits of embedded memory, and 260 user I/O pins in a 572-ball flip-chip BGA (FC-FBGA) package. It integrates up to 12 transceivers capable of 3.75 Gbps operation and runs on a 0.9 V core supply. A field-programmable gate array (FPGA) is a reprogrammable semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and embedded RAM. FPGAs sit within the programmable logic hierarchy as cousins to CPLDs and ASICs, and they are widely used to implement custom digital signal processing, high-speed serial interfaces, and glue logic without the NRE cost of an ASIC. The Arria II GX family targets mid-range applications that need a balance of logic density, transceiver bandwidth, and power efficiency. Key features of the EP2AGX125DF25I5G include 8.315 Mbits of on-chip memory (about 8.3 Mb), 576 (9-bit) embedded multiplier blocks, and 12 full-duplex transceivers with CMU, PMA, and PCS support up to 3.75 Gbps. The -I5 speed grade and industrial -40C to +100C junction temperature rating make it suitable for harsh environments, while the 572-pin FC-FBGA package supports high signal integrity for dense, multi-gigabit designs. The architecture combines a fine-grained logic fabric with dedicated hard IP blocks, reducing power versus a soft-only implementation and freeing fabric resources for user logic. Designers use Quartus II to compile, place-and-route, and program the device via JTAG or active serial configuration, allowing rapid design iteration. Typical applications include wireless baseband processing, high-speed serial protocol bridging (PCIe Gen1/Gen2, CPRI, OBSAI, XAUI, SDI), video and imaging pipelines, and industrial control planes that demand deterministic latency. The transceiver-rich fabric is particularly well matched to telecom fronthaul and backhaul. When designing with this device, plan the PCB for FC-FBGA fan-out, thermal management (multiple GND balls for the exposed die), and reference-clock distribution, because transceivers require very clean, low-jitter clocks to meet eye-mask compliance.

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EP2AGX125EF29C4G - Arria II GX FPGA 118K LE 780-FBGA | Intel
EP2AGX125EF29C4G

EP2AGX125EF29C4G - Arria II GX FPGA 118K LE 780-FBGA | Intel

The Intel (formerly Altera) EP2AGX125EF29C4G is a high-density Arria II GX Field Programmable Gate Array (FPGA) housed in a 780-ball FineLine Ball-Grid Array (FBGA) package, built on a 40 nm low-power process. Per the Altera/Intel datasheet, the device integrates 118,143 logic elements, 4,964 LABs/CLBs, 8,315,904 bits of embedded RAM, 372 user I/Os, and 8 embedded transceiver channels operating up to 6.375 Gbps, with a maximum core speed of 500 MHz and 0.9 V core supply. What is an FPGA? A Field Programmable Gate Array is a programmable logic device whose logic fabric, routing, and I/O cells are configured by the customer after manufacture, allowing custom digital hardware to be implemented without an ASIC tape-out. FPGAs sit within the broader taxonomy of programmable logic (PAL, CPLD, FPGA) and are widely used to accelerate parallel processing, high-speed serial interfaces, and DSP functions. The Arria II GX family specifically targets mid-range applications requiring integrated transceivers, embedded memory, and DSP blocks. Key features of the EP2AGX125EF29C4G include 8 high-speed transceivers with PMA, PCS, and hard PCIe/Serial RapidIO/GIGE IP cores, dedicated DSP blocks for high-throughput multiplication, and a rich clock network with PLLs. The 'C4' speed grade balances Fmax and power for cost-sensitive designs, while the 'G' suffix indicates Pb-free / RoHS-compliant lead finish. The 40 nm process and the integrated transceiver hard IP enable low-latency serial I/O, deterministic timing closure, and reduced BOM cost relative to two-chip implementations. Designers benefit from the Quartus II design suite, a mature toolchain supporting Verilog, VHDL, and SystemVerilog with extensive IP libraries. Typical applications include PCIe Gen1/Gen2 endpoint cards, telecom backplanes with Serial RapidIO, broadcast video processing, wireless baseband pre-processing, and industrial imaging. The combination of 8.3 Mbits of RAM, DSP blocks, and high-speed transceivers makes the part well-suited to data-pipeline designs that need both parallel processing and serial connectivity. When designing with this device, pay close attention to PCB layout for the MGTP/GTX transceiver channels - controlled-impedance differential routing and tight return-path stitching are critical for 5+ Gbps signaling. Use IBIS-AMI models and Quartus transceiver toolkits during pre-layout simulation. The 780-ball FBGA requires a 1.0 mm or finer pitch PCB and high-density interconnect. This page synthesizes distributor inventory, drop-in alternatives, and practical design notes for EP2AGX125EF29C4G not found in the manufacturer datasheet alone.

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EP2AGX125EF29C5G - Arria II GX FPGA, 118K LE | Intel | 780-FBGA
EP2AGX125EF29C5G

EP2AGX125EF29C5G - Arria II GX FPGA, 118K LE | Intel | 780-FBGA

The Intel (formerly Altera) EP2AGX125EF29C5G is a high-density Arria II GX Field Programmable Gate Array (FPGA) with 118,143 logic elements, 8,315,904 bits of embedded memory, and 372 user I/Os, housed in a 780-ball FineLine BGA (FCBGA) package at 0.9 V core. Built on TSMC's 40 nm low-power process, this variant ships in the commercial C5 speed grade and integrates up to 8 embedded transceivers capable of 3.75 Gbps operation for high-speed serial I/O. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit within the programmable logic hierarchy as: programmable logic -> programmable logic device (PLD) -> FPGA. Arria II GX devices belong to Intel's mid-range, transceiver-equipped family, positioned between low-cost Cyclone and high-end Stratix families, targeting applications that need both high-speed serial and DSP/parallel processing without the power envelope of a Stratix part. Key features include 8 transceiver channels supporting PCI Express Gen1/Gen2 (x1, x4) and several serial RapidIO and Gigabit Ethernet configurations; 12 transceiver-side PLLs and 8 fractional PLLs on the core fabric; dedicated 18x18 multipliers supporting up to 590 GMACS DSP performance; 8.3 Mbits of M9K block RAM plus 1.5 Mbits of MLAB distributed memory; and up to 372 user I/O across 12 I/O banks supporting LVDS, DDR2/DDR3, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The architecture combines a power-optimized logic fabric with hard IP blocks for transceivers, PCIe, and external memory interfaces, allowing deterministic timing closure for high-throughput signal-processing applications while keeping the part within a single 780-pin FC-FBGA outline (29 mm x 29 mm, 1.0 mm pitch). The transceiver hard IP blocks implement PCS and PMA layers in silicon, offloading serialization from user logic. Typical applications include wireless baseband processing, military radar signal chains, video broadcast infrastructure, high-speed imaging, industrial test equipment, and PCIe-based coprocessor cards. The combination of transceivers, dedicated DSP blocks, and abundant block RAM makes it a strong fit for digital signal processing pipelines. When designing with this device, the PCB must implement length-matched differential pairs for all transceiver channels (typically 6 layers or more) and a 12-layer stack-up is recommended for PCIe Gen2 compliance. Quartus II design software is required for place-and-route, and IBIS models are needed for signal-integrity simulation of the LVDS/DDR interfaces. This page synthesizes distributor pricing, Arria II GX drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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EP2AGX125EF29C6G - Arria II GX FPGA, 125K LE, 8.3Mbit, 780-BGA | Intel
EP2AGX125EF29C6G

EP2AGX125EF29C6G - Arria II GX FPGA, 125K LE, 8.3Mbit, 780-BGA | Intel

The Intel (formerly Altera) EP2AGX125EF29C6G is a high-density Arria II GX Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA (FCBGA) package. The device integrates 118,143 logic elements backed by 8,315,904 bits of embedded memory, with 372 general-purpose I/O pins. It is fabricated on a 40 nm low-power process and includes dedicated transceivers supporting multi-gigabit serial protocols, making it a workhorse for high-throughput embedded and communications designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and a hierarchy of embedded memory and DSP resources. FPGAs sit above CPLDs in the programmable logic taxonomy and below fixed-function ASICs in per-unit cost, occupying the sweet spot where high logic density, parallel processing, and reconfigurability are required. Within Intel's portfolio, the Arria II GX family targets mid-range applications that need integrated transceivers, embedded transceivers, and PCI Express hard IP without migrating to the higher-cost Stratix series. Key features of the EP2AGX125EF29C6G include up to 8.315 Mbits of embedded SRAM, embedded 18x18 multipliers for DSP, up to 8 high-speed transceivers per device family, hard PCI Express Gen1/Gen2 controllers, and a comprehensive clock management network with PLLs. The device supports JTAG (IEEE 1149.1) and passive/active configuration schemes including fast passive parallel (FPP) and active serial (AS). The 780-BGA package exposes 372 user I/O and provides the signal integrity needed for DDR2/DDR3 external memory interfaces running up to 533 MHz. The Arria II GX architecture uses adaptive logic modules (ALMs) rather than legacy 4-input LUTs, delivering finer-grained packing efficiency. The transceiver blocks support data rates up to 6.375 Gbps, enabling protocols such as PCIe Gen2, Serial RapidIO, and CPRI. The on-chip PLLs (up to 8 per device) support fractional-N synthesis, simplifying multi-frequency clock trees common in wireless baseband and video broadcast infrastructure. Typical applications include wireless baseband processing, video broadcast and contribution encoders, high-speed test and measurement backplanes, military signal processing cards, and PCI Express Gen2 endpoint/root-port designs. The combination of embedded transceivers, hard PCIe IP, and abundant logic also suits the device for medical imaging pre-processing and industrial high-speed vision pipelines. When designing with this device, allocate sufficient PCB area for the 780-BGA footprint (29 mm x 29 mm) and a multi-layer stack-up (typically 8-12 layers) to maintain signal integrity on the transceiver channels. Use the Quartus II design suite (or its successor) for synthesis, place-and-route, and timing closure. For power estimation, plan for a worst-case TDP near 13-14 W; an appropriately-sized thermal solution or airflow is required in enclosed chassis.

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EP2AGX125EF29I3 - Arria II GX FPGA, 118K LE, 780-FBGA | Intel
EP2AGX125EF29I3

EP2AGX125EF29I3 - Arria II GX FPGA, 118K LE, 780-FBGA | Intel

The Intel EP2AGX125EF29I3 is a high-density Arria II GX Field Programmable Gate Array (FPGA) delivering 118,143 logic elements, 7,892 Kbits of embedded memory, and 372 user I/Os, all housed in a 780-pin flip-chip BGA (FCBGA) package. Built on a 40 nm low-power process, it integrates up to 12 transceivers capable of 3.75 Gbps operation, making it a workhorse for mid-range serial connectivity in industrial temperature environments. The 'I3' speed/temperature grade designation confirms industrial-temperature operation (-40C to +85C) with a -3 speed bin. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon IP such as transceivers, block RAM, DSP blocks, and PLLs. FPGAs sit between fixed-function ASICs and software-driven processors, offering hardware-timed parallelism, deterministic latency, and field-upgradable functionality. Within the broader hierarchy, FPGAs belong to programmable logic devices -> logic ICs -> integrated circuits -> semiconductors, and are widely used to implement custom data-path, control, and interface functions before or instead of an ASIC. Key features of the EP2AGX125EF29I3 include 49,640 adaptive logic modules (ALMs), 4,964 LABs, integrated hard PCIe Gen1 controllers, dedicated 6.144 Gbps-capable transceivers, and on-chip DSP blocks for high-throughput signal processing. The 780-BGA package provides the I/O density required for high-pin-count designs while supporting high-speed serial links and parallel memory interfaces. Designers typically target the Arria II GX family when they need multi-gigabit transceivers without paying the premium for higher-end Stratix devices. Typical applications for this FPGA include high-speed serial interface bridging, video broadcast and processing equipment, telecom line cards, industrial imaging, and software-defined radio front-ends. The combination of PCIe hard IP and multi-gigabit transceivers also makes it suitable for protocol conversion cards and test-and-measurement instrumentation where deterministic, low-latency I/O is required. When designing with this device, pay particular attention to power-rail sequencing and decoupling because the Arria II GX architecture requires multiple supply rails (core, I/O, transceiver, PLL). PCB layout should follow Intel/Altera pin-out guidelines for the FCBGA-780 footprint to maintain signal-integrity on the transceiver channels. Stock at major distributors is constrained because the part is now NRND - check distributor inventory and consider EP2AGX125EF29I5 for higher speed grade if availability is limited.

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EP2AGX125EF29I3G Arria II GX FPGA | Intel
EP2AGX125EF29I3G

EP2AGX125EF29I3G Arria II GX FPGA | Intel

The Intel EP2AGX125EF29I3G is an Arria II GX field-programmable gate array with 372 user I/O, 8,315,904 programmable bits, and 118,143 logic elements, supplied in a 780-ball FCBGA package. The device is intended for programmable digital logic designs requiring configurable interconnect, embedded functional resources, and high-density I/O. This product-family-level summary uses the exact values available in the verified distributor and search records; detailed timing, transceiver, memory, power, and package-dimension values remain subject to confirmation from the official device datasheet. An FPGA is a semiconductor device whose digital logic, routing, and I/O behavior can be configured after manufacturing. In the system hierarchy, it sits between fixed-function application-specific integrated circuits and software-defined processing: unlike an ASIC, an FPGA can be reprogrammed, while unlike a microprocessor, it can execute many operations concurrently in configured hardware. FPGAs are commonly selected for data paths, interface bridging, digital signal processing, control systems, and prototyping. The target belongs to the Arria II GX family, a programmable-logic product family from Intel/Altera. The verified listings identify the part as an Arria II GX FPGA and expose three headline architecture values: 372 user I/O, 8,315,904 programmable bits, and 118,143 logic elements. These values indicate a high-density programmable device with a substantial I/O interface. The package is listed as 780-BBGA and FCBGA, with a ball-grid-array form factor suitable for surface mounting. The listings also identify the part as an FPGA, allowing engineers to distinguish it from fixed-function interface, memory, or power-management components. The architecture is relevant to applications that need parallel processing, configurable timing, and hardware-level interface adaptation. The 118,143 logic elements provide the programmable fabric for implementing combinational and sequential logic. The 8,315,904 programmable-bit figure describes the device's programmable configuration capacity as reported by the distributor listing. The 372 user-I/O count indicates the available external interface resources, although actual usable I/O depends on the selected package, bank assignments, configuration, and design constraints. Typical applications include communications equipment, industrial automation, test and measurement systems, and data-acquisition or signal-processing platforms. These systems can benefit from configurable hardware parallelism and interface customization. The exact transceiver count, maximum operating frequency, logic-element configuration, supported memory interfaces, and power requirements are not present in the supplied verified data, so those parameters must be confirmed from the official datasheet before implementation. Designers should verify the complete ball map, bank-specific I/O rules, configuration method, clocking resources, transceiver specifications, power rails, thermal limits, and recommended decoupling network from the official Intel documentation. The 780-ball package requires careful PCB escape routing, controlled-impedance analysis, and verification of the exact land pattern. The supplied search results are sufficient for product identification, package description, I/O count, logic-element count, programmable-bit count, and distributor availability, but not for a complete electrical design sign-off. This page combines verified distributor records, an Arria II GX datasheet reference result, and structured cross-reference search results. It is designed to help engineers identify the component and assess procurement options while clearly separating supplied facts from parameters that require additional manufacturer documentation.

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EP2AGX125EF29I5G - Arria II GX FPGA 118K LE 780-FBGA | Intel
EP2AGX125EF29I5G

EP2AGX125EF29I5G - Arria II GX FPGA 118K LE 780-FBGA | Intel

The Intel (formerly Altera) EP2AGX125EF29I5G is a high-density Arria II GX Field-Programmable Gate Array (FPGA) delivering 118,143 logic elements, 8,315,904 bits of embedded memory, and 372 user I/O pins in a 780-ball Flip-Chip BGA (FCBGA) package. Built on a 40 nm process, it integrates up to 12 transceivers (per Arria II GX family) operating up to 3.75 Gbps (GX) / 5 Gbps (GZ), with a core voltage of 0.9 V and an industrial temperature grade (I5: -40C to +100C). An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory blocks (BRAM/M9K/M144K), DSP blocks, and high-speed transceivers. Within the broader semiconductor taxonomy, FPGAs sit above ASICs as flexible alternatives that allow hardware reconfiguration post-manufacture. Arria II GX is positioned in Intel's mid-range transceiver-equipped family, between Cyclone (low-cost) and Stratix (high-performance), targeting applications requiring serial connectivity without Stratix-tier cost. Key features include 8,315,904 embedded memory bits distributed across M9K/M144K blocks, dedicated 18x18 hardware multipliers for DSP, 12 high-speed transceivers with CDR support, and PCI Express (PIPE) hard IP blocks. The 780-FCBGA package (29 mm x 29 mm) exposes 372 user I/O pins across 8 I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, SSTL, and DDR/DDR2/DDR3 external memory interfaces. The architecture combines an adaptive logic module (ALM) fabric, embedded memory, DSP blocks, and PLLs in a fine-grained programmable fabric. Hard IP blocks for PCIe Gen1/Gen2 and external memory controllers accelerate system integration while preserving the FPGA's parallel processing throughput for custom logic, signal processing, and protocol bridging. Typical applications include high-speed serial protocol bridging (PCIe, Serial RapidIO, Gbps Ethernet), digital signal processing, telecom baseband processing, video processing pipelines, and ASIC prototyping. The transceiver-rich architecture also suits test and measurement equipment requiring multi-channel data acquisition. When designing with this device, ensure proper power sequencing for the 0.9 V core, 1.5 V/2.5 V/3.3 V auxiliary rails, and PLL analog supplies. Thermal management of the FCBGA requires a heatsink or thermal interface material for sustained transceiver operation; junction temperatures above 100C may degrade I5-grade reliability. This page synthesizes distributor pricing, Arria II GX family drop-in alternatives, transceiver IP guidance, and thermal design notes not found in a single place in the manufacturer datasheet.

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EP2AGX125EF35C4G - Arria II GX FPGA, 118K LEs, 1152-FCBGA | Intel
EP2AGX125EF35C4G

EP2AGX125EF35C4G - Arria II GX FPGA, 118K LEs, 1152-FCBGA | Intel

The Intel (formerly Altera) EP2AGX125EF35C4G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) with 118,143 logic elements, 8,315,904 bits of embedded memory, and 452 hardware multipliers, housed in a 1152-ball flip-chip BGA (FC-FBGA) package. Operating at a core voltage of 0.9 V with a transceiver capability up to 6.375 Gbps, this device integrates transceivers, PCI Express hard IP blocks, and DSP blocks on a single die, targeting mid-range serial connectivity and DSP applications. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic fabric, interconnect, and I/O can be configured by the customer after manufacture. FPGAs sit within the broader hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Arria II GX family occupies the mid-density, transceiver-rich tier between Cyclone (low-cost) and Stratix (high-performance) families, offering a balance of cost, power, and high-speed serial capability. Key features include 12 transceiver channels with integrated Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA), up to 6.375 Gbps data rate per channel, hard PCI Express Gen1/Gen2 IP cores with x1/x4/x8 endpoint and rootport support, and dedicated DSP blocks with up to 552 18x18 multipliers. Memory interfaces support DDR3, DDR2, and QDR II/II+ SRAM at rates up to 800 Mbps. The 40nm process technology delivers static power reductions of up to 50% versus prior-generation 65nm FPGAs. Architecturally, the Arria II GX employs a logic array based on 8-input adaptive look-up tables (ALUTs), embedded memory (M9K and M144K blocks), and variable-precision DSP blocks. Transceivers integrate signal-conditioning features including pre-emphasis, equalization, and output swing control. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes using industry-standard SRAM-based configuration bits. Typical applications include high-speed serial interface bridging (PCIe, Serial RapidIO, Gbps Ethernet), wireless baseband processing, video broadcast and image processing, military radar signal processing, and test and measurement equipment. The combination of transceivers and DSP blocks makes it well suited for protocol bridging and high-throughput data acquisition. When designing with this device, allocate adequate power-decoupling capacitance (typically 200-300 uF bulk plus per-pin decoupling) and follow Intel's recommended PCB layout for the FC-FBGA package. The transceiver reference clocks require clean jitter performance; use a dedicated low-jitter oscillator and matched-length routing to the CLK pins. This page synthesizes distributor pricing, package-specific drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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