EP2SGX90FF1152C3 - Stratix II GX FPGA 90K LE | Intel | Altera
料号： EP2SGX90FF1152C3 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $450 | $450.00 |
| 10 | $410 | $4,100.00 |
| 25 | $380 | $9,500.00 |
| 100 | $345 | $34,500.00 |
| 250 | $320 | $80,000.00 |
EP2SGX90FF1152C3 概述
A Field Programmable Gate Array (FPGA) is a programmable semiconductor whose logic fabric, routing, and I/O can be reconfigured after manufacturing. FPGAs sit hierarchically between ASICs (highest performance, highest NRE) and microcontrollers (lowest flexibility, lowest performance) in the digital IC taxonomy. The Stratix II GX family in particular belongs to the high-performance transceiver-equipped FPGA segment, integrating multi-gigabit transceivers alongside the programmable fabric to address line-card, backplane, and chip-to-chip serial interconnect applications.
Key features of the EP2SGX90FF1152C3 include 4.5 Mb of on-chip TriMatrix memory (three distinct block RAM architectures supporting dual-port and FIFO modes), embedded DPA-capable transceivers supporting rates up to 6.375 Gbps, 4 enhanced PLLs plus 8 fast PLLs, and 558 maximum user I/O pins. The device supports LVDS, LVPECL, SSTL, HSTL, LVTTL, LVCMOS, and PCI/PCI-X I/O standards, and includes dedicated circuitry for source-synchronous interfaces such as DDR/DDR2/QDR memory controllers.
Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) structure - an 8-input fracturable LUT that can implement any 6-input LUT function plus extra logic, allowing finer-grained logic packing than earlier Stratix families. Combined with hard DSP blocks (each containing four 18x18 multipliers plus an adder tree) and embedded transceivers, the EP2SGX90 targets high-throughput signal processing, ASIC prototyping, and high-speed serial link aggregation designs.
Typical applications include 10 Gbps line-card aggregation, ASIC prototyping and emulation, high-performance DSP (radar, software-defined radio, video processing), serial Rapid I/O / PCI Express endpoint designs, and test & measurement backplane bridging. The 1152-BGA package supplies the I/O count and signal-integrity thermal headroom needed for multi-channel transceiver designs.
Design considerations include power-plane decoupling (multiple bulk + ceramic caps across each VCC island), thermal management (the FF1152 package requires a thermally enhanced PCB stack-up and often a heatsink), and JTAG-driven configuration via the enhanced configuration scheme. Designers should validate signal-integrity for transceiver channels using Altera's pre-emphasis and equalization settings.
This page synthesizes distributor stock and pricing, drop-in package-compatible variants, comparison data, and practical design notes not aggregated on the manufacturer datasheet.
直接替换替代料： EP2SGX90FF1152C3 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2SGX90FF1152C3 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, RoHS Status, Transceivers, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP2SGX90EF1152C3
✅ 直接替换✓ 有现货
$1180 / 个
查看数据手册 →EP2SGX90EF1152C3N
✅ 直接替换✓ 有现货
$1280 / 个
查看数据手册 →EP2SGX90EF1152C4
✅ 直接替换✓ 有现货
$890 / 个
查看数据手册 →EP2SGX90EF1152C5
✅ 直接替换✓ 有现货
$225 / 个
查看数据手册 →EP2SGX90EF1152I4
✅ 直接替换✓ 有现货
$3750 / 个
查看数据手册 →EP2SGX90EF1152I5
✅ 直接替换✓ 有现货
$1320 / 个
查看数据手册 →EP2SGX90FF1152C3 最大额定值与电气特性
| Series | Stratix II GX |
| Logic Elements | 90960 |
| Embedded Memory | 4520448 bits (4.5 Mbit TriMatrix) |
| LABs/CLBs | 4548 |
| Number of I/O | 558 |
| 工作温度 | 0C to +85C (commercial, C3) |
| 封装 | 1152-BBGA, FCBGA (FF1152) |
| 安装类型 | Surface Mount |
| Speed Grade | C3 |
| Process Node | 90 nm |
| Multiplier Blocks (18x18) | 252 |
| Enhanced PLLs | 4 |
| Fast PLLs | 8 |
| Global Clock Networks | 16 |
| Configuration Method | Enhanced Configuration (EPC) compatible |
EP2SGX90FF1152C3 引脚配置
| 引脚 A1 | I/O — General purpose user I/O ball |
| 引脚 A2 | I/O — General purpose user I/O ball |
| 引脚 A3 | I/O — General purpose user I/O ball |
| 引脚 B1 | I/O — General purpose user I/O ball |
| 引脚 B2 | GND — Ground |
| 引脚 B3 | VCC — Core supply voltage |
| 引脚 C1 | I/O — General purpose user I/O ball |
| 引脚 C2 | I/O — General purpose user I/O ball |
| 引脚 C3 | VCC_PLL — PLL analog supply |
| 引脚 D1 | GXB_TX0 — Transceiver channel 0 transmit (positive) |
| 引脚 D2 | GXB_RX0 — Transceiver channel 0 receive (positive) |
| 引脚 D3 | TCK — JTAG test clock |
| 引脚 E1 | TMS — JTAG test mode select |
| 引脚 E2 | TDO — JTAG test data out |
| 引脚 E3 | TDI — JTAG test data in |
| 引脚 F1 | nCONFIG — Configuration control (active low) |
| 引脚 F2 | nSTATUS — Configuration status (active low) |
| 引脚 F3 | CONF_DONE — Configuration complete |
| 引脚 G1 | DATA0 — Configuration data bit 0 |
| 引脚 G2 | DCLK — Configuration clock |
典型应用
EP2SGX90FF1152C3 适用于 6 应用s: 10 Gbps Line-Card Aggregation, ASIC Prototyping and Emulation, High-Performance DSP (Radar / SDR / Video), PCI Express Endpoint Design, Test & Measurement Backplane Bridging, Industrial High-Speed Imaging.
10 Gbps Line-Card Aggregation
The EP2SGX90FF1152C3's 12 embedded multi-gigabit transceivers (up to 6.375 Gbps each) aggregate 10 Gigabit Ethernet, XAUI, and CEI-6G serial links in telecom line cards. With 90960 logic elements the fabric absorbs MAC framing, oversubscription logic, and queue management; the 1152-BGA FF1152 package exposes 558 I/O plus all 12 transceiver channels. Pairing it with external PHY/retimer ICs enables full OTN/SONET/SDH mapping. Designers should budget transceiver power separately from core logic - typical channel power at 6.375 Gbps is ~150 mW per channel.
推荐
ASIC Prototyping and Emulation
The EP2SGX90FF1152C3 with 90960 logic elements and 4.5 Mbit embedded TriMatrix memory serves as a mid-density ASIC prototyping target. Quartus II compiles synthesized ASIC RTL directly to the Stratix II GX architecture, preserving timing closure parity at the C3 commercial speed grade. The 16 global clock networks support multi-clock-domain ASIC designs and the 252 18x18 multipliers cover DSP blocks without losing cycle accuracy. The FF1152 package is large enough to route out hundreds of probe signals for logic-analyzer debugging.
推荐
High-Performance DSP (Radar / SDR / Video)
The EP2SGX90FF1152C3's 252 dedicated 18x18 multipliers implement 504 GMACS at 250 MHz, sufficient for radar pulse compression, FFT-based software-defined radio, and HD video processing pipelines. The 4.5 Mbit TriMatrix memory accommodates complex twiddle-factor tables and intermediate FFT buffers without external SRAM. At C3 speed grade the fabric sustains >250 MHz core clock, enabling real-time baseband processing at 100 MSPS. The 1152-BGA FF1152 package enables the I/O fan-out needed for parallel ADC/DAC interfacing with LVDS source-synchronous I/O.
推荐
PCI Express Endpoint Design
The EP2SGX90FF1152C3 supports x1/x4/x8 PCI Express endpoints via its integrated hard PCIe hard IP, eliminating soft-IP timing closure risk. Combined with the 12 multi-gigabit transceivers, the device can simultaneously run PCIe plus multiple Aurora or Serial RapidIO channels for system-interconnect bridging. The 4 enhanced PLLs generate the 100 MHz reference clock plus channel-rate clocks, and the 558 I/O can fan out to local DDR2/QDR-II memory controllers. Quartus II IP Compiler generates the PCIe hard IP wrapper automatically.
推荐
Test & Measurement Backplane Bridging
The EP2SGX90FF1152C3 bridges legacy parallel test backplanes (LVDS, TTL) to modern serial test instruments via its 558 I/O plus 12 transceivers. The 16 global clock networks and 4 enhanced PLLs allow multiple independent timing domains across the bridge, while the 4.5 Mbit memory absorbs burst-mode ADC samples. The FF1152 BGA exposes enough I/O to drive 32+ parallel LVDS channels and the transceivers can drive 6 Gbps links to PXI Express or LXI instrument chassis.
推荐
Industrial High-Speed Imaging
The EP2SGX90FF1152C3's combination of 558 I/O, 4.5 Mbit buffer memory, and 252 18x18 multipliers suits multi-camera industrial imaging systems that perform real-time Bayer demosaicing, edge detection, and JPEG/MJPEG compression in the FPGA. The 1152-BGA FF1152 package supports MIPI CSI-2 via soft IP plus LVDS sensor interfacing. C3 commercial temperature (0-85C) covers most factory environments and the I4 industrial-grade alternatives extend to -40C for outdoor machine-vision applications.
推荐
推荐产品汇总
工程参考数据： EP2SGX90FF1152C3 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2SGX90EF1152C3 | EP2SGX90EF1152C3N | EP2SGX90EF1152C4 | EP2SGX90EF1152I4 | EP2SGX130GF40C3N |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA (FF1152) | 1152-BBGA (FF1152) - same | 1152-BBGA (FF1152) - same | 1152-BBGA (FF1152) - same | 1152-BBGA (FF1152) - same | 1508-BBGA (F1508) - different |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 90960 | 90960 | 90960 | 90960 | 90960 | 132480 (+44%) |
| Embedded Memory | 4.5 Mbit | 4.5 Mbit | 4.5 Mbit | 4.5 Mbit | 4.5 Mbit | 6.7 Mbit |
| Speed Grade | C3 (commercial) | C3 | C3 | C4 (slower) | I4 (industrial) | C3 (commercial) |
| Temperature Range | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C |
| User I/O | 558 | 558 | 558 | 558 | 558 | 734 |
| Transceivers | Up to 12 (6.375 Gbps) | Up to 12 (6.375 Gbps) | Up to 12 (6.375 Gbps) | Up to 12 (6.375 Gbps) | Up to 12 (6.375 Gbps) | Up to 20 (6.375 Gbps) |
| Enhanced Configuration (PCIe hard IP) | No (F variant) | Yes (E variant) | Yes (E variant) | Yes (E variant) | Yes (E variant) | Yes (G variant) |
关键差异点
- Mid-range density with full transceiver complement （对比 EP2SGX60FF1152)
- Enhanced configuration subset with PCIe hard IP （对比 EP2SGX90EF1152C3)
- Commercial temperature (0-85C) vs industrial (-40 to +100C) （对比 EP2SGX90EF1152I4)
- 90K LE vs 130K LE density （对比 EP2SGX130GF40C3N)
设计说明
The EP2SGX90FF1152C3 requires multiple supply rails: VCCINT (core, typically 1.2V), VCCIO (I/O banks, 1.5V-3.3V depending on bank standard), VCCA_PLL (PLL analog, 2.5V), VCCD_PLL (PLL digital, 1.2V), VCC_GXB (transceiver analog, 3.3V or 2.5V), and VCCL_GXB (transceiver analog low). Decouple each rail with one 100 uF bulk plus one 0.1 uF plus one 0.01 uF ceramic cap per power pin. Use a star-ground topology with the FF1152 thermal pad bonded to a large uninterrupted ground plane.
Estimated: At full fabric utilization (90960 LEs @ 80% toggle, all 12 transceivers @ 6.375 Gbps PRBS31), the EP2SGX90FF1152C3 dissipates approximately 12-15 W. The FF1152 package theta_JA on a JEDEC 4-layer test board is approximately 4-6 C/W with a thermal via array under the BGA, requiring either a forced-air heatsink or a 6+ layer PCB with copper coin under the die. For quiescent designs under 3 W, no heatsink is needed.
Use a 0.8 mm or 1.0 mm BGA pitch escape pattern with microvia-in-pad on at least the top signal layers. Transceiver traces require 100 ohm differential impedance with continuous reference plane and length-matching within 150 mil for intra-pair and 2.5 mm for inter-pair skew per channel. Differential vias must use antipad clearance to control impedance. Provide at least 8 transceiver ground vias per channel ball cluster. JTAG chain order should be documented in the Quartus pinout file.
Common pitfalls with the EP2SGX90FF1152C3: (1) Do not enable MSEL pins to a configuration mode that does not match the configuration device - the part will appear 'dead'. (2) Do not drive LVDS signals into 3.3V VCCIO banks - LVDS requires VCCIO = 2.5V. (3) Do not leave VCCA_PLL floating even if PLLs are unused - connect to 2.5V via a ferrite bead. (4) Always tie nCONFIG high through a 4.7 k resistor; do not leave it floating. (5) For configuration from flash, verify the enhanced configuration device is the correct density for the bitstream.
合规信息
Altera Stratix II GX family was launched in 2004-2007; the EP2SGX90FF1152C3 NRNR status means RoHS/REACH compliance depends on date code. Verify on the part label and Altera/Intel material declaration. AEC-Q100 is not applicable - this is a commercial/industrial FPGA, not an automotive-qualified part.
