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产品（32752)

A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FGG324I

A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

The Microchip Technology (Actel/Microsemi) A3PE3000-FGG324I is a ProASIC3E family flash-based FPGA with 3 million system gates, 75264 CLBs, 221 user I/Os, and a maximum toggle rate of 350 MHz, housed in a 324-ball Fine-Pitch Ball Grid Array (FBGA/PBGA324) measuring 19 x 19 mm with 1.0 mm ball pitch. A Field Programmable Gate Array (FPGA) is a semiconductor device that implements user-defined digital logic through a configurable fabric of logic blocks, routing resources, and I/O cells. The ProASIC3E sits in the flash-FPGA branch of this hierarchy: unlike SRAM-based FPGAs, it stores its configuration in nonvolatile flash, making it a single-chip, Instant-On solution that needs no external configuration device. Key features include nonvolatile flash programming with reprogrammability, 1.5 V core operation on a 130 nm process, embedded memory, and low total cost of ownership (TOC) as a cost-effective ASIC replacement. The industrial temperature grade (-40 C to +125 C ambient, denoted by the I suffix) supports harsh-environment deployment. Technically, the device uses the ProASIC3EVersaTile architecture, where each versatile cell can be configured as combinational logic, a flip-flop, or small memory, giving designers fine-grained control. The fifth-generation flash switch technology provides security benefits because configuration data cannot be easily read back, which matters in avionics, networking, and consumer designs where IP protection is required. Typical applications include ASIC prototyping and bridging, industrial control, networking and communications line cards, avionics subsystems, and high-reliability consumer platforms. The 221 available user I/Os allow wide parallel bus interfaces and glueless connection to processors and memories. A key design consideration is power supply sequencing and decoupling: the 1.5 V core rail requires stable, low-ripple supplies, and the BGA-324 footprint demands careful via-fanout planning during PCB layout. This page synthesizes distributor pricing context, verified drop-in alternatives, and practical design notes that go beyond the raw specifications listed in the manufacturer datasheet.

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A3PE3000-FGG484 - ProASIC3E FPGA 3M Gates 484-BGA | Microchip
A3PE3000-FGG484

A3PE3000-FGG484 - ProASIC3E FPGA 3M Gates 484-BGA | Microchip

The Microchip Technology A3PE3000-FGG484 is a ProASIC3E family flash-based FPGA delivering 3 million system gates (75264 cells) with 341 user I/Os in a 484-ball FBGA package measuring 23 x 23 mm with a 1 mm ball pitch. Fabricated on a 130 nm flash process and operating from a 1.5 V core supply, it supports system performance up to 231 MHz. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration device. Within the programmable logic hierarchy - FPGA -> field-programmable gate array -> programmable SoC/programmable logic device - flash FPGAs occupy the single-chip niche: they power up instantly, require no boot PROM, and offer inherent security against configuration readback compared with SRAM FPGAs. Key features include non-volatile flash programming (single-chip solution, low total cost of ownership), reprogrammability for in-field updates, abundant advanced features such as embedded block RAM, and the large 341 I/O count that suits wide bus interfaces. The ProASIC3E variant adds up to 2 Mbit of embedded RAM and PLL support, targeting system-level integration. Technically, the fabric uses a sea-of-gates architecture with VersNet routing and flash switch elements, eliminating volatile configuration and its associated power-up glitch risk. The 130 nm CMOS process with 1.5 V core keeps static power moderate, while the FBGA-484 footprint provides dense, high-speed interconnect for DDR-class interfaces. Typical applications include industrial automation controllers, communications and networking line cards, medical instrumentation, military/aerospace secure systems, and test equipment, where instant-on operation and configuration security are valued. A key design consideration: ProASIC3E FGG484 parts are RoHS lead-free (FGG suffix), whereas FG484 variants are not - verify soldering compatibility before substitution. This page synthesizes distributor pricing, drop-in alternatives within the ProASIC3/3E family, and practical design notes not found in the manufacturer datasheet.

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A3PE3000-FGG484I - ProASIC3E FPGA 3M Gates 484-FBGA | Microchip
A3PE3000-FGG484I

A3PE3000-FGG484I - ProASIC3E FPGA 3M Gates 484-FBGA | Microchip

The Microchip Technology (Microsemi) A3PE3000-FGG484I is a ProASIC3E flash-based FPGA delivering 3 million system gates (75,264 logic cells), 341 user I/Os, and up to 516,096 bits of embedded RAM in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package, rated for the industrial temperature range of -40C to +100C. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field. The ProASIC3E family sits in the flash-based FPGA hierarchy: FPGA -> programmable logic device -> programmable SoC/system logic, distinguished from SRAM FPGAs by its nonvolatile flash configuration cells. Key features include flash-based live-at-power-up operation with no external configuration device, single 1.5V core operation on 130nm flash technology, low total cost of ownership through single-chip integration, and reprogrammability without a boot PROM. The 341 I/Os support multiple standards, and the 23x23 mm FBGA footprint suits high-IO industrial designs. Architecturally, the A3PE3000 uses a sea-of-vanilla logic tile fabric with Versatile routing, flash switch blocks, and embedded SRAM blocks totalling 516,096 bits. Because configuration is stored in flash, the device is inherently secure against bitstream interception and instantly active at power-up - critical for systems with fast-start requirements. Typical applications include industrial automation and motor control, aerospace and defense subsystems, medical instrumentation, communications bridging, and test equipment where nonvolatile, secure, instant-on programmable logic is required. A key design consideration: the FGG484I is the industrial-grade, RoHS-code-No variant in some parametric databases, so verify environmental compliance requirements against the official Microchip datasheet before finalizing BOM approvals. This page synthesizes distributor pricing signals, drop-in same-footprint alternatives, and practical design notes not found on the manufacturer product page alone.

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A3PE3000-FGG896 - ProASIC3E 3M-Gate Flash FPGA 896-BGA | Microchip
A3PE3000-FGG896

A3PE3000-FGG896 - ProASIC3E 3M-Gate Flash FPGA 896-BGA | Microchip

The Microchip (Actel) A3PE3000-FGG896 is a ProASIC3E flash-based FPGA with 3 million system gates, 75264 CLBs, 620 user I/Os, and a maximum system performance of 231 MHz, housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package operating from a 1.5V core supply. A flash-based FPGA is a field-programmable gate array whose configuration data is stored in on-chip flash memory cells rather than volatile SRAM. Unlike SRAM FPGAs, flash FPGAs retain their configuration through power cycles without an external configuration PROM, reducing bill-of-materials cost and improving system boot security. Within the power-management hierarchy of programmable logic devices, the FPGA sits above CPLDs and below full ASIC implementations, and the ProASIC3E family was positioned by Actel (now Microchip Technology) specifically as a cost-effective ASIC replacement for high-volume applications. Key differentiating features of the A3PE3000 include single-chip operation with no external boot device, reprogrammability with live-at-power-up behavior, low total cost of ownership, and abundant embedded block resources. The ProASIC3E fabric is built on a 130nm flash process technology, delivering deterministic, high-performance logic capacity of 35K logic elements with 516096 bits of distributed and block memory for buffering, FIFOs, and data-path functions. Architecturally, the device combines a sea-of-versatile-modules fabric with embedded flash switches, which supply inherent security benefits because configuration data is non-volatile and cannot be easily read back. This makes the family attractive for avionics, networking, computing, and consumer platforms where IP protection matters. The 620 available I/Os support broad system connectivity within a single 896-ball package. Typical applications include industrial control systems, wireless and networking communication equipment, ASIC prototyping and low-volume ASIC replacement, and avionics subsystems that require non-volatile, secure configuration storage. A key design consideration is supply integrity: the 1.5V core rail must be well-regulated and decoupled, and BGA escape routing requires careful fanout planning on high-layer-count PCBs. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.

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A3PE3000-FGG896I - ProASIC3E FPGA 620 I/O | Microchip
A3PE3000-FGG896I

A3PE3000-FGG896I - ProASIC3E FPGA 620 I/O | Microchip

The Microchip Technology (Microsemi) A3PE3000-FGG896I is a ProASIC3E Flash-based FPGA with 35,000 logic elements (LEs), 620 user I/Os, and system performance up to 231 MHz, housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA/FGG896) package and rated for the industrial temperature range of -40C to +85C. It operates from a 1.5 V core supply and is fabricated on a 130 nm flash process. A Flash FPGA is a field-programmable gate array that stores its configuration in on-chip nonvolatile flash memory rather than an external configuration ROM. In the programmable logic hierarchy, the A3PE3000 sits within the ProASIC3E family, which itself belongs to the broader categories of nonvolatile FPGAs, programmable logic devices, and digital semiconductors. Because the configuration is retained on-chip, the device is a true single-chip, Instant-On solution that needs no boot PROM and offers inherent resistance to configuration readback. Key features include reprogrammable flash fabric based on the third-generation VersaTile architecture, where each tile functions as a three-input LUT or a D-flip-flop/latch with enable; a large 620-pin I/O budget supporting high-pin-count board interfaces; low total cost of ownership through single-chip integration; and industrial-grade temperature qualification for harsh environments. The ProASIC3E fabric provides distributed block routing and embedded memory within the family architecture, supporting glue logic consolidation, bus bridging, control-plane functions, and custom data-path implementations. The VersaTile structure allows efficient synthesis mapping, and Microchip's Libero SoC design suite supports HDL entry, synthesis, simulation, and programming of the device. Typical applications include industrial automation controllers, communications and networking line cards, test and measurement instrumentation, medical equipment, and aerospace/defense subsystems where nonvolatile, secure, single-chip FPGA integration is required. A key design consideration is power distribution: the 1.5 V core rail must be well regulated and decoupled across the 896-ball package, and high-speed I/O banks require careful banking and reference planning in the pinout assignment. This page synthesizes verified distributor data, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.

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A3PE3000-PQ208I - 3M-Gate Flash FPGA 147 I/O | Microchip
A3PE3000-PQ208I

A3PE3000-PQ208I - 3M-Gate Flash FPGA 147 I/O | Microchip

The Microchip (Microsemi) A3PE3000-PQ208I is a flash-based FPGA from the ProASIC3E family with 3 million system gates, 75264 configurable logic cells, up to 231 MHz system performance, 147 user I/O, and 1.5V core operation on a 130nm process, housed in a 208-pin PQFP (28 x 28 mm, 0.5 mm pitch) package with industrial temperature rating. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and programmable I/O that designers configure after manufacturing. Within the programmable logic hierarchy, the FPGA sits at the top as a full system-level fabric, above CPLDs and simple programmable devices. The ProASIC3E family is distinguished by its flash-based configuration memory: unlike SRAM FPGAs, it is a single-chip solution that retains its configuration through power cycles and needs no external boot PROM, reducing bill-of-materials cost and improving board-level security. Key features of the A3PE3000 include 3 million gates for substantial logic capacity, 147 user I/O on the PQ208 package, low total cost of ownership (TOC) highlighted by Microchip, and reprogrammability supporting in-field firmware updates. The flash cell technology is inherently non-volatile and low power at standby, and the fabric supports common FPGA design flows using Microchip Libero SoC tools. Technical depth: the device is fabricated on a 130nm CMOS process with a 1.5V core supply. ProASIC3E embeds PLLs and block RAM suitable for bus interfacing, glue logic consolidation, and control-plane designs. The 231 MHz figure represents the family's achievable system performance for typical pipelined designs. Clock management, I/O banking, and flash security features make the part a cost-effective ASIC replacement, particularly where NRE cost and long ASIC lead times are unacceptable. Typical applications include industrial automation control and motor-interface glue logic, networking and communications line-card control logic, and avionics/defense systems that value non-volatile, single-chip, secure configuration without external configuration devices. Design consideration: this PQ208I variant is RoHS non-compliant and contains lead, so it is targeted at legacy, defense, and exemption-qualified industrial programs; for new lead-free designs, select the PQG208 green-package variants instead. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with pricing verified as of 2026-09-02.

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A3PE3000-PQG208 - ProASIC3E 3M-Gate Flash FPGA, 208-PQFP | Microchip
A3PE3000-PQG208

A3PE3000-PQG208 - ProASIC3E 3M-Gate Flash FPGA, 208-PQFP | Microchip

The Microchip (formerly Microsemi/Actel) A3PE3000-PQG208 is a 3-million-gate ProASIC3E flash-based FPGA with 75264 CLBs, up to 516096 bits of embedded memory, a maximum toggle-frequency figure of 231 MHz, fabricated on a 130nm CMOS flash process with a 1.5V core, housed in a 208-pin PQFP (PQG208) package measuring 28 x 28 mm with 0.5 mm lead pitch. An FPGA (field-programmable gate array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that the user configures after manufacturing. The ProASIC3E family sits within the broader hierarchy of programmable logic devices: FPGA -> flash-based FPGA -> single-chip, non-volatile FPGA -> programmable SoC platform. Unlike SRAM FPGAs, ProASIC3E devices store their configuration in on-chip flash, so they power up instantly without an external configuration PROM and offer higher design security. Key features include the flash-based, single-chip architecture with low total cost of ownership (TOC), reprogrammability, support for the ARM Cortex-M1 32-bit soft processor, and abundant embedded RAM blocks. The PQ208 package supports six clock-conditioning circuits (CCCs) and two PLLs, with six chip-level (main) and three quadrant global clock networks available for low-skew clock distribution. Technically, the device uses a 130nm CMOS flash switching fabric with a 1.5V core supply, supporting multiple single-ended and differential I/O standards; certain I/O standard usage is limited on the A3PE3000 density, and each used differential I/O pair reduces the single-ended I/O count by two. The large 3M-gate capacity suits high-gate-count glueless integration of processors, interfaces, and datapath logic in one chip. Typical applications include industrial automation controllers, telecommunications line cards, medical instrumentation, and aerospace/defense systems where instant-on, secure, non-volatile FPGA configuration is required. Design consideration: at 130nm with a 1.5V core, plan power distribution and decoupling carefully and verify I/O banking constraints against the manufacturer datasheet before pin assignment. This page synthesizes distributor pricing, drop-in alternatives within the ProASIC3E family, and practical design notes not found in the manufacturer datasheet.

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A3PE3000-PQG208X3 - 3M-Gate Flash FPGA, 231MHz | Microchip
A3PE3000-PQG208X3

A3PE3000-PQG208X3 - 3M-Gate Flash FPGA, 231MHz | Microchip

The Microchip Technology (Microsemi) A3PE3000-PQG208X3 is a ProASIC3E family flash-based FPGA delivering 3 million system gates with a maximum system performance of 231 MHz, fabricated on a 130 nm process and operating from a 1.5 V core supply in a 208-pin PQFP (PQG208 / 208-BFQFP) surface-mount package. The X3 suffix denotes the tape-and-reel packing option for high-volume automated assembly. A flash FPGA is a field-programmable gate array that stores its configuration in on-chip nonvolatile flash memory rather than an external configuration PROM or SRAM cells. In the power-management hierarchy of programmable logic devices, flash FPGAs sit between one-time-programmable antifuse devices and SRAM-based FPGAs, offering reprogrammability with single-chip, Instant-On behavior and inherent security because no external bitstream is exposed at power-up. Key features of the A3PE3000 include nonvolatile flash programming that eliminates external configuration devices, low power consumption typical of the 130 nm ProASIC3E architecture, and abundant advanced features including support for soft ARM processor cores. The device provides 147 user I/Os in the 208-pin package and 516,096 bits of embedded memory per DigiKey listing data, making it suitable for glueless integration of logic and memory functions. The ProASIC3E architecture uses Microchip's VersaTile structure, a fine-grained logic tile that can be configured as a combinational cell, sequential element, or distributed memory. Fabrication on a 130 nm flash process yields ASIC-level unit costs at low-to-medium volumes, and the optional soft ARM support enables embedded processing without an external microcontroller. Typical applications include industrial control and automation, networking and communications equipment, consumer electronics, computing platforms, and avionics systems, where the family datasheet explicitly positions ProASIC3E as a cost-effective ASIC replacement. Instant-On flash configuration also suits power-critical systems that must be functional within microseconds of supply application. A key design consideration is that the 1.5 V core requires a dedicated low-noise rail, while I/O banks must be planned against the 208-pin PQFP allocation early in the pinout cycle, since PQFP packages limit total I/O and signal-integrity headroom compared with fine-pitch BGA alternatives. This page synthesizes distributor listing data, drop-in same-package alternatives, pricing tiers, and practical design notes not found in the manufacturer datasheet.

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A3PE3000L-1FG324 - ProASIC3L Low Power FPGA 324-BGA | Microchip
A3PE3000L-1FG324

A3PE3000L-1FG324 - ProASIC3L Low Power FPGA 324-BGA | Microchip

The Microchip Technology (Microsemi) A3PE3000L-1FG324 is a low-power ProASIC3L flash FPGA with 3 million system gates, approximately 35K logic elements, 221 user I/Os, and a 1.2 V core voltage, housed in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package. It is fabricated on a 130 nm flash-based CMOS process and belongs to the ProASIC3L family with Flash*Freeze technology. A flash FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external configuration device. Within the programmable logic hierarchy, it sits as an FPGA (below ASIC and above CPLD in density) and as a power-management-oriented member of the Microchip flash FPGA portfolio that includes ProASIC3, ProASIC3L, ProASIC3E, and the Fusion/IGLOO families. Key features include flash-based live-at-power-up operation with no external boot PROM, 1.2 V to 1.5 V core operation, I/O operation as low as 1.2 V, and the Flash*Freeze mode that dramatically cuts dynamic and static power for battery-operated systems. According to the ProASIC3L family datasheet, ProASIC3L devices reduce dynamic power by roughly 40% and static power by roughly 50% versus equivalent ProASIC3 parts. The A3PE3000L is the low-power 3M-gate variant; the -1 speed grade balances performance with lowest dynamic power, and the FG324 ball map exposes 221 user I/Os supporting single-ended and differential standards. Fabricated at 130 nm, the architecture uses Versatile Logic Elements, embedded SRAM blocks (516,096 bits total on this device), and flexible I/O banks. Typical applications include portable and battery-powered instrumentation, industrial control, space-constrained military/aerospace subsystems, and bridge/control logic in communication equipment where non-volatile instant-on configuration is required. Design consideration: plan power budgeting around Flash*Freeze entry/exit latency and verify I/O banking voltage compatibility with adjacent logic in the 324-ball footprint. This page synthesizes verified distributor data, drop-in same-footprint alternatives, pricing tiers, and practical design notes not consolidated in the manufacturer datasheet.

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A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-1FG324I

A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip

The Microchip Technology (formerly Microsemi/Actel) A3PE3000L-1FG324I is a ProASIC3L low-power flash FPGA with 3 million system gates, 221 user I/Os, and a 1.2V to 1.5V core voltage, housed in a 324-ball Fine-Pitch Ball Grid Array (FBGA/FG324) package with industrial temperature rating (-40C to +100C). A field-programmable gate array (FPGA) is a semiconductor device containing programmable logic blocks and interconnects that the designer configures after manufacturing. FPGAs sit within the broader programmable logic hierarchy: logic cell / look-up table (LUT) -> fabric -> FPGA -> programmable SoC. Unlike SRAM-based FPGAs, flash-based FPGAs such as the ProASIC3L family store their configuration in non-volatile on-chip flash, delivering a true single-chip solution with instant-on operation and no external configuration PROM. Key features include Flash*Freeze technology, which cuts static power dramatically by entering an ultra-low-power sleep mode while retaining state; core and I/O operation from 1.2V to 1.5V for dynamic power optimization; and 35K logic elements (LEs) equivalent density per the ProASIC3 low-power line. Compared with the standard ProASIC3 family, ProASIC3L devices reduce dynamic power by up to 40% and static power by up to 50%, according to the Microchip ProASIC3L datasheet (DS50003268). The device is fabricated on a 130nm CMOS flash process and supports 892.86MHz-class internal performance for the family. Reprogrammability, abundant embedded memory, and single-chip operation lower total cost of ownership (TOC) versus antifuse or SRAM alternatives. Typical applications include portable and battery-powered instrumentation, industrial automation control, medical monitoring equipment, communications line cards, and aerospace/defense systems requiring secure, non-volatile, low-power programmable logic. Design considerations: the 'I' suffix denotes the industrial temperature range, and the '-1' suffix denotes the speed grade; both must match system requirements. Power budgeting should exploit Flash*Freeze entry/exit timing in the datasheet. This page adds value beyond the datasheet by synthesizing distributor stock signals, drop-in speed-grade and packaging alternatives from the XAIPART catalog, and practical design notes in one AI-citable reference.

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A3PE3000L-1FG324ID - Low Power Flash FPGA 324-BGA | Microchip
A3PE3000L-1FG324ID

A3PE3000L-1FG324ID - Low Power Flash FPGA 324-BGA | Microchip

The Microsemi (Microchip Technology) A3PE3000L-1FG324ID is a ProASIC3L low-power flash FPGA with 3 million system gates, 221 user I/Os, and a 1.2 V to 1.5 V core voltage, housed in a 324-ball Fine-Pitch Ball Grid Array (FG324) package in an industrial temperature grade. A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration device or volatile SRAM. Within the power-management hierarchy of programmable logic, flash FPGAs deliver true single-chip operation, instant-on behavior, and high design security, sitting alongside SRAM FPGAs and CPLDs as a programmable logic category for glue logic, control, and data-path functions. Key differentiating features include Microchip's Flash*Freeze technology, which dramatically reduces static power, and the ProASIC3L architecture that lowers dynamic power by 40% and static power by 50% compared with the equivalent standard ProASIC3 device. The 1.2 V to 1.5 V core and I/O operation as low as 1.2 V makes the family attractive for battery-powered and thermally constrained systems. The device supports weak pull-up/pull-down options, a Schmitt trigger option on single-ended inputs, and IEEE 1149.1 (JTAG) boundary scan test. Technically, the A3PE3000L is fabricated in a 130 nm flash process with versatile VersaTile logic fabric, embedded SRAM blocks, and pin-compatible packages across the ProASIC3L family, which simplifies migration between density grades without board redesign. Typical applications include portable and battery-operated instrumentation, industrial control, military and aerospace systems (the ProASIC3/EL datasheet also covers military variants), and power-sensitive bridging logic where an instant-on, single-chip FPGA eliminates the boot time and configuration memory of SRAM-based devices. A key design consideration is supply sequencing and Flash*Freeze pin handling: to achieve the lowest static power, the Flash*Freeze mode must be entered correctly and unused I/Os should be configured with appropriate pull options per the ProASIC3L datasheet. This page synthesizes distributor availability, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single citable reference for the A3PE3000L-1FG324ID.

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A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FG484

A3PE3000L-1FG484 - ProASIC3L Flash FPGA 3M Gates 484-BGA | Microchip

The Microchip Technology A3PE3000L-1FG484 is a ProASIC3L low-power flash FPGA with 3 million system gates (75,264 cells), 341 user I/Os, and support for up to 516,096 bits of embedded memory, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA-484, 23 x 23 mm, 1.0 mm ball pitch) with a -1 speed grade. A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable fabric, allowing designers to implement custom digital circuits after manufacturing. Within the FPGA hierarchy, the ProASIC3L family sits in Microchip (formerly Actel/Microsemi) flash-based FPGA portfolio, distinguished from SRAM FPGAs by its non-volatile flash configuration cells that eliminate external boot ROMs and provide instant-on operation. Key features of the A3PE3000L include Flash*Freeze technology for near-zero static power mode, a 1.2 V to 1.5 V core voltage, live reprogrammability, single-chip operation without external configuration devices, and secure flash programming that resists bitstream extraction. Embedded SRAM blocks and multiple PLLs support high-performance designs, while 1 mm pitch ball-out simplifies PCB routing relative to finer-pitch substrates. Architecturally, the ProASIC3L fabric uses Versatile routing with an advanced 6-layer metal flash CMOS process. Logic resources total 75,264 equivalent cells, and dedicated block RAM totals up to 516 Kbits. The -1 speed grade denotes the slowest commercial timing bin of the family, trading maximum frequency for lower cost and power. Typical applications include industrial automation controllers, portable battery-powered instruments, communications line cards, and space-constrained embedded systems where instant-on, low static power, and single-chip integration matter. Design consideration: because this is a BGA package, verify ball-map routing feasibility and consider the -1 speed grade limits when targeting 100+ MHz clock domains. This page synthesizes distributor pricing, drop-in alternatives, design notes, and FAQ content not found in the manufacturer datasheet alone.

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A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip
A3PE3000L-1FG484I

A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip

The Microchip Technology (formerly Microsemi/Actel) A3PE3000L-1FG484I is a low-power ProASIC3L flash FPGA with 3M system gates, 341 user I/Os, and 516,096 bits of embedded RAM, housed in a 484-ball Fine-Pitch Ball Grid Array (FG484) package rated for the industrial temperature range. A flash-based FPGA is a field-programmable gate array that stores its configuration in non-volatile on-chip flash memory rather than an external configuration PROM or SRAM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> digital logic IC -> semiconductor), flash FPGAs occupy the single-chip, instant-on niche: they power up with logic already loaded, need no boot device, and are inherently more resistant to configuration disturbance than SRAM FPGAs. Key features of the A3PE3000L include the low-power 'L' variant silicon operating from a 1.2 V core (the family also supports 1.5 V core options in the non-L ProASIC3E parts), Flash*Freeze technology that lets the device enter an ultra-low static-power mode without losing register state, and single-chip operation that lowers total cost of ownership by removing external configuration storage. The 130 nm flash process combines reprogrammability with non-volatility, and the abundant 341 I/Os support wide bus interfaces in compact 484-BGA packaging. Architecturally, the ProASIC3L fabric is built from VersaTiles, a fine-grained lookup-table-based tile that can implement combinational and sequential logic without wasting routes, and embedded SRAM blocks totaling 516 Kbits for FIFOs and dual-port buffering. Timing closure is achieved with standard static timing analysis using Libero SoC design tools from Microchip. Typical applications include industrial automation controllers, portable and battery-powered instrumentation, medical diagnostics hardware, and secure communications equipment where instant-on operation, low static power, and single-chip integration are decisive. A key design consideration: the '-1' speed grade and industrial 'I' temperature suffix must both be matched when qualifying alternates, because timing and operating range differ across grade variants of the same die. This page adds value beyond the manufacturer datasheet by synthesizing distributor stock and pricing, drop-in same-footprint alternates, and practical design notes in one AI-citable reference.

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A3PE3000L-1FG484M - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FG484M

A3PE3000L-1FG484M - 3M-Gate Low-Power Flash FPGA | Microchip

The Microchip Technology (formerly Microsemi/Actel) A3PE3000L-1FG484M is a ProASIC3L low-power flash-based FPGA with 3 million system gates, 341 user I/Os, and a 250 MHz performance grade, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package. It operates from a 1.2 V to 1.5 V core voltage and integrates Flash*Freeze technology for dynamic power reduction. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory cells rather than SRAM, so the device loads its design instantly at power-up without an external configuration PROM. Within the programmable-logic hierarchy, the A3PE3000L sits under the FPGA category as a member of the ProASIC3/ProASIC3L flash FPGA family, one of the major alternatives to SRAM-based and antifuse programmable logic. Key features include a reprogrammable flash fabric, instant-on operation, low static and dynamic power consumption, and support for single-ended and differential I/O standards. The device provides IEEE 1149.1 (JTAG) boundary scan test, Schmitt-trigger options on single-ended inputs, and weak pull-up/pull-down options. Pin-compatible packages across the ProASIC3L family (except PQ208) simplify migration between logic densities. The ProASIC3L fabric is built on a 130-nm flash process with 1.2 V or 1.5 V core operation. The Flash*Freeze technology allows the device to enter an ultra-low-power state while retaining state and I/O functionality, making it distinctive versus SRAM FPGAs that need external boot devices and exhibit higher standby current. Typical applications include portable and battery-powered instrumentation, industrial automation control, aerospace and defense subsystems requiring instant-on secure flash configuration, and communications line cards where low static power is important. A key design consideration is power planning: use the Flash*Freeze pin and a 1.2 V core rail for lowest power, and budget I/O bank voltages early since 341 user I/Os are divided across multiple banks with distinct VCCI requirements. This page synthesizes distributor stock data, drop-in same-package alternatives, pinout guidance, and practical design notes not found in the manufacturer datasheet alone.

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A3PE3000L-1FG896I - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FG896I

A3PE3000L-1FG896I - 3M-Gate Low-Power Flash FPGA | Microchip

The Microchip Technology (formerly Microsemi/Actel) A3PE3000L-1FG896I is a low-power flash-based FPGA from the ProASIC3L family delivering 3,000,000 system gates, 75,264 logic cells, and up to 620 user I/Os in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package, built on 130 nm flash technology with a 1.2 V to 1.5 V core voltage and industrial temperature rating of -40C to +85C. A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration PROM. Within the programmable logic hierarchy, the ProASIC3L sits under the broader FPGA and programmable logic device categories and is distinguished from SRAM FPGAs by its single-chip, instant-on, secure, reprogrammable architecture. Key differentiating features include Flash*Freeze technology, which allows near-zero static power consumption while retaining state; live reprogrammability; single-chip operation with no external boot device; weak pull-up/down options and Schmitt trigger inputs on single-ended I/Os (A3PE3000L); and IEEE 1149.1 (JTAG) boundary scan test support. Pin-compatible packages across the ProASIC3L family simplify migration between densities. Technically, the device uses a 130 nm CMOS flash process with a Sea-of-Tiles switch fabric. The low core voltage (1.2 V nominal) plus Flash*Freeze mode yields very low static power, making it suited to battery-sensitive and thermally constrained systems. The 896-ball FBGA offers a 1.00 mm ball pitch for surface mounting. Typical applications include industrial automation and control, portable and battery-powered instrumentation, secure military and communications systems, and bridge/interconnect logic where instant-on and configuration security matter. A key design consideration is power-rail sequencing: the ProASIC3L requires the 2.5 V I/O/auxiliary supply and 1.2 V core supply per datasheet recommendations, and Flash*Freeze entry/exit timing should be validated in system. This page synthesizes distributor availability data, drop-in alternatives within the same FG896 footprint, and practical design notes not found in the manufacturer datasheet.

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A3PE3000L-1FGG324 - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FGG324

A3PE3000L-1FGG324 - 3M-Gate Low-Power Flash FPGA | Microchip

The Microchip Technology A3PE3000L-1FGG324 is a ProASIC3L low-power flash FPGA with 3 million system gates, 221 user I/Os, and a 1.2 V core voltage, housed in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package. A field-programmable gate array (FPGA) is a reprogrammable semiconductor device that implements user-defined digital logic through a configurable fabric of logic elements, routing resources, and I/O cells. The ProASIC3L family belongs to the nonvolatile flash FPGA class within the broader power-management and programmable-logic hierarchy: flash FPGA -> FPGA -> programmable logic IC -> digital integrated circuit. Unlike SRAM-based FPGAs, its flash cells are nonvolatile, so the device powers up instantly without an external configuration PROM. Key features include the ProASIC3L low-power fabric with Flash*Freeze technology for dramatic dynamic power reduction, a 1.2 V to 1.5 V core voltage range, single-chip secure operation, and reprogrammability without boot-time configuration delay. The device targets total-cost-of-ownership-sensitive designs by removing the need for configuration flash and external power-cycling circuitry. Architecturally, the A3PE3000L uses a 130 nm CMOS flash process with 75264 logic cells organized in VersaTile clusters, allowing each tile to act as a logic function, registered logic, or small memory. The fabric supports high performance while the L-variant leverages low-power process and core operation for portable and power-constrained systems. Typical applications include industrial automation control, portable and battery-powered instrumentation, secure military and aerospace subsystems, and communications line-card glue logic, where nonvolatile instant-on configuration and low standby power are essential. Design consideration: the 324-ball FBGA requires careful PCB layout with appropriate via-in-pad or dog-bone fanout, and core voltage selection (1.2 V vs 1.5 V) must match speed-grade requirements. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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A3PE3000L-1FGG324I - 3M-Gate Flash FPGA, 324-FBGA | Microchip
A3PE3000L-1FGG324I

A3PE3000L-1FGG324I - 3M-Gate Flash FPGA, 324-FBGA | Microchip

The Microchip (Microsemi) A3PE3000L-1FGG324I is a ProASIC3L low-power flash-based FPGA delivering 3 million system gates, 75264 logic elements, 516096 bits of embedded SRAM, and 221 user I/Os in a 324-ball FBGA (19x19 mm) package, fabricated on a 130 nm flash process with a 1.2 V core voltage and industrial temperature rating of -40C to +125C. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers configure using a hardware description language such as Verilog or VHDL. FPGAs sit between fixed-function ASICs and software-programmable processors in the programmable logic hierarchy, offering ASIC-like integration without mask costs or NRE. The ProASIC3L family adds Flash*Freeze technology on top of the base ProASIC3 architecture for dramatic dynamic power reduction. Key features of the A3PE3000L-1FGG324I include nonvolatile flash programming, which makes the device Instant On and single-chip, requiring no external configuration PROM and providing inherent design security. The low-power L variant supports 1.2 V to 1.5 V core operation and Flash*Freeze mode, which preserves state while cutting dynamic power. Embedded SRAM blocks total 516096 bits, supporting FIFOs and dual-port memories. Technically, the device uses Microchip's flash switch fabric on a 130 nm CMOS process, with reprogrammable, secure, single-chip operation. The -1 speed grade balances performance with power, and the FGG 1.0 mm ball-pitch FBGA package supports fine-pitch surface-mount assembly. According to the Microsemi ProASIC3L datasheet, the family targets low total cost of ownership and high system performance. Typical applications include industrial automation controllers, battery-powered portable instrumentation, medical monitoring equipment, aerospace subsystems requiring secure instant-on logic, and communications line cards where power gating during idle periods saves energy. When designing with this FPGA, plan power rails for the 1.2 V core and I/O banks early, and exploit Flash*Freeze mode by gating the clock domain during idle intervals to maximize battery life. This page synthesizes distributor availability data, same-footprint drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484

A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip

The Microchip Technology (formerly Microsemi) A3PE3000L-1FGG484 is a low-power ProASIC3L flash-based FPGA with 3,000,000 system gates, 75,264 logic cells, and 341 user I/Os, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) with a 1 mm ball pitch and commercial 0C to +70C temperature rating. It operates from a 1.2 V to 1.5 V core voltage with speed grade -1. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that implements custom digital logic through configurable logic blocks, routing fabric, and I/O cells. Unlike SRAM FPGAs, flash-based FPGAs such as the ProASIC3L family store their configuration in nonvolatile flash, making them single-chip, Instant-On solutions that need no external boot flash and are inherently more secure against bitstream interception. Key features include up to 504 kbits of true dual-port SRAM, up to 616 user I/Os across the family, and Flash*Freeze technology, which dramatically cuts dynamic and static power during idle periods without losing state. The 130-nm, 7-layer-metal (6 copper) flash CMOS process delivers a strong balance of density, performance, and low total cost of ownership. The ProASIC3L architecture provides live-at-power-up Level 0 support, enabling glueless integration in systems where the FPGA must be functional immediately at reset. Its reprogrammability supports in-field upgrades, while the single-chip design reduces BOM cost and board area compared to configuration-flash-based alternatives. Typical applications include industrial automation controllers, portable and battery-powered instrumentation, communications line cards, and medical diagnostic equipment where low standby power and instant-on behavior are required. A key design consideration: the 484-BGA requires careful PCB fanout and at minimum a 6-layer stack-up with dedicated power/ground planes; verify the 1 mm pitch footprint against the Microchip package drawing before layout release. This page synthesizes distributor availability data, drop-in alternatives within the ProASIC3/ProASIC3L family, and practical design notes not found in the manufacturer datasheet.

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A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484I

A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip

The Microchip Technology A3PE3000L-1FGG484I is a ProASIC3L low-power flash FPGA with 3 million system gates, 341 user I/Os, and 516096 bits of total RAM, housed in a 484-ball Fine-Pitch Ball Grid Array (484-FPBGA, 23x23 mm) package rated for -40C to +100C junction temperature operation. A Field Programmable Gate Array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks and programmable interconnects that designers configure after manufacturing. FPGAs sit within the broader programmable logic hierarchy: FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. Unlike SRAM-based FPGAs, ProASIC3L devices use a flash-based fabric that is non-volatile, single-chip, and instantly-on at power-up with no external configuration device required. Key features of the A3PE3000L include a core supply range of 1.14V to 1.575V (1.2V nominal, up to 1.5V operation), FlashFreeze technology that dramatically reduces dynamic power by roughly 40% and static power by roughly 50% versus the standard ProASIC3 family, and reprogrammability supporting in-system updates. The low-power L variant targets battery-powered and thermally constrained systems where leakage and dynamic power dominate the power budget. Technically, the device is fabricated on a 130 nm flash process and belongs to the ProASIC3L family derived from Actel/Microsemi architecture. It integrates abundant advanced features such as embedded RAM blocks totaling 516096 bits and up to 341 user-accessible I/O pins, supporting both single-chip solutions and small-footprint designs with low total cost of ownership. Typical applications include portable and battery-operated instrumentation, industrial automation and control, communications line cards requiring power-gated standby modes, and medical monitoring equipment where the FlashFreeze mode preserves state while cutting power consumption. When designing with this device, verify core voltage sequencing and exploit FlashFreeze entry/exit timing in the power budget analysis; I/O bank voltage selection must match adjacent-board logic standards before PCB release. This page synthesizes distributor pricing, drop-in alternatives, design notes, and FAQ content not found in the manufacturer datasheet.

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A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip
A3PE3000L-1FGG484M

A3PE3000L-1FGG484M - ProASIC3L Flash FPGA 35K LEs | Microchip

The Microchip Technology (Microsemi/Actel) A3PE3000L-1FGG484M is a low-power ProASIC3L flash-based FPGA with approximately 3 million system gates (35K logic elements), 341 user I/Os, and 516096 bits (504 kbits) of true dual-port SRAM, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure to implement custom digital circuits. Within the programmable logic hierarchy, the ProASIC3L family sits in the low-power, mid-density class of flash FPGAs, distinct from SRAM-based FPGAs because configuration is stored in non-volatile on-chip flash, enabling single-chip, live-at-power-up operation without an external boot flash. Key features of the A3PE3000L include a 1.2 V core voltage (the L suffix denotes low-power operation), I/O operation as low as 1.2 V, and Microchip's Flash*Freeze technology, which the datasheet states reduces dynamic power by 40% and static power by 50% versus the equivalent ProASIC3 device. The device is fabricated on a 130-nm, 7-layer-metal (6 copper) flash-based CMOS process and is reprogrammable in-system. Architecturally, the ProASIC3L fabric consists of VersaTiles (logic modules), embedded SRAM blocks, and abundant routing resources, supporting system performance suited to glue logic consolidation, interface bridging, and control-path implementations. Level 0 support and true single-chip operation simplify board design and improve reliability versus multi-chip configuration schemes. Typical applications include industrial control and automation, portable and battery-powered instrumentation, aerospace/defense payloads requiring non-volatile, secure configuration, and communications line cards where the low static power of the flash fabric and the Flash*Freeze mode directly extend battery life or reduce thermal budget. A key design consideration: the -1 speed grade balances performance against the lowest dynamic power; verify I/O bank voltage assignment early since VCCI can be as low as 1.2 V per bank. Use Microchip Libero SoC design suite for synthesis and place-and-route. This page synthesizes distributor pricing and stock, drop-in alternatives within the same 484-BGA footprint, and practical design notes not found in the manufacturer datasheet alone.

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A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896

A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip

The Microchip Technology A3PE3000L-1FGG896 is a ProASIC3L low-power flash FPGA delivering 3 million system gates, 75,264 logic cells, and up to 620 user I/Os in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package with a 1.2 V core voltage and -1 speed grade. A field-programmable gate array (FPGA) is an integrated circuit that engineers configure after manufacturing to implement custom digital logic. Within the power-management hierarchy of programmable logic, the ProASIC3L family sits in Microchip's (formerly Microsemi/Actel) flash FPGA lineup, distinguished from SRAM FPGAs by its nonvolatile flash configuration cells, which eliminate the external boot flash and enable true single-chip operation with instant-on power-up. Key features of the A3PE3000L-1FGG896 include Flash*Freeze technology, which dramatically cuts dynamic and static power while retaining SRAM state and running I/Os; 1.2 V to 1.5 V core and I/O operation with I/O rails as low as 1.2 V; 130 nm flash process technology; and reprogrammability with secure, live-at-power-up configuration. Compared with the equivalent ProASIC3 device, the ProASIC3L reduces dynamic power by roughly 40% and static power by about 50%. Technically, the fabric is built from Versatile logic elements organized into 75,264 cells, supporting both sequential and combinational designs, with embedded memory blocks and high-performance I/O structures supporting multiple single-ended and differential standards. The -1 speed grade balances performance against power for mainstream designs; FPGAkey lists the family clock-related figure of 892.86 MHz for the underlying technology parameters. Typical applications include portable and battery-powered instrumentation, industrial control, medical monitoring equipment, communications line cards, and aerospace subsystems where single-chip, low-static-power programmable logic is required. A key design consideration is thermal and power budgeting: although the Flash*Freeze mode minimizes consumption, designers must still verify I/O bank voltage assignments and ensure adequate decoupling on the multiple VCC/VCCI rails. This page synthesizes distributor pricing, drop-in alternatives, comparison data, and practical design notes not found in the manufacturer datasheet, providing a complete sourcing and engineering reference.

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A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FGG896I

A3PE3000L-1FGG896I - 3M Gate Low-Power Flash FPGA | Microchip

The Microchip Technology A3PE3000L-1FGG896I is a ProASIC3L low-power flash-based FPGA delivering 3 million system gates, 504 kbits of true dual-port SRAM, and up to 620 user I/O in an 896-ball FBGA package rated for industrial operation from -40C to +85C. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. This places the ProASIC3L family in the power management-oriented branch of the FPGA taxonomy: unlike SRAM FPGAs, it is single-chip, Instant On at power-up, and inherently secure because the bitstream never leaves the device. Its hierarchy runs: A3PE3000L -> ProASIC3L family -> flash FPGA -> field-programmable gate array -> programmable logic device. Key features include 1.2 V to 1.5 V core voltage operation, Flash*Freeze technology that dramatically cuts dynamic and static power without losing register or SRAM state, six PLLs for clock management, and speed grade -1 performance up to approximately 272 MHz. The 130-nm, 7-layer metal (6 copper layers) flash-based CMOS process combines high logic density with live-at-power-up Level 0 support, eliminating the boot delay and configuration controller required by SRAM FPGAs. The low-power architecture makes this device well suited to battery-powered and thermally constrained systems. Flash*Freeze mode allows the fabric to be frozen in microseconds while I/O states are held, resuming full-speed operation just as quickly, which is valuable in duty-cycled instruments and portable data acquisition units. Typical applications include industrial automation controllers, portable medical and test instrumentation, aerospace and defense subsystems requiring secure single-chip configuration, and communication line-card glue logic. Designers should budget board space and stack-up for the 1 mm pitch 896-ball FBGA and verify power sequencing across the core and I/O banks; the industrial -40C to +85C rating of the I-suffix part must be observed in thermal analysis. This page synthesizes distributor availability data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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A3PE3000L-1FGG896M - 3M Gate ProASIC3L Low Power FPGA | Microchip
A3PE3000L-1FGG896M

A3PE3000L-1FGG896M - 3M Gate ProASIC3L Low Power FPGA | Microchip

The Microchip Technology (Microsemi) A3PE3000L-1FGG896M is a low-power ProASIC3L flash FPGA with 3 million system gates, 620 user I/Os, and 1.2 V to 1.5 V core operation, housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field. The ProASIC3L family sits within the broader hierarchy of flash-based FPGAs -> programmable logic devices -> programmable semiconductors. Unlike SRAM FPGAs, ProASIC3L devices use nonvolatile flash configuration cells, so they power up instantly without an external configuration PROM and offer inherently higher security against design theft. Key features include 40% lower dynamic power and 50% lower static power than the equivalent ProASIC3 device, the patented Flash*Freeze technology that freezes state while cutting core power during idle periods, and single-chip operation with no boot PROM. The 620 user I/Os support low-voltage operation down to 1.2 V, and the 130 nm flash process delivers a balance of density, performance, and low total cost of ownership. Architecturally, the device integrates versatile logic elements (approximately 35,000 LEs per the Mouser listing description), embedded SRAM blocks, and flash-based routing fabric. The Flash*Freeze pin allows the design to enter an ultra-low-power mode in microseconds while retaining SRAM and register state, an advantage over power-gating approaches that lose context. Typical applications include battery-powered portable instrumentation, industrial automation controllers, military and aerospace secure designs, and communications line cards where static power dominates the power budget. A key design consideration is power-supply sequencing across the 1.2 V, 1.5 V, and 2.5 V/3.3 V I/O rails, plus careful decoupling of the many BGA power balls; the Flash*Freeze entry/exit timing must also be validated in-system. This page synthesizes distributor pricing data, same-package drop-in ordering-code alternatives, and practical design notes not found in the manufacturer datasheet.

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A3PE3000L-1PQ208 - ProASIC3L Flash FPGA 208-PQFP | Microchip
A3PE3000L-1PQ208

A3PE3000L-1PQ208 - ProASIC3L Flash FPGA 208-PQFP | Microchip

The Microchip Technology (Microsemi) A3PE3000L-1PQ208 is a low-power ProASIC3L flash-based FPGA with approximately 3 million system gates (about 35,000 usable LEs), 147 user I/Os, and a 1.2V core voltage, housed in a 208-pin PQFP (BFQFP) package. A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. Within the programmable logic hierarchy, the A3PE3000L belongs to the ProASIC3L family (low-power branch of ProASIC3), which sits under the broader FPGA/PLD category and power-management-aware system-on-chip solutions. Because configuration is nonvolatile, the device is Instant On at power-up and requires no external boot flash. Key features include Flash*Freeze technology, which dramatically cuts dynamic power while retaining state, a single 1.2V to 1.5V core supply per the Microchip product page, 130nm flash process technology, and reprogrammability with secure single-chip operation. The verified distributor data reports a characteristic performance figure of 892.86 MHz for the family listing. Architecturally, the ProASIC3L fabric is built from VersaTiles, third-generation three-input LUT-equivalent logic cells that can also act as a D flip-flop or latch with enable, giving efficient mapping of sequential and combinational logic. The low-power flash approach removes the configuration element of SRAM FPGAs and reduces total cost of ownership in high-volume systems. Typical applications include portable and battery-powered industrial equipment, low-power embedded control and interface bridging, and space- or power-constrained communications hardware where 147 I/Os suffice. A key design consideration: the PQFP-208 package has larger lead inductance than ball-grid alternatives, so power-integrity and simultaneous-switching noise demand generous ground returns. This page synthesizes distributor listings, cross-reference data, and drop-in packaging-variant analysis not consolidated in the manufacturer datasheet.

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