EP3SE260F1152I4L - 255K Logic Elements FPGA | Intel / Altera
料号： EP3SE260F1152I4L ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $32662.06958 | $32,662.07 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP3SE260F1152I4L 概述
A field-programmable gate array, or FPGA, is a programmable semiconductor containing configurable logic blocks, interconnect, memory blocks, and I/O resources. It occupies a position between fixed-function ASICs and discrete processor or logic systems: hardware functions can be changed after manufacturing without producing a new IC. Within the hierarchy, this FPGA is a programmable logic device, an integrated circuit, and ultimately a semiconductor used to implement digital acceleration, interface bridging, protocol handling, and embedded control.
The headline capacity of 255,000 logic elements supports substantial parallel datapaths, while 16,672,768 embedded memory bits provide on-chip storage for buffers, lookup tables, packet data, and control structures. Its 744 I/Os support large systems requiring many external interfaces. The 1152-terminal FCBGA arrangement is intended for high-pin-count board designs, and a second verified listing describes the physical package as 1152-FBGA measuring 35 mm by 35 mm.
Architecturally, the part is identified as a Stratix III E FPGA with 10,200 LABs and 65 nm technology. These features place it within a conventional SRAM-based FPGA generation where logic functions and routing are configured through programmable resources. The combination of capacity, embedded memory, and I/O count allows a system designer to consolidate control logic, data processing, and interface functions into one configurable platform.
Typical uses include high-performance communications equipment, industrial automation, test and measurement, image or video processing, and protocol-oriented data acquisition. A 744-I/O budget can be valuable where an FPGA must aggregate many parallel channels or connect multiple downstream devices. The 0.9 V supply and 65 nm process are relevant to power-distribution design, configuration management, thermal analysis, and selection of compatible legacy development tools.
Board design should follow the complete manufacturer pinout and the manufacturer's power-supply sequencing and decoupling guidance. Because this is a 1152-pin FCBGA component, controlled-impedance routing, complete ground-reference continuity, reliable power delivery, and appropriate thermal analysis are essential. Exact signal functions, package-ball names, timing limits, transceiver details, and configuration requirements remain datasheet-dependent.
This page consolidates verified distributor specifications, current unit pricing, package details, datasheet access, and a conservative drop-in comparison. Where the available cross-reference data does not prove pin-to-pin compatibility, no unverified substitute is presented as a drop-in replacement.
直接替换替代料： EP3SE260F1152I4L ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SE260F1152I4L （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Process Technology, Core Voltage, Embedded Memory.
快速对比工具——选择替代料号进行并排对比：
EP3SE260F1152I4
✅ 直接替换✓ 有现货
$1750 / 个
查看数据手册 →EP3SE260F1152I3
✅ 直接替换✓ 有现货
$16500 / 个
查看数据手册 →EP3SE260F1152I3N
✅ 直接替换✓ 有现货
$3360 / 个
查看数据手册 →EP3SE260F1152I3G
✅ 直接替换✓ 有现货
$1240 / 个
查看数据手册 →EP3SE110F1152I4L
✅ 直接替换✓ 有现货
$4317.9 / 个
查看数据手册 →EP3SE260F1152I4L 最大额定值与电气特性
| Product Type | Field-Programmable Gate Array (FPGA) |
| Series | Stratix III E |
| Logic Elements | 255000 |
| Embedded Memory | 16672768 bit |
| Logic Array Blocks | 10200 LAB |
| User I/O Count | 744 |
| Core Voltage | 0.9 V |
| Supply Voltage Range | 0.86 V to 1.15 V |
| Process Technology | 65 nm |
| Reported Clock Frequency | 375 MHz |
| 封装 | 1152-BBGA, FCBGA |
| Alternative Package Description | 1152-FBGA, 35 mm x 35 mm |
| 引脚数量 | 1152 |
| 安装类型 | Surface Mount |
| Manufacturer | Intel / Altera |
EP3SE260F1152I4L 1152-fbga, 35 mm x 35 mm 引脚配置指南
EP3SE260F1152I4L（1152-fbga, 35 mm x 35 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SE260F1152I4L.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SE260F1152I4L 适用于 6 应用s: Communications Infrastructure, Industrial Automation, Test and Measurement, Video and Image Processing, High-Speed Data Acquisition, Legacy Embedded Control.
Communications Infrastructure
EP3SE260F1152I4L fits communications infrastructure that needs substantial programmable logic and a large number of external connections. The device provides 255,000 logic elements, 16,672,768 embedded memory bits, and 744 I/Os, allowing parallel protocol processing, packet buffering, and interface aggregation in one FPGA. Its Stratix III E architecture can be configured for control-plane functions, data-path logic, and legacy interface conversion. The 0.9 V supply and 65 nm process make power integrity and signal integrity important, while the obsolete lifecycle status requires a supply-chain review. Use the manufacturer configuration and timing documentation before production.
推荐
Industrial Automation
EP3SE260F1152I4L is appropriate for industrial automation controllers that require deterministic programmable logic and many field connections. Its 10,200 LABs and 744 I/Os can support motor-control sequencing, machine vision interfaces, timing logic, sensor aggregation, and safety-related control partitioning. The 16,672,768 memory bits provide storage for lookup tables, buffers, and protocol state information. The 1152-pin FCBGA package is a high-density surface-mount design that requires a controlled-impedance PCB, complete power distribution, and careful thermal analysis. Because the supplied data does not confirm temperature or compliance ratings, verify industrial-environment requirements before use.
推荐
Test and Measurement
EP3SE260F1152I4L can serve as a configurable processing and control platform in test and measurement equipment. The combination of 255,000 logic elements and 16,672,768 memory bits supports waveform formatting, trigger logic, data reduction, timing generation, and instrument-interface processing. Its 744 I/Os are useful when the instrument must coordinate multiple ADCs, DACs, sensors, displays, or communication ports. The 65 nm Stratix III E process and 0.9 V supply emphasize clean power and deterministic clock distribution. The verified data does not include detailed timing or thermal limits, so the FPGA must be qualified using the complete manufacturer datasheet and the intended measurement accuracy requirements.
推荐
Video and Image Processing
EP3SE260F1152I4L is suitable for legacy video and image-processing systems that need high-density programmable datapaths. The FPGA can be configured to implement pixel pipelines, frame buffering, filtering, format conversion, timing generation, and interface adaptation. The verified capacity of 16,672,768 embedded memory bits is useful for line buffers, lookup tables, and small frame stores, while 744 I/Os support multiple parallel data and control interfaces. The device is not a substitute for a modern image-processing SoC, and the obsolete status may limit long-term support. Existing designs should retain verified clock constraints, memory interfaces, and package-ball assignments before any redesign or procurement decision.
推荐
High-Speed Data Acquisition
EP3SE260F1152I4L fits high-speed data-acquisition systems that need configurable capture, buffering, and preprocessing. Its 255,000 logic elements and 10,200 LABs can implement multiple parallel acquisition channels, digital filtering, decimation, packetization, and time-stamping functions. The 16,672,768 embedded memory bits provide local storage for transient buffers and data formatting, while 744 I/Os help interface to converters, clocks, control devices, and host systems. The device uses a 0.9 V core supply according to verified listings, so power integrity and decoupling are central to stable operation. Exact converter compatibility, timing performance, and signal-integrity constraints must be verified from the device documentation.
推荐
Legacy Embedded Control
EP3SE260F1152I4L is a practical fit for maintaining legacy embedded-control platforms already designed around the Stratix III E family. It can consolidate state machines, protocol handlers, memory interfaces, timing logic, and application-specific datapaths while preserving a familiar FPGA design flow. The 1152-pin FCBGA package makes it best suited to an existing board or a controlled redesign rather than a new low-cost platform. The 65 nm process and 0.9 V supply should be handled according to the original manufacturer design guidance, including power sequencing and thermal management. Before extending production, verify available inventory, software support, and any required obsolescence or longevity plan.
推荐
推荐产品汇总
工程参考数据： EP3SE260F1152I4L ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SE260F1152I4 | EP3SE260F1152I3 | EP3SE260F1152I3N | EP3SE260F1152I3G | EP3SE110F1152I4L |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Series | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
关键差异点
- High verified logic capacity （对比 EP3SE110F1152I4L)
- Large user-I/O resource （对比 EP3SE110F1152I4L)
- High embedded-memory density （对比 EP3SE110F1152I4L)
- Targeted legacy Stratix III E platform （对比 EP3SE260F1152I3)
设计说明
Use a 0.9 V core supply for EP3SE260F1152I4L, while recognizing that the supplied data also reports a 0.86 V to 1.15 V supply range. This range is a system-design fact from the part listing, not permission to select any voltage without checking the manufacturer operating conditions. Confirm the exact rail tolerances, current requirements, power-up sequence, and I/O-bank voltages from the manufacturer datasheet. Place local decoupling at the package power pins and maintain a low-impedance ground reference.
The 1152-pin FCBGA package requires a fan-out strategy that preserves continuous ground and power planes beneath the device. Escape each BGA row with the smallest practical via and trace arrangement, then use the FPGA design-software pin information to separate power, configuration, clock, transceiver, and user-I/O routes. The supplied evidence confirms the package family and 35 mm by 35 mm description, but it does not include a complete ball map. Do not begin PCB fabrication from an assumed pinout.
Thermal analysis is required for EP3SE260F1152I4L, especially when using its 255,000 logic elements and 744 I/Os at high activity. The verified data does not provide power dissipation, junction temperature, thermal resistance, or airflow guidance, so those values must be obtained from the manufacturer documentation rather than estimated. Use a complete board-level model, provide an appropriate thermal path, and verify that the selected heat-spreader or enclosure solution keeps every FPGA and power component within its allowed operating range.
Do not select a replacement solely because it is another Stratix III E device with a similar MPN. EP3SE260F1152I4, EP3SE260F1152I3, EP3SE260F1152I3N, EP3SE260F1152I3G, and EP3SE110F1152I4L are listed as related candidates, but the supplied evidence does not fully prove identical speed, temperature, ordering, or pin behavior. Obtain the full manufacturer package drawing, ordering-code definition, and migration guidance before making a drop-in claim. Also validate the legacy toolchain and configuration memory requirements.
合规信息
The supplied verified data does not establish RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is not applicable to the supplied product classification evidence, but formal qualification status is not documented.