EP3SE260F1152C4L - Stratix III E FPGA 255K LE 1152-FCBGA | Intel
料号： EP3SE260F1152C4L ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2695 | $26,950.00 |
| 100 | $2450 | $245,000.00 |
| 500 | $2200 | $1,100,000.00 |
| 1,000 | $1950 | $1,950,000.00 |
EP3SE260F1152C4L 概述
An FPGA (Field Programmable Gate Array) is a reprogrammable digital integrated circuit containing configurable logic blocks, programmable interconnect, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. Within the broader semiconductor taxonomy, an FPGA sits under programmable logic devices (PLDs) and above fixed-function ASICs in flexibility, making it ideal for prototyping, low-volume production, and applications requiring post-deployment in-field updates. The Stratix III E family specifically targets designers needing the lowest-power high-performance 65-nm FPGA fabric.
Key features include 10,200 adaptive logic modules (ALMs), dedicated DSP blocks for high-speed arithmetic, embedded TriMatrix memory supporting up to 16.67 Mbits, and integrated high-speed transceivers. The device supports DDR2/DDR3 memory interfaces through dedicated hard memory controllers, accelerating memory-intensive workloads. Configuration is achieved via passive serial, fast passive parallel, or JTAG modes.
Architecturally, the EP3SE260F1152C4L leverages 65 nm CMOS logic with adaptive logic modules that combine fracturable look-up tables, adders, and registers, allowing efficient implementation of arithmetic-intensive datapaths. The embedded transceivers deliver multi-gigabit serial connectivity, while the programmable power technology enables fine-grained control of static and dynamic power across operating regions.
Typical applications include high-end ASIC prototyping, communications infrastructure (bridges, routers, baseband processing), high-performance digital signal processing, broadcast video and image processing, and military/aerospace systems. When designing with this device, plan thermal management around the FC-FBGA ball-grid footprint, use controlled-impedance PCB stackups for transceiver channels, and follow Altera's Quartus II power-aware synthesis flow to minimize dynamic power.
直接替换替代料： EP3SE260F1152C4L ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3SE260F1152C4L （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Series, Speed Grade, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EP3SE260F1152C4
✅ 直接替换✓ 有现货
$8900 / 个
查看数据手册 →EP3SE260F1152C3N
✅ 直接替换✓ 有现货
$7500 / 个
查看数据手册 →EP3SE260F1152C3
✅ 直接替换✓ 有现货
$12500 / 个
查看数据手册 →EP3SE260F1152C2N
✅ 直接替换✓ 有现货
$11000 / 个
查看数据手册 →EP3SE260F1152C2
✅ 直接替换✓ 有现货
$2400 / 个
查看数据手册 →EP3SE260F1152C2G
✅ 直接替换✓ 有现货
$2050 / 个
查看数据手册 →EP3SE260F1152C4L 最大额定值与电气特性
| Family | Stratix III E |
| Logic Elements (LE) | 255,000 |
| Adaptive Logic Modules (ALMs) | 10,200 |
| Total Embedded Memory | 16,672,768 bits (16.67 Mbit) |
| User I/O Pins | 744 |
| Process Technology | 65 nm CMOS |
| Core Voltage | 0.9 V |
| 封装 | 1152-ball FC-FBGA |
| 工作温度 | 0C to +85C (Commercial) |
| Maximum Frequency | 375 MHz |
| Transceivers | Integrated high-speed transceivers |
| Memory Interfaces | DDR2/DDR3 with hard controllers |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
EP3SE260F1152C4L 1152-ball fc-fbga 引脚配置指南
EP3SE260F1152C4L（1152-ball fc-fbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3SE260F1152C4L.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3SE260F1152C4L 适用于 6 应用s: High-Speed Communications Infrastructure, ASIC Prototyping and Emulation, High-Performance DSP and Signal Processing, Broadcast Video Processing and Display Walls, Military and Aerospace Avionics, Test and Measurement Instrumentation.
High-Speed Communications Infrastructure
The EP3SE260F1152C4L's 255K logic elements and integrated multi-gigabit transceivers make it ideal for core routers, multi-service switches, and base-station baseband processing where the fabric must terminate high-speed serial links and process Layer 2/3 forwarding tables concurrently. With 16.67 Mbit of embedded TriMatrix memory, packet buffers and queue descriptors can be held on-chip, eliminating external SRAM in many line-card designs and reducing BOM cost. The 744 user I/Os expose enough parallel bandwidth to bridge multiple SFP+/QSFP cages to the backplane. Designers should leverage Altera's hard IP cores for Ethernet MAC, Interlaken, and CPRI to accelerate time-to-market while meeting tight latency budgets in carrier-grade equipment.
推荐
ASIC Prototyping and Emulation
Engineers use the EP3SE260F1152C4L for ASIC prototyping because its 255K LEs provide enough logic capacity to map mid-complexity ASIC RTL into real silicon for hardware-software co-validation. Multiple FPGAs can be partitioned via Time Domain Multiplexing (TDM) to emulate larger ASICs. The 65 nm fabric delivers predictable timing closure with Quartus II, and the abundant block RAM (16.67 Mbit) supports in-circuit trace buffers used during silicon validation. The commercial 0-85C grade is sufficient for lab environments, and the FC-FBGA package supports high-speed transceiver-based bring-up boards that match production ASIC I/O. This drastically shortens pre-silicon software development cycles for complex SoCs.
推荐
High-Performance DSP and Signal Processing
The EP3SE260F1152C4L's dedicated DSP blocks deliver hundreds of GMACs of fixed- and floating-point arithmetic, making it well suited to radar beamforming, software-defined radio baseband, medical imaging front-end processing, and broadcast video codecs. With 255K LEs and 16.67 Mbit embedded memory, FFT pipelines and matrix multipliers can be implemented without external memory, reducing latency below 1 microsecond. The 744 I/Os accept multiple parallel ADC/DAC channels at LVDS rates, while integrated transceivers move processed data to host processors. Altera's DSP Builder and the Quartus II Megacore FIR compiler accelerate filter design and timing closure for production-grade DSP systems.
推荐
Broadcast Video Processing and Display Walls
Broadcast studios and digital signage walls demand real-time multi-stream video processing at uncompressed rates. The EP3SE260F1152C4L's 255K LEs can implement multiple HD-SDI or 3G-SDI receivers, color-space converters, and on-screen overlay engines concurrently. The 16.67 Mbit of embedded memory serves as frame-buffer storage between input and output streams, supporting pipelined scaling without external DDR in many 1080p designs. With 744 user I/Os, the FPGA can drive multi-megapixel display walls directly through LVDS or mini-LVDS interfaces. Designers use Altera's Video and Image Processing (VIP) Suite to accelerate development of deinterlacers, scalers, and chroma keyers for live production environments.
推荐
Military and Aerospace Avionics
Avionics subsystems use the EP3SE260F1152C4L in commercial-temperature variants for flight-control test rigs, mission-computing prototypes, and ruggedized signal-intelligence platforms where moderate logic density and high I/O count are required. The Stratix III E family's robust SEU mitigation features and configuration memory scrubbing support mission-critical reliability, while the 744 I/Os handle multiple ARINC 429, MIL-STD-1553, and LVDS sensor buses in parallel. Designers should verify against the I-suffix variant (EP3SE260F1152I4N) for industrial temperature operation, and pair the FPGA with radiation-tolerant companion devices for full mission assurance per DO-254 design assurance objectives.
推荐
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers rely on the EP3SE260F1152C4L for real-time acquisition, triggering, and post-processing of multi-gigabit signals. With 16.67 Mbit of embedded memory the FPGA can buffer deep acquisition windows, while 744 I/Os accept wide parallel buses from high-speed ADCs. The integrated transceivers stream processed data to a host CPU over PCIe or proprietary serial links. Quartus II's SignalTap II logic analyzer tool simplifies in-system debug of complex trigger sequences, and the device's reprogrammability allows one board design to support multiple instrument SKUs, dramatically reducing NRE cost for the test-and-measurement product line.
推荐
推荐产品汇总
工程参考数据： EP3SE260F1152C4L ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3SE260F1152C4 | EP3SE260F1152C3N | EP3SE260F1152C3 | EP3SE260F1152C2N | EP3SE260F1152C2 | EP3SE260F1152C2G |
|---|---|---|---|---|---|---|---|
| Package | 1152-ball FC-FBGA | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same | 1152-ball FC-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 255,000 | 255,000 - same | 255,000 - same | 255,000 - same | 255,000 - same | 255,000 - same | 255,000 - same |
| User I/Os | 744 | 744 - same | 744 - same | 744 - same | 744 - same | 744 - same | 744 - same |
| Speed Grade | C4 (fastest) | C4 - same | C3 (-1 speed grade) | C3 (-1 speed grade) | C2 (-2 speed grades, slowest) | C2 (-2 speed grades, slowest) | C2 (-2 speed grades, slowest) |
| Lifecycle Status | Last-Time-Buy (L) | Active (non-L) | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
| Temperature Grade | Commercial (0C to +85C) | Commercial - same | Commercial - same | Commercial - same | Commercial - same | Commercial - same | Commercial - same |
关键差异点
- Last-Time-Buy (L) lifecycle indicator encoded in part number （对比 EP3SE260F1152C4)
- Fastest speed grade in the EP3SE260F1152 family （对比 EP3SE260F1152C2N)
- Highest density Stratix III E commercial variant （对比 EP3SE110F1152C4N)
设计说明
The 1152-ball FC-FBGA package requires an HDI PCB stackup with laser-drilled microvias and 0.4 mm to 0.5 mm pitch escape routing. Use 1 oz copper outer layers and follow Altera's recommended BGA fanout pattern. Maintain a continuous reference plane under the BGA to control impedance of high-speed transceiver channels (typically 100 ohm differential). Signal-via and BGA-ball antipads must be designed per JEDEC BGA assembly guidelines to avoid solder joint defects.
Estimated: at 0.9 V core with 50% logic utilization and typical 65 nm Stratix III power profile, the FC-FBGA package dissipates 8-12 W. With a typical theta_JA of 12 C/W for this 35x35 mm FCBGA under 1.5 m/s airflow, junction temperature rise is approximately 96-144 C above ambient. A heatsink with thermal interface material (TIM) or a cold plate is recommended for closed-enclosure designs, especially at the 85C commercial temperature ceiling.
Power-on sequencing must follow Altera's recommended order: VCCINT first, then VCCPD, then VCCIO, with monotonic ramp and maximum 100 ms delay between rails. Use a TI TPS3808 supervisor or equivalent to monitor all rails and hold nCONFIG low until supplies stabilize. Decoupling requires 100 nF X7R at every VCCINT pin plus 22 uF bulk tantalum or polymer per power region per the Stratix III device handbook power distribution network (PDN) design guide.
Do not assume commercial-grade EP3SE260F1152C4L parts will operate correctly in industrial or military temperature environments - select the I-suffix variant for -40C to +100C operation. Also, JTAG chain order matters in multi-FPGA configurations: TDO of the upstream device must connect to TDI of the downstream device, and TCK should be buffered for chains longer than 4 devices to avoid signal-integrity issues.
合规信息
RoHS compliance confirmed via Intel/Altera product environmental documentation. Lead-free and halogen-free status requires verification against the exact device marking (N or G suffix indicates lead-free). AEC-Q100 not applicable - this is a commercial-grade FPGA.