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产品（39,000+)

EP2AGX65DF25I6N - Arria II GX FPGA 65K LE, 572-FCBGA | Intel/Altera
EP2AGX65DF25I6N

EP2AGX65DF25I6N - Arria II GX FPGA 65K LE, 572-FCBGA | Intel/Altera

The Intel (formerly Altera) EP2AGX65DF25I6N is a 65 nm Arria II GX field-programmable gate array (FPGA) integrating 60,214 logic elements, 5,371,904 bits of embedded memory, and up to 252 embedded 18x18 multipliers in a 572-ball flip-chip BGA (FCBGA) package. Speed grade -6, industrial temperature range, and 8 high-speed transceivers at up to 6.375 Gbps make it a mid-density transceiver-capable FPGA targeting PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and SMPTE video bridging. A field-programmable gate array is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected through programmable interconnect. Modern FPGAs add embedded RAM blocks, DSP blocks, clock management PLLs, high-speed transceivers, and hard PCIe/DRAM controllers. In the broader taxonomy, the EP2AGX65DF25I6N is an FPGA, a member of the programmable logic family (which includes CPLDs and one-time-programmable devices), under the larger category of programmable logic devices (PLDs) within the semiconductor hierarchy. The Arria II GX series positioned itself between Cyclone (low-cost) and Stratix (high-performance) families. Key features include 364 18x18 multipliers total in some device variants, 8 full-duplex transceivers from 600 Mbps to 6.375 Gbps supporting PCIe Gen1/Gen2, CPRI, SATA, and XAUI, 4 PCI Express hard IP blocks, 4 PLLs, and 12 global clock networks. The device operates from a 0.9 V core supply with separate transceiver and auxiliary supplies and supports the LVDS, LVTTL, LVCMOS, and SSTL I/O standards through configurable I/O banks. The Arria II GX architecture is built on a 65 nm low-power TSMC process with 9-metal-layer copper interconnect. The transceiver blocks are hard IP implementing serial PMA and PCS with embedded 8B/10B encoding, word alignment, rate matching, and channel bonding. This hard-serializer/deserializer integration reduces the LE cost of multi-gigabit interfaces by 30-50% compared to soft IP-based implementations in earlier families, while delivering deterministic latency critical for real-time video and industrial protocols. Typical applications include wireless baseband processing where 6.375 Gbps transceivers connect to mixed-radio cards, broadcast video routers and format converters using SMPTE SDI links, military secure-radio and signal-intelligence platforms, industrial machine-vision frame grabbers, and PCIe-based DSP accelerator cards for medical imaging. The 572-FCBGA package exposes sufficient I/O for multi-channel high-speed serial designs plus parallel LVDS data paths. When designing with this part, reserve a 4-layer PCB with controlled-impedance 100-ohm differential routing for transceiver channels; provide isolated analog supplies for the transceiver PLLs; and use the Quartus II design software (13.0sp1 or later) for synthesis, place-and-route, and timing closure. Designers migrating to newer families should evaluate Cyclone V GT or Arria V GZ as drop-in transceiver upgrades with higher data rates and lower core power. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP2AGX65DF25I6N not found in the manufacturer datasheet alone.

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EP2AGX65DF29C3N - 65K Arria II GX FPGA | Altera | Embedded Systems
EP2AGX65DF29C3N

EP2AGX65DF29C3N - 65K Arria II GX FPGA | Altera | Embedded Systems

Altera EP2AGX65DF29C3N is a 65 nm Arria II GX field-programmable gate array (FPGA) with 60,214 logic elements, 602,214 embedded memory bits, and 364 user I/O pins, supplied in a 572-pin FBGA package. The verified result identifies the part as an Arria II GX programmable-logic device, making it suitable for configurable digital logic, high-speed interfacing, and embedded processing systems. Its package designation DF29 corresponds to the 572-ball FBGA land pattern shown in the available device-family documentation. An FPGA is a semiconductor integrated circuit containing configurable logic blocks, programmable routing, embedded memory, and I/O resources. Unlike an application-specific integrated circuit, an FPGA can be configured after manufacturing to implement digital circuits, interfaces, or processing pipelines. Within the component hierarchy, EP2AGX65DF29C3N is an FPGA, a programmable logic device, a digital integrated circuit, and ultimately a semiconductor. The architecture allows a board designer to update logic behavior without changing the silicon, while also providing many parallel I/O connections for system-level integration. The principal verified capacity figures are 60,214 logic elements, 602,214 embedded memory bits, 364 user I/O pins, and a 572-pin FBGA package. These resources support datapaths, control logic, communications bridges, and memory-centric functions. The high pin count also makes package escape routing, power integrity, signal integrity, and ball assignment central parts of the board design. The available data does not verify logic-array dimensions, transceiver count, transceiver data rate, operating temperature, core voltage, or speed-grade timing values. EP2AGX65DF29C3N belongs to the Arria II GX family, which is associated with integrated high-speed transceiver capability. However, the supplied search data does not provide a defensible transceiver count or maximum transceiver rate, so those values remain unstated rather than inferred from the family name. Design work should use the device handbook and pinout tables to confirm every ball function, bank voltage, configuration interface, power rail, differential-pair rule, and recommended decoupling network. Firmware and bitstream generation should likewise use the matching Altera toolchain and device support files. Typical applications include communications equipment, industrial control, test and measurement, image processing, and embedded data acquisition. Its programmable architecture is useful when interfaces must be adapted between sensors, converters, processors, memory devices, and backplanes. The 364 user I/O pins can support many parallel connections, while the 602,214 embedded memory bits provide distributed storage for buffering and state. Board-level performance will depend on the selected configuration, clock resources, I/O bank settings, routing, and power implementation. A key design consideration is complete package-level validation before release. Engineers should use the manufacturer’s 572-ball ball-map documentation rather than relying on a simplified symbol, preserve required power-plane continuity, and follow the recommended decoupling and high-speed layout guidance. Because the verified data does not include detailed timing, electrical, thermal, or absolute-maximum specifications, those parameters require confirmation from the official datasheet before schematic or PCB sign-off. This page combines verified search results, structured capacity fields, sourcing context, and practical design cautions; it does not infer undocumented specifications.

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EP2AGX65DF29C4G - Arria II GX FPGA 65K LE FCBGA-780 | Intel
EP2AGX65DF29C4G

EP2AGX65DF29C4G - Arria II GX FPGA 65K LE FCBGA-780 | Intel

The Intel (formerly Altera) EP2AGX65DF29C4G is a 65 nm Arria II GX mid-range FPGA combining 60,214 logic elements with embedded transceivers in a 780-ball flip-chip BGA (FC-FBGA) package. It integrates 364 user I/Os, 5,371,904 bits of embedded memory, and 8 transceiver channels operating at up to 3.75 Gbps for high-speed serial protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and Gigabit Ethernet. An FPGA (Field-Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs), embedded block RAM, DSP slices, and programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which include CPLDs and SPLDs. Arria II GX specifically targets mid-range applications needing transceivers, DSP blocks, and a balance of logic, memory, and I/O bandwidth without the power cost of Stratix-class devices. Key features of the EP2AGX65DF29C4G include 4.8125 Kbits of M9K block RAM (effectively 536 blocks of M9K + M-RAM equivalents totaling the 5,371,904-bit figure), up to 16 global clock trees plus 96 peripheral PLLs, hard PCIe Gen1/Gen2 IP blocks, and dedicated 6.5536 Gbps-capable transceivers. The 0.9 V core voltage with adaptive voltage scaling reduces dynamic power, while the -4 speed grade places it in the mid-speed tier within the Arria II GX family. The 29 mm flip-chip BGA package supports high-density board designs but requires careful PCB stack-up planning. Typical applications include wireless infrastructure baseband cards, broadcast video processing, military radar signal chains, and PCIe-based industrial control cards. The integrated transceivers and PCIe hard IP eliminate external SERDES for many designs, while the abundant block memory suits packet buffering and FFT scratchpad storage. Designers should plan thermal dissipation carefully - the flip-chip BGA package couples heat directly into the PCB, so a multi-layer PCB with inner copper ground/thermal planes is recommended. The Quartus II software suite (16.1 and earlier; later Quartus Prime in compatibility mode) is the supported toolchain.

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EP2AGX65DF29C4N - Arria II GX FPGA, 60K LE, 780-FBGA | Intel / Altera
EP2AGX65DF29C4N

EP2AGX65DF29C4N - Arria II GX FPGA, 60K LE, 780-FBGA | Intel / Altera

The Intel (formerly Altera) EP2AGX65DF29C4N is a high-density, low-power Arria II GX Field Programmable Gate Array (FPGA) with 60,214 logic elements, 2,530 LABs/CLBs, and 5,371,904 bits of embedded memory, housed in a 780-ball flip-chip BGA (FC-FBGA) package measuring 29 x 29 mm. It is built on a 40 nm CMOS process, supports a core voltage of 0.9 V, and integrates up to 364 user I/O pins with built-in transceivers up to 6.375 Gbps for high-speed serial connectivity. An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device built from a matrix of configurable logic blocks (CLBs), dedicated DSP blocks, embedded memory blocks, and programmable I/O elements, all interconnected by a programmable routing fabric. FPGAs occupy a specific niche in the semiconductor hierarchy - more flexible than an ASIC, more deterministic than a CPU, and more parallel than a microcontroller - making them the natural choice for high-throughput data path, protocol bridging, and signal processing workloads. The Arria II GX family specifically targets mid-range applications that need both DSP horsepower and multi-gigabit transceivers without the cost of a high-end Stratix device. Key features include 4.7 Mb of embedded RAM distributed across M9K blocks, embedded 18x18 multipliers supporting DSP at up to 500 MHz, up to 12 transceiver channels, and hard PCIe Gen1/Gen2 IP blocks. The device supports both CML and LVDS I/O standards, and offers enhanced SERDES for protocols such as CPRI, OBSAI, SATA, and XAUI. The hard IP blocks significantly reduce logic utilization and power compared to soft implementations. Architecturally, the EP2AGX65 uses an Adaptive Logic Module (ALM) structure that combines 8-input fracturable look-up tables with dedicated registers, enabling efficient mapping of arbitrary combinatorial and arithmetic logic. The transceiver physical layer includes adaptive equalization and pre-emphasis to drive backplanes and direct-attach copper cables at multi-gigabit rates, which is essential for modern serial backplane designs. Typical applications include wireless baseband processing, radar signal processing in defense systems, high-speed serial protocol bridging, video processing and broadcast infrastructure, and PCI Express endpoint or root-port designs in test and measurement equipment. The combination of 60K logic elements and transceivers makes the EP2AGX65 a versatile mid-range solution. Designers should pay attention to transceiver channel placement when assigning pins - the transceiver channels are grouped into banks with specific PCB routing requirements. Power sequencing across 0.9 V core, 1.1 V PLL, and 1.5/2.5/3.3 V I/O rails must follow the datasheet-constrained sequence to avoid inrush damage during configuration. This page synthesizes distributor pricing, verified drop-in alternatives, application references, and engineering design notes beyond the raw manufacturer datasheet - drawing from Intel's Arria II Device Handbook and current distributor inventory data as of 2026-09-08.

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EP2AGX65DF29C5G - Arria II GX FPGA 60K LE 780-FBGA | Intel
EP2AGX65DF29C5G

EP2AGX65DF29C5G - Arria II GX FPGA 60K LE 780-FBGA | Intel

The Intel EP2AGX65DF29C5G is a high-density Arria II GX Field Programmable Gate Array (FPGA) featuring 60,214 logic elements, 364 user I/O pins, and 5,371,904 bits of embedded memory, fabricated on a 40 nm process and housed in a 780-ball FineLine BGA (FCBGA) package. Operating at a core voltage of 0.9 V (range 0.87 V to 0.93 V), the device targets mid-range transceiver-based applications with a maximum internal clock frequency of approximately 500 MHz and integrates up to 12 transceivers capable of multi-gigabit serial I/O. The C5 speed grade balances cost and performance, while the commercial temperature range (0 °C to 85 °C junction) suits telecommunications, broadcast, and industrial imaging platforms. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP/Memory/Transceiver blocks, and I/O cells on a single die. Within the broader taxonomy, an FPGA is a type of programmable logic -> semiconductor -> integrated circuit. The Arria II GX family sits in the mid-density transceiver-equipped tier of Intel (formerly Altera) FPGAs, optimized for cost-effective serial connectivity up to 6.375 Gbps while retaining rich logic and on-chip memory resources. Key features include 60,214 logic elements, 2,530 LABs, 5,371,904 RAM bits, 364 user I/O pins, integrated transceivers for high-speed serial protocols such as PCIe Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI, and dedicated hardware DSP blocks for high-throughput signal processing. The 40 nm process delivers a strong power/performance trade-off, and the 780-FBGA package provides a high-density interconnect ceiling required for 364 I/O and multiple transceiver channels. The architecture combines a logic fabric built from adaptive logic modules (ALMs) with embedded M9K memory blocks, MLABs, and 18x18 multipliers. Hard PCIe Gen2 IP blocks and 6.375 Gbps transceivers enable immediate deployment of high-speed serial interfaces without consuming fabric for soft SERDES, freeing logic for protocol stacks, packet processing, or DSP pipelines. Typical applications include 4G/LTE baseband and backhaul cards, Serial RapidIO bridges, HD-SDI broadcast video processing, software-defined radio (SDR) platforms, PCIe Gen2 endpoint/root complex designs, test and measurement instrumentation, and radar/signal-intelligence front ends. The combination of mid-density logic and integrated transceivers is particularly well suited to wireline line cards and wireless base station designs where BOM consolidation and time-to-market are critical. When designing with this device, allocate pins early to transceiver channels because they are bonded to specific balls in the 780-FBGA package. Use the Quartus II / Quartus Prime design suite, and validate signal-integrity with the IBIS models Intel publishes. The C5 speed grade trades a small amount of Fmax versus faster C6/I6 grades - consider whether a faster speed grade is required for your most demanding timing path.

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EP2AGX65DF29C5N - Arria II GX FPGA, 60K LE, 780-FBGA | Intel
EP2AGX65DF29C5N

EP2AGX65DF29C5N - Arria II GX FPGA, 60K LE, 780-FBGA | Intel

The Intel (formerly Altera) EP2AGX65DF29C5N is a 60,214-logic-element Arria II GX Field-Programmable Gate Array (FPGA) housed in a 780-ball FC-FBGA package. It integrates 2,530 LABs/CLBs, 5,371,904 bits of embedded RAM, 364 user I/O pins, and built-in 3.125 Gbps transceivers for high-speed serial I/O. Fabricated on a 40 nm TSMC process, the device runs at 0.9 V core with transceiver support up to 3.75 Gbps. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose logic function is defined by the user after manufacturing, occupying the same engineering role as a programmable ASIC. FPGAs sit within the semiconductor hierarchy as reconfigurable logic devices between standard logic ICs and fully-hardened ASICs. The Arria II GX family adds hardened transceivers and DSP blocks to the general FPGA fabric, positioning it for mid-range protocol bridging and DSP applications. Key features include up to 12 transceivers at 3.75 Gbps, 256 18x18 multipliers for DSP, 4 PLLs, dedicated memory controllers (DDR2/DDR3/LPDDR2), and PCI Express hard IP. The 780-ball FC-FBGA package supports high pin density and high-speed signal integrity while providing thermal headroom for transceiver operation. The architecture combines Look-Up Tables (LUTs), block RAM (M9K/M144K), variable-precision DSP blocks, and IOE (IO element) banks with calibrated on-chip termination (OCT). Hardened PHY macros for PCIe Gen1/Gen2 reduce soft-logic overhead. This combination delivers deterministic high-speed serial I/O alongside flexible programmable fabric for glue logic, state machines, and protocol adaptation. Typical applications include PCI Express endpoint cards, telecommunications backplane bridges, video broadcasting infrastructure, radar signal preprocessing, and industrial protocol converters. The 3.75 Gbps transceivers suit Serial RapidIO, SATA, and CPRI links common in wireless baseband processing. When designing with this device, engineers should pay close attention to transceiver reference-clock jitter, PCB impedance control for the FC-BGA breakout, and thermal coupling between transceivers and core logic. Quartus II software is required for synthesis, place-and-route, and configuration bitstream generation. This page synthesizes distributor pricing, drop-in alternatives from the same Arria II GX family, and practical design notes not found in the standalone manufacturer datasheet, enabling faster component selection and supply-chain decisions.

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EP2AGX65DF29C6 - Arria II GX FPGA, 60K LE, 364 I/O, 780-FCBGA | Intel
EP2AGX65DF29C6

EP2AGX65DF29C6 - Arria II GX FPGA, 60K LE, 364 I/O, 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGX65DF29C6 is a high-density Arria II GX Field-Programmable Gate Array (FPGA) with 60,214 logic elements, 2,530 LABs, and 5,371,904 bits of embedded memory, housed in a 780-ball FineLine BGA (FC-FBGA) package. Built on a 40 nm process, it integrates 8 transceivers supporting up to 3.75 Gbps for protocols such as PCI Express Gen1, Serial RapidIO, and Gigabit Ethernet. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LEs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, DSP blocks, and PLLs. FPGAs sit in the programmable-logic hierarchy alongside CPLDs and are used as alternative silicon paths when ASIC NRE cost or time-to-market makes custom logic impractical. The Arria II GX family targets mid-range applications that require transceivers and moderate logic density without the cost of Stratix-class devices. Key features of the EP2AGX65DF29C6 include a 364-pin maximum user I/O count, 312 (18x18) multiplier blocks for DSP, 4 PLLs, 6.553 Gbps maximum transceiver data rate per the Arria II GX family spec, and a 0.9 V core voltage. Industrial temperature grade is denoted by the suffix 'I'; the 'C6' speed grade indicates the device's transceiver and logic performance bin. The 780-FCBGA package uses flip-chip technology for high signal integrity at multi-Gbps rates. Typical applications include wireless infrastructure baseband processing, video broadcast equipment, industrial imaging and machine vision, high-speed serial backplane bridging, and ASIC prototyping. The combination of moderate logic density, integrated transceivers, and a flip-chip BGA makes it well suited for line-card designs that need multi-gigabit serial I/O without the higher cost of Stratix IV/V devices. When designing with this device, allocate PCB layers for the flip-chip BGA fanout and follow Intel's power-supply decoupling reference (multiple decoupling caps per rail). Quartus II (legacy) or Quartus Prime (current) is required for synthesis, place-and-route, and bitstream generation. For new designs, evaluate the newer Cyclone V or Arria V families for lower power and improved tool flow.

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EP2AGX65DF29C6G - Arria II GX FPGA 60K LE 780-FBGA | Altera / Intel
EP2AGX65DF29C6G

EP2AGX65DF29C6G - Arria II GX FPGA 60K LE 780-FBGA | Altera / Intel

The Intel (formerly Altera) EP2AGX65DF29C6G is a high-density, low-power Arria II GX Field Programmable Gate Array (FPGA) fabricated on a 40 nm process node, with 60,214 logic elements and 5,371,904 bits of embedded memory, housed in a 780-pin FC-FBGA (Flip-Chip Fine-pitch BGA) package. It operates with a core voltage of 0.9 V and supports up to 364 user I/O pins. The device integrates up to 12 embedded transceivers with data rates suitable for multi-gigabit serial connectivity, and includes dedicated DSP blocks, embedded multipliers, and 12 PLL clock managers for high-performance digital signal processing. An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and I/O pads that can be reconfigured by the customer after manufacturing to implement custom digital logic. FPGAs occupy a unique position in the system hierarchy: they sit between fixed-function ASICs (high NRE cost, low unit cost) and microcontrollers (lower performance, software-driven). Within Intel's programmable logic lineup, the Arria II GX family is positioned between the lower-cost Cyclone series and the high-performance Stratix series, targeting mid-range applications that require transceivers, moderate logic density, and a balance between cost and performance. Key features of the EP2AGX65DF29C6G include 60,214 logic elements, 5,371,904 bits of embedded SRAM, 12 dedicated 18x18 multipliers, 12 full-duplex multi-gigabit transceivers (C6 speed grade, 6 Gbps maximum data rate), and 364 user I/O pins. The device supports high-speed external memory interfaces including DDR3, DDR2, and QDR II+/QDR II SRAM. It is built on TSMC's 40 nm low-power process, balancing performance with power efficiency. Architecturally, the Arria II GX combines a logic fabric based on 8-input adaptive logic modules (ALMs), embedded memory blocks (M9K/M144K), variable-precision DSP blocks, and a transceiver tile array. The 6-speed-grade (-C6) designation indicates a commercial temperature range and a mid-tier speed bin. The 780-BGA package uses flip-chip technology to minimize inductance and support the multi-gigabit transceiver signaling integrity required for protocols such as PCI Express Gen2, Gigabit Ethernet, Serial RapidIO, and XAUI. Typical applications include wireless baseband processing, radar signal processing, video broadcast equipment, software-defined radio (SDR) platforms, military secure communications, and high-speed serial interface bridging. The integrated transceivers make it particularly well-suited for designs that require multi-gigabit serial I/O without an external PHY. When designing with the EP2AGX65DF29C6G, allocate adequate PCB layers (typically 8 to 14) to maintain signal integrity on the multi-gigabit transceiver lanes, follow Intel/Altera's power distribution and decoupling guidelines, and use the Quartus II design software (version 13.0 or compatible) for synthesis, place-and-route, and timing closure. The 780-FBGA package has a 1.0 mm or finer pitch and requires advanced assembly techniques including X-ray inspection of solder joints. This page consolidates distributor pricing, same-family Arria II GX drop-in alternatives, and practical design considerations beyond what is found in the manufacturer datasheet.

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EP2AGX65DF29C6N - Arria II GX 65K LE FPGA, 780-FBGA | Intel
EP2AGX65DF29C6N

EP2AGX65DF29C6N - Arria II GX 65K LE FPGA, 780-FBGA | Intel

The Intel (formerly Altera) EP2AGX65DF29C6N is a high-density, low-power Arria II GX Field-Programmable Gate Array (FPGA) featuring 60,214 logic elements, 5,371,904 bits of embedded memory, and 364 user I/Os in a 780-ball FineLine BGA (FBGA) package. Built on TSMC's 40nm process, this device integrates up to 12 transceivers capable of 3.75 Gbps data rates, making it suitable for PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and other high-speed serial protocols commonly used in wireless infrastructure, broadcast, and military systems. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceiver slices that can be re-programmed post-manufacturing. FPGAs sit at the apex of digital logic integration, between fixed-function ASICs and software-driven processors, providing hardware-timed parallel processing at nanosecond latency. The Arria II GX family is positioned as the mid-density, transceiver-rich member of Intel's programmable logic portfolio, balancing cost, power, and high-speed serial I/O for mainstream applications. Key features of the EP2AGX65DF29C6N include 2,530 LABs/CLBs, dedicated 18x18 multipliers, hard PCI Express Gen2 controller cores, and support for DDR3 SDRAM interfaces with on-chip termination. The 780-FBGA (29 mm x 29 mm) package includes an exposed die pad for thermal dissipation and supports the industrial operating range when ordered with the I-temperature suffix. The EP2AGX65DF29C6N variant specifies the C6 speed grade (commercial, -6) for cost-sensitive deployments where maximum transceiver reach is not required. Architecturally, the device uses a 40nm low-leakage CMOS process with on-die decoupling, clock networks with up to 16 PLLs, and adaptive logic modules (ALMs) that can implement 6-input look-up tables. The hard transceiver macros support multiple serial protocols without consuming soft logic resources, which preserves fabric utilization for the application payload. Typical applications include wireless baseband processing, video broadcast and image processing, military secure communications, and high-speed serial protocol bridging. Its combination of moderate logic density, embedded transceivers, and cost-effective packaging makes it well-suited for production deployments where the higher-end Arria V or Stratix families would be over-specified. Design considerations include PCB layout for the FBGA package (requires microvia stack-up and matched-length routing for transceiver channels), power sequencing for the 0.9V core and 1.8V/2.5V/3.3V I/O rails, and thermal management via the exposed pad. Quartus II software provides the development environment for HDL synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in speed-grade alternatives from the Arria II GX family, and practical design guidance not consolidated in the Intel datasheet.

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EP2AGX65DF29I3G - Arria II GX FPGA 65K LE 780-FCBGA | Intel
EP2AGX65DF29I3G

EP2AGX65DF29I3G - Arria II GX FPGA 65K LE 780-FCBGA | Intel

The Intel EP2AGX65DF29I3G is a high-performance, low-power Arria II GX Field Programmable Gate Array (FPGA) in a 780-pin FineLine Ball-Grid Array (FCBGA) package. It integrates 60,214 logic elements, 5,371,904 bits of embedded memory, and 364 user I/Os, with integrated transceivers supporting up to 3.75 Gbps for serial connectivity. An FPGA (Field Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon blocks such as transceivers, memory controllers, and DSP slices. In the broader taxonomy, FPGAs sit alongside CPLDs as programmable logic ICs, above fixed-function ASICs in design flexibility, and form the core of high-performance digital design for communications, video, and signal processing. The Arria II GX family is the mid-range transceiver-equipped node in the Arria II lineup, between Arria II GZ (high-end) and Cyclone IV (low-cost). Key features of the EP2AGX65DF29I3G include up to 8 integrated 3.75 Gbps transceivers, 6.4 Gbps for -1 speed grade, dedicated hard IP for PCI Express Gen1 (x1/x4/x8) and a 2.5/3.125 Gbps external memory interface. The device supports DDR3, DDR2, DDR, QDRII+, and RLDRAMII memory standards, allowing high-bandwidth external memory integration. It also embeds hard IP for high-speed serial protocols. Technically, the device is built on a 40nm process and uses 0.85V/1.1V core operation, with the I3 speed grade denoting an industrial temperature range. Configuration can be performed via JTAG, passive serial, fast passive parallel, or through Altera-supported EPCS/EPCQ configuration flash. The 780-FCBGA package provides 364 user I/Os and is a thermally enhanced fine-pitch BGA. Typical applications include wireless baseband processing, high-speed serial protocol bridging, video broadcast equipment, and high-performance DSP. Designers select the EP2AGX65DF29I3G when they need integrated multi-gigabit transceivers with mid-range logic density and industrial temperature operation. When designing, ensure proper PCB layout for BGA fan-out, thermal vias under the package, and a multi-rail decoupling network. Quartus II design software is required for synthesis, place-and-route, and bitstream generation. The I3 speed grade at industrial temperature is appropriate for thermally constrained environments where the -C6 commercial speed grade would not meet reliability targets. This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the Altera/Intel Arria II GX datasheet, helping procurement and FPGA design teams evaluate drop-in and migration options.

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EP2AGX65DF29I3N - Arria II GX FPGA 60K LE | Intel | 780-FBGA
EP2AGX65DF29I3N

EP2AGX65DF29I3N - Arria II GX FPGA 60K LE | Intel | 780-FBGA

The Intel (formerly Altera) EP2AGX65DF29I3N is a member of the Arria II GX family of field-programmable gate arrays (FPGAs) fabricated on a 40 nm TSMC low-power process. Per the Arria II GX Device Handbook, the device integrates 60,214 logic elements, 5,371,904 bits of embedded memory (M9K + M144K blocks), and 2530 LABs/CLBs, packaged in a 780-ball fine-line BGA (FBGA-780) at 29 x 29 mm with 364 user I/Os. The transceiver subsystem delivers up to eight multi-gigabit transceivers supporting data rates up to 3.75 Gbps, enabling protocols such as PCI Express Gen1/Gen2, Serial RapidIO, CPRI, and Gigabit Ethernet. Core voltage is 0.9 V, with the I/O subsystem providing LVDS, SSTL, HSTL, LVCMOS, and PCI/PCI-X signaling. The integrated transceivers allow the device to interface directly to SERDES-based backplanes and high-speed serial links without an external PHY. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, dedicated block RAM, DSP blocks, and I/O cells, all of which can be reconfigured by the end user after manufacture. FPGAs sit in the broader taxonomy of programmable logic devices -> semiconductors -> integrated circuits, and are widely used as hardware accelerators, glue logic, and prototyping platforms for ASIC designs. Compared to ASICs, FPGAs offer fast time-to-market and in-field reconfigurability at the cost of higher per-unit power and lower raw performance. The Arria II GX family occupies the mid-range position in Intel's portfolio, between the low-power Cyclone series and the high-performance Stratix series, and was specifically engineered for cost-sensitive applications requiring transceivers and moderate logic density. The 780-FBGA package supports the full industrial temperature range (-40 C to +100 C), indicated by the 'I' in the MPN. The '3' speed grade places the device in the slow-but-low-power tier (versus -4/-5/-6), making EP2AGX65DF29I3N ideal for thermally constrained designs that still require transceiver capability. The 'N' suffix denotes lead-free / RoHS-compliant terminations. Typical applications include PCI Express Gen2 endpoint and root-complex designs, wireless baseband DSP, digital video broadcast equipment, industrial serial-backplane aggregation, and military/aerospace image processing. The combination of mid-range logic density and integrated transceivers makes it a strong fit for bridging FPGAs to ASSPs in heterogeneous system designs. When designing with EP2AGX65DF29I3N, ensure that the PCB accommodates the 1.0 mm pitch BGA, that the transceiver reference clocks are jitter-clean, and that the JTAG chain is correctly buffered for multi-device configuration. Quartus II software (legacy, replaced by Intel Quartus Prime with Arria II device support) is required for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, Intel/Altera Arria II GX same-package variants, and practical design notes not found in the manufacturer datasheet alone.

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EP2AGX65DF29I5 - Arria II GX 65K LE FPGA, 364 I/O | Intel
EP2AGX65DF29I5

EP2AGX65DF29I5 - Arria II GX 65K LE FPGA, 364 I/O | Intel

The Intel (formerly Altera) EP2AGX65DF29I5 is a high-density Arria II GX Field-Programmable Gate Array (FPGA) in the 780-pin FC-FBGA package with 364 user I/Os, built on a 40nm process technology. The device integrates 60,214 logic elements, 2,530 LABs (Logic Array Blocks), and 5,371,904 bits of embedded memory, operating at a maximum core frequency of 500 MHz with a 0.9 V core supply. The DF29 package designation refers to the 29 mm x 29 mm FC-FBGA footprint with high-speed transceiver-capable balls assigned along one edge. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnects, and embedded memory and DSP resources on a single semiconductor die. FPGAs occupy the top of the programmable-logic hierarchy, above CPLDs and below ASICs, and are used to implement custom digital signal processing, high-speed serial interfaces, and glue logic without the NRE cost of an ASIC. The Arria II GX family specifically targets mid-range transceiver-based applications, bridging between Cyclone (low-cost) and Stratix (high-performance) families. Key features of the EP2AGX65DF29I5 include up to 8 high-speed transceivers supporting data rates up to 3.75 Gbps (PCIe Gen1/Gen2 capable), dedicated DSP blocks for high-throughput signal processing, embedded memory up to 4.5 Mbits of M9K blocks, and hardened PCIe and memory controllers. The 0.9 V core voltage combined with 1.2 V/1.5 V/2.5 V/3.3 V I/O standards minimizes power while maintaining 780-ball BGA compatibility with Altera's 40nm Arria II toolchain. The 40nm process delivers an optimal balance of performance and static power versus earlier 65nm/90nm nodes, and the Arria II GX architecture includes partial reconfiguration support for runtime logic swapping. The transceiver PHY supports multiple protocols including CPRI, OBSAI, SATA, and XAUI, making the family suitable for wireless backhaul and storage. Typical applications include wireless baseband and backhaul (LTE, WiMAX, CPRI), broadcast video processing, high-speed serial protocol bridging, PCIe Gen1/Gen2 endpoint or root complex designs, and military/aerospace signal processing. Industrial temperature grade (-40C to +100C ambient) is supported per the I5 speed grade suffix. When designing with the EP2AGX65DF29I5, ensure the PCB uses a minimum 1 mm pitch BGA land pattern with proper microvia stack-up and matched-length transceiver traces for 3.75 Gbps operation. Reference Altera AN 558 and AN 593 transceiver layout guidelines for the 780-BGA footprint. JTAG and active serial configuration should use the dedicated MSEL[3..0] pins; verify mode selection in Quartus II pin-planner before layout. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical layout guidance not found on any single distributor page.

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EP2AGX65DF29I5G - Arria II GX FPGA 60K LE, 780-FCBGA | Intel
EP2AGX65DF29I5G

EP2AGX65DF29I5G - Arria II GX FPGA 60K LE, 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGX65DF29I5G is a high-density, low-power Arria II GX Field-Programmable Gate Array (FPGA) integrating 60,214 logic elements, 5,371,904 bits of embedded memory, and 364 user I/Os in a 780-ball Flip-Chip BGA (FCBGA) package. Built on a 40 nm TSMC process, this transceiver-equipped device combines a hardened PCIe Gen2 hard IP block with up to 12.5 Gbps multi-gigabit transceivers, making it a single-chip solution for serial connectivity-heavy designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable routing fabric that the user defines after manufacture via a hardware description language (HDL). FPGAs sit in the broader hierarchy of programmable logic -> semiconductor IC -> integrated circuit, and are typically chosen over ASSPs when time-to-market, parallel processing, or interface customization are paramount. The Arria II GX family targets the mid-range "sweet spot" between Cyclone (cost-optimized) and Stratix (high-performance) families, balancing transceiver speed with low static power. Key features of the EP2AGX65DF29I5G include eight 6.3125 Gbps multi-gigabit transceivers, two hard PCIe Gen2 controllers with x1/x2/x4 endpoint and root-port support, 17 DSP blocks, 2530 LABs (Logic Array Blocks), and on-chip termination (OCT) calibration. The device also offers configuration via fast passive parallel (FPP), active serial (AS), and JTAG modes, plus dedicated security features (AES-256 bitstream encryption) for IP protection. Operating from a 0.9 V core and 1.5 V/2.5 V/3.3 V I/O banks, the EP2AGX65DF29I5G consumes substantially less power than its Stratix IV predecessor while delivering comparable logic and transceiver performance. Architecturally, the device employs an adaptive logic module (ALM) - an 8-input fracturable LUT - which can be split into two independent 4-input LUTs for higher effective utilization in mixed arithmetic/control designs. The transceiver PMA layer supports multiple protocols including PCIe Gen1/2, XAUI, GbE, SATA, CPRI, and Serial RapidIO through PCS hardening, while the hard PCIe block offloads transaction layer complexity from soft logic. The 780-FCBGA package integrates the flip-chip die on an organic substrate with an integrated heat spreader, enabling 17 mm x 17 mm board-level designs. Typical applications include wireless basestation fronthaul CPRI links, broadcast video processing and bridging, high-speed serial protocol bridging (PCIe-to-GbE, XAUI repeaters), industrial imaging and machine vision, and military/aerospace signal processing. The combination of transceivers, PCIe hard IP, and mid-density logic makes it especially suited for designs migrating from ASIC to FPGA or upgrading from Cyclone IV. When designing with this device, pay close attention to transceiver reference clock routing, PCB-controlled impedance for 100-ohm differential pairs, and proper decoupling on the 0.9 V core rail. Quartus II Prime software (or the newer Quartus Prime Lite) is required for place-and-route and timing closure, with the device supported in Quartus versions 13.0 and later. This page synthesizes distributor pricing as of 2026-09-08, drop-in alternative MPNs from the Site MPN list, and practical PCB design notes not found in the manufacturer datasheet alone.

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EP2AGX65DF29I5N - Arria II GX FPGA, 60K LE, 780-BGA | Intel
EP2AGX65DF29I5N

EP2AGX65DF29I5N - Arria II GX FPGA, 60K LE, 780-BGA | Intel

The Intel (Altera) EP2AGX65DF29I5N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) from Intel's mid-range transceiver family, featuring 60,214 logic elements, 5,371,904 bits of embedded memory, and 364 user I/Os in a 780-ball Flip-Chip BGA package. Built on a 40 nm process, the device integrates up to 12 transceivers supporting data rates up to 6.375 Gbps, making it well suited for serial connectivity, video bridging, and wireless baseband designs. An FPGA (Field-Programmable Gate Array) is a type of programmable logic IC belonging to the broader semiconductor hierarchy of integrated circuits. FPGAs contain an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, and high-speed transceivers, all interconnected by a programmable routing fabric. Unlike an ASIC, an FPGA's function is defined post-manufacture by loading a user bitstream, enabling rapid prototyping, hardware reconfiguration, and lower NRE costs. FPGAs are commonly used as a bridge between a CPU/MCU and high-speed I/O, or as standalone processing engines for digital signal processing, packet inspection, and protocol bridging. Key features of the EP2AGX65DF29I5N include 2,530 Logic Array Blocks (LABs), 12 dedicated transceivers, 8-input adaptive logic modules (ALMs), and integrated hard IP for PCIe Gen1 and Gen2, multi-gigabit transceivers, and external memory interfaces. The device supports DDR3, DDR2, DDR, and QDRII+ memory controllers with PHY, and offers hardened PCI Express Gen1 (x1/x4/x8) and Gen2 (x1/x4) endpoints for direct system connectivity without consuming fabric logic. Configuration is supported via fast passive parallel, passive serial, JTAG, and AES-256 encrypted bitstreams. The architecture is optimized for low-power, mid-density designs that require 3.125 Gbps to 6.375 Gbps serial links with deterministic latency, common in broadcast video, military communications, and test & measurement. Compared with higher-end Stratix devices, the Arria II GX balances transceiver performance with cost efficiency, offering a compelling power/performance ratio for cost-sensitive applications. Typical applications include HD-SDI video routers, wireless backhaul, 3G/4G baseband processing, software-defined radio (SDR), PCI Express endpoint cards, and high-speed serial interface bridging. Industrial temperature grade (-40C to +100C) and the 780-BGA package make the EP2AGX65DF29I5N suitable for harsh-environment embedded computing. When designing with this device, ensure proper power sequencing of the 0.9 V core, 1.5 V transceiver, and 2.5 V/3.3 V I/O rails, and provide matched impedance routing for the high-speed serial links. PCB layout must follow Intel's BGA escape and decoupling guidelines to maintain signal integrity at multi-gigabit data rates. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a consolidated reference for the EP2AGX65DF29I5N.

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EP2AGX95DF25C4G - 95KLE Arria II GX FPGA, 572-FCBGA | Intel
EP2AGX95DF25C4G

EP2AGX95DF25C4G - 95KLE Arria II GX FPGA, 572-FCBGA | Intel

The Intel (Altera) EP2AGX95DF25C4G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) with 89,178 logic elements, 6,839,296 bits of embedded memory, and integrated transceivers, housed in a 572-ball FineLine BGA (FCBGA) package. It supports up to 260 user I/O pins and operates with a core voltage of 0.87 V to 1.03 V from a -40C to +85C industrial temperature grade. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O and memory resources that can be re-programmed to implement any digital logic function. FPGAs sit in the system hierarchy below ASICs and above general-purpose microcontrollers, offering hardware-level parallelism and deterministic timing for compute-intensive, high-throughput applications such as signal processing, protocol bridging, and high-speed serial I/O. Key features of the EP2AGX95DF25C4G include up to 8 multi-gigabit transceivers supporting data rates suitable for PCI Express Gen1/Gen2 and Serial RapidIO, dedicated DSP blocks for high-throughput arithmetic, and on-chip memory that supports true dual-port and FIFO operations at hundreds of MHz. The device uses SRAM-based configuration cells and supports encrypted bitstream loading. Architecturally, the EP2AGX95DF25C4G implements an 8-input adaptive logic module (ALM) fabric with 8.058 Kbits per ALM, full per-LAB carry chains, and hard IP for memory controllers and SERDES. The 572-ball FCBGA package provides a large pin-count matrix suitable for designs requiring many LVDS pairs and multiple transceiver channels. Typical applications include wireless baseband processing, high-definition video broadcast equipment, high-speed serial protocol bridging (PCIe, SRIO, Gbps Ethernet), industrial imaging, and military/aerospace signal processing. The combination of high logic density and integrated transceivers makes it well suited for systems that previously required an FPGA plus an external PHY. When designing with this device, use the Altera Quartus II design suite for synthesis, place-and-route, and timing closure. Pay particular attention to transceiver reference-clock routing and decoupling on the FCBGA power rails. Estimated: power dissipation at maximum toggle rate in the 572-ball package typically requires forced-air thermal management above 6 W of internal power.

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EP2AGX95DF25C5G - Arria II GX FPGA, 89K LE, 6.8Mbit, 572-FCBGA | Intel
EP2AGX95DF25C5G

EP2AGX95DF25C5G - Arria II GX FPGA, 89K LE, 6.8Mbit, 572-FCBGA | Intel

The Intel (formerly Altera) EP2AGX95DF25C5G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) housed in a 572-ball FineLine Ball-Grid Array (FCBGA) package. It integrates 89,178 logic elements (LEs), 6,839,296 bits of embedded memory, and 260 user I/O pins, with integrated transceivers optimized for 3.75 Gbps backplane and chip-to-chip interconnect. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and embedded memory, DSP, and transceiver resources. FPGAs occupy the broad category hierarchy: FPGA -> programmable logic device (PLD) -> digital IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are reprogrammed in-system to implement custom digital logic, signal-processing pipelines, and high-speed serial protocols, making them ideal for low-volume designs, hardware prototyping, and systems whose feature set evolves after deployment. Key features of the EP2AGX95DF25C5G include 8 integrated transceivers supporting data rates up to 3.75 Gbps, 8-input adaptive logic modules (ALMs) for fine-grained arithmetic, 8.5 x 9-bit multipliers configurable as 17 x 17 or 18 x 18 signed multipliers for DSP blocks, and dynamic phase-alignment circuitry for high-speed serial interfaces. The device supports LVDS, LVPECL, SSTL, HSTL I/O standards and offers 1.0 V core operation at the C5 speed grade. Architecturally, the EP2AGX95DF25C5G uses a 40 nm process node, dedicated per-channel PMA blocks for each transceiver, and hardened PCI Express Gen1 hard IP. The C5 speed grade places it in the mid-range of Arria II GX device variants, balancing timing closure against power consumption for industrial and communications equipment. Typical applications include wired telecommunications backplanes, industrial imaging pipelines, video broadcast equipment, ASIC prototyping, and PCI Express endpoint cards. The high I/O count and transceiver density make it especially well-suited to multi-channel serial-link aggregation designs. When designing with this device, ensure the board layout supports the FCBGA 1.0 mm ball pitch with appropriate microvia stack-up, and use the Quartus II design suite (version 13.0 or later with Arria II device support) for synthesis, place-and-route, and timing closure.

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EP2AGX95DF25C6G - Arria II GX FPGA 89K LE 572-FCBGA | Intel
EP2AGX95DF25C6G

EP2AGX95DF25C6G - Arria II GX FPGA 89K LE 572-FCBGA | Intel

The Intel EP2AGX95DF25C6G is a member of the Arria II GX family of mid-range, transceiver-equipped FPGAs, integrating 89,178 logic elements, 6,839,296 bits of embedded memory, and 260 user I/O in a 572-ball FineLine BGA (FCBGA, 25x25 mm) package. It features up to 12 integrated transceivers operating up to 6.375 Gbps, providing a high-bandwidth serial interface for protocols such as PCIe Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI, while the speed grade -6 indicates the performance bin within the family. The device is fabricated on a 40 nm process and targets applications that require a balance of logic density, on-chip memory, and multi-gigabit serial I/O. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, programmable I/O, and (in transceiver families such as Arria II GX) hardened multi-gigabit transceivers. Unlike a microcontroller, which executes sequential instructions, an FPGA realizes parallel digital logic through user-defined configuration bitstreams loaded into SRAM cells, with a hierarchy that places FPGAs as a class of programmable logic devices (PLD) within the broader semiconductor landscape. Key technical features of the EP2AGX95DF25C6G include up to 6.375 Gbps transceiver data rate, 8-input adaptive logic module (ALM) architecture, dedicated on-chip memory blocks (M9K and M144K), variable-precision DSP blocks, and support for external memory interfaces including DDR3, DDR2, and QDRII+. The 'C' speed grade (commercial, 0C to 85C junction temperature range) and '6' speed bin make it the fastest commercial variant in the family. Typical applications span high-speed serial interface bridging, telecom baseband processing, video broadcast and imaging pipelines, industrial control with real-time DSP, and military/aerospace subsystems where mid-range density and proven transceiver performance are required. The C6 grade is preferred over I6 when the design operates within commercial temperature and maximum clock/transceiver rates are required. When designing with the EP2AGX95DF25C6G, careful attention must be paid to PCB layout for the 572-ball FCBGA: use microvia stack-up (typically 6 to 8 layers), controlled-impedance routing for transceiver channels, and decouple every VCC/VCCPD pin with 0.1 uF plus 10 uF bulk capacitance. Configuration can be loaded from an external flash via Active Serial (AS) or Fast Passive Parallel (FPP) modes. This page synthesizes distributor pricing, drop-in same-family alternatives, application contexts, and PCB-layout design notes that go beyond the manufacturer datasheet, helping engineers decide whether the EP2AGX95DF25C6G is the correct Arria II GX speed grade and package for their design.

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EP2AGX95DF25C6N - Arria II GX FPGA, 89K LE, 572-FCBGA | Intel
EP2AGX95DF25C6N

EP2AGX95DF25C6N - Arria II GX FPGA, 89K LE, 572-FCBGA | Intel

The Intel EP2AGX95DF25C6N is a high-density Arria II GX Field-Programmable Gate Array (FPGA) featuring 89,178 logic elements, 3,747 LABs, and 6,839,296 bits of embedded memory in a 572-ball Flip-Chip BGA (FCBGA) package. It integrates up to 260 user I/Os and is built on a 40 nm process technology operating from a 0.9 V core supply. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose logic functionality is defined by the customer after manufacturing, rather than at the fab. In the broader taxonomy, FPGAs belong to programmable logic devices, which also include CPLDs (Complex Programmable Logic Devices). Arria II GX sits in the mid-range of Intel's FPGA portfolio, positioned between the low-power Cyclone family and the high-performance Stratix family. The "GX" suffix denotes integrated transceivers optimized for serial connectivity. Key features include 3.125 Gbps transceivers, dedicated DSP blocks for high-speed arithmetic, and embedded memory blocks supporting FIFO and dual-port operation. The device includes a hard PCI Express Gen1 endpoint block and supports external memory interfaces including DDR3, DDR2, and QDRII+. Configuration is supported via JTAG, passive serial, or fast passive parallel modes. Architecturally, the EP2AGX95DF25C6N combines a fabric of adaptive logic modules with embedded multiplier blocks, phase-locked loops for clock management, and high-speed serial transceiver channels. The 40 nm process delivers a balance of performance and power efficiency suitable for mid-volume applications. Typical applications include telecom line cards, video processing pipelines, industrial machine vision, and wireless baseband processing where transceiver density and DSP throughput are required. The 572-ball FCBGA package supports high-speed signal integrity for multi-gigabit interfaces. When designing with this device, ensure adequate power decoupling and thermal management. The 0.9 V core rail requires low-impedance PCB routing with bulk and ceramic decoupling placed close to the device. Signal integrity analysis is recommended for transceiver channels operating at 3.125 Gbps. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP2AGX95DF25I3G - Arria II GX FPGA, 95K LE, 572-FCBGA | Intel
EP2AGX95DF25I3G

EP2AGX95DF25I3G - Arria II GX FPGA, 95K LE, 572-FCBGA | Intel

The Intel EP2AGX95DF25I3G is a high-performance, low-power Arria II GX Field Programmable Gate Array (FPGA) housed in a 572-ball Flip-Chip BGA (FCBGA) package. According to the manufacturer datasheet, the device integrates approximately 89,178 logic elements backed by 6,839,296 bits of embedded memory, with 260 user I/O pins and integrated transceivers optimized for high-speed serial connectivity. The 'I' speed grade and '3' core voltage designation place it in the industrial-temperature, mid-performance tier of the Arria II GX family. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose digital logic fabric, routing interconnect, and I/O behavior are configured by the end user after manufacture. Within the broader semiconductor hierarchy, an FPGA sits alongside ASICs as a programmable logic device, offering hardware-level parallelism that microcontrollers and DSPs cannot match for high-throughput, low-latency workloads. The Arria II GX family specifically targets transceiver-rich applications in communications, broadcast, and high-end industrial imaging. Key features of the EP2AGX95DF25I3G include a high logic-to-I/O ratio suitable for parallel interface bridging, embedded memory blocks capable of buffering multi-gigabit data streams, hard IP for PCI Express and multiple high-speed serial protocols, and the FCBGA package's flip-chip thermal path that enables higher sustained junction temperatures under transceiver load. The 'I3G' suffix denotes the industrial temperature range (-40C to +100C ambient for transceiver-grade parts) and lead-free, RoHS-compliant terminal finish. The device's architecture combines a fine-grained logic fabric with hard silicon IP for transceivers, memory controllers, and DSP blocks, allowing deterministic timing closure at multi-hundred-megahertz system clock rates. Power consumption scales with toggle rate and transceiver utilization, and the FCBGA package's exposed-die flip-chip construction provides a low thermal resistance path to the board for heatsink attachment in high-duty-cycle designs. Typical applications include 10G Ethernet line cards, wireless baseband processing, high-speed data acquisition front-ends, broadcast video routing matrices, and PCIe Gen1/Gen2 endpoint cards. The wide transceiver count and rich memory make it well suited to systems where soft logic alone would not close timing on parallel-to-serial conversion paths. When designing with this device, ensure the PCB uses a high-layer-count stack-up to fan out the 572-ball grid and that thermal vias under the package die are properly sized to extract heat from the flip-chip BGA. Power-supply decoupling requires dedicated regulator sequencing because Arria II GX transceivers demand sub-millivolt ripple on their analog supply rails. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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EP2AGX95DF25I5G - Arria II GX FPGA 89K LE 6.8Mb 572-FCBGA | Intel
EP2AGX95DF25I5G

EP2AGX95DF25I5G - Arria II GX FPGA 89K LE 6.8Mb 572-FCBGA | Intel

The Intel (formerly Altera) EP2AGX95DF25I5G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) with 89,178 logic elements, 6,839,296 bits of embedded memory, and 260 user I/O pins, housed in a 572-ball Flip-Chip BGA (FCBGA) package. It features integrated transceivers, 3747 CLBs, and operates in the industrial temperature range. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the digital logic hierarchy. Unlike fixed-function ASICs, FPGAs are reconfigured by the designer after manufacture, enabling rapid prototyping, hardware acceleration, and post-deployment updates. The Arria II GX family specifically targets mid-range applications requiring transceivers and DSP blocks alongside general-purpose logic. Key features of the EP2AGX95DF25I5G include 89,178 logic elements (LEs), 6,839,296 embedded memory bits (approximately 6.83 Mbit), 4 transceiver blocks supporting multi-gigabit serial protocols, and 260 user I/O pins. The part carries an industrial temperature grade designation (suffix I5 indicating -40C to +100C operation) and is built on a 40nm process node. The 572-ball FCBGA package supports high-speed signal integrity required for transceiver-based designs. Architecturally, the Arria II GX integrates hard IP for PCI Express Gen1/Gen2, multi-gigabit transceivers up to 6.375 Gbps, dedicated DSP blocks for high-throughput signal processing, and on-chip memory controllers. The 6.83 Mbit of embedded RAM is distributed across M9K and M144K blocks, balancing fine-grained and bulk storage allocation. Transceiver capability makes this family particularly suitable for serial connectivity, while the 260 I/Os provide ample parallel interface bandwidth for memory buses and control logic. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, video processing and broadcast equipment, military/aerospace signal processing, medical imaging systems, and ASIC prototyping. The transceiver channels support protocols such as PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI/OBSAI in wireless base stations. When designing with this part, ensure the PCB layout accommodates the 1.0 mm or 0.8 mm pitch FCBGA ball array, which requires microvia or HDI PCB technology. Thermal management relies primarily on the package's exposed-die flip-chip construction, so a heatsink with adequate airflow is recommended for sustained high utilization. Quartus II software is required for design entry, synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in a single source, combining verified web data with engineering guidance for engineers evaluating the Arria II GX platform.

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EP2AGX95DF25I5N - Arria II GX 95K LEs FPGA, 260 I/O 572-FCBGA
EP2AGX95DF25I5N

EP2AGX95DF25I5N - Arria II GX 95K LEs FPGA, 260 I/O 572-FCBGA

The Intel (formerly Altera) EP2AGX95DF25I5N is a high-density, transceiver-equipped Arria II GX Field-Programmable Gate Array (FPGA) housed in a 572-ball FCBGA package. The device integrates 89,178 logic elements, 3,747 LABs (logic array blocks), 4,486 Kbits of embedded memory (M9K), and 260 user I/O pins, fabricated on a 40 nm process node at 0.9 V core voltage with maximum internal clock rates up to 500 MHz. The part ships in industrial temperature grade (-40C to +100C ambient) and supports up to 6 high-speed transceiver channels supporting rates up to 3.75 Gbps in some configurations, suitable for PCIe Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and CPRI backhaul links. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated silicon IP blocks (memory, DSP, transceivers, PLLs). In the broader taxonomy, FPGAs belong to the programmable logic device (PLD) family, which itself is a sub-category of digital integrated circuits used for hardware-level parallel processing. Designers select FPGAs over ASICs for low-to-mid volume production, prototyping, and applications requiring post-deployment reconfigurability. Key differentiators of the Arria II GX family include integrated transceivers that eliminate the need for external PHY chips, embedded PCI Express hard IP blocks, and DSP blocks for high-throughput signal-pipeline acceleration. The EP2AGX95 specifically targets mid-range applications requiring a balance of logic density, memory bandwidth, and serial connectivity. The DF25 package designation indicates a 25 mm x 25 mm FCBGA body with exposed-die lid for thermal management. Power architecture uses 0.9 V core supply plus separate VCCPD (pre-driver), VCCIO (I/O bank), VCCR_GXB and VCCT_GXB (transceiver analog supplies), and PLL analog rails. Designers must implement a sequencing strategy documented in the Arria II GX Device Handbook to prevent latch-up. The 572-FCBGA package offers a typical theta_JA around 10-14 C/W with adequate airflow, but junction temperatures must stay below 100C for industrial-grade reliability. Typical applications include wireless baseband processing, software-defined radio (SDR), video broadcast and pro-AV infrastructure, military radar signal chains, test and measurement ASIC prototyping, and PCIe Gen2 endpoint cards. The integrated transceivers make this part especially attractive for protocol-bridge and aggregation designs. When designing with the EP2AGX95DF25I5N, designers must install the Quartus II design software (legacy support required because the Arria II family is end-of-life on newer Quartus Prime Pro releases). Plan for power-rail sequencing, multiple decoupling capacitor values on every supply, and thermal relief on inner PCB layers tied to the package substrate balls. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Arria II GX 95K logic-density bin, and practical design considerations compiled from Intel/Altera device handbooks and reference designs - information that complements the official datasheet with cross-vendor purchasing guidance.

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EP2AGX95EF29C3N - Arria II GX FPGA, 95K LE, FBGA-780 | Altera
EP2AGX95EF29C3N

EP2AGX95EF29C3N - Arria II GX FPGA, 95K LE, FBGA-780 | Altera

The Altera EP2AGX95EF29C3N is a member of the Arria II GX FPGA family delivering approximately 95,000 logic elements, integrated transceivers up to 6.375 Gbps, and a 780-ball FineLine BGA (FBGA-780) package. The device pairs a logic-rich fabric with dedicated hardware for memory, DSP, and serial I/O, targeting mid-range applications that require both DSP throughput and high-speed serial connectivity. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), interconnect, and I/O elements that can be electrically programmed after manufacture to implement arbitrary digital circuits. FPGAs sit at the same hierarchical level as ASICs and CPLDs in the broader category of programmable logic devices (PLDs), but offer higher logic density and finer-grained parallelism. Within Altera/Intel's portfolio, the Arria II GX family targets mid-cost transceiver-based designs, positioned between the low-cost Cyclone series and the high-end Stratix series, and optimized for protocols such as PCIe Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI. Key features of the EP2AGX95EF29C3N include 12 transceivers at up to 6.375 Gbps, embedded PCIe Gen2 hard IP blocks (x1, x2, x4), dedicated DSP blocks supporting 18x18 multipliers, and on-chip memory of approximately 5.7 Mbits distributed plus block RAM. The -C3 speed grade and industrial temperature variant position the device for cost-sensitive mid-performance designs. Arria II GX uses a 40nm process node and features Adaptive Logic Module (ALM) architecture, where each ALM contains an 8-input fracturable look-up table combined with dedicated registers. Transceivers incorporate signal conditioning, equalization, and built-in PCIE PHY IP to ease protocol implementation. Typical applications include wireless baseband processing, video broadcast and image processing pipelines, industrial control and test equipment, and PCIe Gen2 endpoint cards. The combination of transceivers, DSP blocks, and on-chip memory makes it well-suited for DSP-heavy designs with moderate serial I/O requirements. When designing with this part, ensure proper power-rail sequencing between VCC, VCCAUX, and VCCP, as incorrect sequencing can damage the device. Transceiver channels require dedicated reference clocks with controlled jitter; use an FPGA-grade oscillator rather than a generic clock source. This page synthesizes distributor pricing, drop-in alternatives from the same Altera Arria II GX family, and practical design notes not found in the manufacturer datasheet.

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EP2AGX95EF29C4G - Arria II GX FPGA 89K LE 780-FCBGA | Intel
EP2AGX95EF29C4G

EP2AGX95EF29C4G - Arria II GX FPGA 89K LE 780-FCBGA | Intel

The Intel (formerly Altera) EP2AGX95EF29C4G is a high-performance, low-power Arria II GX Field-Programmable Gate Array (FPGA) integrating 89,178 logic elements, 6,839,296 bits of embedded memory, and 372 user I/Os in a 780-pin flip-chip BGA (FCBGA) package. The device combines a rich programmable logic fabric with up to 12 transceivers capable of 3.75 Gbps operation, making it suitable for high-speed serial I/O and DSP-intensive designs. What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy a unique position in the computing hierarchy between general-purpose CPUs/GPUs and fixed-function ASICs: they offer hardware re-programmability while delivering ASIC-like parallelism for latency-critical workloads. Within Intel's product taxonomy, Arria II GX belongs to the mid-range Arria family, positioned above Cyclone low-density parts and below Stratix high-density parts, targeting cost-sensitive applications requiring transceivers and DSP. Key features include 8-input adaptive logic modules (ALMs) supporting 6-input LUT-based architectures, dedicated 18x18 multipliers and hard DSP blocks for high-throughput signal processing, and on-chip memory controllers supporting DDR2/DDR3/LPDDR2 external interfaces. The -4 speed grade and C-grade commercial temperature (0C to +85C) suffix denote the device's timing closure and operating envelope. The Arria II GX architecture embeds PCI Express hard IP blocks and multi-gigabit transceivers (MGTs), reducing external PHY BOM cost. The device targets applications including wireless baseband processing, video broadcast infrastructure, military radar signal processing, and ASIC prototyping. Typical design entry uses Intel Quartus II design software with HDL synthesis and place-and-route. The 780-pin FCBGA package exposes all transceiver pins, PLLs, and I/O banks required for high-speed memory and SERDES connectivity, requiring careful PCB layout with controlled-impedance traces and matched-length routing. When designing with EP2AGX95EF29C4G, careful attention to transceiver channel placement, decoupling network design, and power supply sequencing is essential. Multiple supply rails (VCC, VCCAUX, VCCPT, VCCPD, and transceiver supplies) require separate decoupling and power-on order. JTAG configuration via the enhanced configuration block supports AS, PS, JTAG, and FPP modes.

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EP2AGX95EF29C4N - Arria II GX FPGA 89K LE 780-FBGA | Intel
EP2AGX95EF29C4N

EP2AGX95EF29C4N - Arria II GX FPGA 89K LE 780-FBGA | Intel

The Intel EP2AGX95EF29C4N is a member of the Arria II GX family of mid-range FPGAs fabricated on a 40 nm low-power process, integrating 89,178 logic elements, 6,839,296 bits of embedded memory, and 372 user I/O in a 780-ball FineLine BGA package. It operates from a 0.9 V core supply and supports transceiver speeds up to 6.375 Gbps for serial connectivity, with embedded transceivers and PCI Express hard IP blocks aimed at high-bandwidth bridging and backplane applications. A Field Programmable Gate Array (FPGA) is a programmable semiconductor that implements custom digital logic through a configurable array of logic elements, embedded memory blocks, DSP blocks, and high-speed transceivers, all wired by programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices -> programmable logic -> integrated circuits -> semiconductors, and are positioned above fixed-function ASICs in flexibility but below microcontrollers in ease of use, making them the workhorse for hardware-accelerated signal processing, protocol bridging, and prototype-to-production design. Key features include 8 transceivers at up to 6.375 Gbps, 4 PCI Express hard IP blocks (x1/x4/x8), dedicated DSP blocks for fixed- and floating-point math, and an active serial configuration interface. The 780-FBGA package exposes 372 user I/O pins through 12 I/O banks supporting DDR3, LVDS, and other common interface standards, while 4 PLLs and 28 global clocks provide flexible timing closure for multi-clock domain designs. The Arria II GX architecture pairs a register-rich logic fabric with hard IP for memory controllers and PCI Express, eliminating soft logic overhead and reducing compile time. Transceivers are grouped into banks with dedicated clock-data-recovery circuitry, allowing the device to interface directly to SFP+, SATA, or backplane SERDES without external PHY ICs in many designs. Typical applications include high-speed serial protocol bridges (PCI Express Gen1/Gen2 endpoints, SFP+ to ASIC bridges), wireless baseband signal processing, video broadcast and image processing pipelines, and military/aerospace secure communications. The mid-range density targets designs that are too large for CPLDs but do not require the largest Stratix-class devices. When designing with the EP2AGX95EF29C4N, plan power rail sequencing between 0.9 V core and 1.1/1.5/2.5/3.3 V I/O supplies carefully, and provide a stable reference clock to the transceiver reference inputs to minimize jitter. Use the Quartus II design software for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes that supplement the manufacturer datasheet with cross-reference guidance not always available from Intel directly.

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