A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
料号： A3PE3000L-1FGG484 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $172 | $1,720.00 |
| 100 | $158 | $15,800.00 |
| 500 | $146 | $73,000.00 |
| 1,000 | $134 | $134,000.00 |
A3PE3000L-1FGG484 概述
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that implements custom digital logic through configurable logic blocks, routing fabric, and I/O cells. Unlike SRAM FPGAs, flash-based FPGAs such as the ProASIC3L family store their configuration in nonvolatile flash, making them single-chip, Instant-On solutions that need no external boot flash and are inherently more secure against bitstream interception.
Key features include up to 504 kbits of true dual-port SRAM, up to 616 user I/Os across the family, and Flash*Freeze technology, which dramatically cuts dynamic and static power during idle periods without losing state. The 130-nm, 7-layer-metal (6 copper) flash CMOS process delivers a strong balance of density, performance, and low total cost of ownership.
The ProASIC3L architecture provides live-at-power-up Level 0 support, enabling glueless integration in systems where the FPGA must be functional immediately at reset. Its reprogrammability supports in-field upgrades, while the single-chip design reduces BOM cost and board area compared to configuration-flash-based alternatives.
Typical applications include industrial automation controllers, portable and battery-powered instrumentation, communications line cards, and medical diagnostic equipment where low standby power and instant-on behavior are required.
A key design consideration: the 484-BGA requires careful PCB fanout and at minimum a 6-layer stack-up with dedicated power/ground planes; verify the 1 mm pitch footprint against the Microchip package drawing before layout release.
This page synthesizes distributor availability data, drop-in alternatives within the ProASIC3/ProASIC3L family, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A3PE3000L-1FGG484 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE3000L-1FGG484 （相同外形与封装尺寸） ——差异在于 Package, Family, Process Technology, RoHS Status, System Gates.
快速对比工具——选择替代料号进行并排对比：
A3PE3000L-1FGG484I
✅ 直接替换✓ 有现货
$104.5 / 个
查看数据手册 →A3PE3000L-FGG484I
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A3PE3000L-FGG484
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A3PE3000L-1FGG484M
✅ 直接替换✓ 有现货
$117.6 / 个
查看数据手册 →A3PE3000-1FGG484I
✅ 直接替换✓ 有现货
$1336.6 / 个
查看数据手册 →A3PE3000L-1FGG484 最大额定值与电气特性
| Family | ProASIC3L |
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| User I/Os (this package) | 341 |
| Maximum User I/Os (family) | 616 |
| Embedded SRAM | Up to 504 kbits true dual-port |
| Core Voltage | 1.2 V to 1.5 V |
| Speed Grade | -1 |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration | Nonvolatile flash, Instant On, single chip |
| Low Power Feature | Flash*Freeze technology |
| 封装 | 484-ball FBGA (FG484), 23 x 23 mm, 1 mm pitch |
| 安装方式 | SMD/SMT |
| 工作温度 | 0C to +70C |
| Packaging | Tray |
| Power-Up Mode | Live at power-up (Level 0 support) |
A3PE3000L-1FGG484 484-ball fbga (fg484), 23 x 23 mm, 1 mm pitch 引脚配置指南
A3PE3000L-1FGG484（484-ball fbga (fg484), 23 x 23 mm, 1 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE3000L-1FGG484.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE3000L-1FGG484 适用于 6 应用s: Industrial Automation and Motor Control, Portable and Battery-Powered Instrumentation, Communications Line Cards and Network Interfaces, Medical Diagnostic Equipment, Defense and Aerospace Systems, Test and Measurement Systems.
Industrial Automation and Motor Control
In PLC I/O modules, motion controllers, and fieldbus interfaces, the A3PE3000L-1FGG484 provides 3M gates of glue logic, interface bridging, and custom counters/encoders in a single chip. Its nonvolatile flash configuration delivers Instant On behavior, so the FPGA is live at power-up Level 0 - critical when the controller must respond to safety interlocks immediately at reset without waiting for configuration boot. The 341 user I/Os in the FG484 package support multiple I/O standards for mixing 3.3 V legacy signals with lower-voltage interfaces. Flash*Freeze lets idle axes and communication ports drop to low static power during machine standby, reducing cabinet heat and energy use in continuously powered factory equipment.
推荐
Portable and Battery-Powered Instrumentation
Handheld test equipment, portable data loggers, and field analyzers benefit directly from the ProASIC3L low-power architecture. The 1.2 V to 1.5 V core minimizes dynamic energy, and Flash*Freeze technology suspends logic into a near-zero-power state while retaining all register and SRAM contents, resuming in microseconds when a trigger or user input occurs - eliminating the reconfiguration delay an SRAM FPGA would need. With 75,264 logic cells and 504 kbits of true dual-port SRAM, the device implements acquisition sequencers, display controllers, and protocol engines that would otherwise need an MCU plus an FPGA. Because configuration is on-chip, the BOM omits boot flash, saving board area and battery-draining boot current in compact enclosures.
推荐
Communications Line Cards and Network Interfaces
Line-card designs use the A3PE3000L-1FGG484 to implement framing, deskew, bus bridging, and backplane interface logic across the 341 available I/Os. The device's live-at-power-up flash configuration means the FPGA participates in backplane enumeration and reset handshaking immediately, without an external configuration controller. The -1 speed grade supports the moderate clock rates typical of framing and bridging functions; verify timing closure in Libero for your specific clock domain. Flash*Freeze can power down complete line-card FPGA fabric during low-traffic periods, reducing chassis thermal load. Its reprogrammable flash also enables in-field feature updates without reflow or device replacement, cutting service costs across deployed network equipment.
推荐
Medical Diagnostic Equipment
Benchtop analyzers, imaging front ends, and patient-interface modules require deterministic, instantly available control logic plus quiet, low-noise operation. The A3PE3000L-1FGG484 implements sensor-timing generators, detector interfaces, and USB/UART bridges with the 75,264-cell fabric and dual-port SRAM buffering. Nonvolatile configuration removes the boot delay and the configuration-bitstream security exposure inherent to SRAM FPGAs - relevant for protecting proprietary algorithmic IP in medical products. For equipment used in hospital environments with tight EMC budgets, the flash FPGA avoids configuration-device read activity during operation, reducing switching noise sources. Industrial-temperature variant A3PE3000L-1FGG484I should be selected where autoclave-adjacent or cold-chain conditions are expected.
推荐
Defense and Aerospace Systems
Microchip (Microsemi) ProASIC3 devices have a long heritage in defense programs because flash-based FPGAs are single-chip, nonvolatile, and resistant to configuration readback. The military-temperature sibling A3PE3000L-1FGG484M uses the identical die and FG484 footprint as this commercial part, allowing one PCB design to serve multiple program temperature classes. The 3M-gate density implements sensor processing, bus interfaces (MIL-STD-style protocols in fabric), and secure boot glue logic, while Instant On operation meets requirements for immediate function at power application. Microchip's longevity commitments on ProASIC3 support multi-year program lifecycles; confirm screening flow and documentation requirements directly with Microchip for program-specific qualification.
推荐
Test and Measurement Systems
Bench instruments, protocol analyzers, and automated test equipment use the A3PE3000L-1FGG484 as the timing and capture engine: pattern generators, edge detectors, trigger state machines, and bus exercisers built in the 75,264-cell fabric with dual-port SRAM capture buffers. Flash*Freeze allows the instrument to hold a triggered state indefinitely at negligible power, and Instant On means the instrument is ready as soon as mains power is applied - no configuration countdown. The 341 I/Os connect to front-end level shifters across mixed-voltage DUT interfaces. Because the design flow is entirely in Libero SoC, firmware revisions ship as flash updates in the field, letting one hardware platform serve multiple instrument models.
推荐
推荐产品汇总
工程参考数据： A3PE3000L-1FGG484 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3PE3000L-1FGG484I | A3PE3000L-FGG484I | A3PE3000L-FGG484 | A3PE3000L-1FGG484M | A3PE3000-1FGG484 |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (FG484) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 341 | 341 | 341 | 341 | 341 | 341 |
| Speed Grade | -1 | -1 | standard (faster) | standard (faster) | -1 | -1 |
| Flash*Freeze Low Power | Yes | Yes | Yes | Yes | Yes | No (ProASIC3E) |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.5 V |
关键差异点
- Flash*Freeze near-zero-power idle state （对比 A3PE3000-1FGG484)
- Single-chip nonvolatile configuration （对比 A3PE3000-1FGG484)
- Temperature-range migration without redesign （对比 A3PE3000L-1FGG484I)
- Lower cost than faster speed grades at relaxed timing （对比 A3PE3000L-FGG484)
设计说明
The 484-ball FBGA uses a 1 mm ball pitch on a 23 x 23 mm body. Plan a 6-layer or higher PCB stack-up with dedicated ground planes and via-in-pad or dog-bone fanout; typical escape routing uses 4-mil trace/space to escape two rows of balls. Verify the exact land-pattern dimensions against the FG484 mechanical drawing in datasheet DS50003268 before release, and place the 0.5 mm via-in-pad option only if your fabricator supports filled-and-capped microvias.
Supply the core from a regulated 1.2 V to 1.5 V rail and I/O banks per the selected I/O standards. Because configuration is nonvolatile, no configuration-power sequencing is required, but follow the datasheet power-supply ramp requirements. Estimated: use Microchip's ProASIC3L power calculator with your actual toggle rates; do not size regulators from worst-case family numbers alone, as flash FPGAs with Flash*Freeze can idle far below active current. Decouple each power pin pair with 0.1 uF plus bulk capacitance near the package.
Do not confuse part-number suffixes when procuring: the base A3PE3000L-1FGG484 is commercial grade (0C to +70C), the 'I' suffix is industrial (-40C to +100C), and the 'M' suffix is military-screened. Mixing grades on one board risks cold-start failures in unheated enclosures. Also remember the 'L' family includes Flash*Freeze: if your design was ported from ProASIC3E (non-L), the Flash*Freeze pin must be handled correctly or left deasserted, or the device may enter low-power state unexpectedly.
With 341 user I/Os at up to 3.3 V signaling, group banks by voltage standard and keep high-toggle-rate buses away from sensitive analog or clock inputs. Assign series termination on fast single-ended outputs leaving the package, and use Libero's I/O timing reports to confirm setup/hold at board level. For long backplane traces, simulate with IBIS models available from Microchip for the FG484 package before committing to a layout revision.
合规信息
Compliance data was not present in the provided web data. Xecor comparison data for the A3PE3000 series showed 'Rohs Code: Yes' for A3PE3000 parts, but this was not confirmed for the A3PE3000L-1FGG484 specifically; verify on the Microchip product page before procurement.
