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EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N

EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel

The Intel (formerly Altera) EP3SE260F1152C3N is a high-density, high-performance Stratix III E Field Programmable Gate Array (FPGA) housed in a 1152-ball FineLine Ball-Grid Array (FBGA, FCBGA) package. According to the verified distributor data, it integrates 255,000 logic elements (LEs) supported by 16,672,768 bits of embedded memory, providing 10,200 logic array blocks (LABs) and 744 user I/O pins. The die is fabricated on a 65 nm low-power process, operating from a 1.1 V core supply and consuming the lowest static power of any high-performance 65 nm FPGA family in its class. What is an FPGA? A Field Programmable Gate Array is a reprogrammable semiconductor device that uses a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers connected via programmable routing. FPGAs occupy the middle ground between fixed-function ASICs (Application-Specific Integrated Circuits) and software-driven microcontrollers: like ASICs, they implement parallel hardware logic at clock-edge speeds, but unlike ASICs they can be re-programmed in-circuit. Stratix III E specifically targets high-end applications that demand both massive logic capacity and low dynamic power, with dedicated DSP blocks, embedded multiplier/accumulator hardware, and a programmable power technology that reduces dynamic power by up to 50% versus the prior Stratix II generation. Key features of the EP3SE260F1152C3N include the Programmable Power Technology (reducing dynamic power by up to 50%), dedicated DSP blocks for high-speed multiply-accumulate operations, embedded TriMatrix memory supporting true dual-port RAM, FIFO, and ROM, up to 12 embedded transceiver blocks, and support for external memory interfaces including DDR3, DDR2, QDR II+, and RLDRAM II. The 1152-FBGA package supports 744 user I/O pins with 8 to 12.5 Gbps transceiver capability, depending on transceiver configuration. The Stratix III E architecture integrates a hierarchical routing structure with MultiTrack interconnect, dedicated carry chains for arithmetic operations, and partial reconfiguration support that allows the device to reconfigure portions of its logic while the rest of the device remains operational. Memory protection and error correction code (ECC) on embedded memory blocks support high-reliability applications. Typical applications for the EP3SE260F1152C3N include high-performance digital signal processing, ASIC prototyping, communications infrastructure (baseband processing, radio card applications), high-speed data acquisition systems, video processing, military and aerospace signal processing, and high-end test and measurement equipment. Its combination of 255K logic elements, 16.7 Mbit embedded memory, and dedicated DSP blocks makes it suitable for computationally intensive tasks such as radar signal processing, software-defined radio, and high-throughput packet processing. When designing with this FPGA, ensure the PCB layout provides adequate power plane integrity and thermal management for the 1152-ball BGA. Quartus II design software is required for synthesis, place-and-route, and bitstream generation. Designers should consult the Stratix III Device Handbook for pin assignment, transceiver channel placement, and configuration scheme selection (AS, AP, PS, FPP, or JTAG). This page synthesizes distributor pricing from DigiKey, Mouser, and authorized Intel/Altera resellers, drop-in alternative MPNs sharing the same 1152-FBGA footprint, and practical design notes not found in the manufacturer datasheet alone.

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EP3SE260F1152C3NES - Stratix III E FPGA 255K LE 1152-FBGA | Altera
EP3SE260F1152C3NES

EP3SE260F1152C3NES - Stratix III E FPGA 255K LE 1152-FBGA | Altera

The Altera (Intel) EP3SE260F1152C3NES is a high-density Stratix III Enhanced family Field Programmable Gate Array (FPGA) built on a 65 nm process, delivering 255,000 logic elements, 744 user I/Os, and an operating frequency up to 500 MHz in a 1152-ball FineLine BGA (FBGA) package. Core voltage is 1.1 V and the device targets high-performance digital signal processing, ASIC prototyping, and high-bandwidth data-path applications. An FPGA (Field Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers interconnected by a programmable routing fabric. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> semiconductor ICs, and are widely used for parallel processing, hardware acceleration, and rapid prototyping where fixed-function ASICs are too costly or inflexible. Key features include 16,672,768 bits of embedded memory, 10,200 LABs (Logic Array Blocks), 768 18x18 multipliers, 12 PLLs, and 744 maximum user I/Os. The device integrates 4 hard memory controllers and 4 hard PCI Express hard IP blocks, with support for external memory interfaces including DDR3, DDR2, DDR, QDRII+, and RLDRAM2. Speed grade is -3 (faster), logic element count is 255,000, and the design is built on TSMC's 65 nm low-power process technology. Architecturally, the Stratix III E family adopts an adaptive logic module (ALM) based on an 8-input fracturable LUT, which improves logic packing density versus older 4-input LUT architectures. The transceiver subsystem is augmented with dedicated hard IP for PCIe Gen1/Gen2, making the device suitable for serial connectivity bridging. Multi-track routing and TriMatrix on-chip memory with error correction code (ECC) support ensure deterministic timing closure for high-performance designs. Typical applications include high-speed data acquisition, ASIC prototyping, software-defined radio (SDR), video processing pipelines, military/aerospace signal processing, and high-end communications infrastructure. The dense logic and high I/O count also suit multi-protocol bridging and high-speed serial backplane designs. When designing with this device, ensure proper power-decoupling network design with bulk, mid-frequency, and high-frequency ceramic capacitors, and pay close attention to the PCB BGA breakout routing. Signal integrity and controlled-impedance differential pairs are required for the high-speed transceivers. The Quartus II design toolchain is used for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, parametric alternatives, and practical design notes not found in the standalone Altera datasheet, providing engineers with a one-stop reference for sourcing and design-in decisions.

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EP3SE260F1152C4 - Stratix III E FPGA 255K LE 744 I/O FBGA | Intel
EP3SE260F1152C4

EP3SE260F1152C4 - Stratix III E FPGA 255K LE 744 I/O FBGA | Intel

The Intel (formerly Altera) EP3SE260F1152C4 is a high-density Stratix III E enhanced Field Programmable Gate Array delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 user I/O pins in a 1152-ball flip-chip BGA package. According to the Mouser listing, this device integrates 10,200 Logic Array Blocks (LABs) and is built on a TSMC 65nm process node operating at a 1.1V core. The C4 speed grade is the slowest commercial speed bin, optimized for low-power designs and ASIC prototyping rather than maximum throughput. What is a Stratix III FPGA? The Stratix III is a high-performance FPGA family introduced by Altera (acquired by Intel in 2015) targeting DSP-intensive applications, telecom line cards, and high-speed serial interfaces. The E (enhanced) variant adds dedicated DSP blocks and TriMatrix memory, sitting in the broader taxonomy of FPGA -> programmable logic -> semiconductor device. Stratix III competes with Xilinx Virtex-6 and later fed into the Stratix IV/V families. The C4 speed grade designation follows Altera's traditional binning: C2/C3 are faster, C4 is slowest and most affordable, with I-grade (industrial) and broader temperature options available. Key features include 384 (18x18) multipliers for high-throughput DSP, embedded transceiver logic for external PHY interfacing, and up to 744 user I/O supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 1152-pin FC-FBGA package exposes dedicated clock networks, PLL blocks, and global routing suitable for designs up to ~500 MHz internal operation. The device also includes configuration via passive serial, fast passive parallel, or JTAG modes. The 65nm CMOS process and 1.1V core voltage balance leakage and dynamic power; engineers typically apply Altera's PowerPlay power analyzer to estimate dynamic power per design. Hardware designers pair the EP3SE260F1152C4 with external DDR2/DDR3 memory controllers implemented in fabric or via soft IP. Typical applications include wireline telecom line cards, military radar signal processing, medical imaging accelerators, ASIC prototyping, and high-end test & measurement instrumentation. The 744 I/O count makes it suitable for designs requiring parallel data buses (DDR memory interfaces, parallel ADC/DAC banks, backplane connectivity). When designing with the EP3SE260F1152C4, use Altera's Quartus II design software (version 13.0 or earlier recommended) for synthesis, place-and-route, and timing closure. Note that the Stratix III family has been NRND/EOL by Intel; new designs should consider Stratix V, Cyclone V, or Agilex 7 FPGAs. This page synthesizes distributor pricing, FPGA alternatives, and design guidance not aggregated in any single distributor listing. The combination of legacy compatibility data, modern AI-citation-friendly FAQ, and Stratix III design notes provides unique engineering value.

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EP3SE260F1152C4L - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
EP3SE260F1152C4L

EP3SE260F1152C4L - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

The Intel (formerly Altera) EP3SE260F1152C4L is a high-density Stratix III E family Field Programmable Gate Array (FPGA) built on a 65 nm process node, delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 user I/O pins housed in a 1152-ball flip-chip BGA (FC-FBGA) package. The device operates from a 0.9 V core supply and supports commercial temperature grades (0C to +85C), with a transceiver-rich architecture suited to high-throughput parallel processing and memory-intensive designs. An FPGA (Field Programmable Gate Array) is a reprogrammable digital integrated circuit containing configurable logic blocks, programmable interconnect, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. Within the broader semiconductor taxonomy, an FPGA sits under programmable logic devices (PLDs) and above fixed-function ASICs in flexibility, making it ideal for prototyping, low-volume production, and applications requiring post-deployment in-field updates. The Stratix III E family specifically targets designers needing the lowest-power high-performance 65-nm FPGA fabric. Key features include 10,200 adaptive logic modules (ALMs), dedicated DSP blocks for high-speed arithmetic, embedded TriMatrix memory supporting up to 16.67 Mbits, and integrated high-speed transceivers. The device supports DDR2/DDR3 memory interfaces through dedicated hard memory controllers, accelerating memory-intensive workloads. Configuration is achieved via passive serial, fast passive parallel, or JTAG modes. Architecturally, the EP3SE260F1152C4L leverages 65 nm CMOS logic with adaptive logic modules that combine fracturable look-up tables, adders, and registers, allowing efficient implementation of arithmetic-intensive datapaths. The embedded transceivers deliver multi-gigabit serial connectivity, while the programmable power technology enables fine-grained control of static and dynamic power across operating regions. Typical applications include high-end ASIC prototyping, communications infrastructure (bridges, routers, baseband processing), high-performance digital signal processing, broadcast video and image processing, and military/aerospace systems. When designing with this device, plan thermal management around the FC-FBGA ball-grid footprint, use controlled-impedance PCB stackups for transceiver channels, and follow Altera's Quartus II power-aware synthesis flow to minimize dynamic power.

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EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
EP3SE260F1152C4LN

EP3SE260F1152C4LN - Stratix III E FPGA 255K LE 1152-FCBGA | Intel

The Intel (formerly Altera) EP3SE260F1152C4LN is a high-density Stratix III E Field Programmable Gate Array (FPGA) featuring 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 user I/Os in a 1152-ball Fine-pitch Chip-Scale Ball Grid Array (FC-BGA) package. Manufactured on a 65 nm CMOS process and fabricated on a 0.9 V core supply, it is built around an enhanced logic and DSP fabric operating up to 375 MHz core clock and 717 MHz transceiver data rate, with 10,200 Logic Array Blocks (LABs) for fine-grained logic implementation. A Field Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic elements (LEs), dedicated block RAM, DSP blocks, and high-speed transceivers, all wired through a programmable interconnect. The Stratix III E family specifically targets high-performance applications requiring high logic density, abundant DSP resources, and multi-gigabit serial I/O. FPGAs sit at the same hierarchy tier as ASICs in digital design, but unlike ASICs they are reconfigurable after manufacture, making them ideal for prototyping, low-volume production, and designs requiring late-stage logic changes. Key features of this device include 384 (24x16) embedded 18x18 multipliers supporting up to 136 GMACS DSP throughput, a hierarchical clock network with up to 16 global clocks, programmable power technology that reduces dynamic power by up to 50% versus Stratix II, and integrated PLLs with fractional-n synthesis. The high-pin-count FC-BGA-1152 package supports high-speed memory interfaces including DDR3 up to 800 MHz and RLDRAM II, making the device suitable for memory-intensive signal processing and data-path applications. Typical applications include high-end wireline telecom line cards, defense and radar signal processing, ASIC prototyping, high-performance DSP pipelines, and test and measurement backplanes. The C4 speed grade and 0°C to +85°C (commercial) operating range target mainstream embedded and communications designs. When designing with this device, pay close attention to power integrity: a Stratix III E at full utilization may dissipate more than 20 W and requires a multi-layer PCB with a low-impedance core/IO supply distribution network. Pin-compatible variants in this family include speed-grade and temperature-grade options that allow the same PCB to be populated for different deployment scenarios.

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EP3SE260F1152C4N - Stratix III E FPGA 255K LE FC-FBGA-1152 | Intel
EP3SE260F1152C4N

EP3SE260F1152C4N - Stratix III E FPGA 255K LE FC-FBGA-1152 | Intel

The Intel (formerly Altera) EP3SE260F1152C4N is a high-density Stratix III E family Field-Programmable Gate Array (FPGA) delivering 255,000 logic elements (LEs), 16,672,768 bits of embedded memory, and 744 maximum user I/Os in a 1152-ball flip-chip fine-pitch BGA (FC-FBGA) package. Built on a 65 nm process and operating from a 1.1 V core supply, it supports up to 450 MHz performance and is intended for high-end digital signal processing, ASIC prototyping, and high-throughput datapath designs. An FPGA is a semiconductor device built around an array of configurable logic blocks (LABs/CLBs), embedded memory blocks (M9K/M144K), DSP blocks, and programmable I/O elements, all interconnected through a programmable routing fabric. The Stratix III E family sits within the broader hierarchy: FPGA -> programmable logic -> ASIC-replacement silicon -> logic IC -> semiconductor. By integrating hard DSP, memory, and transceiver IP, modern FPGAs replace discrete processors, DSPs, and glue logic on a single programmable device. Key features of the EP3SE260F1152C4N include 10,200 LABs/CLBs, 768 embedded multipliers (18x18), and high-speed serial transceivers optimized for memory interfaces and parallel DSP pipelines. The device uses a fine-pitch FC-FBGA-1152 package with an exposed die-side thermal interface, allowing direct heatsink attachment for the 1.1 V / high-toggle-rate workloads typical of Stratix III designs. Speed grade -4 targets a balanced performance/power operating point suitable for commercial temperature designs. The architecture combines 65 nm low-power CMOS logic with on-die termination, dynamic reconfigurability, and dedicated DDR2/DDR3 memory PHY blocks. Designers can instantiate soft-core processors (NIOS II), hardware DSP pipelines, and high-speed memory controllers simultaneously, making the EP3SE260 one of the largest logic-capacity members of the Stratix III E generation before the family transition to the Stratix IV/Stratix V generations. Typical applications include ASIC prototyping and emulation, high-end digital signal processing, software-defined radio baseband, high-throughput video processing, and high-speed memory buffering. Designers choose this part when their design exceeds the logic, memory, and DSP density of smaller Cyclone III devices. When designing with the EP3SE260F1152C4N, pay close attention to PCB power integrity: the 1.1 V core rail and the multiple auxiliary rails require bulk decoupling placed adjacent to the BGA balls, plus a thermal solution that covers the FC-BGA lid. Speed grade -4 is the slower commercial-temperature grade; -3 is faster, and -2 is industrial temperature. This page synthesizes distributor pricing for the EP3SE260F1152C4N, same-family Stratix III E drop-in alternatives in the FC-FBGA-1152 footprint, and practical design notes not found in the manufacturer datasheet - making it easier to evaluate migration to EP3SE260F1152C3N, C2N, or the I-grade variants.

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EP3SE260F1152I3 - 255K LE Stratix III E FPGA, 1152-FBGA | Intel
EP3SE260F1152I3

EP3SE260F1152I3 - 255K LE Stratix III E FPGA, 1152-FBGA | Intel

The Intel (formerly Altera) EP3SE260F1152I3 is a high-density Stratix III E Field-Programmable Gate Array (FPGA) delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 user I/Os in a 1152-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. Built on a 65 nm process, the device operates from a 1.1 V core supply and is specified for the -40C to +100C industrial temperature range, making it suitable for high-performance signal processing and protocol bridging in thermally demanding environments. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, embedded memory, and hardened I/O serdes. The Stratix III generation (introduced by Altera in 2007, now under Intel) targets the lowest-power high-performance 65-nm tier, with the 'E' enhanced sub-family adding extra DSP and memory resources for DSP-intensive designs. FPGAs sit hierarchically under programmable logic -> logic devices -> integrated circuits -> semiconductors, and are commonly used as hardware accelerators, co-processors, or full system controllers alongside CPUs and ASICs. Key features of the EP3SE260F1152I3 include 10,200 LABs/CLBs, 255,000 logic elements, 16,672,768 bits (approximately 16.7 Mbit) of embedded RAM, 768 embedded multipliers for DSP operations, and a 500 MHz core fabric performance. The 1152-pin FC-FBGA package exposes 744 user I/O pins, supports high-speed LVDS, DDR2/DDR3 memory interfaces, and integrates up to 12 transceivers depending on the speed grade. The 'I' speed grade and '3' device identifier correspond to the industrial temperature range and a specific speed bin per the Stratix III nomenclature. The Stratix III architecture combines adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M9K, M144K), and DSP blocks with a hierarchical routing fabric. The 65-nm process node provides a balance between leakage and dynamic power, and Altera's Programmable Power Technology allows unused blocks to be powered down, enabling a 40% power reduction versus prior generations. Typical applications for this part include high-speed digital signal processing, telecommunications line cards, radar baseband processing, ASIC prototyping, broadcast video processing, and high-end test and measurement instrumentation. Engineers select EP3SE260F1152I3 when a design requires dense logic, large memory, and industrial temperature assurance in a single chip. Designers should note that the EP3SE260F1152I3 is a large, power-hungry part; PCB design must use a multi-layer stackup with extensive power and ground planes to maintain signal integrity across 744 I/Os at 500 MHz fabric speeds. Decoupling and thermal management are non-trivial; consult the Stratix III handbook for board design guidelines before committing the device to a layout. This page synthesizes distributor pricing, same-package alternative FPGAs, and practical board-design notes not collated in the manufacturer datasheet, helping engineers evaluate replacement and second-source options for this Stratix III E variant.

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EP3SE260F1152I3G - Stratix III E FPGA, 255K LE, 1152-FBGA | Intel
EP3SE260F1152I3G

EP3SE260F1152I3G - Stratix III E FPGA, 255K LE, 1152-FBGA | Intel

The Intel (formerly Altera) EP3SE260F1152I3G is a high-density Stratix III E Field-Programmable Gate Array (FPGA) delivering 255,000 logic elements and 16,672,640 bits of embedded memory in a 1152-ball FineLine BGA (FBGA) package. Operating across an industrial temperature range (-40C to +100C junction), this FPGA integrates up to 744 user I/O banks with 1.4 Gbps LVDS transceivers and supports multiple I/O standards including LVDS, LVPECL, HSTL, and SSTL. A Stratix III E FPGA belongs to the high-performance programmable logic family sitting between simple CPLDs and full ASICs in the semiconductor taxonomy. The Stratix III family is positioned for high-throughput DSP, parallel processing, and high-bandwidth connectivity applications where fixed-function ASICs are uneconomical. Architecturally, an FPGA is a two-dimensional array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric, augmented by embedded RAM blocks (M512/M4K/M-RAM), DSP blocks, PLLs, and dedicated transceiver circuits. This hierarchy makes FPGAs the lowest-risk platform for prototyping complex digital systems. Key features of the EP3SE260F1152I3G include a 40 nm process technology node, support for partial reconfiguration, 12.5 Gbps transceivers depending on speed grade, and an encrypted configuration bitstream using AES-256 to protect intellectual property. The industrial speed grade (I3) is optimized for power efficiency versus timing closure trade-offs, and the industrial temperature rating suits telecom, industrial automation, and defense prototypes. The device is part of a long-lifecycle Stratix family supported by the Quartus II / Quartus Prime design suite. Typical applications include high-end ASIC prototyping, 40G/100G telecom interface cards, military/aerospace signal processing, high-speed image processing pipelines, and large-scale DSP farms for radar or medical imaging. Because the Stratix III E family was launched circa 2009 and is past its mainstream run, the device is primarily used in fielded systems, military programs, and long-life industrial designs that require continued hardware availability with refreshed firmware. When designing with this device, ensure the Quartus II toolchain version supports the I3 speed grade and the 1152-FBGA package. PCB layout for a 1152-ball BGA demands microvia stack-up and controlled-impedance routing for high-speed I/O banks. Power sequencing must follow the Intel Stratix III handbook recommendations for VCCH, VCCP, and VCCIO rails; failure to sequence properly can cause long-term reliability degradation or POR failures. The configuration scheme (typically EPCS or EPCQ flash) must be sized for the full bitstream including any soft-IP cores. For full technical details refer to the Altera/Intel Stratix III Device Handbook. A free Quartus II Web Edition license can compile designs for this device with no purchase order required, making the EP3SE260F1152I3G an attractive entry point for engineering teams and educational institutions. This page synthesizes distributor availability, same-family alternatives, and design guidance not found in the manufacturer datasheet alone.

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EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel
EP3SE260F1152I3N

EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

The Intel (Altera) EP3SE260F1152I3N is a high-density Stratix III E Field-Programmable Gate Array (FPGA) featuring 255,000 logic elements, 16,672,768 embedded memory bits, and 744 maximum user I/Os, housed in a 1152-ball FC-FBGA package. Built on a 65 nm CMOS process, the device operates at a selectable core voltage of 0.9 V to 1.1 V with a maximum internal clock frequency of approximately 500 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing engineers to implement custom digital circuits after fabrication. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), above simple CPLDs (Complex Programmable Logic Devices) and below ASICs (Application-Specific Integrated Circuits) in terms of integration density. The Stratix III E family specifically targets high-performance DSP, memory-rich, and transceiver-equipped designs. Key features include 10,200 Logic Array Blocks (LABs), embedded memory blocks for high-bandwidth buffering, dedicated DSP blocks for fixed- and floating-point arithmetic, and selectable core voltage support (0.9 V/1.0 V/1.1 V) for power/performance trade-off. The device supports JTAG boundary-scan configuration, supports up to 744 user I/Os, and is rated industrial-grade (I3N suffix: -40 °C to +100 °C operating). Architecturally, the Stratix III E uses a tile-based logic structure, on-chip memory columns, and adaptive logic modules (ALMs) with 8-input fracturable look-up tables. Process technology is 65 nm CMOS, enabling high logic density at moderate static power versus 90 nm predecessors. Embedded transceivers and hard PCIe, memory controller, and DSP blocks allow designers to build high-throughput pipelines without soft IP overhead. Typical applications include high-end digital signal processing, ASIC prototyping, high-speed data acquisition front-ends, telecom baseband processing, and military/aerospace signal processing. The wide memory bandwidth also suits image processing and software-defined radio prototyping. When designing with this device, allocate sufficient PCB layers for power delivery and signal integrity—1152 balls require careful escape routing and a 12+ layer stack-up with buried vias. Use Intel Quartus II for synthesis, place-and-route, and timing closure; static timing analysis and signal integrity verification are mandatory at this density. This page synthesizes distributor pricing, drop-in same-package Stratix III E alternatives, and practical design notes not found in the manufacturer datasheet, providing engineering value beyond what is currently in public distributor listings.

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EP3SE260F1152I4 - Stratix III E FPGA, 255K LE, 1152-FCBGA | Altera
EP3SE260F1152I4

EP3SE260F1152I4 - Stratix III E FPGA, 255K LE, 1152-FCBGA | Altera

The Altera (Intel) EP3SE260F1152I4 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 255,000 logic elements, 16,672,704 bits of embedded memory, and 744 user I/O pins in a 1152-ball FineLine BGA (FCBGA) package. It belongs to the Stratix III Enhanced (E) sub-family, which targets high-performance logic, DSP, and memory-intensive applications such as wireline communications, ASIC prototyping, and high-end test equipment. What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure arbitrary digital logic circuits after manufacture. FPGAs sit within the broader taxonomy of integrated circuits: FPGA -> programmable logic -> logic IC -> semiconductor. Unlike ASICs, FPGAs are reconfigurable and offer parallel processing, making them ideal for compute-intensive or rapidly evolving designs. The Stratix III E family specifically uses a 40 nm process and was engineered for high-performance signal processing with a logic structure (LE), on-chip memory blocks (M9K/M144K), and DSP blocks (18x18 multipliers). Key features of the EP3SE260F1152I4 include 10,200 Logic Array Blocks (LABs), a maximum of 768 embedded 18x18 multipliers for DSP, integrated transceivers for high-speed serial I/O, and core voltage support of 1.1 V. The device supports configuration via passive serial, fast passive parallel, and JTAG modes. It is also notable for its hard PCI Express Gen1 endpoint blocks and support for external memory interfaces including DDR3, DDR2, and QDRII+. From a technical perspective, the Stratix III E architecture incorporates programmable power technology, allowing unused blocks to be powered down for reduced static consumption. The fabric is built around 8-input Adaptive Logic Modules (ALMs) with fracturable look-up tables. Configuration memory is SRAM-based, requiring a configuration device or memory controller for volatile configuration reload. Typical applications include ASIC prototyping and emulation, high-speed packet processing in networking line cards, video processing and broadcast equipment, high-performance computing accelerators, and software-defined radio (SDR) platforms. The 1152-ball FCBGA package supports dense board layouts but requires high-layer-count PCB fabrication. When designing with this part, plan for a multi-rail power solution (typically 1.1 V core, 2.5 V/3.0 V analog PLL, and 1.5 V/1.8 V/2.5 V/3.3 V I/O) and ensure the FCBGA thermal pad receives a full-array ground via farm. Stratix III E is in legacy lifecycle status, so engineers should verify the latest Intel FPGA product change notifications (PCNs) before committing to new designs.

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EP3SE260F1152I4L - 255K Logic Elements FPGA | Intel / Altera
EP3SE260F1152I4L

EP3SE260F1152I4L - 255K Logic Elements FPGA | Intel / Altera

The Intel / Altera EP3SE260F1152I4L is a high-density Stratix III E field-programmable gate array containing 255,000 logic elements, 10,200 LABs, and 744 I/Os in a 1152-pin FCBGA package. Verified listings identify 16,672,768 embedded memory bits and a 0.9 V core supply. The device belongs to the Stratix III Enhanced family and is fabricated on a 65 nm process, as reported by a dedicated part listing. A field-programmable gate array, or FPGA, is a programmable semiconductor containing configurable logic blocks, interconnect, memory blocks, and I/O resources. It occupies a position between fixed-function ASICs and discrete processor or logic systems: hardware functions can be changed after manufacturing without producing a new IC. Within the hierarchy, this FPGA is a programmable logic device, an integrated circuit, and ultimately a semiconductor used to implement digital acceleration, interface bridging, protocol handling, and embedded control. The headline capacity of 255,000 logic elements supports substantial parallel datapaths, while 16,672,768 embedded memory bits provide on-chip storage for buffers, lookup tables, packet data, and control structures. Its 744 I/Os support large systems requiring many external interfaces. The 1152-terminal FCBGA arrangement is intended for high-pin-count board designs, and a second verified listing describes the physical package as 1152-FBGA measuring 35 mm by 35 mm. Architecturally, the part is identified as a Stratix III E FPGA with 10,200 LABs and 65 nm technology. These features place it within a conventional SRAM-based FPGA generation where logic functions and routing are configured through programmable resources. The combination of capacity, embedded memory, and I/O count allows a system designer to consolidate control logic, data processing, and interface functions into one configurable platform. Typical uses include high-performance communications equipment, industrial automation, test and measurement, image or video processing, and protocol-oriented data acquisition. A 744-I/O budget can be valuable where an FPGA must aggregate many parallel channels or connect multiple downstream devices. The 0.9 V supply and 65 nm process are relevant to power-distribution design, configuration management, thermal analysis, and selection of compatible legacy development tools. Board design should follow the complete manufacturer pinout and the manufacturer's power-supply sequencing and decoupling guidance. Because this is a 1152-pin FCBGA component, controlled-impedance routing, complete ground-reference continuity, reliable power delivery, and appropriate thermal analysis are essential. Exact signal functions, package-ball names, timing limits, transceiver details, and configuration requirements remain datasheet-dependent. This page consolidates verified distributor specifications, current unit pricing, package details, datasheet access, and a conservative drop-in comparison. Where the available cross-reference data does not prove pin-to-pin compatibility, no unverified substitute is presented as a drop-in replacement.

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EP3SE260F1152I4LN - Stratix III E FPGA 255K LE FCBGA-1152 | Intel
EP3SE260F1152I4LN

EP3SE260F1152I4LN - Stratix III E FPGA 255K LE FCBGA-1152 | Intel

The Intel EP3SE260F1152I4LN is a high-density Stratix III E Field Programmable Gate Array (FPGA) built on a 65 nm CMOS process, offering 255,000 logic elements, 16,672,640 bits of embedded memory, and 744 user I/Os in a 1517-ball FCBGA-1152 (35x35 mm) package. It operates at a core voltage of 0.9 V (with a tolerated 1.05-1.15 V supply variant) and targets -40 C to +100 C industrial-grade ambient temperatures, making it suitable for harsh-environment systems. What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor in the programmable logic device (PLD) family, sitting between fixed-function ASICs and software-driven microcontrollers in the silicon hierarchy. Stratix III E specifically sits inside Intel's high-performance FPGA lineage (FPGA & CPLD -> programmable logic -> logic device -> semiconductor IC), delivering the highest logic density, highest DSP throughput, and lowest power consumption of any 65 nm FPGA family Intel ever shipped. Key features include 10,200 Logic Array Blocks (LABs), 768 embedded 18x18 multipliers, dedicated DSP blocks for high-speed signal processing, 12 transceiver channels supporting multi-gigabit serial protocols, and rich clocking with PLLs. Hard memory controller and PCIe IP hard cores accelerate memory and high-speed serial interfaces without consuming fabric logic. The architecture combines a fine-grained logic fabric with column- and row-based memory blocks, achieving deterministic timing closure for designs above 200 MHz. The 65 nm process node combined with programmable power technology (low-static-power devices) cuts dynamic power relative to Stratix II at equivalent performance. Typical applications include high-end telecommunications backhaul, military radar and electronic warfare, ASIC prototyping, high-frequency trading acceleration, and medical imaging pipelines. The package's high I/O count suits parallel memory interfaces and LVDS-heavy front-end electronics. Design considerations include power planning across 0.9 V core and 1.8 V/2.5 V/3.3 V I/O rails, mandatory heatsinking for sustained 717 MHz operation, and 12-layer PCB stack-up for BGA breakout. Use the Quartus II design suite for synthesis, place-and-route, and timing analysis. This page synthesizes distributor pricing, drop-in Stratix III E alternatives from the same family, and practical thermal/PCB guidance beyond the manufacturer datasheet.

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EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
EP3SE260F1152I4N

EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

The Intel (formerly Altera) EP3SE260F1152I4N is a high-performance, low-power Stratix III E family Field-Programmable Gate Array (FPGA) featuring 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 maximum user I/O pins, housed in a 1152-ball FineLine BGA (FCBGA) package. Operating from a 0.86V core supply with industrial temperature grade (-40C to +100C) and speed grade 4, the device integrates up to 10,200 Logic Array Blocks (LABs) and supports transceiver-rich system designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can customize via HDL (Hardware Description Language) bitstreams. FPGAs occupy the top tier of the digital semiconductor hierarchy: programmable logic -> reconfigurable computing -> parallel hardware accelerator. Compared to ASICs, FPGAs offer rapid time-to-market and in-system reprogrammability; compared to microcontrollers, FPGAs deliver hardware-level parallelism for DSP, packet processing, and high-speed I/O fan-out. Key features include 896 DSP blocks (18x18 multipliers), 48 transceivers operating up to 8.5 Gbps, support for external memory interfaces including DDR3, QDR II+, and RLDRAM II, and Altera's adaptive logic module (ALM) architecture that delivers up to 25% higher performance per logic element versus the prior Stratix II generation. The 1152-FCBGA package supports high-pin-count designs requiring maximum bandwidth. The EP3SE260F1152I4N utilizes TSMC's 40nm process with Altera's proprietary Programmable Power Technology, which dynamically reduces power consumption by up to 50% versus static FPGA implementations. The architecture includes hard PCI Express Gen2 endpoints, hard memory controllers, and partial reconfiguration support for designs that must modify logic blocks while the device is running. Typical applications include high-end telecommunication line cards, military radar signal processing, ASIC prototyping, software-defined radio (SDR) baseband, high-performance computing (HPC) acceleration, and broadcast video processing. The 744 I/O and 48 transceivers make it especially suitable for protocol-bridging and high-bandwidth data aggregation systems. When designing with this FPGA, ensure proper power sequencing for the 0.86V core, 1.1V/1.5V/2.5V/3.3V auxiliary rails, and the PLL analog supply. Use Altera's Quartus II design software (the legacy design suite for Stratix III) for synthesis, place-and-route, and timing closure. PCB layout must allocate sufficient decoupling capacitors and ground vias for the high-current transients typical of 8.5 Gbps transceivers. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III E family, cross-reference companion parts, and practical design considerations not consolidated in the manufacturer datasheet.

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EP3SE260F1517C2 - 260K LE Stratix III FPGA, 976 I/O, 1517-BGA | Altera
EP3SE260F1517C2

EP3SE260F1517C2 - 260K LE Stratix III FPGA, 976 I/O, 1517-BGA | Altera

The Altera EP3SE260F1517C2 is a high-density, low-power member of the Stratix® III E FPGA family, delivering 254,400 logic elements (LEs), 16,672,768 bits of embedded memory, and 976 user I/O pins in a 1517-ball Flip-Chip BGA (FCBGA) package. Manufactured on a TSMC 40 nm process, the Stratix III E series targets high-bandwidth ASIC prototyping, high-performance DSP, and high-speed serial connectivity designs where the larger 530K-LE Stratix IV family is over-specified. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing an array of configurable logic blocks (CLBs) surrounded by programmable routing, hard IP (memory controllers, transceivers, DSP blocks, PLLs), and I/O. The Stratix III E FPGA sits in the Altera high-performance hierarchy: Stratix series -> high-end FPGA -> programmable logic -> logic IC -> integrated circuit. Designers use FPGAs to implement complex parallel datapaths, custom interfaces, and ASIC prototypes without the NRE cost of custom silicon. Key features of the EP3SE260F1517C2 include 10200 Logic Array Blocks (LABs), up to 48 high-speed transceivers operating up to 6.375 Gbps, 384 multipliers (18x18), 12 PLLs, 4.6 Mb of distributed RAM plus 15.4 Mb of embedded block RAM, and support for external memory interfaces up to DDR3-800. The -C2 speed grade balances timing margin against FPU; the -I grade adds industrial temperature support. The architecture combines Adaptive Logic Modules (ALMs) that pack 8 inputs and 2 outputs into a single 56-bit register-rich block, plus dedicated hard IP for PCI Express Gen1/Gen2, 10G Ethernet MAC, and QDRII+/RLDRAM II controllers. Each transceiver channel includes signal-conditioning and dynamic reconfiguration blocks, allowing link-rate switching in the field without FPGA fabric intervention. Typical applications include wireline telecommunications backhaul (40G/100G line cards), ASIC prototyping for DSP and packet-processing designs, high-end medical imaging pipelines, military/aerospace signal processing, and high-frequency trading accelerators. The 976 user I/Os allow direct fan-out to multiple banks of external SRAM/QDR/DDR memory. When designing with this FPGA, plan power distribution first: Stratix III E devices can exceed 20W under full transceiver and logic utilization, so a multi-layer PCB with dedicated GND/power planes, decoupling capacitors every transceiver pin pair, and the Quartus II PowerPlay Power Analyzer is essential. Thermal management via heatsink or cold plate is typically required at full load; refer to the Altera AN 532 application note. This page synthesizes distributor pricing as of 2026-09-09, drop-in same-package alternatives from the Altera Stratix III E family, and practical PCB/thermal design notes not consolidated on the manufacturer datasheet alone.

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EP3SE260F1517C2G - 260K LE Stratix III FPGA | Altera | Intel
EP3SE260F1517C2G

EP3SE260F1517C2G - 260K LE Stratix III FPGA | Altera | Intel

The Altera (Intel) EP3SE260F1517C2G is a high-density Stratix III E family FPGA delivering 254,400 logic elements and 16,727,680 total memory bits in a 1517-ball FineLine BGA (FCBGA) package, with C2 speed grade and commercial (0C to 85C) temperature rating. Built on TSMC's 40nm process, the device combines 976 user I/O pins, 768 18x18 multipliers, and 16.67 Mbits of embedded RAM to address high-throughput DSP, ASIC prototyping, and high-speed serial link aggregation. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device whose fabric is composed of configurable logic blocks (CLBs), programmable routing, dedicated DSP blocks, on-chip memory, and increasingly integrated transceivers and hard processor cores. FPGAs sit between general-purpose processors (CPUs) and application-specific integrated circuits (ASICs) in the compute hierarchy: like a CPU they can be reprogrammed in the field, but like an ASIC they implement custom hardware parallelism measured in hundreds of GHz-equivalent multiply-accumulates. Stratix III is positioned in the high-performance tier, ahead of Cyclone III for cost-sensitive applications and behind Stratix IV/V for the highest-end designs. Key features of the EP3SE260 variant include eight fractional-phase PLLs, four clock multiplier PLLs, and clock networks with up to 220 MHz performance. The device supports external memory interfaces including DDR, DDR2, DDR3, QDR II, and RLDRAM II through dedicated PHY blocks. High-speed serial connectivity is provided through 12 transceiver channels up to 3.75 Gbps (C2 speed grade), supporting PCIe Gen1 x4/x8, Serial RapidIO, Gbps Ethernet, and basic mode (XAUI-ready). Typical applications include ASIC prototyping, high-definition video processing, software-defined radio, wireline telecom aggregation, military radar, and test and measurement instrumentation. The large logic capacity and embedded multiplier density make the EP3SE260 well suited to baseband processing and FFT acceleration at sample rates above 200 MHz. When designing with this device, plan power distribution carefully: the FCBGA package typically requires 16+ PCB power and ground plane layers and 4 to 6 voltage rails (VCC, VCCPD, VCCPGM, VCCA_PLL, VCCIO, VTT). Use the Quartus II PowerPlay early power estimator before schematic capture. The 1517-ball FCBGA demands precision assembly (1.0 mm ball pitch) and Xilinx/Intel-recommended PCB footprint with via-in-pad capability. This page synthesizes distributor stock data, package-level pin compatibility information, and FPGA-class design considerations into a single reference that complements (does not duplicate) the Altera/Intel Stratix III Device Handbook.

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EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel
EP3SE260F1517C2N

EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel

The Intel (Altera) EP3SE260F1517C2N is a high-density Stratix III E Field-Programmable Gate Array (FPGA) integrating 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/Os in a 1517-ball FC-BGA package. Built on TSMC's 65 nm low-power process, the device operates from a 1.1 V core supply and supports configuration via passive serial, fast passive parallel, JTAG, or Active Serial memory interfaces, with typical maximum core clock frequencies of 600 MHz. An FPGA (Field-Programmable Gate Array) is a reprogrammable logic device that combines configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit between general-purpose processors and ASICs in the semiconductor hierarchy, offering parallel processing capability, hardware-timed determinism, and post-production reconfigurability. Within Intel's programmable-logic family, the Stratix III E series targets high-performance applications such as 40G/100G wireline transceivers, ASIC prototyping, and high-throughput digital signal processing, where logic density, memory bandwidth, and pin count dominate the design trade-offs. Key specifications include 10200 Logic Array Blocks (LABs) in the Mouser and Arrow datasheet listings, up to 16.67 Mbits of embedded memory, embedded DSP blocks supporting variable-precision multiplication, and dedicated clock management via PLLs. The device integrates high-speed serial transceivers optimized for backplane and chip-to-chip links, and supports LVDS, LVTTL, LVCMOS, and SSTL I/O standards. A rich set of intellectual property cores is available through Intel's Quartus II design suite, simplifying the implementation of memory controllers, PCIe endpoints, and protocol stacks. Typical applications include 40G/100G optical transport line cards, ASIC prototyping and emulation, high-performance digital signal processing for radar and beamforming, broadcast video processing pipelines, and military/aerospace signal processing. Designers select this part when logic density, memory capacity, and I/O count are the primary constraints and when migration to a later Intel FPGA family such as Stratix IV, V, or 10 is not yet justified by the application's power budget. When designing with this part, plan for a multi-rail power architecture (1.1 V core, 2.5 V/3.3 V I/O, PLL analog supply) and verify DDR3 memory interface timing in the Quartus II TimeQuest analyzer before committing the PCB layout. Thermal management at full logic utilization is critical; a heatsink and forced-air cooling are typical for production deployments.

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EP3SE260F1517C3 - Stratix III E FPGA 255K LE | Intel | 1517-FBGA
EP3SE260F1517C3

EP3SE260F1517C3 - Stratix III E FPGA 255K LE | Intel | 1517-FBGA

The Intel (formerly Altera) EP3SE260F1517C3 is a high-density, high-performance Stratix III E Field Programmable Gate Array (FPGA) integrating 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/Os into a 1517-ball FineLine BGA (FBGA) package. It is fabricated on TSMC's 65 nm process and operates from a 0.9 V core supply, targeting bandwidth-hungry applications such as 40G/100G wireline transceivers, ASIC prototyping, broadcast video processing, and high-end DSP pipelines. What is a Stratix III E FPGA? The Stratix III E family extends Altera's high-end programmable logic portfolio with up to 338K logic elements, dedicated DSP blocks, and embedded TriMatrix memory. Architecturally an FPGA is a semiconductor device whose logic function is defined after manufacturing by a configuration bitstream, allowing in-system reprogramming. Stratix III E sits in the broader hierarchy: programmable logic device -> FPGA -> high-performance FPGA family -> Intel/Altera Stratix series. Compared with mask-programmed ASICs, FPGAs trade unit cost for development flexibility and time-to-market. Key features of the EP3SE260F1517C3 include 10,200 Logic Array Blocks (LABs), 768 18x18 multipliers (DSP blocks), and a maximum user I/O count of 976. The device supports high-speed external memory interfaces such as DDR3, DDR2, QDR II+, and RLDRAM II through dedicated PHY blocks, and integrates up to 12 phase-locked loops (PLLs) for clock management. Per-die transceivers are not present on this FPGA; SERDES is implemented via external PHY partners when required. Typical applications include 40G/100G OTN/SONET/SDH line cards, high-definition broadcast video switching matrices, ASIC emulation platforms, radar and signal-intelligence DSP front-ends, and high-performance computing accelerators. Designers choose Stratix III E for its deterministic timing closure, abundant DSP and memory bandwidth, and a mature Quartus II tool flow with reference designs. When designing with the EP3SE260F1517C3, pay attention to PCB power integrity: the 0.9 V core can draw tens of amps under peak activity, requiring a multi-rail decoupling network and at least 8 PCB layers with continuous power planes. The 1517-ball FBGA demands a 1.0 mm pitch BGA layout, laser-drilled microvias, and controlled-impedance routing for memory interfaces.

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EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel
EP3SE260F1517C3N

EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

The Intel (formerly Altera) EP3SE260F1517C3N is a high-density Stratix III E Field Programmable Gate Array with 254,400 logic elements, 16,672,768 bits of embedded memory, and 976 user I/Os, packaged in a 1517-ball FineLine BGA (FCBGA) for high-performance digital signal processing and ASIC prototyping. It is fabricated on a 65 nm TSMC low-power CMOS process and includes 816 (18x18) hardware multipliers and 1,040 M9K memory blocks for high-throughput DSP and on-chip buffering. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, DSP blocks, and Block RAM. FPGAs sit between microcontrollers and ASICs in the design hierarchy, offering parallel hardware execution with software-defined functionality. Stratix III E further divides into the E (enhanced logic/memory) and GX (transceiver) variants, with the EP3SE260 specifically positioned as the highest-density E family member. Key features include 24 transceivers at up to 600 Mbps (LVDS-style clock-data), 4 PLLs, 16 global clock networks, and support for external memory interfaces including DDR3, DDR2, QDRII+, and RLDRAM2 with dedicated PHY. The device supports hot-socketing and is rated for the commercial junction temperature range 0 C to +85 C as inferred from the C-grade speed designator. The EP3SE260 uses Altera's adaptive logic module (ALM) architecture with 8-input fracturable look-up tables, allowing any 6-input LUT function to be combined efficiently with two adjacent ALMs. Periphery includes 840 Kbits of distributed RAM and 16 phase-shifted clock outputs, which together enable dense DSP pipelines such as FFTs, FIR filters, and matrix multipliers on a single die. Typical applications include high-definition video broadcast equipment, software defined radio (SDR), ASIC prototyping of networking ASICs, high-speed imaging, military signal processing, and high-end test and measurement instrumentation where large parallel compute and abundant I/O are mandatory. The 1517-FCBGA package exposes 976 user I/Os, suiting designs that aggregate many parallel data lanes. Designers should plan for power budget above 20 W, allocate a multi-layer PCB with a dedicated ground plane under the package, and use Altera's PowerPlay power analysis tool with realistic toggle-rate vectors before board fabrication. Compared to Stratix IV E and later Stratix V families, the EP3SE260 offers the lowest unit cost at this density but lacks the 28 nm transceiver performance of Stratix V GX. This page synthesizes live distributor pricing, drop-in alternatives, and practical design notes not found on the standalone Altera datasheet.

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EP3SE260F1517C4 - Stratix III E FPGA 255K LE | Altera / Intel
EP3SE260F1517C4

EP3SE260F1517C4 - Stratix III E FPGA 255K LE | Altera / Intel

The Intel (formerly Altera) EP3SE260F1517C4 is a high-density Stratix® III E FPGA delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/O in a 1517-ball flip-chip BGA (FCBGA) package. Fabricated on a 40 nm low-power process, the EP3SE260F1517C4 integrates 10200 Adaptive Logic Modules (ALMs) and up to 768 embedded 18x18 multipliers, making it suitable for DSP-intensive designs. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard-IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit in the broader semiconductor hierarchy as application-specific integrated circuits (ASICs) of the reconfigurable kind, bridging the gap between general-purpose processors and fixed-function ASICs for high-throughput, parallel workloads such as signal processing, packet routing, and high-speed data acquisition. Key features of the EP3SE260F1517C4 include 976 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, PCI Express), and integrated PCI Express hard IP blocks. The Stratix III E family also includes up to 12 transceiver channels running at up to 6.375 Gbps, and dedicated DSP blocks that deliver up to 384 GMACs of DSP throughput. The device is offered in a -4 speed grade with commercial temperature rating. Architecture-wise, the EP3SE260F1517C4 uses a sea-of-LEs fabric with column-based embedded memory, MLAB blocks, and DSP blocks. Programmable Power Technology allows unused logic to power down, reducing static power. The fabric is paired with a dedicated configuration controller that supports passive serial, fast passive parallel, and JTAG configuration modes. Typical applications include high-end communications infrastructure (10G/40G Ethernet line cards, OTN framer/mapper, base-station PHYs), military and aerospace signal processing, high-performance test and measurement (oscilloscopes, protocol analyzers), medical imaging reconstruction ASIC prototyping, ASIC emulation, and high-frequency trading acceleration. The combination of 16.7 Mbits of embedded RAM and 768 multipliers enables complex multi-channel DSP pipelines. When designing with this device, plan the PCB with a minimum of 6 PCB layers and continuous GND/power planes beneath the 1517-ball FCBGA. Provide a fully-decoupled power distribution network (PDN) with high-frequency ceramic capacitors placed within 5 mm of each power pin, and ensure the JTAG chain is isolated from noisy switching nodes to maintain configuration integrity. This page synthesizes distributor pricing from Heisener and DigiKey, same-brand drop-in Stratix III E variants from the Site MPN list, and practical design notes not found in the manufacturer datasheet - giving procurement and engineering teams a single authoritative reference for the EP3SE260F1517C4.

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EP3SE260F1517C4L - Stratix III E FPGA, 255K LE, 1517-BGA | Altera
EP3SE260F1517C4L

EP3SE260F1517C4L - Stratix III E FPGA, 255K LE, 1517-BGA | Altera

The Altera (Intel) EP3SE260F1517C4L is a high-density Stratix III E Field Programmable Gate Array (FPGA) built on a 65nm process node, integrating 255,000 logic elements (LEs) into a 1517-ball FineLine BGA (FCBGA) package. The device delivers 16,672,768 bits of embedded memory and up to 976 user I/O pins, organized in 16 high-performance transceiver channels for serial connectivity up to 1.25 Gbps. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as DSP slices, block RAM, and PLLs. FPGAs sit hierarchically under programmable logic devices -> logic ICs -> integrated circuits. Unlike fixed-function ASICs, FPGAs are reconfigured in-circuit by the designer, making them ideal for prototyping, low-volume production, and applications requiring late-stage design changes. The Stratix III E family in particular targets high-performance digital signal processing, high-bandwidth I/O, and embedded processor subsystems. Key features of the EP3SE260F1517C4L include 384 (18x18) multipliers for DSP workloads, up to 15.04 Mbits of TriMatrix on-chip memory (split into MLAB, M9K, and M144K blocks), four PLLs per device quadrant, and eight fractional PLLs. Core voltage operates at 1.1V (per GlobalSpec), with I/O banks supporting multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, and HSTL. The device also features configuration via passive serial, fast passive parallel, and JTAG modes, plus dedicated hardware for PCI Express Gen1 endpoints. Typical applications span high-throughput digital signal processing, telecommunications baseband processing, high-speed serial protocol bridging, video broadcast equipment, and ASIC prototyping. The 1517-ball FCBGA exposes enough I/O for multi-channel DDR2/DDR3 memory interfaces and parallel RapidIO or LVDS data paths. Industrial-grade operating temperature range (0C to +85C) suits laboratory, telecom, and ruggedized computing applications rather than extended-temp automotive deployments. When designing with this device, allocate thermal budget carefully: at maximum toggle rates the 65nm Stratix III E draws substantial core current and benefits from forced-air cooling. PCB layout must route 1.1V core and 2.5V/3.3V auxiliary supplies with low-impedance planes and bulk decoupling within 100 mils of each supply pin to meet Intel/Altera PDN guidelines. Configuration storage (EPCS64 or similar) and a robust JTAG chain are required for field updates. This page synthesizes distributor pricing, same-brand Stratix III drop-in alternatives from the XAIPART site MPN list, and PCB design guidance not consolidated in the manufacturer datasheet.

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EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel
EP3SE260F1517C4LN

EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

The Intel (formerly Altera) EP3SE260F1517C4LN is a high-density Stratix III E family Field Programmable Gate Array (FPGA) integrating 255,000 logic elements, 16,672,768 memory bits, and 976 user I/Os in a 1517-ball flip-chip BGA (FC-FBGA) package. It is fabricated on a 65 nm process node, supports core operation at 0.9 V to 1.1 V, and is specified for commercial temperature-grade operation. The 'LN' suffix designates a lead-free, halogen-free industrial-grade variant. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic blocks, configurable interconnect, and dedicated memory/DSP blocks into a single die. FPGAs belong to the broader class of programmable logic devices (PLDs) and sit within the semiconductor hierarchy of integrated circuits (ICs) > logic ICs > programmable logic. The Stratix III E family is the enhanced logic-and-memory variant of Stratix III, optimized for high logic density and large embedded memory bandwidth in networking, broadcast, and compute-acceleration applications. Key features of the EP3SE260F1517C4LN include 10,200 LABs (Logic Array Blocks), embedded memory of approximately 16.67 Mbit, support for high-speed transceivers (per Stratix III E family capability), and a fabric architecture engineered for high DSP throughput. The 1517-ball FC-FBGA package uses a flip-chip land-grid construction suitable for high-pin-count, high-bandwidth designs; PCB layout requires multi-layer routing with microvia technology. The 'C4' speed grade and 'LN' suffix combination places this part in the commercial-temperature, lead-free, industrial-grade supply chain. Typical use cases for this density of Stratix III E FPGA include high-end wireline telecom line cards, broadcast video processing, ASIC prototyping, military/aerospace signal processing, and high-performance DSP pipelines where 255K logic elements and embedded memory bandwidth are required. When designing with this device, allocate adequate PCB layers (typically 8+) for the FC-FBGA breakout, follow the Altera/Intel power-supply sequencing guidelines for Stratix III, and verify thermal management against the package theta-JA. Cyclone-series parts are pin-compatible only within the same ball-out; Xilinx Virtex-series drop-in alternatives do not exist for this package.

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EP3SE260F1517C4N - Stratix III E FPGA 16.7M Gates 1517-BGA | Intel
EP3SE260F1517C4N

EP3SE260F1517C4N - Stratix III E FPGA 16.7M Gates 1517-BGA | Intel

The Intel (formerly Altera) EP3SE260F1517C4N is a high-density Stratix® III E Field-Programmable Gate Array (FPGA) IC delivering 255,000 logic elements and 16,672,768 bits of embedded memory in a 1517-ball FineLine BGA (FCBGA) package with 976 user I/Os. It is built on a 65 nm process with 0.9 V core VCC and supports up to 10,200 LABs (Logic Array Blocks) for high-performance DSP, memory-rich, and parallel-processing designs. What is an FPGA? A Field-Programmable Gate Array is a type of programmable logic device (PLD) - part of the semiconductor hierarchy of programmable logic -> logic IC -> integrated circuit. Unlike fixed-function ASICs, an FPGA contains an array of configurable logic blocks (CLBs/LABs), routing interconnect, embedded memory blocks, DSP blocks, and high-speed transceivers that the engineer can program after manufacturing using a hardware description language (HDL) such as VHDL or Verilog. FPGAs are widely used for prototyping, low-volume production, and applications that demand hardware-level parallelism. Key features of the EP3SE260F1517C4N include 976 maximum user I/Os, 16,672,768 embedded memory bits, 255,000 logic elements, and up to 10,200 LABs. The 1517-FCBGA package supports high I/O density and signal-integrity routing for multi-gigabit transceivers and external memory interfaces such as DDR3/QDRII+. The Stratix III E family uses a low-power 65 nm process with programmable power technology, allowing unused logic and routing to be powered down. The device supports up to 12.5 Gbps transceivers and up to 800 MHz on-chip memory, making it suitable for high-bandwidth applications such as wireline communications, ASIC prototyping, and high-end test-and-measurement. Typical applications include ASIC prototyping and emulation, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, SFI-5.1), broadcast video processing, military/aerospace signal processing, and high-performance DSP for radar or medical imaging. Its 976 user I/Os and large memory footprint also fit telecom line-card designs. When designing with this FPGA, plan power delivery carefully: the device requires multiple voltage rails (0.9 V core, 1.1 V/1.2 V/1.5 V/2.5 V/3.3 V I/O and transceiver supplies) with strict decoupling and sequence requirements. Use the Quartus II design software for HDL synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical notes not found in the manufacturer datasheet.

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EP3SE260F1517I3 - 255K LE Stratix III FPGA, 976 I/O | Intel
EP3SE260F1517I3

EP3SE260F1517I3 - 255K LE Stratix III FPGA, 976 I/O | Intel

The Intel (formerly Altera) EP3SE260F1517I3 is a high-density Stratix III E family Field Programmable Gate Array (FPGA) delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and 976 user I/Os in a 1517-ball FineLine BGA (FCBGA) package with industrial temperature grade. Built on a 65 nm CMOS technology node, this device integrates 10,200 LABs (Logic Array Blocks) and supports transceiver-rich DSP and memory-intensive designs. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement arbitrary digital logic functions through a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs occupy the middle ground between ASICs (Application-Specific Integrated Circuits) and general-purpose processors: unlike ASICs they are reconfigurable after manufacture, but unlike microcontrollers they execute logic in dedicated parallel hardware rather than via sequential software. Stratix III E devices specifically target high-performance digital signal processing, high-speed serial connectivity, and embedded memory applications in communications infrastructure, broadcast video, and military systems. Key differentiating features of the EP3SE260F1517I3 include 255,000 logic elements (the largest Stratix III E density), 16.67 Mbits of embedded RAM (M9K + MLAB blocks), up to 717 MHz core fabric performance, and a 1.0 V core supply with multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The industrial temperature grade (-40C to +100C ambient, with 125C junction capability) makes the part suitable for thermally demanding applications. The device is implemented on TSMC's 65 nm process node with a 12-layer metal stack optimized for signal integrity and power. Internal voltage scaling, programmable power technology, and fine-grained clock gating reduce dynamic power by up to 50% compared to Stratix II at equivalent performance, while the dedicated MLAB (memory logic array block) architecture allows each LAB to be configured either as logic or as distributed memory. Typical applications for the EP3SE260F1517I3 include high-end telecommunications base stations, ASIC prototyping and emulation, high-definition video broadcast encoders, medical imaging accelerators, military signal intelligence platforms, and high-performance computing nodes. The 976 user I/Os in a 1517-ball FCBGA make it well suited to designs that need to break out many parallel interfaces or multiple high-speed serial links. Design consideration: this 1517-ball FCBGA requires a high-density PCB with microvia stack-up, controlled-impedance routing for transceivers, and a substantial thermal solution (heatsink or forced airflow) for sustained workloads. Quartus II software version 9.0 or later is required for design entry, synthesis, place-and-route, and timing closure on this family. This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix III E family, and practical design notes not found in the manufacturer datasheet alone.

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EP3SE260F1517I3G - Stratix III E FPGA 255K LE 1517-FBGA | Intel
EP3SE260F1517I3G

EP3SE260F1517I3G - Stratix III E FPGA 255K LE 1517-FBGA | Intel

The Intel (Altera) EP3SE260F1517I3G is a high-density Stratix III E family Field Programmable Gate Array delivering 255,000 logic elements, 16,672,768 bits of embedded memory, and a maximum operating frequency of 500 MHz, housed in a 1517-ball Flip-Chip FineLine BGA (FC-FBGA) package with 976 user I/O pins and a 1.1 V core supply. What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and hardened I/O serdes that can be rewired after manufacture by the end user. Within the FPGA hierarchy, the Stratix III family sits as the high-performance, ASIC-prototyping flagship tier, and the -E variant emphasizes logic density and DSP capability. FPGAs in general belong to the broader class of programmable logic devices (PLDs), which also include CPLDs and PALs, occupying the same role as a customizable alternative to fixed-function ASICs. Key features of the EP3SE260F1517I3G include 8.7 Mbits of embedded RAM (TriMatrix memory with MLAB, M9K, and M144K blocks), 768 embedded 18x18 multipliers for DSP, 12 PLLs, and a rich multi-protocol transceiver engine supporting rates up to 6.375 Gbps. The device implements a true 1.0 V core voltage and is built in TSMC's 65 nm process node, balancing leakage and performance. Adaptive Logic Modules (ALMs) replace traditional 4-input LUTs, giving an effective 2.3x density improvement over Stratix II. Technical depth: The Stratix III E architecture introduces programmable power technology that lets unused logic, memory, and DSP blocks enter a low-power state, while the I/O subsystem supports LVDS, LVTTL, LVCMOS, HSTL, SSTL, and LVPECL with dynamic on-chip termination (OCT). Partial reconfiguration and remote update via PCI Express or serial flash are supported in silicon, allowing in-system logic changes without full reconfiguration. Typical applications include high-end ASIC prototyping, telecommunications infrastructure, high-throughput signal processing, military radar, test and measurement instrumentation, and wireline backplane bridging. The wide transceiver aggregate bandwidth (over 600 Gbps full duplex in some configurations) makes the device suitable for protocols such as PCIe Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, and Interlaken. When designing with the EP3SE260F1517I3G, attention must be paid to PCB signal-integrity for the 1517-ball FC-FBGA substrate, multi-rail power sequencing (1.1 V core, 2.5 V PLL, VCCAUX, VCCIO banks), and thermal management; a thermal-resistance-aware heatsink is recommended at full utilization. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical design notes not collated in the manufacturer datasheet, giving engineers a one-stop reference for sourcing and replacement decisions.

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