EP2A70F1508C9N - APEX II FPGA 67.2K Cells 1060 I/O | Altera
料号： EP2A70F1508C9N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 50 | $215 | $10,750.00 |
| 100 | $195 | $19,500.00 |
| 500 | $175 | $87,500.00 |
EP2A70F1508C9N 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable routing, and embedded resources such as block RAM, PLLs, and high-speed transceivers. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Unlike fixed-function ASICs, FPGAs are programmed after manufacturing for prototyping, custom datapaths, glue logic, and parallel processing tasks. The APEX II family is engineered for high-density logic implementation with MultiCore architecture combining fine-grain logic with embedded memory.
Key features include 1,146,880 bits of embedded system RAM distributed across embedded array blocks (EABs), 1060 user I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, GTL), four phase-locked loops (PLLs) for clock management, and a MultiVolt core allowing mixed-voltage operation with I/O banks. The 1508-ball FC-FBGA package supports high signal-counting designs while minimizing PCB footprint.
The device supports in-system configuration via passive serial, active serial, and JTAG modes, with optional on-chip encryption for design security. The 0.15 µm process delivers a balance of density and power efficiency for telecom, networking, and DSP-intensive applications. A built-in JTAG (IEEE 1149.1) boundary-scan test interface simplifies board-level test.
Typical applications include high-speed telecommunication switching, ASIC prototyping, DSP co-processing, networking infrastructure, and parallel coprocessing engines. Designers choose the EP2A70F1508C9N when projects require high logic density and high I/O count in a single device. Note that this part is from a long-discontinued legacy family and is typically procured for maintenance of existing designs or as a known drop-in equivalent.
When designing with this device, ensure decoupling capacitance meets APEX II power-supply guidelines, and verify that signal-integrity simulation is performed on high-speed I/O banks. The 1508-ball FC-FBGA requires advanced PCB stack-up with controlled-impedance routing.
This page synthesizes distributor availability, same-family drop-in alternatives, and design notes beyond the manufacturer datasheet for engineers maintaining legacy APEX II designs or evaluating second-source equivalents.
直接替换替代料： EP2A70F1508C9N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2A70F1508C9N （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Process Technology, Speed Grade, Series.
快速对比工具——选择替代料号进行并排对比：
EP2A70F1508C9
✅ 直接替换✓ 有现货
$1310 / 个
查看数据手册 →EP2A70F1508C9ES
✅ 直接替换✓ 有现货
$199 / 个
查看数据手册 →EP2A70F1508C8N
✅ 直接替换✓ 有现货
$175 / 个
查看数据手册 →EP2A70F1508C8
✅ 直接替换✓ 有现货
$1495 / 个
查看数据手册 →EP2A70F1508C7N
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP2A70F1508C7ES
✅ 直接替换✓ 有现货
$250 / 个
查看数据手册 →EP2A70F1508C9N 最大额定值与电气特性
| Family | APEX II |
| Series | EP2A70 |
| Logic Elements / Cells | 67200 |
| System Gates | 3M |
| Embedded Memory Bits | 1146880 |
| Maximum User I/O | 1060 |
| Number of PLLs | 4 |
| Core Voltage | 1.5 V (1.425 V to 1.575 V) |
| Operating Frequency | 198 MHz |
| Process Technology | 0.15 um CMOS |
| Package Type | 1508-ball FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Pin Count | 1508 |
| 安装类型 | Surface Mount |
| Operating Temperature Grade | Commercial |
| Configuration Method | JTAG, Passive Serial, Active Serial |
| RoHS 状态 | Unknown - legacy part, verify with supplier |
| JTAG (IEEE 1149.1) | Supported |
EP2A70F1508C9N 1508 引脚配置指南
EP2A70F1508C9N（1508 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2A70F1508C9N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2A70F1508C9N 适用于 6 应用s: Telecommunications Switching Infrastructure, ASIC Prototyping and Emulation, DSP Coprocessor and DSP Pipeline, Networking Infrastructure / Router Line Card, Parallel Coprocessing Engine, Industrial Control and Test Equipment.
Telecommunications Switching Infrastructure
The EP2A70F1508C9N's 67200 logic cells, 1060 user I/Os, and 4 on-chip PLLs make it well-matched to legacy SDT/STM telecommunications switching fabrics. Its 198 MHz internal frequency supports cell/packet processing at typical telecom line rates, and the MultiVolt I/O banks interface directly with 3.3 V and 5 V backplane logic. The device's high I/O count enables parallel connection to multiple line cards, while the 1.146 Mbit embedded RAM buffers cells between switch ports. Design tip - clock distribution must account for PLL jitter when multiplexing multiple STS streams.
推荐
ASIC Prototyping and Emulation
With 3M system gates, the EP2A70F1508C9N is sized to emulate multi-million-gate ASICs used for pre-silicon validation. Engineers map RTL or gate-level netlists onto the LUT-rich APEX II architecture and use the 1060 I/O pins to drive external test benches at up to 198 MHz. The 1508-ball FC-FBGA package allows a dense, controlled-impedance PCB emulation board. Performance is sufficient for ASIC clock-tree prototyping. Trade-off - the 0.15 µm process draws more power than modern 28/14 nm FPGAs.
推荐
DSP Coprocessor and DSP Pipeline
The APEX II EP2A70F1508C9N integrates 1.146 Mbit of embedded RAM arranged in EABs (Embedded Array Blocks) suitable for DSP filter coefficient storage and data-path pipelining. Combined with 67200 logic cells, the device implements multiply-accumulate (MAC) units for fixed-point DSP at telecom sample rates. The 198 MHz fabric rate supports 100+ MHz DSP clock domains. JTAG (IEEE 1149.1) boundary-scan aids board test of high-density DSP cards. Note that no dedicated DSP blocks (as in modern Stratix) exist - all DSP is implemented in fabric.
推荐
Networking Infrastructure / Router Line Card
The EP2A70F1508C9N's 1060 user I/O count and high logic density suit legacy router and switch line-card designs requiring parallel packet classification, header parsing, and queue management. Its 198 MHz fabric rate handles 100 Mbps Fast Ethernet and basic Gigabit Ethernet forwarding paths. The 1.5 V core plus MultiVolt I/O banks interface with PHY and TCAM devices on legacy line cards. The device is typically paired with external TCAM for L3 lookups. Heat dissipation at full I/O toggle requires proper airflow.
推荐
Parallel Coprocessing Engine
High-end coprocessing and accelerator boards of the early 2000s used APEX II devices like the EP2A70F1508C9N to perform bit-level parallelism in cryptography, image processing, and scientific workloads. The 67200 logic cells and 1.146 Mbit of distributed RAM enable efficient parallel data-path pipelines, and the 1060 I/Os support wide memory interfaces to external SRAM/DRAM banks. Designers should note that modern alternatives (Cyclone V, Arria 10) deliver dramatically higher performance per watt.
推荐
Industrial Control and Test Equipment
Long-lifecycle industrial control, defense, and test-and-measurement systems still rely on APEX II FPGAs like the EP2A70F1508C9N for deterministic parallel I/O handling, custom bus protocols, and instrumentation signal routing. Its 1060 I/Os interface with parallel ADC/DAC arrays, and JTAG boundary-scan simplifies in-field diagnostics. Operating temperature grade is commercial; verify with distributor for industrial/extended-temperature screening. Lead-time stability is a concern given the obsolete lifecycle.
推荐
推荐产品汇总
工程参考数据： EP2A70F1508C9N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2A70F1508C9 | EP2A70F1508C9ES | EP2A70F1508C8N | EP2A70F1508C7N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 1508-ball FC-FBGA | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same |
| Logic Cells | 67200 | 67200 | 67200 | 67200 | 67200 |
| System Gates | 3M | 3M | 3M | 3M | 3M |
| Embedded RAM | 1146880 bits | 1146880 bits | 1146880 bits | 1146880 bits | 1146880 bits |
| User I/O | 1060 | 1060 | 1060 | 1060 | 1060 |
| Speed Grade | C9 (fastest) | C9 | C9 | C8 (~10% slower) | C7 (~20% slower) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Pin/Ball Finish | Pb-free (N suffix) | SnPb (no suffix) | ES screening/finish code | Pb-free | Pb-free |
关键差异点
- Fastest speed grade in the same-package EP2A70 family （对比 EP2A70F1508C8N)
- Pb-free (RoHS-compatible) ball finish for modern assembly （对比 EP2A70F1508C9)
- Highest logic density in 1508-ball FC-FBGA APEX II package （对比 EP2A70F1508C7N)
设计说明
The APEX II EP2A70F1508C9N requires multiple power rails: a 1.5 V core (VCCINT) supplied at 1.425-1.575 V, separate VCCIO rails for each I/O bank (typically 1.5 V, 1.8 V, 2.5 V, or 3.3 V), and VCCPD for configuration pins. Altera's APEX II datasheet specifies bulk tantalum + ceramic decoupling per bank. At full I/O toggle the device can draw several amps on VCCINT; use a high-current LDO or DC-DC converter with adequate thermal dissipation. Add 0.1 µF and 10 µF capacitors adjacent to every power pin.
The 1508-ball FC-FBGA requires a high-density PCB stack-up, typically 8-12 layers with microvia or via-in-pad technology. Signal-integrity simulation is mandatory for DDR-style source-synchronous interfaces. Per Altera's APEX II hardware design guide, controlled-impedance routing (50 ohm single-ended, 100 ohm differential) is required for all I/O banks. Use ground/power planes immediately below the BGA to provide a low-impedance return path. Thermal vias under the package improve heat dissipation.
Common pitfalls include: (1) confusing EP2A70F1508 (1508-ball) with EP2A70F1020 (1020-ball) - they are NOT pin-compatible despite similar family; (2) ignoring speed-grade differences (C7 vs C8 vs C9) when substituting in timing-critical paths; (3) using wrong configuration mode - APEX II supports JTAG, Passive Serial (PS), and Active Serial (AS) but the configuration bitstream format is family-specific; (4) assuming Pb-free (N suffix) and SnPb (no suffix) parts are drop-in - they are pin-compatible but reflow profiles differ.
Estimated: at 1.5 V core, full I/O toggle, and 100% logic utilization, the EP2A70F1508C9N dissipates an estimated 3-5 W typical. The FC-FBGA package has a theta-JA of roughly 15-20 C/W on a standard 8-layer PCB with thermal vias, giving a junction-temperature rise of 45-100 C above ambient. Verify with manufacturer thermal model for the actual layout. Adequate airflow is required; consider heatsink or cold plate for high-ambient or enclosed designs.
合规信息
The 'N' suffix denotes Pb-free ball finish per Altera ordering convention. RoHS/REACH status not confirmed in the verified web data; verify with supplier at time of order. Not AEC-Q100 (FPGAs are not AEC-qualified unless explicitly automotive-graded).
