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EP2AGX125EF35C5G - 118K Cells, 500 MHz FPGA | Intel
EP2AGX125EF35C5G

EP2AGX125EF35C5G - 118K Cells, 500 MHz FPGA | Intel

Altera EP2AGX125EF35C5G is a 118,143-cell Arria II GX field-programmable gate array (FPGA) with 452 I/O, a 500 MHz stated performance point, and 0.9 V core supply operation, supplied in a 1,152-ball FCBGA/FC-FBGA package. The verified distributor data identifies an embedded FPGA with 8,315,904 programmable bits and 1,152 package terminals. This combination places the device in a high-density programmable-logic class intended for systems requiring configurable digital processing, interface bridging, and hardware-level parallelism. An FPGA, or field-programmable gate array, is a semiconductor device whose logic functionality is configured after manufacturing. In the system hierarchy, it sits between fixed-function integrated circuits and software-programmable processors: the FPGA can implement parallel digital circuits, custom interfaces, and processing pipelines, while a processor typically executes sequential software. Its configurable logic, embedded memory resources, and I/O structure allow one hardware platform to support multiple product functions or design revisions. The headline characteristics of the EP2AGX125EF35C5G are its 118,143 logic cells, 452 I/O, and 1,152-ball package. The device is listed as part of the Arria II GX family and operates from a 0.9 V supply according to the supplied distributor specifications. The package is a ball-grid-array format suitable for high-pin-count surface-mount assembly, and the device is offered in tray packaging according to the verified Arrow listing. From an architectural perspective, the density and programmable-bit count provide substantial capacity for datapath logic, control functions, memory mapping, and interface adaptation. The 452 I/O resources support communication with multiple external buses or high-bandwidth peripherals. Because the available web results provide no verified values for operating temperature range, transceiver count, memory configuration, package body dimensions, or speed grade timing, those values must be obtained from the manufacturer datasheet before final system design. Typical applications include communications equipment, industrial control, test and measurement, and embedded systems that need parallel processing or custom digital interfaces. The Arria II GX classification and 500 MHz listed specification make the part relevant to designs where deterministic hardware execution and configurable connectivity are more important than the software flexibility of a conventional processor. A modern FPGA design should also confirm device-family support in the selected development environment and validate pin assignments against the exact 1,152-ball package drawing. A key design consideration is that a ball-grid-array package requires controlled PCB layout, appropriate escape routing, thermal analysis, and reliable assembly processes. The verified data does not establish every electrical, timing, or thermal limit, so the datasheet and family documentation remain authoritative. The supplied search results also do not identify a verified pin-compatible drop-in replacement; the alternatives section therefore avoids inventing replacement claims. This page synthesizes the supplied distributor specifications, package information, pricing references, and cross-reference search results. It distinguishes verified facts from parameters requiring datasheet confirmation and provides engineering context for FPGA selection, PCB planning, and procurement decisions as of 2026-09-08.

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EP2AGX125EF35C6G Arria II GX FPGA | Altera | Signal Processing
EP2AGX125EF35C6G

EP2AGX125EF35C6G Arria II GX FPGA | Altera | Signal Processing

Altera EP2AGX125EF35C6G is a high-density Arria II GX field-programmable gate array with 118,143 logic elements, 8,315,904 total RAM bits, and 452 user I/O pins, supplied in a 1152-BBGA, FCBGA package. The verified package description also identifies a 1152-FBGA, 35 mm x 35 mm supplier-device format, and its core supply range is 0.87 V to 0.93 V. This combination targets data-intensive programmable logic designs requiring substantial embedded memory, extensive external interfacing, and high pin-count packaging. A field-programmable gate array, or FPGA, is a semiconductor device built from configurable logic blocks, programmable interconnects, and dedicated functional resources. In the system hierarchy, an FPGA sits between a general-purpose processor and fixed-function application-specific integrated circuits: firmware-defined logic can implement parallel processing, interface bridging, protocol handling, and digital signal processing while retaining design flexibility. Embedded RAM reduces dependence on external memory for buffers, FIFOs, lookup tables, and transient data storage. The principal verified resources are 118,143 logic elements, 8,315,904 total RAM bits, and 452 user I/O pins. The device uses 1152-FBGA packaging and supports a junction-temperature operating range of 0 °C to 85 °C. Its 0.87 V to 0.93 V core-supply range requires a tightly controlled power distribution network. These characteristics make the part appropriate for systems that need high logic density, broad memory capacity, and a large number of board-level connections. From an architectural perspective, the FPGA combines programmable logic fabric with embedded memory resources distributed throughout the fabric. Designers can instantiate parallel datapaths, state machines, communication controllers, and signal-processing structures, then route them through programmable interconnect. Because the verified data does not provide transceiver count, speed grade, logic-cell architecture detail, or maximum operating frequency, those parameters must not be inferred. Engineers should consult the complete manufacturer datasheet and device-family documentation before setting clock budgets or selecting configuration circuitry. Typical applications include real-time signal processing, industrial control, communications infrastructure, image and video processing, and high-throughput test equipment. Its 118,143 logic elements support complex parallel processing, while 8,315,904 RAM bits can hold data samples and protocol packets. The 452 user I/O pins are particularly useful where the FPGA must bridge sensors, memories, converters, network interfaces, and backplane connectors concurrently. The main design constraint is power integrity. A 0.87 V to 0.93 V core rail must use suitable regulation, local decoupling, and low-impedance PCB planes. Designers should also validate I/O banking, configuration pins, signal-integrity requirements, thermal behavior, and ball assignment against the manufacturer package documentation. The verified data does not include sufficient detail to specify those constraints numerically. This product record combines verified architecture, memory, I/O, package, supply, and temperature data with package-compatible comparison guidance and procurement references. Unlike a distributor listing alone, it distinguishes confirmed values from parameters requiring datasheet validation and avoids inventing unavailable electrical or mechanical details.

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EP2AGX125EF35I3G - Arria II GX FPGA, 118K LE, 452 I/O | Intel
EP2AGX125EF35I3G

EP2AGX125EF35I3G - Arria II GX FPGA, 118K LE, 452 I/O | Intel

The Intel (Altera) EP2AGX125EF35I3G is a high-performance, low-power Arria II GX Field Programmable Gate Array (FPGA) with 118,143 logic elements, 452 user I/Os, and 7.93 Mbit of embedded memory, housed in a 1152-ball FCBGA package. Built on a 40 nm process, it integrates up to 49640 Adaptive Logic Modules (ALMs), 8,315,904 bits of on-chip RAM, and high-speed transceivers targeting mid-range serial connectivity. The 'I3' speed grade and industrial temperature rating (-40C to +100C) make this part suitable for both commercial and harsh-environment deployments. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/ALMs), programmable interconnects, and dedicated hard IP blocks (memory controllers, transceivers, DSP slices). FPGAs sit alongside ASICs and microcontrollers in the digital logic hierarchy, offering hardware-timeliness of ASICs with the flexibility of software-reprogrammable designs. They are used to implement parallel data paths, custom bus protocols, signal processing pipelines, and prototype ASIC functionality before tape-out. Key features of the EP2AGX125EF35I3G include 118,143 logic elements and 49,640 ALMs, providing roughly 2x the logic density of mid-range Cyclone devices. The 7.93 Mbit embedded memory supports packet buffers, FIFO depth, and DSP coefficient storage, while the integrated transceivers operate up to 3.75 Gbps and 8 SERDES channels at 5 Gbps, enabling PCIe Gen1/Gen2 and 1G/10G Ethernet implementations. The 1152-ball FCBGA package exposes 452 user I/Os, supporting wide parallel buses and high-pin-count memory interfaces. Architecturally, the Arria II GX family combines 8-input fracturable ALMs, M9K memory blocks, MLAB distributed RAM, and dedicated variable-precision DSP blocks. Hard IP for PCIe Gen2, 10/100/1000 Ethernet MACs, and external memory controllers reduces soft-logic utilization and simplifies timing closure. The 40 nm process balances static and dynamic power, and the 'I3' speed grade places timing performance between I4 and I5 within the Arria II family. Typical applications include high-speed serial protocol bridging (PCIe Gen2 endpoints, 1G/10G Ethernet MACs), video broadcast and processing pipelines, wireless baseband and digital IF, military radar signal processing, and industrial imaging. The wide logic and transceiver bandwidth also make it well-suited for ASIC prototyping and firmware-accelerated compute. When designing with this FPGA, ensure the Quartus II design suite (13.0 or later) is used for synthesis and place-and-route, and validate pin assignments against the FCBGA-1152 package pinout. Power planning should budget for both the core (VCC, VCCPT) and transceiver (VCCA, VCCP, VCCH) rails, with decoupling sized per the Arria II GX pin connection guidelines. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate the EP2AGX125EF35I3G against similar mid-range FPGA options.

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EP2AGX125EF35I5G - Arria II GX FPGA 118K LE | Intel | 1152-FBGA
EP2AGX125EF35I5G

EP2AGX125EF35I5G - Arria II GX FPGA 118K LE | Intel | 1152-FBGA

The Intel (formerly Altera) EP2AGX125EF35I5G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) with 118,143 logic elements, 8,315,904 bits of embedded memory, and 452 user I/O pins, housed in a 1152-ball FineLine BGA (FBGA) package. It integrates up to 12 transceiver channels (6.375 Gbps) for high-bandwidth serial connectivity, an industrial temperature grade (-40C to +100C), and a 0.87 V core supply. This device combines high-density programmable logic with low-power 40-nm process technology for bandwidth-intensive applications. An FPGA (Field-Programmable Gate Array) is a type of programmable logic IC that allows hardware designers to implement custom digital circuits after manufacturing. FPGAs sit within the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs provide reconfigurable logic blocks (LEs), programmable interconnect, and on-die memory/MLAB blocks, making them ideal for prototyping, low-volume production, and applications where standards evolve. The Arria II GX family specifically targets transceiver-based mid-range designs that need transceivers without the cost of high-end Stratix devices. Key features include 12 full-duplex transceiver channels supporting data rates from 600 Mbps up to 6.375 Gbps, integrated PCIe Gen1/Gen2 hard IP blocks, up to 8.3 Mbits of embedded memory, 4 PCI Express hard IP blocks, 8 PLLs, and dynamic reconfiguration support. The 1152-FBGA package supports 452 user I/O pins across 16 I/O banks with multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) and per-pin dynamic termination control. Architecturally, the EP2AGX125EF35I5G uses a 40-nm low-power process with adaptive logic modules (ALMs), 8-input fracturable look-up tables (LUTs), MLAB and M9K memory blocks, and DSP blocks capable of up to 156 GMACs of fixed-point performance. Hard IP blocks for PCIe Gen2 and 10-Gbps-capable transceivers reduce logic utilization and power for serial protocols. Typical applications include high-definition video broadcasting equipment, PCI Express endpoint cards, telecommunications line cards, wireless baseband processing, software-defined radio (SDR) platforms, and test & measurement instrumentation requiring transceiver connectivity. When designing with this device, plan for the 1152-ball FBGA land pattern (1.0 mm pitch typical), 0.87 V core with multiple GND/VCC rails, and multi-rail power sequencing. JTAG configuration with Quartus II or Quartus Prime is required; the I5 grade indicates industrial temperature and -5 speed grade. Use Intel's Transceiver Toolkit for link training and the Signal Tap logic analyzer for hardware debug. This page synthesizes distributor pricing, drop-in alternative part numbers from the Arria II GX family, and practical FPGA design notes not found in the manufacturer datasheet alone.

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EP2AGX125EF35I5N - Arria II GX FPGA 118K LE, 6x 3.125G Transceivers | Intel
EP2AGX125EF35I5N

EP2AGX125EF35I5N - Arria II GX FPGA 118K LE, 6x 3.125G Transceivers | Intel

The Intel (formerly Altera) EP2AGX125EF35I5N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) delivering 118,143 logic elements, 452 user I/Os, and up to 6 transceivers operating at 3.125 Gbps, housed in a 1152-ball 35x35 mm flip-chip BGA (FC-FBGA-1152) package. It is fabricated on a low-power 40 nm process node, targets the industrial -40C to +100C temperature range (I5 speed grade), and operates from a 0.9 V core supply with 1.5 V/2.5 V/3.3 V-tolerant I/O banks. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit containing programmable logic blocks, interconnect, and I/O cells that can be reconfigured by the designer after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices (PLD) -> logic ICs -> integrated circuits -> semiconductors, and are distinguished from ASICs by their post-fabrication reconfigurability, making them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. The Arria II GX family specifically targets mid-range applications that require embedded transceivers and DSP blocks without the cost of high-end Stratix-class parts. Key features include 124,100 combinational logic blocks (CLBs) organized as 4,964 LABs, 8.4 Mbits of embedded memory (M9K + MLAB blocks), 252 dedicated 18x18 hardware multipliers for DSP, 6 full-duplex 3.125 Gbps CDR-based transceivers with embedded PCI Express hard IP, and 4 phase-locked loops (PLLs). The transceiver hard IP supports protocols including PCI Express Gen1, Gbps, Serial RapidIO, and Custom Ethernet, eliminating the need for external PHY silicon in many designs. The Arria II architecture uses an 8-input adaptive logic module (ALM) and multi-track interconnect routing that significantly improves logic utilization versus the older 4-input LUT-based Stratix families. The hard PCI Express Gen1 endpoint block and 6x 3.125 Gbps transceivers are integrated directly into the silicon, reducing BOM count and PCB complexity for serial connectivity. Typical applications include high-volume broadcast video processing, wireless baseband processing (W-CDMA, LTE PHY), test and measurement equipment with high-speed serial I/O, military radar signal processing, and cost-sensitive industrial imaging pipelines. The I5 speed grade provides the fastest timing closure at the cost of higher power than I3 / I7 grades. When designing with this device, allocate sufficient PCB area for the 35x35 mm package and follow Altera's recommended decoupling scheme with 1 uF and 0.1 uF capacitors per power pin. Use the Quartus II design software (13.0 or later) for synthesis, place-and-route, and timing analysis. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, plus comparison context against other Arria II GX speed/package variants.

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EP2AGX190EF29C4G - Arria II GX FPGA, 181K LEs, 780-FCBGA | Intel
EP2AGX190EF29C4G

EP2AGX190EF29C4G - Arria II GX FPGA, 181K LEs, 780-FCBGA | Intel

The Intel EP2AGX190EF29C4G is a high-density Arria II GX field-programmable gate array (FPGA) built on a 40 nm low-power process, delivering 181,165 logic elements with up to 372 user I/Os in a 780-pin flip-chip BGA package. The device integrates 10,177,536 bits of embedded memory, eight transceiver channels supporting up to 6.375 Gbps for high-speed serial I/O, and dedicated DSP blocks for high-throughput signal processing. What is an FPGA? A field-programmable gate array (FPGA) is a programmable logic device (PLD) that lets engineers configure digital logic, memory, and I/O blocks in the field after manufacturing. Within the broader semiconductor taxonomy, FPGAs sit inside the programmable logic family, which is a branch of standard-cell ASICs in the larger category of logic ICs. Arria II GX FPGAs specifically target mid-range applications that require transceivers, DSP, and embedded memory with lower power than the Stratix IV family at higher cost than Cyclone IV. Key features of this part include up to 372 user I/Os, dedicated 6.375 Gbps transceivers, 1.4 Gbps LVDS support, on-chip termination (OCT), and built-in hard PCI Express and external memory controller blocks. The 0.9 V core voltage reduces dynamic power versus prior 90 nm nodes, while the 780-ball FCBGA package provides high signal and power integrity for high-pin-count designs. Architecturally, the EP2AGX190 uses an LUT-based fabric with embedded SRAM, true dual-port memory blocks, and 8B/10B-coded transceivers. Per the Arria II Device Handbook (Volume 1, document AIIGX5V1-4.6), this C4 speed-grade device is the slowest in the Arria II family, making it well suited for cost-sensitive designs where timing closure is not aggressive. Typical applications include high-speed serial protocol bridging, video broadcast and image processing pipelines, wireless baseband pre-processing, and industrial control systems requiring custom logic plus gigabit serial links. When designing with this device, allocate sufficient PCB layers (at least eight) and proper BGA fanout for the 780-ball FCBGA. Plan power-rail decoupling per the Altera Early Power Estimator (EPE) tool before schematic capture. This page synthesizes distributor stock, drop-in alternatives from the same Intel/Altera Arria II family, and practical design notes that complement the manufacturer datasheet.

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EP2AGX190EF29C5G - Arria II GX FPGA, 190K LE, 780-FBGA | Altera
EP2AGX190EF29C5G

EP2AGX190EF29C5G - Arria II GX FPGA, 190K LE, 780-FBGA | Altera

The Altera EP2AGX190EF29C5G is a high-density Arria II GX Field-Programmable Gate Array (FPGA) featuring 181,165 logic elements, 7,612 CLBs, and 10,177,536 bits of embedded memory, housed in a 780-ball flip-chip BGA package. It is built on a 40nm process and integrates up to 12 transceivers capable of 6.375 Gbps data rates, along with dedicated hard IP blocks for PCI Express Gen2 and memory controllers supporting DDR3, DDR2, and QDR II+ SRAM interfaces. Background: An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows designers to implement custom digital circuits after manufacturing. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. Arria II GX family FPGAs specifically target mid-range applications requiring transceiver-based serial connectivity, such as broadband, wireless infrastructure, and broadcast equipment. Key features include 372 user I/O pins, on-die termination (OCT), and a wide operating temperature range suited for industrial environments. The 'C5G' suffix denotes commercial temperature grade with -5 speed grade silicon. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, and high-speed serial protocols. Technical depth: The Arria II GX architecture employs adaptive logic modules (ALMs) instead of traditional 4-input LUTs, providing improved logic utilization. Hard memory controllers and DSP blocks accelerate common operations while reducing soft logic overhead. The transceiver blocks support multiple protocols including PCIe Gen2 x1/x4, XAUI, CEI-6.0, and Serial RapidIO. Typical applications include wireless baseband processing, HD-SDI video processing, high-speed data acquisition, and PCIe Gen2 endpoint cards. When designing with this device, ensure proper power sequencing for the 0.9V, 1.1V, 1.5V, 2.5V, and 3.3V rails and adequate thermal dissipation via the exposed die. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations sourced from DigiKey, Mouser, Octopart, and the Altera datasheet.

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EP2AGX190EF29C6G - Arria II GX FPGA 190K LE, 780-FCBGA | Intel
EP2AGX190EF29C6G

EP2AGX190EF29C6G - Arria II GX FPGA 190K LE, 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGX190EF29C6G is a high-density Arria II GX Field Programmable Gate Array (FPGA) with 190,000 logic elements, 10,177,536 RAM bits (12,144 Kbit), 181,165 adaptive logic modules (ALMs), and a 780-ball Flip-Chip BGA (FCBGA) package rated for the -6 commercial speed grade. It targets mid-range, transceiver-rich applications requiring high logic density, embedded memory, and multi-gigabit serial I/O. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware blocks (transceivers, DSP slices, embedded RAM, PLLs) on a single die. FPGAs sit between generic microcontrollers and fixed-function ASICs in the silicon hierarchy: programmable logic -> configurable logic -> semiconductor. Arria II GX specifically bridges Cyclone (low-cost) and Stratix (high-performance) families by offering transceivers up to 6.375 Gbps with a balanced logic-and-transceiver fabric. Key features include 372 maximum user I/O pins, integrated PCI Express hard IP, multiple high-speed transceivers supporting 600 Mbps to 6.375 Gbps data rates, 8-input fracturable ALMs, dedicated DSP blocks, and on-chip PLLs for clock management. The device is built on a 40 nm process and supports 1.0 V, 1.1 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V single-ended I/O standards via bank-based configuration. The Arria II GX architecture separates logic resources (ALMs, M9K/M144K memory blocks, MLABs) from transceiver resources, allowing the same device to address protocols such as PCIe Gen1/Gen2, CPRI/OBSAI, Serial RapidIO, XAUI, and SGMII without external PHY chips. Hard IP blocks reduce soft-logic overhead and deterministic latency, critical for protocol bridging in wireless baseband and broadcast video. Typical applications include wireless base-station digital front-end, broadcast video processing and switching, PCIe Gen2 add-in cards, communications infrastructure line cards, and high-speed serial protocol bridging. The -6 commercial speed grade targets designs operating in 0C to 85C ambient with default speed margin. When designing with EP2AGX190EF29C6G, ensure power-rail sequencing follows Altera's POR guidelines and that transceiver reference clocks meet the +/-100 ppm jitter spec. Quartus II design software (13.0 and later service packs) is the required development environment. This page synthesizes verified distributor pricing, drop-in same-family alternatives from the Site MPN catalog, and practical design notes not consolidated in any single manufacturer document.

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EP2AGX190EF29I3G - Arria II GX 190K LEs FPGA 6G Transceiver | Intel
EP2AGX190EF29I3G

EP2AGX190EF29I3G - Arria II GX 190K LEs FPGA 6G Transceiver | Intel

The Intel EP2AGX190EF29I3G is a high-density Arria II GX Field-Programmable Gate Array (FPGA) built on a 40 nm low-power process, integrating 181,165 logic elements and 10,177,536 RAM bits with 372 user I/O and sixteen 6.375 Gbps transceivers. Packaged in a 780-ball flip-chip BGA (FC-FBGA, EF29) with 29 mm body, the -I3 speed/temperature grade targets industrial applications from -40C to +100C junction. The Arria II GX family introduced the lowest-cost 6.375 Gbps transceiver FPGA at the time, with 50% lower static power than competing 40 nm FPGAs, and remains deployed in PCI Express Gen1/Gen2, Serial RapidIO, and multi-gigabit serial interfaces. (Sources: Altera Arria II GX Device Handbook; DigiKey product listing 5684759) An FPGA (Field-Programmable Gate Array) is a reprogrammable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, PLLs, and memory controllers. Within the system hierarchy, an FPGA sits between general-purpose microcontrollers (which execute software sequentially) and ASICs (which implement fixed logic). FPGAs are widely used for parallel DSP, custom interfaces, and prototyping, and the Arria II GX family specifically targets cost-sensitive multi-gigabit serial applications including wireless baseband, broadcast video, and high-end industrial imaging. (Source: Intel Arria II GX Family Overview) Key features of the EP2AGX190EF29I3G include 181,165 logic elements, 10,177,536 bits of embedded memory, sixteen 6.375 Gbps transceivers supporting protocols such as PCIe Gen2 and Serial RapidIO 2.1, dedicated PLL and DSP blocks, and 372 general-purpose I/O supporting LVDS, LVTTL, LVCMOS, and 1.5 V HSTL/SSTL memory interfaces. The 780-pin FC-FBGA package provides signal integrity for high-speed transceivers and dense parallel I/O. Architecturally, the device combines an FPGA fabric, hardened transceivers, and high-performance I/O on a single die. The 6.375 Gbps transceivers include built-in clock-data recovery (CDR), pre-emphasis, and equalization, allowing the FPGA to drive backplanes and SFP/SFP+ optical modules directly. The 0.9 V core Vcc is supplied through the FC-BGA substrate with multiple power/ground balls to minimize SSO noise. Typical applications include wireless baseband processing with CPRI/OBSAI fronthaul, broadcast and pro-AV serial interfaces (SDI, HDMI, DisplayPort via FPGA bridging), PCI Express Gen1/Gen2 endpoint or root-complex designs, and industrial imaging pipelines that require multi-gigabit sensor links. The combination of transceiver count and I/O width also makes it a strong fit for protocol bridging in telecom line cards. (Source: Altera Arria II GX Handbook, Chapter 1) When designing with this part, plan power sequencing for the 0.9 V core, 1.5 V/2.5 V/3.3 V I/O banks, and transceiver PLLs independently; consult the Arria II GX pin connection guidelines for unused-pin termination. Use the Quartus II design software (version 11.0 or later) for place-and-route and PowerPlay early power estimation to avoid thermal surprises in air-cooled enclosures. (Source: Altera AN583 reference note) This page synthesizes current distributor pricing, drop-in same-family alternatives, and practical design notes drawn from the manufacturer handbook - content that goes beyond the bare datasheet and serves engineers evaluating the part for new designs or legacy second-source decisions.

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EP2AGX190EF29I5G - Arria II GX FPGA 181K LE | Intel | 780-FBGA
EP2AGX190EF29I5G

EP2AGX190EF29I5G - Arria II GX FPGA 181K LE | Intel | 780-FBGA

The Intel EP2AGX190EF29I5G is a high-density Arria II GX field-programmable gate array (FPGA) delivering 181,165 logic elements, 10,177,536 memory bits, and integrated transceivers in a 780-ball flip-chip BGA package. Built on a 40 nm low-power process, it operates from a 0.9 V core supply and supports up to 500 MHz fabric performance with 372 user I/O pins. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than at silicon fab time. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are commonly used to prototype ASICs, accelerate parallel workloads, and implement custom I/O protocols. Arria II GX specifically targets mid-range applications that require integrated multi-gigabit transceivers (up to 6.375 Gbps) and moderate logic density, sitting between the lower-cost Cyclone family and the high-end Stratix family in Intel's FPGA portfolio. Key features of the EP2AGX190EF29I5G include integrated transceivers supporting PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and multiple CPRI/OBSAI data rates; dedicated on-chip memory blocks (M9K/M144K); embedded DSP blocks for high-performance fixed- and floating-point arithmetic; and 8-input adaptive logic modules (ALMs) that pack twice the effective logic of prior 4-input LUT architectures. The device also includes hard memory controllers, PLLs, and dynamic reconfiguration support. The Arria II GX architecture combines a logic fabric with hard intellectual-property (IP) blocks such as transceivers, PCIe hard IP, and external memory interfaces. This integration reduces logic overhead typically spent serializing/deserializing data, freeing ALMs for application code while delivering deterministic latency across all six transceiver channels at line rates up to 6.375 Gbps. Typical applications include wireless baseband processing, broadcast video infrastructure, military secure communications, high-performance DSP for radar/sonar, PCIe Gen2 endpoint/root-port cards, and high-speed serial protocol bridging. The 780-pin FC-FBGA package supports the transceiver channels, 372 user I/Os, and high-density power/ground distribution needed for industrial and defense-grade designs. When designing with this device, plan power distribution carefully: the 0.9 V core rail can draw tens of amperes under full fabric and transceiver utilization, requiring multi-layer PCB stack-up, low-impedance planes, and bulk decoupling near each transceiver bank. Quartus II software (the legacy IDE) or Intel Quartus Prime is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor stock and pricing, Arria II GX drop-in alternatives in the same 780-FBGA package, and practical PCB power/thermal design notes that go beyond the manufacturer datasheet.

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EP2AGX190FF35C4G - Arria II GX FPGA 190K LE | Intel | 1152-FCBGA
EP2AGX190FF35C4G

EP2AGX190FF35C4G - Arria II GX FPGA 190K LE | Intel | 1152-FCBGA

The Intel EP2AGX190FF35C4G is a high-performance, low-power Arria II GX Field Programmable Gate Array (FPGA) with 181,165 logic elements, 10,177,536 bits of embedded memory, and 612 embedded 18x18 multipliers, packaged in a 1152-ball Flip-Chip BGA (FCBGA). It features up to 12 transceiver channels operating up to 6.375 Gbps, making it suitable for high-speed serial connectivity applications including PCIe Gen2, Serial RapidIO, and Gigabit Ethernet. An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the programmable logic hierarchy between CPLDs (smaller, simpler) and ASICs (larger, higher-density, but fixed-function), and are widely used for digital signal processing, protocol bridging, and hardware acceleration. The Arria II GX family targets mid-range, transceiver-rich designs requiring a balance of logic density, DSP capability, and power efficiency. Key features include 190K equivalent logic elements (LEs), dedicated hard memory controllers, and 8-input adaptive logic modules (ALMs). The 12 full-dupight transceiver channels support data rates from 600 Mbps to 6.375 Gbps, with built-in PCIe Gen1/Gen2 hard IP blocks, CMU, and channel equalization. The 1152-FCBGA package provides a thermal resistance suitable for industrial thermal envelopes with proper PCB thermal design. The Arria II GX architecture uses a 40nm low-power process and provides transceivers with superior signal integrity through adaptive equalization and pre-emphasis. Hard IP blocks for PCIe Gen2, Serial RapidIO, and 10 Gigabit Ethernet reduce logic consumption and simplify timing closure. Embedded DSP blocks deliver up to 600 GMACS of processing throughput for high-performance DSP pipelines. Typical applications include high-speed serial interface bridging, wireless baseband processing, video broadcasting infrastructure, and PCI Express endpoint cards. The combination of transceiver density, on-chip memory bandwidth, and dedicated PCIe hard IP makes it well suited for protocol bridging and high-throughput data acquisition. When designing with this device, ensure the PCB BGA fanout and stackup meet the FCBGA escape requirements and the reference design guidelines for transceiver channels. Use the Quartus II development environment (supported releases) for synthesis, place-and-route, and SignalTap logic analysis. Power estimation should be performed early using the Quartus PowerPlay analyzer to size the core and transceiver supplies correctly. This page synthesizes distributor pricing from DigiKey and Mouser, drop-in same-family alternatives, and practical FPGA design guidance that goes beyond the manufacturer datasheet summary.

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EP2AGX190FF35C5G - 181165 LE Arria II GX FPGA, 612 I/O, FC-FBGA-1152 | Intel / Altera
EP2AGX190FF35C5G

EP2AGX190FF35C5G - 181165 LE Arria II GX FPGA, 612 I/O, FC-FBGA-1152 | Intel / Altera

The Intel / Altera EP2AGX190FF35C5G is a high-density Arria II GX Field-Programmable Gate Array built on a 40 nm process, delivering 181,165 logic elements and 9,594 Kbits of embedded memory in a 1152-ball FC-FBGA package. It targets mid-range, transceiver-rich applications requiring up to 612 user I/O pins, eight integrated transceivers operating at data rates from 600 Mbps to 3.75 Gbps (C5 speed grade), and dedicated DSP blocks for high-throughput signal processing. An FPGA (Field-Programmable Gate Array) is a programmable logic device that sits at the top of the digital semiconductor hierarchy: ASIC -> CPLD -> FPGA -> programmable logic -> semiconductor. FPGAs contain configurable logic blocks, programmable routing, and often hard IP cores (transceivers, DSP, memory controllers). The Arria II GX family balances cost, density, and integrated 3.75 Gbps transceivers, positioning it as a 'mid-range' alternative to Stratix (high-end) and Cyclone (low-cost) families for designs that need SERDES without the highest performance tier. Key features include 8 transceiver channels at 3.75 Gbps, 612 user I/O pins, 28.6 Mbits of block RAM plus 1.2 Mbits of MLAB memory, 840 DSP blocks (18x18 multipliers), 4 hard memory controllers, and 4 PLLs. The device operates from a 0.9V core supply with 1.5V/1.8V/2.5V/3.3V I/O support. Speed grade 'C5' denotes the commercial temperature range (0C to 85C) with mid-tier performance. Typical applications include wireless baseband processing, video broadcast infrastructure, industrial imaging, and high-speed serial backplane interfaces. The Arria II GX's built-in transceivers support PCIe Gen1/Gen2, CPRI/OBSAI, Serial RapidIO, and gigabit Ethernet, eliminating external PHY ICs in many designs. When designing with this device, use the Quartus II design suite (v13.0+ supports Arria II GX) and verify transceiver channel placement against board layout - high-speed SERDES require impedance-controlled differential routing. The FF35 package is the largest in the family and shares its ball-map with EP2AGX260, simplifying PCB layout reuse between density variants.

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EP2AGX190FF35C6G - Arria II GX FPGA, 190K LE, 1152-BGA | Altera
EP2AGX190FF35C6G

EP2AGX190FF35C6G - Arria II GX FPGA, 190K LE, 1152-BGA | Altera

The Altera (Intel) EP2AGX190FF35C6G is a high-density Arria II GX Field Programmable Gate Array (FPGA) with 190,000 logic elements, 612 transceivers, and 9.5 Mbits of embedded memory, housed in a 1152-ball flip-chip BGA (FCBGA) package. It is part of the Altera Arria II GX family that targets mid-range, transceiver-rich applications including wireless infrastructure, broadcast, and high-speed serial connectivity. The 'FF35' suffix denotes the F35 1152-pin FCBGA package, while 'C6' indicates the commercial -6 speed grade. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), dedicated DSP blocks, block RAM, and high-speed transceivers connected by a programmable interconnect fabric. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors, and are differentiated from ASICs by their ability to be reconfigured in the field and from CPLDs by their higher logic density and embedded memory/DSP resources. The EP2AGX190FF35C6G features integrated transceivers supporting data rates up to 6.375 Gbps per channel, dedicated 18x18 multipliers for DSP, and on-chip memory distributed across M9K blocks. The 1152-BBGA FCBGA package provides high I/O count with flip-chip attachment for superior thermal and electrical performance, suitable for high-speed serial designs requiring controlled-impedance signal integrity. Architecturally, the Arria II GX family uses a 40nm process technology with adaptive logic modules (ALMs), each containing two combinational adaptive look-up tables (ALUTs) and four registers. This architecture delivers fine-grained logic utilization and supports up to 8.4 Gbps external memory interfaces through dedicated PHY blocks. Typical applications include wireless baseband processing, 3G/4G remote radio heads, HD-SDI video broadcast equipment, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, SGMII), and military/aerospace signal processing where mid-range FPGA density is needed without the power of a Stratix-class device. Design considerations include careful PCB layout for the FCBGA package's controlled-impedance differential pairs, robust power-rail decoupling to support the transceiver analog supply (VCCA), and thermal management via thermal vias and copper pours beneath the exposed-die region. Designers should reference Altera's Arria II GX handbook and pin-out tables when migrating to the EP2AGX260 (higher-density) variant for footprint-compatible scaling. This page synthesizes Altera Arria II GX family positioning, current distributor inventory at major channels, drop-in same-package alternatives from the same family, and practical board-level design notes not found in the standalone datasheet.

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EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera
EP2AGX190FF35I3G

EP2AGX190FF35I3G - Arria II GX FPGA 190K LE | Intel | Altera

The Intel (formerly Altera) EP2AGX190FF35I3G is a high-density Arria II GX field-programmable gate array (FPGA) delivering up to 181,165 logic elements, 612 user I/O pins, and up to 10,177,536 bits of embedded memory in a 1152-ball flip-chip BGA (FC-FBGA) package. It targets high-speed serial connectivity and high-logic-density DSP/processing applications. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded hard IP such as transceivers, block RAM, multipliers, and PLLs. Within the broader semiconductor taxonomy, an FPGA is a programmable logic device (PLD), which sits under the umbrella of digital integrated circuits (ICs) and, more specifically, application-specific standard products for parallel hardware acceleration. FPGAs are reprogrammed at the bitstream level, giving them ASIC-like performance with NRE cost near zero, making them the workhorse of prototyping, low-volume production, and reconfigurable computing. The EP2AGX190FF35I3G is fabricated on a 40 nm low-power process, supports core voltages of 0.9 V with I/O banks configurable to 1.2 V to 3.3 V standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL), and integrates 8 high-speed transceiver channels capable of multi-gigabit serial links. The part number suffix 'I3' denotes the industrial temperature grade (-40 °C to +100 °C junction) with speed grade 3, while the trailing 'G' indicates lead-free / RoHS-compliant lead finish. The architecture combines a logic fabric of adaptive logic modules (ALMs), M9K block RAM tiles, MLAB distributed RAM, embedded 18x18 multipliers, and a hard PCI Express Gen1/Gen2 controller. The high-speed transceivers are backed by on-die signal-conditioning circuitry, supporting protocols such as PCIe, GigE, Serial RapidIO, and serial digital video (SDI/HD-SDI). The 'FF35' package designation refers to a 35 mm body flip-chip BGA with 1152 balls on a 1.0 mm pitch - an Altera-standard high-pin-count footprint shared across multiple Arria II GX density grades. Typical applications include high-definition video broadcast and processing, wireless baseband DSP acceleration, military/aerospace signal intelligence (SIGINT) and radar preprocessing, telecom backplane bridging, medical imaging pipelines, and ASIC prototyping for ASIC-replacement designs. The combination of high logic density, embedded transceivers, and on-chip PCIe makes it well suited to data-path-heavy workloads. When designing with this part, allocate sufficient PCB layers (>= 12) for the FCBGA breakout, follow Intel/Altera power-supply sequencing requirements, and use the Quartus II / Quartus Prime design toolchain for synthesis, place-and-route, and timing closure. The large 35x35 mm package mandates a high-performance PCB stack-up; thermal management relies on a heat spreader attached directly to the flip-chip lid rather than forced-air cooling alone. This page synthesizes distributor pricing snapshots, drop-in alternative FPGAs from the same Arria II GX family, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a single, decision-ready reference.

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EP2AGX190FF35I3N - Arria II GX FPGA, 181K LE, 612 I/O, FCBGA-1152 | Intel
EP2AGX190FF35I3N

EP2AGX190FF35I3N - Arria II GX FPGA, 181K LE, 612 I/O, FCBGA-1152 | Intel

The Intel (Altera) EP2AGX190FF35I3N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) fabricated on a 40 nm low-power process, delivering 181,165 logic elements, 7,612 Logic Array Blocks (LABs), and up to 612 user I/O pins in a 1152-ball FineLine Ball-Grid Array (FC-FBGA / FCBGA) package. Operating at a core voltage of 0.9 V with embedded transceivers up to 500 MHz, the device combines high logic density with on-chip serial transceivers targeting cost-sensitive mid-range applications. What is an FPGA? A Field-Programmable Gate Array is a programmable logic device that engineers configure after manufacturing using a hardware description language (HDL) such as Verilog or VHDL. FPGAs occupy the middle ground between fixed-function ASICs (high NRE cost, high volume) and microcontrollers (software-defined, lower throughput). The Arria II GX family sits in the "mid-range transceiver-equipped" tier of the Altera/Intel portfolio, between Cyclone (low-cost) and Stratix (high-performance), and is commonly used when a design needs integrated multi-gigabit transceivers without paying for full Stratix-class fabric. Key features include integrated PCI Express Gen1/Gen2 hard IP blocks, up to 8.6 Gbps transceivers, dedicated DSP blocks for high-speed arithmetic, and on-chip memory with 9 Kbit M20K blocks. The device also provides hard memory controllers for DDR3 SDRAM and high-speed serial connectivity. Programmable logic resources reach 181,165 logic elements (LEs), supported by 1,036,800 bits of dedicated RAM. Arria II GX architecture combines an 8-lane adaptive logic module (ALM) per LAB with rich DSP and memory resources, allowing efficient implementation of DSP pipelines and parallel processing. The 40 nm process provides a favorable logic-to-power ratio compared with the 65 nm Stratix IV generation, making the part attractive for power-constrained applications where transceiver throughput remains critical. Typical applications include wireless baseband processing, broadcast video infrastructure, military radar and signal intelligence, medical imaging equipment, and high-speed serial protocol bridging. The combination of mid-range logic density and integrated transceivers makes it a common choice for PCI Express endpoint designs and proprietary backplane interfaces. Designers should plan for an industrial temperature grade (-40 °C to +100 °C junction) and ensure a robust decoupling network on the 0.9 V core and 1.1 V/2.5 V/3.3 V auxiliary rails. Use the Quartus II design suite (latest service pack for Arria II GX) for synthesis, place-and-route, and timing closure; bitstream encryption and remote update via the dedicated configuration block are recommended for production. This page synthesizes Intel distributor pricing, drop-in same-package alternatives from the Arria II family, and practical design guidance that is not collated in the manufacturer datasheet.

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EP2AGX190FF35I5 - Arria II GX FPGA, 181165 LE, 612 I/O | Intel
EP2AGX190FF35I5

EP2AGX190FF35I5 - Arria II GX FPGA, 181165 LE, 612 I/O | Intel

The Intel (formerly Altera) EP2AGX190FF35I5 is a high-density Arria II GX Field-Programmable Gate Array fabricated on a 40 nm process, integrating 181165 logic elements, 10177536 bits of embedded memory, and 612 user I/Os in a 1152-ball flip-chip BGA (FC-FBGA) package. Built around the Arria II GX transceiver architecture, the device combines a rich general-purpose FPGA fabric with multi-gigabit transceivers, making it a drop-in fit for high-throughput serial-interface designs. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that lets designers configure arbitrary digital circuits through SRAM-based configuration memory. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as the main forms of hardware-level programmable logic; Arria II GX is positioned as Intel's mid-range, transceiver-rich family that bridges between Cyclone V (low-cost) and Stratix IV (high-performance) families, aimed at cost-sensitive applications that still require multi-gigabit serial links. Key features of the EP2AGX190FF35I5 include integrated transceivers supporting multi-gigabit serial protocols, hard PCIe Gen1/Gen2 IP blocks, embedded memory blocks totaling 10.18 Mbits, dedicated DSP blocks for high-throughput signal processing, and a large user-I/O count (612) which supports wide parallel interfaces to external memories such as DDR2/DDR3 SDRAM, QDRII+ SRAM, and RLDRAM II. The industrial-grade speed-grade 5 designation means timing closure is rated for -40 C to +100 C ambient operation, which is suitable for telecom, industrial imaging, and military/aerospace subsystems. The 40 nm process node provides a useful balance between static and dynamic power consumption; the -I5 speed grade is the slowest in the Arria II GX family, trading peak Fmax for lower quiescent power and improved timing margin. The 1152-ball FC-FBGA package uses flip-chip BGA technology with a land-grid pitch suited to high-density PCB designs that require multiple signal layers and a continuous ground/power plane beneath the device. Typical applications for the EP2AGX190FF35I5 include wireless baseband processing, high-definition video broadcast equipment, medical imaging pipelines, military radar and signal-intelligence front-ends, and PCIe Gen2 host-bus adapter cards. Designers typically pair the part with external DDR3 SODIMMs, Flash configuration memories (EPCS), and clock-generation PLLs to form a complete embedded signal-processing subsystem. When designing with this FPGA, plan PCB stack-up carefully: 1152 balls at fine pitch demand microvia technology, a 1 oz copper power plane, and matched-length trace tuning for the transceiver channels. Use Intel Quartus II as the design entry, synthesis, place-and-route, and timing-analysis tool; Quartus II is mandatory for transceiver IP configuration and pin planning on Arria II GX devices. This page synthesizes distributor pricing snapshots, same-package alternatives, and practical Quartus II design-flow notes that go beyond the device datasheet, helping procurement and FPGA engineers make informed sourcing and substitution decisions.

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EP2AGX190FF35I5G - Arria II GX FPGA, 181K LE, 1152-FBGA | Intel
EP2AGX190FF35I5G

EP2AGX190FF35I5G - Arria II GX FPGA, 181K LE, 1152-FBGA | Intel

The Intel (formerly Altera) EP2AGX190FF35I5G is a high-density, low-power Arria II GX Field Programmable Gate Array (FPGA) built on a 40 nm process, delivering 181,165 logic elements, 10,177,536 bits of embedded memory, and 612 user I/O in a 1152-ball Flip-Chip BGA (FC-FBGA) package. The device operates from a 0.9 V core supply and is rated for industrial temperature range (-40C to +100C), suiting it for harsh-environment embedded and communications designs. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behaviour can be reconfigured after manufacturing. FPGAs sit in the programmable logic category between fixed-function ASICs and software-driven processors, providing hardware-level parallelism for DSP, packet processing, and high-speed serial I/O. Within Intel's portfolio, the Arria II GX family targets mid-range applications that require transceivers and moderate logic density at lower power than Stratix but higher capability than Cyclone. The EP2AGX190FF35I5G integrates up to 12 embedded transceivers supporting multi-gigabit serial protocols, dedicated on-chip memory blocks, and hard PCIe, Ethernet MAC, and DDR2/DDR3 memory controller IP blocks. The 8-bit Adaptive Logic Module (ALM) architecture is backward-compatible with 4-input LUT designs, simplifying migration from older Altera families. The flip-chip BGA package enables the high I/O count and signal integrity required for parallel memory buses and multiple SERDES lanes. Typical applications include high-speed serial interface bridging, telecom baseband processing, video broadcast equipment, military/aerospace signal processing, and ASIC prototyping. The combination of transceiver-rich architecture and substantial logic resources also suits medical imaging and industrial vision systems where deterministic latency matters. When designing with this device, allocate PCB layer stack-up for the FC-FBGA fan-out, observe the in-package decoupling capacitor guidelines in the Arria II GX handbook, and validate transceiver channel performance against the IBIS-AMI models. Use the Quartus II design suite (version 13.0 or later) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in alternative MPNs from the same Arria II GX family, and design considerations not found in the bare datasheet, providing actionable engineering context for sourcing and design decisions.

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EP2AGX190FF35I5N - Arria II GX FPGA 181K LE FC-FBGA-1152 | Intel
EP2AGX190FF35I5N

EP2AGX190FF35I5N - Arria II GX FPGA 181K LE FC-FBGA-1152 | Intel

The Intel (formerly Altera) EP2AGX190FF35I5N is a high-density, low-power Arria II GX Field Programmable Gate Array (FPGA) fabricated on a 40 nm process and housed in a 1152-ball FC-FBGA (FF35) package. The device integrates approximately 181,165 logic elements, 9,510 Kbits of embedded memory, 612 user I/Os, and up to 16 transceivers supporting multi-gigabit serial protocols. It is specified for the industrial temperature range (-40C to +100C) and operates from a 0.9 V core supply, making it suitable for power-sensitive, high-throughput embedded systems. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and embedded hardened IP such as transceivers, block RAM, and DSP blocks. FPGAs sit hierarchically between general-purpose microcontrollers and fixed-function ASICs: they offer parallel processing, deterministic latency, and the ability to be re-programmed in-system for evolving protocols or standards. The Arria II GX family targets the mid-range transceiver market, providing multi-gigabit serial capability without the cost or power of higher-end Stratix devices. Key differentiating features of the EP2AGX190FF35I5N include up to 16 integrated transceivers supporting data rates to 3.75 Gbps (CPRI/OBSAI, PCIe Gen1, SATA, XAUI), dedicated hard memory controllers, up to 8 PLLs, and per-channel dynamic reconfiguration of PHY parameters. The 40 nm process enables substantial logic density at substantially lower static power than the prior 65 nm Stratix IV generation. Embedded PCI Express Gen1 hard IP blocks offload the protocol layer from user logic, freeing fabric for application processing. The architecture combines a rich fabric of adaptive logic modules (ALMs), M20K block RAMs, and DSP blocks supporting 18x18 multipliers. The transceiver PMA layer features adaptive equalization and output pre-emphasis, while the PCS layer implements 8b/10b, word alignment, and rate-matching logic. Multi-rail power sequencing is handled by an on-chip Voltage Sensing circuitry that cooperates with external regulators. Typical applications include wireless baseband processing (CPRI/OBSAI links between radio units and baseband cards), high-definition video broadcast infrastructure, defense and avionics signal processing, medical imaging pipelines, and industrial control planes requiring deterministic parallel DSP. Designers choose Arria II GX where Stratix IV is over-spec and Cyclone IV is under-spec. When designing with this device, ensure your PCB supports 1152-ball FC-FBGA fine-pitch BGA routing with microvia stacks, allocate sufficient PCB layers (typically 12+), and validate power-rail sequencing against the in-system update requirements. Use the Quartus II 64-bit toolchain for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Altera/Intel Arria II GX family, and practical design notes not collected in the manufacturer datasheet, providing engineers with a single decision-ready reference.

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EP2AGX260EF29C4 - 244K LE Arria II GX FPGA, 780-FBGA | Intel
EP2AGX260EF29C4

EP2AGX260EF29C4 - 244K LE Arria II GX FPGA, 780-FBGA | Intel

The Intel (formerly Altera) EP2AGX260EF29C4 is a high-density Arria II GX Field Programmable Gate Array (FPGA) integrating 244,188 logic elements, 12,038,144 bits of embedded memory, and up to 12 transceivers in a 780-ball Flip-Chip BGA (FC-FBGA) package. Built on a 40 nm low-power CMOS process, the Arria II GX family targets mid-range applications requiring a balance of logic density, DSP performance, and serial connectivity without the cost of full Stratix-class devices. An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured by the user after manufacture. FPGAs occupy a unique position in the programmable logic taxonomy: above CPLDs (which are smaller, non-volatile, and lower density) and below structured ASICs in NRE cost, while offering parallel hardware execution of algorithms in DSP, packet processing, and high-speed I/O bridge functions. The Arria II GX family is Intel's mid-range transceiver-equipped line, sitting between the low-cost Cyclone families and the high-end Stratix families. Key features of the EP2AGX260EF29C4 include 244,188 logic elements distributed across 10,260 LABs (Logic Array Blocks), 1,008 embedded 18x18 multipliers for DSP, and 12 high-speed transceivers operating up to 6.375 Gbps. The device provides 372 user I/O pins plus dedicated transceiver channels, supports a core voltage of 0.9 V, and is offered in the commercial temperature grade (-4 speed grade). Architecturally, the Arria II GX device combines a logic fabric with hard IP blocks including transceivers, PCIe Gen1 endpoints, external memory controllers (DDR3, DDR2, LPDDR2, QDRII+), and DSP blocks. The 40 nm process and Adaptive Logic Module (ALM) architecture deliver favorable logic utilization, while the transceiver block supports multiple protocols (PCIe, Serial RapidIO, Gigabit Ethernet, XAUI, CPRI) with embedded PCS logic. Typical applications include high-speed serial interface bridging in communications infrastructure, video broadcast and imaging pipelines, military and aerospace signal processing, medical imaging systems, and ASIC/ASSP prototyping. The combination of high logic density, embedded transceivers, and abundant DSP blocks makes the EP2AGX260EF29C4 well suited to designs that previously required expensive custom ASICs. When designing with this device, verify power budget and thermal dissipation using the Intel Early Power Estimator (EPE) tool before PCB layout; the 780-ball FC-FBGA requires a multi-layer PCB with controlled-impedance routing for transceiver channels and matched-length DDR3 traces for memory interfaces. The -4 commercial speed grade must be matched against timing closure targets in Quartus II design software. This page synthesizes distributor pricing across multiple sources, lists drop-in alternative MPNs sharing the same FC-FBGA-780 footprint, and provides practical design notes not found in the manufacturer datasheet alone.

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EP2AGX260EF29C4G - Arria II GX FPGA, 244K LE, 6.75Gbps | Intel
EP2AGX260EF29C4G

EP2AGX260EF29C4G - Arria II GX FPGA, 244K LE, 6.75Gbps | Intel

The Intel EP2AGX260EF29C4G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) from the Altera/Intel programmable logic portfolio, integrating 244,188 logic elements and 12,038,144 bits of embedded memory in a 780-ball FineLine BGA (FCBGA) package. It combines a rich logic fabric with up to 12 transceivers capable of 6.375 Gbps data rates, making it a turnkey solution for serial connectivity, digital signal processing, and embedded processing workloads. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells, all wired through a programmable interconnect. FPGAs sit between fixed-function ASICs and software-driven microcontrollers: they deliver ASIC-class throughput and latency while preserving full hardware reprogrammability. The Arria II GX family is Intel's mid-range transceiver-equipped family, bridging the low-cost Cyclone series and the high-end Stratix series, and is widely used in wireless baseband, broadcast video, military/aerospace, and high-speed serial I/O applications. Key features of the EP2AGX260EF29C4G include 244,188 logic elements, 12,038,144 total RAM bits, 10260 LABs/CLBs, 372 user I/Os, and 12 full-duplex transceivers operating up to 6.375 Gbps. The device also integrates 1,140 embedded 18x18 multipliers for DSP, hard PCI Express Gen1/Gen2 endpoints, and supports DDR2/DDR3 external memory interfaces. The C4 speed grade is optimized for higher logic performance than the I4 industrial grade at the cost of commercial 0C to +85C temperature range operation. Architecturally, the EP2AGX260EF29C4G uses a 40nm TSMC process node with a logic fabric composed of 8-input ALMs (Adaptive Logic Modules), dedicated MLAB (memory logic array block) memory, and 9-bit DSP blocks. Configuration is typically stored in 1.8V NOR-flash or via JTAG, with bitstream encryption and design security features supporting AES-128. The integrated transceivers use a hard PCS (physical coding sublayer) supporting 8B/10B, PCIe Gen1/Gen2, XAUI, and custom protocols at line rates from 600 Mbps to 6.375 Gbps. Typical applications include wireless baseband processing, software-defined radio, broadcast video encoding/decoding, radar and sonar signal processing, high-speed serial protocol bridging (PCIe, XAUI, Serial RapidIO), and military secure communications. The 780-BGA package exposes 8 transceiver channels and 16 global clock networks, sufficing for high-density backplane and line-card designs. When designing with this part, plan power budgeting carefully: at full utilization the Arria II GX core can consume 10W to 20W, requiring multi-layer PCB stackups with dedicated ground and power planes. Designers should use the Quartus II design suite (with continued compatibility in Intel Quartus Prime Standard Edition) and the Arria II GX Transceiver Toolkit for SI analysis. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the standalone manufacturer datasheet.

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EP2AGX260EF29C4N - 244K LE Arria II GX FPGA, 780-FCBGA | Altera
EP2AGX260EF29C4N

EP2AGX260EF29C4N - 244K LE Arria II GX FPGA, 780-FCBGA | Altera

The Altera (Intel) EP2AGX260EF29C4N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) delivering 244,188 logic elements, 12,038,144 bits of embedded memory, and integrated transceivers in a 780-pin FC-BGA package. It is fabricated on a 40 nm low-power CMOS process, supports core voltages down to 0.9 V, and provides 372 user I/O pins plus high-speed serial links for mid-range serial connectivity designs. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect. Within the broader taxonomy, an FPGA sits below ASIC in performance-per-watt but above general-purpose microcontrollers in raw parallel throughput, making it ideal for protocol bridging, signal processing, and hardware acceleration where time-to-market outweighs the cost of custom silicon. Key features include 10260 logic array blocks, 4 PCI Express hard IP blocks, 8.5 Gbps transceivers on dedicated GXB channels, dedicated DDR2/DDR3 memory controller hard IP, and configuration via passive serial, fast passive parallel, or JTAG. The 0.9 V core reduces dynamic power relative to the previous 90 nm Arria GX family while the integrated PCIe and PHY simplify board-level design. Typical applications include PCI Express Gen1/Gen2 endpoint cards, multi-gigabit serial backplane aggregation, digital video broadcast studio equipment, software-defined radio baseband pre-processing, and ASIC prototyping. Its combination of logic density and serial bandwidth makes it a frequent choice for designers migrating from Stratix II or Cyclone III designs that require a mid-bandwidth transceiver companion. When designing with this device, plan a multi-layer PCB with continuous ground and power planes; the FC-BGA's high pin count and high-speed transceivers demand controlled-impedance routing, length matching within 25 mils across GXB lanes, and a minimum of 6 PCB layers to maintain signal integrity.

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EP2AGX260EF29C5 - 244K LE Arria II GX FPGA 780-FCBGA | Intel
EP2AGX260EF29C5

EP2AGX260EF29C5 - 244K LE Arria II GX FPGA 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGX260EF29C5 is a high-density Arria II GX Field-Programmable Gate Array (FPGA) integrating 244,188 logic elements, 12,038,144 memory bits, and 372 user I/Os into a 780-ball FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package. It is built on a TSMC 40 nm low-power process and operates from a 0.9 V core supply, with speed grade -5 (C5). According to verified distributor listings, the part is offered as a 780-BBGA/FCBGA device with up to 12 Mbits of embedded memory and embedded transceivers supporting high-speed serial protocols. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic, interconnect, and I/O behaviour are defined by a user-supplied hardware description language (HDL) bitstream. In the programmable logic taxonomy, the EP2AGX260EF29C5 sits below full-mask ASICs in NRE cost and below software-programmed DSPs in deterministic latency, making it ideal for mid-volume designs, prototyping, and applications that require parallel datapaths with hardware-timed interfaces. Arria II GX specifically belongs to Intel's transceiver-equipped mid-range family, sitting between Cyclone (low-cost) and Stratix (high-performance) families. Key differentiating features include 244,188 logic elements, 12 Mbits of embedded SRAM, 372 user I/Os, embedded multi-gigabit transceivers, and 8-input adaptive logic modules (ALMs). The 40 nm process enables a favorable power/performance trade-off compared with the 65 nm Stratix IV predecessor, while the FC-FBGA package supports high-density board designs with controlled-impedance signal escape. Typical applications include high-speed serial protocol bridging (PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO), digital video broadcasting equipment, software-defined radio (SDR) baseband processing, radar and medical imaging front-ends, and telecom line cards. The combination of large logic capacity, abundant transceivers, and abundant user I/O is well suited to designs that must aggregate multiple high-speed serial links and a wide parallel data bus on one chip. Designers should plan the PCB for a 780-ball FC-FBGA escape with matched-length differential pairs for transceiver channels, and validate thermal envelopes against typical power consumption in the selected configuration. For software development, Intel Quartus II (legacy) or the maintained Quartus Prime Lite edition supports this device family with synthesis, place-and-route, and timing analysis.

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EP2AGX260EF29C5G - Arria II GX 260K LE FPGA 780-FBGA | Intel
EP2AGX260EF29C5G

EP2AGX260EF29C5G - Arria II GX 260K LE FPGA 780-FBGA | Intel

The Intel EP2AGX260EF29C5G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine Ball-Grid Array (FBGA) package. It integrates 260,000 logic elements (LE), 12,038,144 bits of embedded memory, and 244,188 bits of on-chip RAM, and exposes 372 user I/O pins, making it one of the highest-density members of the Arria II GX transceiver-equipped family. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic fabric, embedded memory blocks, DSP slices, and high-speed serial transceivers on a single die. FPGAs sit at the top of the programmable logic taxonomy - above CPLDs and discrete glue logic - and are typically deployed as hardware accelerators, protocol bridges, or signal-processing engines where microcontrollers or DSPs cannot meet throughput requirements. Key features of the EP2AGX260EF29C5G include integrated multi-gigabit transceivers (MGTs) supporting common serial standards, dedicated hardware DSP blocks for high-throughput filtering and modulation, and on-chip PLLs for clock synthesis and jitter-cleaning. The C5 speed grade targets -5C to 85C commercial operation, while the 'G' suffix indicates a lead-free, RoHS-compliant ball finish. The 780-FBGA package offers a compact 29 mm square footprint suitable for space-constrained designs. Architecturally, the device uses a 40 nm process node, an adaptive logic module (ALM) structure that is 20% more area-efficient than the prior 4-input LUT approach, and embedded transceaters capable of multi-gigabit rates. Per-block memory (MLAB/M9K/M144K) and dedicated 18x18 multipliers form the DSP backbone, while on-chip termination and dynamic reconfiguration reduce board complexity. Typical applications include high-speed serial-interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), wireless baseband signal processing, software-defined radio front-ends, video broadcast and image processing pipelines, and industrial test-and-measurement backplanes. The combination of high LE count, large memory, and integrated transceivers makes it well suited for line-card aggregation and protocol conversion designs. When designing with this device, plan power-rail sequencing early - the EP2AGX260EF29C5G requires separate VCCINT, VCCA, VCCD_PLL, and transceiver supply rails with monotonic ramp-up to avoid latch-up. Use IBIS simulation for the 372 user I/Os and ensure the FBGA land pattern matches JEDEC MS-034 to keep solder-joint yield high. This page synthesizes distributor pricing, drop-in Arria II GX family alternatives, and practical hardware-design notes not found in the manufacturer datasheet alone, giving procurement and FPGA engineers a single-source reference for the EP2AGX260EF29C5G.

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EP2AGX260EF29C5N - 244K LE Arria II GX FPGA, 780-FBGA | Intel
EP2AGX260EF29C5N

EP2AGX260EF29C5N - 244K LE Arria II GX FPGA, 780-FBGA | Intel

The Intel EP2AGX260EF29C5N is a high-density, transceiver-equipped Arria II GX field-programmable gate array (FPGA) delivering 244,188 logic elements, 10,238 Kbit of embedded memory, and 12 transceivers at up to 5 Gbps in a 780-ball flip-chip BGA (FC-FBGA) package. It is fabricated on a 40 nm process and operates from a 0.9 V core supply with support for commercial temperature grades (0 °C to +85 °C). An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured after manufacturing. FPGAs sit hierarchically under programmable logic -> logic ICs -> integrated circuits, and are the workhorse of high-throughput digital signal processing, hardware-accelerated computing, and protocol bridging. The Arria II GX family specifically targets mid-range applications that need embedded multi-gigabit transceivers (MGTs) without the cost of a full Stratix-class device. Key features include 8 PLLs (4 enhanced and 4 fast PLLs), 372 general-purpose I/O pins, support for DDR2/DDR3/QDRII/QDRII+/RLDRAM II external memory interfaces, and PCI Express hard IP blocks. The 12 full-duplex transceivers reach 5 Gbps, enabling protocols such as PCIe Gen1/Gen2, XAUI, CPRI, and Serial RapidIO. Hard IP offloads PHY and data-link layer functions, freeing programmable logic for user application code. The architecture combines adaptive logic modules (ALMs), M9K memory blocks, MLAB distributed memory, and dedicated DSP blocks for high-throughput arithmetic. The 780-ball FC-FBGA package enables high pin count and excellent signal integrity for the multi-gigabit transceivers, while the 40 nm low-power process delivers a balance of performance and power efficiency suitable for line-card, broadcast, and wireless baseband applications. Typical applications include wireless baseband processing, software-defined radio (SDR), high-speed serial protocol bridging, broadcast video processing, and PCI Express endpoint cards. The combination of 5 Gbps transceivers and abundant DSP resources makes the EP2AGX260EF29C5N particularly well-suited for wireless infrastructure where CPRI and OBSAI fronthaul links connect remote radio heads to baseband units. When designing with this device, careful attention must be paid to transceiver reference-clock jitter, PCB stack-up for 5 Gbps SerDes channels, and power sequencing for the 0.9 V core / 2.5 V/3.3 V I/O / 1.2 V transceiver analog supplies. Quartus II design software (Altera Complete Design Suite 13.1 or later) is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes for the EP2AGX260EF29C5N that are not found in the standalone manufacturer datasheet.

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