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A3PE3000-1FGG484I - Flash FPGA, 3M Gates | Microchip Technology
A3PE3000-1FGG484I

A3PE3000-1FGG484I - Flash FPGA, 3M Gates | Microchip Technology

The Microchip Technology A3PE3000-1FGG484I is a ProASIC3E flash-based FPGA with 3,000,000 system gates, 35,000 logic elements, 504 Kbits of true dual-port SRAM, and 341 user I/O, delivered in a 484-ball FBGA package with 1.0 mm pitch. This industrial-temperature variant is a single-chip, reprogrammable logic device that powers up immediately from its nonvolatile flash configuration. A field-programmable gate array (FPGA) is a semiconductor device whose logic fabric is configured by the designer after manufacturing rather than being fixed at the foundry. FPGAs implement parallel hardware data paths using configurable logic blocks, embedded memory, and programmable routing. ProASIC3E belongs to the flash-based FPGA hypernym, which contrasts with SRAM-based FPGAs that require external configuration memory. Because the configuration is stored in flash cells, the A3PE3000-1FGG484I is live at power-up and offers higher security against readback, simplifying system design and reducing bill-of-materials cost. Key features include a 130-nm, seven-layer-metal (six copper) CMOS process, 1.5 V core supply, system performance up to 231 MHz, and up to 616 user I/O across the family. The 504 Kbit true dual-port SRAM supports simultaneous read/write for FIFOs and multi-clock domain buffering. Flash-based security features and the green FGG finish support lead-free assembly while making the configuration nonvolatile and more resistant to unauthorized readback. Architecturally, the device implements Microsemi/Microchip VersaTile logic elements surrounded by embedded SRAM blocks and programmable I/O. The flash switch fabric is configured in-system via JTAG using Microchip's FlashPro programmer. Since configuration memory is nonvolatile, no boot flash or FPGA configuration controller is required. The part also supports optional soft ARM processor cores for SoC-style designs, per the ProASIC3E datasheet description. Typical applications include industrial motor control, communications line cards, video capture/processing, medical equipment, automotive infotainment, and aerospace interfaces where low cost, low power, and secure flash configuration are needed. With 341 user I/O, it can interface to parallel ADC/DACs, SDRAM controllers, Ethernet PHYs, and custom backplanes. When designing, provide a clean 1.5 V core supply with adequate decoupling at the many VCC balls, and use Microchip Libero SoC software for timing closure and power estimation. For FGG484, thermal relief and ground plane design are important because the BGA has no exposed pad; route the 1.0 mm pitch with microvias or fine trace widths. This page combines distributor-verified pricing, drop-in FBGA-484 alternatives, package diagrams, and practical design notes not printed in the manufacturer datasheet, helping engineers make faster, more confident replacement and procurement decisions.

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A3PE3000-1FGG896 - ProASIC3E Flash FPGA 3M Gates 620 I/O | Microchip
A3PE3000-1FGG896

A3PE3000-1FGG896 - ProASIC3E Flash FPGA 3M Gates 620 I/O | Microchip

The Microchip Technology A3PE3000-1FGG896 is a ProASIC3E flash-based FPGA featuring 3,000,000 system gates, 75,264 logic cells, and 620 user I/Os, housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package at speed grade -1. A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. Within the programmable logic hierarchy, the A3PE3000-1FGG896 sits as a system-gate-class device under the broader FPGA and programmable logic category, part of Microchip (formerly Actel/Microsemi) ProASIC3E third-generation flash family that succeeded the ProASICPLUS family. Key features include single-chip, Instant-On operation enabled by nonvolatile flash technology, reprogrammability without external boot flash, low total cost of ownership (TOC), and ASIC-level unit cost at volume. The flash fabric removes the configuration-time and security concerns of SRAM FPGAs, since the bitstream is stored on-chip and does not need to be loaded at power-up. The ProASIC3E architecture provides high-performance logic fabric with embedded block memory for data buffering and system integration, supporting complex digital designs that previously required an ASIC or an SRAM FPGA plus configuration device. The 896-ball FGG package provides the highest I/O count option in the family, making the 620 available user I/Os suitable for wide bus interfaces and high-pin-count system interconnect. Typical applications include industrial automation and control, communications and networking equipment, medical instrumentation, aerospace and defense systems, and ASIC prototyping where the flash fabric's security and single-chip operation provide system-level benefits. A key design consideration is that the -1 speed grade is the slowest grade in the family; if timing closure is difficult, the -2 grade in the same 896-ball package (A3PE3000-2FGG896) is a same-footprint option. Verify I/O banking rules and power sequencing in the manufacturer datasheet before board layout. This page synthesizes distributor availability, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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A3PE3000-1FGG896I - ProASIC3E Flash FPGA 3M Gates | Microchip
A3PE3000-1FGG896I

A3PE3000-1FGG896I - ProASIC3E Flash FPGA 3M Gates | Microchip

The Microchip Technology A3PE3000-1FGG896I is a ProASIC3E flash-based FPGA delivering 3,000,000 system gates, 75,264 logic cells, 620 user I/Os, and 516,096 bits of embedded RAM, operating at up to 272 MHz from a 1.5 V core supply (1.425 V to 1.575 V) in an 896-ball Fine-Pitch Ball Grid Array (FBGA) package with industrial temperature grading. A flash-based FPGA is a field-programmable gate array whose configuration data is stored in on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, the A3PE3000-1FGG896I sits in the high-density tier of the ProASIC3E family, which belongs to the broader class of nonvolatile FPGAs and programmable system-on-chip platforms. Because the configuration is retained in flash, the device powers up instantly as a single-chip solution with no external boot device. Key differentiating features include low total cost of ownership through single-chip integration, reprogrammability in-system, support for high-performance system-level designs, and abundant advanced features beyond the earlier ProASICPLUS generation. The 620 I/O count and 516 Kbit RAM make it suited to wide-bus interfaces and data buffering. Architecturally, the device is built on a 130 nm CMOS flash process with a sea-of-modules fabric, distributed SRAM/FIFO blocks, and flexible I/O banking. The -1 speed grade supports core toggling rates up to 272 MHz, sufficient for pipelined DSP datapaths, protocol engines, and glueless processor interfacing. Typical applications include industrial automation controllers, communications and networking line cards, medical instrumentation, aerospace/defense systems requiring single-chip instant-on logic, and test equipment where 620 I/Os terminate backplanes and sensor arrays. A key design consideration: flash FPGAs trade some raw fabric speed versus the fastest SRAM FPGAs, so verify timing closure at 272 MHz with Microchip Libero SoC before committing the PCB. Plan power distribution for the 1.5 V core rail across the 896-ball array. This page synthesizes distributor pricing, same-footprint drop-in speed-grade and low-power alternatives, and practical design notes not found in the manufacturer datasheet.

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A3PE3000-1PQG208I - ProASIC3E FPGA 3M Gates | Microchip
A3PE3000-1PQG208I

A3PE3000-1PQG208I - ProASIC3E FPGA 3M Gates | Microchip

The Microchip Technology A3PE3000-1PQG208I is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) with 3 million system gates, 147 user I/Os, and 516,096 bits of true dual-port SRAM, housed in a 208-pin PQFP (BFQFP) package. It operates from a 1.5V core supply and supports a system performance of up to 272 MHz, making it a single-chip, live-at-power-up solution for mid-density logic integration. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without re-fabrication. The ProASIC3E family uses a flash-based configuration cell, which retains the design even when power is removed, eliminating the need for external boot memory and providing instant-on operation. This places the A3PE3000 within the hierarchy: FPGA -> flash FPGA -> ProASIC3E family -> mid-density programmable logic -> semiconductor. Key features include 3 million system gates, 147 user I/Os, 516,096 bits of true dual-port SRAM, and a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. The device supports live-at-power-up operation, meaning it is ready to function immediately upon power application, and offers Level 0 support for secure in-system programming. The 208-pin PQFP package provides a compact footprint for board-level integration while maintaining adequate I/O count for moderate complexity designs. Technically, the ProASIC3E architecture uses a VersaTile core that can be configured as either a three-input lookup table (LUT) or a D-flip-flop/latch with enable, enabling efficient use of the FPGA fabric. The flash-based configuration is non-volatile, providing inherent security against reverse engineering and eliminating the need for configuration PROMs. The device supports 1.5V core operation with 3.3V, 2.5V, and 1.8V I/O standards, offering flexibility in mixed-voltage systems. Typical applications include industrial control, communications infrastructure, automotive electronics, and aerospace systems where reliability, instant-on capability, and security are critical. The 147 user I/Os and 3M gates are well-suited for glue logic, bus interfacing, and moderate digital signal processing tasks. The flash-based architecture is particularly valuable in safety-critical applications requiring deterministic startup behavior. When designing with this device, ensure adequate decoupling on the 1.5V core supply and all I/O banks. The PQFP package requires careful thermal management; a thermal pad or airflow may be necessary for high-utilization designs. Refer to the ProASIC3E datasheet for specific power supply sequencing and programming voltage requirements. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3PE3000-1PQG208I in their designs.

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A3PE3000-2FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-2FG324

A3PE3000-2FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

The Microchip Technology (Microsemi) A3PE3000-2FG324 is a ProASIC3E flash-based FPGA with 3 million system gates (35,000 logic elements), 221 user I/Os, and a system performance rating of 310 MHz, fabricated on a 130 nm flash process and housed in a 324-ball FBGA package measuring 19 x 19 mm. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program to implement custom digital circuits. Unlike SRAM-based FPGAs, flash-based FPGAs such as the ProASIC3E family store their configuration in on-chip flash cells, giving them instant-on, single-chip operation without an external boot configuration device and inherent protection against bitstream readback. Key features of the A3PE3000-2FG324 include reprogrammable flash configuration, a 1.5 V core supply with a tolerance window of 1.425 V to 1.575 V, low total cost of ownership as an ASIC replacement, and support for soft-processor implementations including the 32-bit ARM Cortex-M1 on M1 ProASIC3 family variants. The 324-FBGA surface-mount package provides a compact footprint for space-constrained designs. Architecturally, the ProASIC3E fabric uses VersaTiles - fine-grained logic tiles based on a 130 nm flash switching element - delivering deterministic performance of up to 310 MHz system speed. Embedded block SRAM and abundant routing resources support data-path, communications, and control applications. Typical applications include consumer electronics, networking and communications equipment, computing platforms, industrial control, and avionics systems where a cost-effective ASIC replacement with reprogrammability is required. A key design consideration is the supply voltage tolerance: the 1.425 V to 1.575 V window demands a tightly regulated 1.5 V rail, and the 0 C to +85 C junction operating range should be verified against your thermal budget since this commercial-grade part is not automotive qualified. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, verified against distributor listings as of 2026-09-02.

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A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip
A3PE3000-2FG324I

A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

The Microchip Technology (Microsemi) A3PE3000-2FG324I is a ProASIC3E family flash-based FPGA with 3 million system gates, 35,000 logic elements (LEs), 221 user I/Os, and a system performance rating of 310 MHz, housed in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package and fabricated on a 130 nm flash process with a 1.5V core supply. A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external configuration ROM. In the programmable logic hierarchy - programmable logic device (PLD) to FPGA to system-on-chip - flash FPGAs occupy the single-chip niche: they power up instantly, require no boot device, and resist radiation-induced configuration upset better than SRAM FPGAs. Key features of the A3PE3000-2FG324I include single-chip operation with no external configuration memory, low total cost of ownership (TOC), reprogrammability, and industrial temperature operation from -40C to +85C. The speed grade 2 rating delivers up to 310 MHz system performance, and the 221 available I/Os support a broad set of single-ended and differential standards. Technically, the ProASIC3E fabric is built from versatile logic elements on Microsemi's (now Microchip's) 130 nm flash process. The non-volatile flash switch architecture eliminates configuration loading time, reduces bill-of-materials cost, and improves board-level security because the bitstream is never exposed on an external bus. Embedded block RAM, PLL support, and optional soft ARM Cortex-M1 capability (in related M1 ProASIC3 devices) make the family suitable for system-level integration. Typical applications include industrial automation controllers, aerospace and defense subsystems, medical instrumentation, and communications bridge logic, where instant-on operation, single-chip configuration, and long product lifecycle are essential requirements. When designing with this device, plan power distribution around the 1.5V core rail and verify I/O bank voltage assignments early in the pin-planning stage; Libero SoC design software provides pin-report checks before layout freeze. This page synthesizes distributor pricing, drop-in same-footprint alternatives across speed grades and temperature ranges, and practical design notes not found in the manufacturer datasheet.

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A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FG484

A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip

The Microchip (Microsemi/Actel) A3PE3000-2FG484 is a 3-million-gate ProASIC3E flash-based FPGA with 75,264 logic cells, 341 user I/Os, and 516,096 bits of embedded SRAM, housed in a 484-ball FBGA (FG484) package operating at a 1.5V core voltage on a 130nm flash process. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash cells rather than the SRAM-based configuration used by Xilinx and Altera devices. Within the programmable logic hierarchy, this makes the ProASIC3E a single-chip, instant-on solution: no external boot flash is required, the device is live at power-up, and no configuration bitstream is exposed, which inherently improves system security and simplifies board design. Key features include the ProASIC3E fabric's VersaTile architecture, where each tile can be configured as a 3-input LUT, a D-flip-flop, or memory, giving extremely flexible logic placement. The -2 speed grade supports system performance up to approximately 310 MHz, and the embedded 516 Kbit SRAM supports dual-port operation for FIFOs and buffering. Optional soft ARM support (via Cortex-M1 soft core licensing) allows a complete system-on-chip integration on one die. Technical depth: the 130nm flash CMOS process yields low static power compared to SRAM FPGAs, and non-volatile configuration eliminates configuration-time sequencing failures. The FG484 package (0.8mm... ball-pitch PBGA, square) is footprint-compatible with FG256 per the datasheet, easing migration paths. Typical applications include industrial automation controllers, medical instrumentation, communications line cards, and military/aerospace single-chip designs where instant-on and high security matter. Design consideration: the commercial-grade (no I suffix) device is rated 0C to +85C; for -40C to +100C use the A3PE3000-2FG484I industrial variant, which shares the same package footprint. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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A3PE3000-2FG484I - ProASIC3E FPGA 3M Gates | Microchip
A3PE3000-2FG484I

A3PE3000-2FG484I - ProASIC3E FPGA 3M Gates | Microchip

The Microchip Technology A3PE3000-2FG484I is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) offering 3 million system gates, 310 MHz system performance, and 516,096 bits of RAM, housed in a 484-pin FBGA package. It operates from a 1.5V core supply and provides 341 user I/Os, making it a high-density, low-power solution for a wide range of applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without costly mask revisions. The ProASIC3E family uses flash-based configuration cells, which are non-volatile, meaning the device retains its configuration when power is removed, eliminating the need for external boot memory and providing instant-on capability. This makes it a secure, single-chip solution in the programmable logic hierarchy, positioned between CPLDs and high-end SRAM-based FPGAs. Key features of the A3PE3000-2FG484I include 3 million system gates, 75,264 logic cells (CLBs), 516,096 bits of embedded RAM, and 341 user I/Os. It supports up to 310 MHz system performance and is fabricated in 130nm flash technology. The device includes advanced features such as programmable I/O standards, clock conditioning circuits (CCC/PLL), and an abundance of routing resources. Its flash-based architecture provides inherent security against reverse engineering and configuration bitstream interception, a critical advantage over SRAM-based FPGAs. Technically, the ProASIC3E family integrates a flash switch fabric that is programmed at the factory or in the field. The device supports multiple I/O standards including LVCMOS, LVTTL, PCI, and differential standards like LVDS and LVPECL. It includes up to 6 PLLs and 6 CCCs for clock management. The 130nm process technology balances performance and power, with a core voltage of 1.5V and low static power consumption. The 484-pin FBGA package (23x23 mm, 1.0 mm pitch) provides excellent thermal and electrical characteristics for high-density designs. Typical applications include industrial automation, communications infrastructure, medical imaging, aerospace and defense systems, and consumer electronics. The device is ideal for implementing glue logic, bus interfaces, protocol controllers, and DSP functions. Its non-volatile, secure configuration makes it suitable for applications requiring high reliability and anti-tamper features, such as encryption engines and secure boot controllers. When designing with this FPGA, consider the power supply decoupling: place 0.1uF and 10uF capacitors close to each VCC and GND pin to minimize noise. Also, use the dedicated programming pins (TCK, TMS, TDI, TDO) for in-system programming via JTAG. The device supports both JTAG and SPI flash programming, allowing flexible configuration updates. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3PE3000-2FG484I.

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A3PE3000-2FG896 - ProASIC3E FPGA, 3M Gates, 620 I/O | Microchip
A3PE3000-2FG896

A3PE3000-2FG896 - ProASIC3E FPGA, 3M Gates, 620 I/O | Microchip

The Microchip Technology A3PE3000-2FG896 is a ProASIC3E flash-based FPGA delivering 3 million system gates with 620 user I/Os in an 896-ball FBGA (FG896) package, operating from a 1.5 V core supply at speed grade -2 and supporting system frequencies up to 310 MHz on 130 nm flash technology. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash cells rather than volatile SRAM. This places the ProASIC3E family in the power-management-friendly middle of the programmable logic hierarchy: unlike SRAM FPGAs it needs no external configuration PROM, boots instantly at power-up, and offers inherently lower static power and higher SEU immunity, making it a single-chip solution for cost-sensitive and high-reliability designs. Key features include 516,096 bits of configuration capacity reported alongside 620 usable I/Os per DigiKey listing, reprogrammable flash fabric supporting secure in-system programming, and abundant advanced features noted by Microchip such as low total cost of ownership (TOC) and strong system performance. The non-volatile fabric eliminates the brown-out configuration risks typical of SRAM devices. Technically, the device is built on a 130 nm flash process with a 1.5 V core. The -2 speed grade balances performance and cost within the ProASIC3E family, which spans densities from 15K to 3M gates. I/O banks support a wide range of voltage-referenced standards, with one VREF pin required per minibank when using voltage-referenced I/O standards, per the ProASIC3E family datasheet (DS0098). Typical applications include industrial automation controllers, communications and networking line cards, aerospace and defense systems requiring instant-on operation, and medical equipment where configuration data must not be externally readable. Design consideration: confirm I/O bank voltage assignment early in PCB layout, since the 896-ball FBGA footprint fixes ball assignments and voltage-referenced standards require dedicated VREF pins per minibank. This page synthesizes distributor pricing, verified cross-references, and drop-in alternatives in the same FG896 footprint - information not consolidated in the manufacturer datasheet.

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A3PE3000-2FG896I - ProASIC3E FPGA 3M Gates 620 I/O | Microchip
A3PE3000-2FG896I

A3PE3000-2FG896I - ProASIC3E FPGA 3M Gates 620 I/O | Microchip

The Microchip Technology (formerly Actel/Microsemi) A3PE3000-2FG896I is a ProASIC3E flash-based FPGA with 3 million system gates, 75,264 logic cells, 516,096 bits of embedded RAM, and 620 user I/Os, housed in an 896-ball FBGA (31 x 31 mm, 1.0 mm ball pitch) package with an industrial temperature rating of -40C to +100C junction temperature. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration PROM. Within the programmable logic hierarchy - FPGA -> programmable logic device -> digital IC - flash FPGAs occupy a distinct niche: they power up instantly (single-chip solution), retain configuration through power cycles, and offer inherently higher security and lower static power than SRAM FPGAs, which must reload configuration from external memory at every boot. Key features of the A3PE3000 include its nonvolatile flash fabric on a 130nm process, single 1.5V core supply (1.425V to 1.575V operating range), speed grade -2 performance, and embedded SRAM blocks totaling 516,096 bits. Because configuration data lives in flash, no external boot device is required, reducing bill-of-materials cost and board area and improving resistance to bitstream interception - a frequent reason avionics and industrial designers choose ProASIC3E over SRAM-based rivals. Architecturally, the ProASIC3E fabric is built from VersaTiles (fine-grained logic modules) interconnected through a hierarchical routing structure, with embedded flash switches storing each routing configuration bit. The -2 speed grade supports system clock rates up to roughly 350 MHz per third-party listings, and the E variant adds embedded RAM blocks plus extensive I/O standards support for interfacing with memory buses and high-speed peripherals. Typical applications include avionics and military systems requiring secure, instant-on logic, industrial automation controllers, networking and communications line cards, medical equipment, and ASIC prototyping where the 3M-gate capacity accommodates substantial RTL designs. A critical design consideration: this specific ordering code is RoHS non-compliant (lead-bearing solder balls), so confirm regulatory requirements before design-in; the FGG (green) package variants are the RoHS-compliant equivalents in the same footprint. Verify supply voltage sequencing of the 1.5V core and 2.5V/3.3V I/O banks per the manufacturer datasheet. This page synthesizes distributor pricing tiers, drop-in alternatives within the ProASIC3E family, and practical design notes not consolidated in the manufacturer datasheet.

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A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-2FGG324

A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

The Microchip Technology (formerly Microsemi/Actel) A3PE3000-2FGG324 is a ProASIC3E family flash-based FPGA with 3 million system gates (approximately 75,264 logic cells), a maximum system performance of 310 MHz, fabricated on 130nm flash technology, operating from a 1.5V core supply, and housed in a 324-pin Fine-Pitch Ball Grid Array (FBGA) package measuring 19 x 19 mm with 1 mm ball pitch. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, memory blocks, and interconnects that designers program after manufacturing. Unlike SRAM-based FPGAs, the ProASIC3E family uses flash cells for configuration, meaning it is single-chip, instantly-on at power-up, and inherently secure against configuration bitstream copying because no external configuration flash is required. Key features of the A3PE3000-2FGG324 include reprogrammable flash fabric supporting live design updates, embedded variable-width SRAM blocks for FIFO and dual-port memory implementations, advanced I/O supporting multiple single-ended and differential standards, and low total cost of ownership through elimination of external boot memory. The ProASIC3E family combines high performance with ultra-low-density-class cost structure and small-footprint packaging options. Technically, the device uses Actel's third-generation flash architecture at 130nm, with speed grade 2 delivering up to 310 MHz system performance. The fabric includes PLLs for clock management, multiple embedded memory arrays totaling dedicated SRAM, and I/O banks that support LVDS-class differential signaling for high-speed board-level interfaces. Typical applications include industrial automation and control, military and aerospace systems requiring secure instant-on logic, communications infrastructure, test and measurement equipment, and medical instrumentation where single-chip reprogrammability, configuration security, and reliable power-up behavior are required. When designing with this device, plan power sequencing for the 1.5V core and auxiliary I/O rails, and verify I/O bank voltage compatibility with the board interface standards chosen. Because the fabric is flash-based, configuration corruption from cold-boot radiation or bitstream loss does not apply, simplifying system reliability analysis. This page synthesizes distributor pricing tiers, verified drop-in alternatives, and engineering design notes not consolidated in the manufacturer datasheet, aiding selection and shortage-risk mitigation.

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A3PE3000-2FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FGG324I

A3PE3000-2FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip

The Microchip (Microsemi/Actel) A3PE3000-2FGG324I is a ProASIC3E flash-based FPGA delivering 3 million system gates with 221 usable I/Os, 516 kbit of embedded flash memory, and system performance up to 272-310 MHz, housed in a 324-ball FBGA (FGG324, 19x19 mm) industrial-grade package rated from -40C to +100C junction temperature with a 1.5V core supply (1.425V to 1.575V). An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that implements digital logic through configurable logic blocks and programmable interconnect. The ProASIC3E family belongs to the flash-based FPGA category, distinct from SRAM FPGAs because configuration is stored in on-chip nonvolatile flash cells, removing the need for an external boot flash and improving single-chip security and instant-on behavior. Key features of the A3PE3000-2FGG324I include its flash-based single-chip architecture (low total cost of ownership, no configuration PROM), 221 user I/Os supporting single-ended and differential standards, embedded 516,096-bit flash memory, and reprogrammability with secure design storage. The -2 speed grade and industrial temperature range make it suitable for harsh-environment deployments. Technically, the device is fabricated in 130nm flash CMOS process technology with a 1.5V core. The ProASIC3E fabric combines VersaTiles (logic modules), embedded RAM blocks, and flash configuration cells, supporting the Cortex-M1 soft processor and typical FPGA design flows in Libero SoC. Typical applications include industrial automation and motor control, aerospace and defense subsystems, communications and networking line cards, and secure single-chip control logic where nonvolatile, tamper-resistant configuration is required. A key design consideration is power: the 1.425V-1.575V core rail must be tightly regulated, and the 324-ball BGA requires careful PCB fanout and a dedicated power/ground ball pattern for signal integrity. This page synthesizes verified distributor data, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet.

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A3PE3000-2FGG484 ProASIC3E FPGA 3M Gates FBGA | Microchip
A3PE3000-2FGG484

A3PE3000-2FGG484 ProASIC3E FPGA 3M Gates FBGA | Microchip

The Microchip Technology A3PE3000-2FGG484 is a ProASIC3E flash-based FPGA delivering 3 million system gates, 75,264 logic elements, and 341 user I/Os in a 484-ball FBGA package with 1.0 mm ball pitch. It operates with a 1.5 V core supply and supports system performance up to 310 MHz, providing a low-power, single-chip programmable logic solution for mid-density designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric can be reconfigured after manufacturing. Unlike SRAM-based FPGAs, the ProASIC3E family uses flash-based configuration cells, so the device is live at power-up and does not require an external boot memory. This makes it a member of the flash FPGA category, often considered when designers need instant-on, secure configuration, and lower system cost. Key features include 516,096 total RAM bits, 341 user I/O, a -2 speed grade, 130nm technology, and flash-based single-chip operation. The device supports multiple I/O standards and includes programmable phase-locked loops (PLLs) and embedded memories. The FGG suffix indicates a green, lead-free 484-ball FBGA package, meeting RoHS requirements for modern manufacturing. Architecturally, the A3PE3000-2FGG484 is built on Microchip's ProASIC3E flash FPGA fabric. Configuration data is stored in flash cells, providing inherent design security and instant-on capability. The device features 75,264 logic elements arranged as VersaTiles, and 516,096 bits of RAM. With a 1.5V core voltage and low static power, it fits power-sensitive applications where SRAM FPGAs would require configuration overhead. Typical applications include communications infrastructure, industrial automation, medical imaging, aerospace and defense systems, and broadcast video equipment. In these systems, the FPGA implements protocol bridging, DSP pre-processing, and system control functions. The 3M gate density and 341 I/Os allow designers to replace multiple discrete logic devices with a single programmable part. A key design consideration is power supply decoupling: place a 10uF bulk capacitor and multiple 0.1uF ceramics close to VCORE and VPLL pins. Because the FGG package uses a 1.0mm ball pitch, careful PCB breakout with micro-vias is recommended. Use thermal vias on the ground balls to improve heat transfer. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not all present in the manufacturer datasheet, giving engineers a faster path from selection to layout.

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A3PE3000-2FGG896 - 3M-Gate ProASIC3E Flash FPGA | Microchip
A3PE3000-2FGG896

A3PE3000-2FGG896 - 3M-Gate ProASIC3E Flash FPGA | Microchip

The Microchip Technology A3PE3000-2FGG896 is a ProASIC3E flash-based FPGA delivering 3,000,000 system gates with 620 user I/Os in an 896-ball Fine-Pitch Ball Grid Array (FBGA, 31x31 mm, 1.0 mm ball pitch) package. A flash-based FPGA stores its configuration in on-chip flash memory rather than SRAM, so the device configures instantly at power-up with no external boot PROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> semiconductor), flash FPGAs sit apart from SRAM FPGAs because they are single-chip, non-volatile, and inherently secure against bitstream interception - a key reason ProASIC3E is widely adopted as an ASIC replacement in avionics, networking, and industrial systems. Key features include a 1.5V core supply (1.425V to 1.575V operating range), support for optional soft ARM support per the ProASIC3E datasheet, and the speed-grade -2 performance bin. The device supports voltage-referenced I/O standards with one VREF pin assigned per I/O minibank. Architecturally, the ProASIC3E fabric uses VersTiles with abundant embedded SRAM and flash memory resources, fabricated in CMOS technology. Flash switching elements keep static power low and eliminate configuration time, giving deterministic single-chip startup that SRAM FPGAs cannot match without auxiliary configuration devices. Typical applications include avionics and defense systems requiring bitstream security, networking and communications line cards, industrial control backplanes, and consumer high-volume designs migrating from ASIC where NRE cost matters. A key design consideration: the FG256/FG484 packages are footprint-compatible, and the G suffix in FGG indicates RoHS-compliant construction, so footprint reuse across the ProASIC3E family simplifies migration between densities. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.

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A3PE3000-2FGG896I - 3M Gate ProASIC3E FPGA | Microchip
A3PE3000-2FGG896I

A3PE3000-2FGG896I - 3M Gate ProASIC3E FPGA | Microchip

The Microchip Technology A3PE3000-2FGG896I is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) with 3 million system gates, 620 user I/Os, and 516,096 bits of RAM, housed in a 896-ball FBGA (31x31 mm) package. It operates from a 1.5V core supply (1.425V to 1.575V) and supports industrial temperature range from -40°C to 100°C (TJ). An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs belong to the programmable logic device (PLD) family, which sits between ASICs and microprocessors in the digital design hierarchy. The ProASIC3E family uses flash-based configuration, meaning the device retains its programming without external boot memory, offering instant-on capability and enhanced security compared to SRAM-based FPGAs. Key features include 3 million system gates, 75,264 logic modules (VersaTiles), 620 user I/Os, and 516,096 bits of embedded RAM. The device supports system performance up to 310 MHz and is manufactured on a 130nm flash process. It offers low power consumption with a typical static power of 0.24W, making it suitable for power-sensitive applications. The flash-based architecture provides inherent security against reverse engineering and supports in-system programming (ISP) for field updates. The ProASIC3E architecture uses a proprietary VersaTile that can be configured as either a three-input lookup table (LUT) or a D-flip-flop/latch with enable, allowing efficient use of the FPGA fabric. This flexibility enables designers to implement both combinational and sequential logic efficiently. The device also includes dedicated phase-locked loops (PLLs) for clock management and supports various I/O standards including LVCMOS, LVTTL, PCI, and LVDS. Typical applications include industrial control systems, communications infrastructure, avionics, and consumer electronics. The flash-based nature makes it ideal for applications requiring secure boot, instant-on operation, and high reliability in harsh environments. The 896-ball FBGA package provides ample I/O for complex designs while maintaining a compact footprint. When designing with this device, consider the 1.5V core supply requirement and ensure adequate decoupling on all power pins. The device supports JTAG-based programming and can be configured via SPI or I2C interfaces. For high-speed designs, pay attention to the PLL configuration and I/O standard selection to meet timing requirements. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3PE3000-2FGG896I.

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A3PE3000-2PQG208 - ProASIC3E 3M-Gate Flash FPGA | Microchip
A3PE3000-2PQG208

A3PE3000-2PQG208 - ProASIC3E 3M-Gate Flash FPGA | Microchip

The Microsemi (now Microchip Technology) A3PE3000-2PQG208 is a ProASIC3E family flash-based FPGA delivering 3,000,000 system gates, 147 user I/Os, and 1.5V nominal core operation in a 208-pin fine-pitch BFQFP (PQG208, 0.5 mm pitch) gull-wing surface-mount package. The -2 speed grade supports system performance up to approximately 310 MHz. A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration PROM. In the programmable logic hierarchy (FPGA -> programmable logic device -> programmable semiconductor), flash FPGAs occupy a distinct niche: they are Instant On at power-up, single-chip (no boot device), inherently more secure against bitstream interception than SRAM FPGAs, and reprogrammable in-system. Key features include nonvolatile ProASIC3E flash architecture on a 130 nm CMOS process, 516096 bits of embedded resources per the device coding, and low total cost of ownership through elimination of external configuration memory. The ProASIC3E family is positioned by Microchip as a cost-effective ASIC replacement for consumer, networking/communications, computing, and avionics markets, offering ASIC-level unit cost with FPGA time-to-market benefits. Technically, the A3PE3000 fabric combines VersTile logic elements with embedded block RAM, supporting the high-performance 32-bit Cortex-M1 soft processor on M1 variants of the same family. The 1.5V core (1.425V to 1.575V range) with commercial 0C to +70C temperature grading suits cost-driven, thermally controlled environments. Typical applications include industrial control, communications line cards, avionics interface glue logic, and ASIC prototyping where single-chip instant-on configuration matters. Design consideration: the 208-pin QFP with 0.5 mm pitch requires careful PCB land-pattern design and a reflow-compatible GND/VCC decoupling strategy; do not confuse the commercial (no suffix) part with the industrial -I suffix variant. This page synthesizes distributor availability, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.

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A3PE3000-2PQG208I - 3M-Gate Flash FPGA, 147 I/O | Microchip
A3PE3000-2PQG208I

A3PE3000-2PQG208I - 3M-Gate Flash FPGA, 147 I/O | Microchip

The Microchip Technology (Microsemi) A3PE3000-2PQG208I is a ProASIC3E family flash-based FPGA delivering 3 million system gates, 147 user I/Os, and a maximum system performance of 310 MHz, housed in a 208-pin fine-pitch PQFP (208-BFQFP / PQG208) package with gull-wing leads and an industrial temperature rating of -40C to +85C. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program to implement custom digital circuits. Within the hierarchy of programmable logic, the A3PE3000 belongs to the flash-based FPGA class - distinct from SRAM FPGAs - because configuration data is stored in on-chip flash memory, giving it inherent single-chip, non-volatile, instant-on behavior without an external configuration PROM. Key features include a 1.5V core supply typical of 130nm CMOS process technology, live-at-power-up (LAPU) operation enabled by flash storage, and reprogrammability that lowers total cost of ownership by eliminating external boot devices. The ProASIC3E family is positioned by Microchip as a cost-effective ASIC replacement for consumer, networking/communications, computing, and avionics markets. Technically, the device uses Microsemi's proprietary flash switch technology combining a flash cell and routing switch in a single unit, which reduces area and improves security versus SRAM-based competitors. Speed grade -2 denotes the faster commercial speed bin, supporting system clock rates up to 310 MHz per distributor data. Embedded features include support for the Cortex-M1 soft processor in the related M1 ProASIC3 variants, plus on-chip PLLs and RAM blocks typical of the ProASIC3E architecture. Typical applications include industrial control and automation, networking and communications line cards, avionics glue logic and interface bridging, medical instrumentation, and secure single-chip ASIC prototyping where non-volatile, tamper-resistant configuration matters. When designing with this device, remember that the 208-pin PQFP has higher lead inductance than BGA alternatives such as the FGG484, which can limit very high-speed I/O signaling; verify signal-integrity margins for edges faster than approximately 500 ps. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, making it a one-stop reference for engineers evaluating the A3PE3000-2PQG208I.

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A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324

A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

The Microchip (Microsemi) A3PE3000-FG324 is a ProASIC3E family flash-based FPGA delivering 3 million system gates with up to 221 user I/Os in a 324-ball FBGA package operating from a 1.5V core supply at system performance up to 231 MHz on 130nm flash technology. A field-programmable gate array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs) and programmable interconnects that designers configure in the field after manufacturing. The ProASIC3E family sits within the broader hierarchy of programmable logic: FPGA -> programmable logic device -> digital logic IC -> semiconductor. Unlike SRAM-based FPGAs, ProASIC3E devices use flash cells for configuration, so they are single-chip, non-volatile solutions that boot instantly without an external configuration PROM. Key features include low total cost of ownership (TOC) through single-chip operation, in-system programmability (ISP), 128-bit AES decryption via JTAG (IEEE 1532-compliant), and FlashLock security designed to protect FPGA contents. The flash fabric also offers inherent resistance to configuration upset, important in avionics and industrial environments. Technically, the device provides 75,264 CLBs on a 130nm CMOS process, supporting high-performance 32-bit soft CPU implementations, and the ProASIC3E family adds embedded memory and enhanced I/O structures targeted at ASIC-replacement designs in consumer, networking/communications, computing, and avionics markets, per the Microchip ProASIC3E Flash Family FPGAs datasheet. Typical applications include ASIC replacement and prototyping, network and communications line cards, industrial control, and avionics subsystems where reprogrammability and single-chip boot matter. A key design consideration: the standard commercial grade A3PE3000-FG324 is listed by some datasheet aggregators as containing lead (RoHS non-compliant); the lead-free FGG variant (A3PE3000-FGG324) should be chosen where RoHS compliance is required. This page synthesizes distributor pricing, drop-in alternatives, FAQs, and design notes not found in the manufacturer datasheet.

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A3PE3000-FG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324I

A3PE3000-FG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip

The Microchip Technology A3PE3000-FG324I is a ProASIC3E family flash-based FPGA delivering approximately 3 million system gates (35K logic elements per distributor listings) with 221 user I/Os, 231 MHz system performance, and a 1.5V core, housed in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package with industrial temperature rating of -40C to +125C. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory cells rather than SRAM, so it powers up instantly without an external configuration PROM and is inherently single-chip. Within the programmable logic hierarchy, the A3PE3000 sits in the mid-density range of the ProASIC3/ProASIC3E family, which is part of the broader FPGA -> programmable logic -> semiconductor taxonomy from Microsemi (now Microchip Technology). Key features include nonvolatile flash programming that eliminates boot-time configuration and improves secure operation, support for high-performance 32-bit soft processors, low total cost of ownership through single-chip integration, and reprogrammability in-system. The 324-ball FBGA footprint with 221 available user I/Os provides substantial interface density for a mid-density device. Technically, the device is manufactured on a 130nm flash process operating from a 1.5V core supply. The ProASIC3E architecture combines VersTiles logic elements with embedded block RAM and abundant advanced features such as on-chip PLLs and I/O standards support for common single-ended and differential signaling, enabling glue logic consolidation, bus bridging, and control-plane designs. Typical applications include industrial automation control, communications and networking line cards, aerospace and defense subsystems requiring instant-on operation, and secure single-chip designs where external boot flash is undesirable. The industrial grade I suffix targets extended-temperature environments. When designing with this device, verify power sequencing and supply rail design against the manufacturer datasheet, and use Libero SoC design software for synthesis and place-and-route. This page synthesizes verified distributor data, drop-in alternatives from the same ProASIC3E family, and practical design guidance not consolidated on the manufacturer page.

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A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip
A3PE3000-FG484

A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip

The Microchip Technology A3PE3000-FG484 is a ProASIC3E family flash-based FPGA delivering 3 million system gates (75,264 cells) with 341 user I/Os in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package operating from a 1.5V core voltage at up to 231 MHz system performance. A flash-based FPGA stores its configuration in on-chip flash memory rather than the SRAM cells used by Xilinx and Intel (Altera) FPGAs. This means the A3PE3000-FG484 is a single-chip, non-volatile, instant-on solution: no external configuration PROM, no boot time, and inherent resistance to configuration readback attacks. Within the power-management hierarchy of programmable logic, flash FPGAs occupy the secure, low-total-cost-of-ownership niche between ASICs and SRAM FPGAs. Key features include reprogrammable flash fabric on a 130nm process, support for soft ARM processors via the CoreConsole/Libero design flow, single-chip operation that lowers bill-of-materials cost, and abundant advanced I/O standards including LVDS and LVPECL differential signaling. The FG484 package measures 23 x 23 mm with a 1.0 mm ball pitch and 2.23 mm height, and the FG256 and FG484 packages are footprint-compatible, providing an upgrade path within the family. Architecturally, the ProASIC3E fabric combines versatile logic elements, embedded block RAM, and flash configuration cells, with optional ARM soft-core support for embedded control applications. The fabric's non-volatile nature also reduces system power during standby because no configuration load cycle is needed at power-up. Typical applications include ASIC replacement in consumer electronics, networking and communications equipment, industrial computing, and avionics systems, where single-chip secure configuration and moderate gate density are valued. When designing with this part, budget for bank-based VCCI voltages: multiple I/O banks allow mixed-voltage signaling, but voltage-referenced standards require one VREF pin per minibank. This page synthesizes distributor pricing, drop-in alternatives across the ProASIC3/ProASIC3L families, and practical design notes not found in the manufacturer datasheet.

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A3PE3000-FG484I - ProASIC3E FPGA 35K LE 341 I/O | Microchip
A3PE3000-FG484I

A3PE3000-FG484I - ProASIC3E FPGA 35K LE 341 I/O | Microchip

The Microchip Technology (Microsemi) A3PE3000-FG484I is a ProASIC3E flash-based FPGA with 3 million system gates, 35K logic elements (LEs), 341 user I/Os, and 504 Kbit (516096-bit) fabric RAM, housed in a 484-ball Fine-pitch Ball Grid Array (FBGA) package rated for -40C to +100C junction temperature. An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that implements digital logic through configurable logic blocks and programmable interconnect. Within the power-management hierarchy of a system, the ProASIC3E family occupies the mid-density, nonvolatile flash FPGA tier: it sits between CPLDs and high-end SRAM FPGAs, offering single-chip operation because configuration data is stored in on-chip flash rather than an external boot flash. Key features of the A3PE3000-FG484I include instant-on, single-chip operation enabled by the flash fabric, a 1.5V core supply (1.425V to 1.575V operating range), support for optional soft ARM processor integration, and high I/O count (341) suited to wide bus interfaces. The ProASIC3E fabric also integrates embedded memory blocks totaling 516096 bits plus 1 Kbit of flash-based uPROM for secure version storage. Technically, the device is built on a 130nm flash process with a system performance rating up to 231 MHz. Unlike SRAM FPGAs, no configuration PROM or power-up configuration sequence is required, improving board-level reliability and reducing bill-of-materials cost. Flash cells also resist single-event configuration upsets better than SRAM, which benefits industrial and communications equipment. Typical applications include industrial automation control, communications and networking line cards, medical instrumentation, and aerospace/defense payloads where instant-on and nonvolatile configuration matter. The 484-ball package balances I/O density with moderate thermal and assembly requirements. When designing with this FPGA, power the 1.5V core and I/O banks in the sequence specified by the manufacturer datasheet and decouple each bank with low-ESR ceramics; the FBGA package requires careful via fan-out planning in the PCB layout stage. This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a one-stop reference for procurement and engineering evaluation.

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A3PE3000-FG896 - ProASIC3E Flash FPGA 620 I/O | Microchip
A3PE3000-FG896

A3PE3000-FG896 - ProASIC3E Flash FPGA 620 I/O | Microchip

The Microchip Technology (Actel) A3PE3000-FG896 is a ProASIC3E flash-based FPGA with 3 million system gates, 620 user I/Os, and 231 MHz system performance, fabricated on a 130 nm flash process and housed in an 896-ball FBGA package with a 1.5 V core supply. A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory cells rather than in an external configuration ROM, as SRAM FPGAs require. Within the power-management hierarchy of programmable logic, flash FPGAs sit between one-time-programmable antifuse devices and reprogrammable SRAM devices, offering single-chip, instant-on behavior with reprogrammability. The ProASIC3E family extends the ProASIC3 architecture with embedded SRAM and PCIe-ready I/O for system-level integration. Key features of the A3PE3000-FG896 include non-volatile flash configuration enabling a true single-chip solution with no external boot device, 620 user I/Os supporting a broad range of voltage-referenced and single-ended standards, and embedded memory totaling 516096 bits for FIFOs and dual-port buffering. The VersaTile architecture allows each tile to function as a three-input LUT, a D flip-flop, or a latch with enable, maximizing fabric efficiency. Technically, the device uses Microchip's third-generation flash switch technology on a 130 nm process. The fabric achieves a typical system clock rate of 231 MHz, and VersaNet global networks distribute low-skew, high-fanout clocks and resets across the die. The 896-ball FBGA provides abundant I/O and power/ground balls for signal-integrity headroom in high-pin-count designs. Typical applications include industrial automation controllers, communications and networking line cards, medical instrumentation, aerospace/defense subsystems requiring instant-on logic, and test equipment, all of which benefit from the 3M-gate capacity and 620 I/O count. Designers should note the commercial 0 C to +70 C operating range of this FG896 speed-grade: industrial applications must select the FG896I variant instead. Voltage-referenced I/O standards require one VREF pin per minibank per the ProASIC3E datasheet. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, as of 2026-09-02.

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A3PE3000-FG896I - ProASIC3E FPGA, 3M Gates, 896-BGA | Microchip
A3PE3000-FG896I

A3PE3000-FG896I - ProASIC3E FPGA, 3M Gates, 896-BGA | Microchip

The Microchip Technology A3PE3000-FG896I is a ProASIC3E flash-based FPGA with 3 million system gates (35K logic elements per distributor listings), 620 user I/Os, and a maximum system performance of 231 MHz, housed in an 896-ball Fine-Pitch Ball Grid Array (FBGA/896-BGA) package measuring 31x31x2.44 mm, qualified for the industrial temperature range. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field, sitting in the system hierarchy between fixed-function ASICs and general-purpose processors. The ProASIC3E family belongs to the flash-based FPGA category: unlike SRAM FPGAs, it stores its configuration in nonvolatile flash, so the device is single-chip, Instant On, and inherently more secure because no external configuration bitstream is exposed at power-up. Key features include nonvolatile flash programming that eliminates the boot PROM and configuration controller, a 1.5V core supply, 130 nm flash process technology, reprogrammability for design iteration, and abundant advanced features such as clock conditioning circuits and embedded block support. The 620 available user I/Os make the FG896 package well suited to wide-bus, high-pin-count designs such as backplane interfaces and memory controllers. Technically, the ProASIC3E fabric uses a sea-of-gates architecture of VersaTiles built on Actel/Microchip's third-generation flash FPGA technology, delivering ASIC-replacement logic density at near-ASIC unit cost. The high-performance fabric supports system speeds up to 231 MHz, adequate for communications, avionics, and computing glue-logic consolidation. Typical applications include networking and communications equipment, industrial automation, avionics subsystems, and secure single-chip ASIC replacement in consumer and computing platforms. Design consideration: budget the 1.5V core rail with adequate decoupling and plan ball-out fanout early, since the 896-ball array requires careful PCB escape routing. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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A3PE3000-FGG324 - ProASIC3E FPGA 3M Gates 221 I/O | Microchip
A3PE3000-FGG324

A3PE3000-FGG324 - ProASIC3E FPGA 3M Gates 221 I/O | Microchip

The Microchip Technology (formerly Microsemi/Actel) A3PE3000-FGG324 is a flash-based ProASIC3E family FPGA with 3 million system gates, 221 user I/O, and a core supply voltage of 1.425V to 1.575V, housed in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package measuring 19 x 19 mm with 1.0 mm ball pitch. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that implements user-defined digital logic through a fabric of configurable logic blocks, routing resources, and I/O cells. Within the programmable logic hierarchy, the FPGA sits at the top of the density range, above CPLDs and SPLDs, and serves as an ASIC replacement or prototyping platform in system-on-chip and embedded designs. The ProASIC3E distinguishes itself from SRAM-based FPGAs by using nonvolatile flash cells to store the configuration, requiring no external boot PROM. Key features include flash-based nonvolatile configuration (instant-on, single-chip solution), 130 nm flash process technology, system performance up to approximately 231 MHz as cited in cross-reference data, 516096 bits of embedded flash resources per distributor listings, and optional support for soft ARM processors, enabling low total cost of ownership (TOC) with reprogrammability. Technically, the ProASIC3E fabric uses a sea-of-gates architecture of versatile logic elements, supported by embedded SRAM blocks and phase-locked loops for clock management. Because configuration is stored in flash, the device is secure against bitstream capture and immune to configuration volatility at power-off, a differentiator versus SRAM FPGAs. Typical applications include industrial automation controllers, networking and communications equipment, computing platforms, avionics systems, and consumer electronics, where the ProASIC3E family is positioned by Microchip as a cost-effective ASIC replacement. Design consideration: the 1.5V core rail must be held within the tight 1.425V to 1.575V window; use a dedicated LDO or buck regulator with adequate decoupling near the ball field. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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