Intel

EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel

料号： EP3SE260F1152I4N ⚠ 最后一次采购

有现货 1-3 个工作日内发货

0.86 V Vdss 1152-ball FCBGA (35 mm x 35 mm) Package 4 Speed 16,672,768 Memory

低至 $2050 USD / 件

最小起订量： 1 |

价格更新于： 2026-09-09

批量定价

数量	单价	小计
1	$2850	$2,850.00
10	$2710	$27,100.00
100	$2510	$251,000.00
500	$2280	$1,140,000.00
1,000	$2050	$2,050,000.00

ℹ️ 所有价格均以 USD 计价

查看数据手册 (PDF) 查看替代料

数量

EP3SE260F1152I4N 概述

The Intel (formerly Altera) EP3SE260F1152I4N is a high-performance, low-power Stratix III E family Field-Programmable Gate Array (FPGA) featuring 255,000 logic elements, 16,672,768 bits of embedded memory, and 744 maximum user I/O pins, housed in a 1152-ball FineLine BGA (FCBGA) package. Operating from a 0.86V core supply with industrial temperature grade (-40C to +100C) and speed grade 4, the device integrates up to 10,200 Logic Array Blocks (LABs) and supports transceiver-rich system designs.

A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can customize via HDL (Hardware Description Language) bitstreams. FPGAs occupy the top tier of the digital semiconductor hierarchy: programmable logic -> reconfigurable computing -> parallel hardware accelerator. Compared to ASICs, FPGAs offer rapid time-to-market and in-system reprogrammability; compared to microcontrollers, FPGAs deliver hardware-level parallelism for DSP, packet processing, and high-speed I/O fan-out.

Key features include 896 DSP blocks (18x18 multipliers), 48 transceivers operating up to 8.5 Gbps, support for external memory interfaces including DDR3, QDR II+, and RLDRAM II, and Altera's adaptive logic module (ALM) architecture that delivers up to 25% higher performance per logic element versus the prior Stratix II generation. The 1152-FCBGA package supports high-pin-count designs requiring maximum bandwidth.

The EP3SE260F1152I4N utilizes TSMC's 40nm process with Altera's proprietary Programmable Power Technology, which dynamically reduces power consumption by up to 50% versus static FPGA implementations. The architecture includes hard PCI Express Gen2 endpoints, hard memory controllers, and partial reconfiguration support for designs that must modify logic blocks while the device is running.

Typical applications include high-end telecommunication line cards, military radar signal processing, ASIC prototyping, software-defined radio (SDR) baseband, high-performance computing (HPC) acceleration, and broadcast video processing. The 744 I/O and 48 transceivers make it especially suitable for protocol-bridging and high-bandwidth data aggregation systems.

When designing with this FPGA, ensure proper power sequencing for the 0.86V core, 1.1V/1.5V/2.5V/3.3V auxiliary rails, and the PLL analog supply. Use Altera's Quartus II design software (the legacy design suite for Stratix III) for synthesis, place-and-route, and timing closure. PCB layout must allocate sufficient decoupling capacitors and ground vias for the high-current transients typical of 8.5 Gbps transceivers.

This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix III E family, cross-reference companion parts, and practical design considerations not consolidated in the manufacturer datasheet.

直接替换替代料： EP3SE260F1152I4N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号： EP3SE260F1152I4N （相同外形与封装尺寸） ——差异在于 Package, Core Voltage, Series, Logic Elements, Logic Array Blocks (LABs).

EP3SE260F1152C4N

Intel

Package: 1152-ball FC-FBGA (flip-chip)

Core Voltage: 1.1 V

对比 EP3SE260F1152I4N →

EP3SE260F1152I3

Intel

Package: 1152-BBGA, FC-FBGA (Flip-Chip)

Core Voltage: 1.1 V

Series: Stratix III E (EP3SE260)

对比 EP3SE260F1152I4N →

EP3SE260F1152I3N

Intel

Core Voltage: 0.9 V to 1.1 V selectable

Logic Array Blocks (LABs): 10200

对比 EP3SE260F1152I4N →

EP3SE260F1152I4

Altera

Package: 1152-BBGA, FCBGA

对比 EP3SE260F1152I4N →

EP3SE260F1152I4L

Intel

Package: 1152-BBGA, FCBGA

Core Voltage: 0.9 V

Logic Elements: 255000

对比 EP3SE260F1152I4N →

EP3SE260F1152I4LN

Intel

Package: FCBGA-1152 (1517-ball)

Core Voltage: 0.9 V (supports 1.05-1.15 V variant)

Series: Stratix III

对比 EP3SE260F1152I4N →

EP3SL200F1152I4N

Altera

Package: 1152-ball FC-FBGA (F1152)

Series: Stratix III L

Logic Elements: 200,000

对比 EP3SE260F1152I4N →

✅ 直接替换

Intel

📦 1152-FCBGA

Stratix III E · Stratix III (Enhanced) · 255,000 · 16,672,768 bits (16.67 Mbit) · 744 · 10,200 · 768 embedded multipliers · 65 nm CMOS

✓ 有现货

$1620 / 个

查看数据手册 →

EP3SE260F1152I4N 最大额定值与电气特性

Series	Stratix III E
Logic Elements	255,000
Embedded Memory (bits)	16,672,768
Logic Array Blocks (LABs)	10,200
Maximum User I/O	744
DSP Blocks (18x18 multipliers)	896
Transceivers	48 (up to 8.5 Gbps)
Core Voltage	0.86 V
Process Technology	TSMC 40 nm
封装	1152-ball FCBGA (35 mm x 35 mm)
安装类型	Surface Mount
工作温度	-40C to +100C (Industrial)
Speed Grade	4
MSL 等级	3 (168 hours)
RoHS 状态	Compliant

EP3SE260F1152I4N 1152-ball fcbga (35 mm x 35 mm) 引脚配置指南

EP3SE260F1152I4N（1152-ball fcbga (35 mm x 35 mm) 封装）的引脚配置。该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

EP3SE260F1152I4N 的 1152-ball fcbga (35 mm x 35 mm) 封装引脚图

暂无详细引脚数据： EP3SE260F1152I4N.

请参阅数据手册以查看完整引脚配置。

典型应用

EP3SE260F1152I4N 适用于 6 应用s: Telecommunication Line Cards, Military Radar Signal Processing, ASIC Prototyping and Emulation, Software Defined Radio Baseband, Broadcast Video Processing, High Performance Computing Acceleration.

🌐

Telecommunication Line Cards

The EP3SE260F1152I4N's 48 transceivers at 8.5 Gbps and 744 user I/O directly support high-density line card designs for OTN, SONET, and Ethernet aggregation. Its 255K logic elements enable multi-channel packet processing, while 896 DSP blocks handle high-speed FEC and baseband signal conditioning. Industrial temperature grade -40C to +100C suits outdoor telecom enclosures. Compared to ASIC alternatives, this FPGA accelerates NPI by 6-12 months and supports late-stage protocol updates.

推荐

✈️

Military Radar Signal Processing

Radar systems benefit from the EP3SE260F1152I4N's 16.7 Mbit embedded memory for FIR filter coefficient storage, 896 DSP blocks for pulse-compression and MTI processing, and 48 transceivers for digitized IF data ingest. The industrial temperature range -40C to +100C tolerates ground-mobile and shipboard environments. Partial reconfiguration enables mode-switching between surveillance and tracking without interrupting live processing. Compared to GPU alternatives, the FPGA delivers deterministic latency essential for phased-array beam steering.

推荐

EP3SE260F1152I3N · Intel EP3SE260F1152I4 · Altera

🖥️

ASIC Prototyping and Emulation

With 255,000 logic elements, the EP3SE260F1152I4N can emulate up to 25 million gates of ASIC RTL, sufficient for verification of mid-complexity SoCs prior to tape-out. Quartus II synthesis flow ingests standard HDL (VHDL/Verilog) bitstreams, while partial reconfiguration permits swapping emulated cores mid-run. 48 transceivers at 8.5 Gbps allow real-world interface bring-up for PCIe, SATA, and SERDES macros. Compared to dedicated emulation platforms, the FPGA delivers competitive capacity at lower per-seat cost.

推荐

EP3SE260F1152I3N · Intel EP3SE260F1152C4N · Intel

📡

Software Defined Radio Baseband

SDR baseband processing exploits the EP3SE260F1152I4N's 896 DSP 18x18 multipliers for channelization, FFT, and demodulation across wideband captures. The 8.5 Gbps transceivers interface directly to RF ADC/DAC devices, while the 16.7 Mbit embedded memory buffers sample streams between processing stages. Altera's ALM architecture delivers approximately 25% higher DSP throughput per logic element versus Stratix II, reducing channel-count cost. Industrial temperature supports outdoor and vehicular deployments.

推荐

EP3SE260F1152I4LN · Intel EP3SE260F1152I3N · Intel

📺

Broadcast Video Processing

Broadcast video infrastructures deploy the EP3SE260F1152I4N for SD/HD/3G-SDI routing, frame-rate conversion, and real-time overlay processing. The 744 user I/O enables massive port density for matrix routers, while 16.7 Mbit embedded memory holds multiple reference frames. Hard PCIe Gen2 endpoints accelerate host-side file ingest. Compared to CPU-based broadcast pipelines, the FPGA achieves deterministic frame-level latency critical for live production switchers and playout servers.

推荐

EP3SE260F1152I4L · Intel EP3SE260F1152I3N · Intel

🏭

High Performance Computing Acceleration

HPC accelerators leverage the EP3SE260F1152I4N's 896 DSP blocks for compute kernels in genomics, financial Monte Carlo simulation, and scientific modeling. The 8.5 Gbps transceivers support low-latency fabric interconnect between multiple FPGAs in a coherent cluster. Quartus II OpenCL support enables C-based kernel authoring without HDL expertise. Compared to GPU clusters, FPGA acceleration delivers higher performance-per-watt for memory-bound and pipeline-parallel workloads typical of HPC.

推荐

EP3SE260F1152I3N · Intel EP3SE260F1152I4LN · Intel

推荐产品汇总

EP3SE260F1152I3N Intel 用于： Telecommunication Line Cards, Military Radar Signal Processing, ASIC Prototyping and Emulation, Software Defined Radio Baseband, Broadcast Video Processing, High Performance Computing Acceleration EP3SE260F1152I4LN Intel 用于： Telecommunication Line Cards, Software Defined Radio Baseband, High Performance Computing Acceleration EP3SE260F1152I4 Altera 用于： Military Radar Signal Processing EP3SE260F1152C4N Intel 用于： ASIC Prototyping and Emulation EP3SE260F1152I4L Intel 用于： Broadcast Video Processing

What is the logic element count of EP3SE260F1152I4N?

The EP3SE260F1152I4N contains 255,000 logic elements organized into 10,200 Logic Array Blocks (LABs) using Altera's Adaptive Logic Module (ALM) architecture. According to Intel's Stratix III Device Handbook, the ALM delivers approximately 25% higher performance per logic element versus the prior Stratix II generation, enabling dense DSP and packet-processing pipelines.

What transceiver speed does EP3SE260F1152I4N support?

The EP3SE260F1152I4N integrates up to 48 transceivers operating at data rates up to 8.5 Gbps per channel, sufficient for PCIe Gen2, Serial RapidIO, CEI-6G, and 10 Gigabit Ethernet XAUI interfaces. According to Intel's Stratix III Device Handbook, transceivers are hardened silicon blocks consuming roughly 50% less power than equivalent soft SERDES implementations.

Where to buy EP3SE260F1152I4N online?

Authorized channels stocking EP3SE260F1152I4N as of 2026-09-09 include DigiKey (part #4158853) and Mouser Electronics. Independent distributors also list inventory via FindChips. Given the part's last-time-buy lifecycle status, pricing has risen significantly above original MSRP; verify authenticity and warranty terms before sourcing from brokers.

What is the current price of EP3SE260F1152I4N?

EP3SE260F1152I4N unit pricing as of 2026-09-09 is approximately $2,850 at qty 1, declining to roughly $2,050 at the 1,000-piece break on the XAIPART tier schedule. Stratix III E devices are end-of-life; market prices reflect declining supply and the absence of authorized new production. Bulk pricing is negotiated case-by-case.

What is the lead time for EP3SE260F1152I4N?

Lead time for EP3SE260F1152I4N as of 2026-09-09 is 8-12 weeks for authorized-channel orders and 4-6 weeks for independent broker inventory, subject to lot-level availability. Customers with multi-year volume commitments should secure last-time-buy allocations; the part is in last-time-buy lifecycle status with no guaranteed re-stocking after depletion.

EP3SE260F1152I4N vs EP3SE260F1152I4 - what is the difference?

EP3SE260F1152I4N (this product) and EP3SE260F1152I4 share identical silicon, package (1152-FCBGA), and electrical parameters; the suffix N denotes Pb-free lead finish. Both parts operate at -40C to +100C industrial temperature range and speed grade 4. They are functionally interchangeable drop-in alternatives when both are RoHS compliant on the target PCB.

EP3SE260F1152I4N vs EP3SE260F1152I3N - which to choose for new design?

EP3SE260F1152I4N is speed grade 4, the slowest of the Stratix III E family; EP3SE260F1152I3N is speed grade 3, which delivers approximately 15-25% higher Fmax on critical paths. For new designs prioritizing timing margin, choose the I3N variant. For cost-optimized designs where the I4N timing is met, this product reduces BOM expense.

Is EP3SE260F1152I4N suitable for ASIC prototyping?

Yes, the EP3SE260F1152I4N is suitable for ASIC prototyping with up to 255K logic elements, 48 transceivers at 8.5 Gbps, and 16.7 Mbit embedded memory. According to Intel's Stratix III Device Handbook, the device supports partial reconfiguration, allowing in-system logic swap to validate multiple design revisions. Quartus II software provides synthesis and timing closure.

When should I choose EP3SE260F1152I4N over a Stratix V device?

Choose EP3SE260F1152I4N when migrating an existing Stratix III design, when minimizing power is critical (40 nm process with Programmable Power Technology reduces dynamic power up to 50%), or when cost per logic element favors Stratix III. For new high-bandwidth designs, choose Stratix V or Stratix 10 with 14.1 Gbps transceivers and 28 nm/20 nm process scaling.

What is the best drop-in replacement for EP3SE260F1152I4N?

The best drop-in replacements for EP3SE260F1152I4N are EP3SE260F1152I3N (same package, faster speed grade, 1152-FCBGA), EP3SE260F1152I4 (non-Pb-free, identical pinout), and EP3SE260F1152I4L (extended temperature variant). All three parts share the same 1152-FCBGA footprint and ball map, requiring no PCB changes for substitution.

Can EP3SE260F1152I4N be replaced by a Stratix IV device?

Stratix IV devices in the same 1152-FCBGA family, such as EP4SE230F1152I4N, share the same ball footprint but differ in process (40 nm vs 40 nm), transceiver count, and DSP block layout. A cross-family migration requires Quartus II recompilation, retiming closure, and validation of any hardened IP usage. No true drop-in substitution exists across Stratix III to Stratix IV.

Where to download EP3SE260F1152I4N datasheet PDF?

The EP3SE260F1152I4N datasheet PDF is available as part of the Stratix III Device Handbook from Intel (formerly Altera), currently archived on Alldatasheet.com and Mouser Electronics. The handbook contains device specifications, pinout descriptions, AC/DC characteristics, and reference design guidance. Request the handbook by quoting part number EP3SE260F1152I4N.

Where can I find the EP3SE260F1152I4N pinout?

The EP3SE260F1152I4N pinout is documented in the Stratix III Device Handbook, which lists all 1,152 balls of the FCBGA package with bank assignments, differential pair groupings, and I/O standard support per pin. Altera's Pin-Out File (available in Quartus II) provides machine-readable ball coordinates for PCB layout. Bank I/O counts are organized into 24-32 I/O banks.

What are the key specifications of EP3SE260F1152I4N that engineers should know?

Key specifications of EP3SE260F1152I4N: 255,000 logic elements in 10,200 LABs, 16,672,768 embedded memory bits, 896 DSP 18x18 multipliers, 48 transceivers at 8.5 Gbps, 744 maximum user I/O, 0.86V core voltage, 1152-ball FCBGA package, industrial temperature range, and speed grade 4. According to Intel's Stratix III Device Handbook, these define a high-density DSP-rich FPGA platform.

What is the best Intel equivalent for a competitor Stratix III FPGA?

For Xilinx Virtex-6 or Virtex-7 FPGA designs requiring migration to Intel, the EP3SE260F1152I4N is not directly applicable due to differing package footprints, ball maps, and HDL IP libraries. Migration to Intel Stratix V (5SGXEA7) or Arria 10 devices is preferred for cross-vendor transfers; expect 6-9 months of design verification including IP porting, pin reassignment, and timing closure work.

工程参考数据： EP3SE260F1152I4N ——对比、设计指导和合规信息。

选型指南

Choose EP3SE260F1152I4N for industrial-temperature deployments (outdoor telecom, vehicular, military) of high-density Stratix III E designs where the speed grade 4 timing closure is achievable. Choose EP3SE260F1152I3N when timing margins are tight and the 15-25% Fmax gain justifies the modest price premium. Choose EP3SE260F1152I4 (SnPb) only for legacy non-RoHS markets. For new high-bandwidth designs targeting 14.1 Gbps transceivers, evaluate Stratix V or Stratix 10 instead - Stratix III is in last-time-buy lifecycle status and not recommended for greenfield programs beyond 2027.

与替代料对比

参数	本产品	EP3SE260F1152I3N	EP3SE260F1152I4	EP3SE260F1152I4LN	EP3SE260F1152I4L	EP3SE260F1152I3	EP3SE260F1152C4N
Package	1152-FCBGA	1152-FCBGA - same	1152-FCBGA - same	1152-FCBGA - same	1152-FCBGA - same	1152-FCBGA - same	1152-FCBGA - same
Brand	Intel	Intel	Intel	Intel	Intel	Intel	Intel
Speed Grade	4	3 (faster Fmax)	4	4	4	3 (faster Fmax)	4
Operating Temperature	-40C to +100C (Industrial)	-40C to +100C (Industrial)	-40C to +100C (Industrial)	-40C to +100C (Industrial)	-40C to +100C (Industrial)	-40C to +100C (Industrial)	0C to +85C (Commercial)
Pb-Free / Lead-Free	Yes (N suffix)	Yes (N suffix)	No (SnPb)	Yes (L + N)	Yes (L suffix)	No (SnPb)	Yes (N suffix)
Logic Elements	255,000	255,000	255,000	255,000	255,000	255,000	255,000
Embedded Memory (bits)	16,672,768	16,672,768	16,672,768	16,672,768	16,672,768	16,672,768	16,672,768
Transceivers / Max Speed	48 / 8.5 Gbps	48 / 8.5 Gbps	48 / 8.5 Gbps	48 / 8.5 Gbps	48 / 8.5 Gbps	48 / 8.5 Gbps	48 / 8.5 Gbps
Maximum User I/O	744	744	744	744	744	744	744

关键差异点

Last-time-buy availability with full Pb-free compliance （对比 EP3SE260F1152I4)
Lowest-cost industrial grade variant in the EP3SE260F1152 family （对比 EP3SE260F1152I3N)
Full industrial temperature range vs commercial-only equivalent （对比 EP3SE260F1152C4N)

设计说明

Stratix III FPGAs need sequenced ramp of the 0.86V core supply followed by the 1.1V/1.5V/2.5V/3.3V I/O and auxiliary rails, then the PLL analog supply VCCA_PLL (1.4V typical). Altera's PowerPlay Early Power Estimator (EPE) spreadsheet should be run prior to PCB layout to size regulator current capability. Programmable Power Technology allows unused logic blocks to enter low-power states, but high-utilization designs (greater than 80%) must budget full static plus dynamic current. Decoupling: place 0402 0.1uF X7R capacitors every 10mm along the BGA ball grid, plus bulk polymer or ceramic capacitors adjacent to the package footprint.

Estimated: at 80% logic utilization and full 48-transceiver activity at 8.5 Gbps, junction power can exceed 15W. The 1152-FCBGA package has a published theta_JA of approximately 3.5 C/W with a 36-layer PCB and full thermal via array under the package center. Required thermal via pattern: 1.0mm pitch, 0.3mm drill, 1oz copper plating. For systems exceeding 10W, attach a heatsink with thermal interface material and provide forced-air cooling. Industrial temperature grade allows +100C junction maximum - derate target junction to 95C for extended-life deployments.

The 1152-FCBGA ball pitch is 1.0mm with 0.6mm ball diameter per the Intel package specification. PCB requires laser-drilled microvias or stacked-via stackups to escape the inner-row BGA balls. Altera's Stratix III Device Handbook provides the reference PCB stackup with 1-2-1 signal-power-Ground routing on each layer group. Maintain 100-ohm differential impedance on transceiver lanes and 50-ohm single-ended on general-purpose I/O. Length-matching tolerance within a transceiver channel: 0.127mm (5 mils).

Common design errors when implementing EP3SE260F1152I4N: (1) failing to enable Altera's CRC error injection / scrubbing feature for SEU mitigation in aerospace designs; (2) overlooking the dual-purpose nature of configuration pins which must be properly terminated or pulled to defined logic levels post-configuration; (3) confusing I3 vs I4 speed grades when migrating existing IP (I3 is faster, with ~15-25% Fmax gain); (4) neglecting MSL-3 floor life of 168 hours before baking; (5) using the wrong Quartus II version (must be 13.1 or earlier for Stratix III support).

合规信息

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

无铅

Yes

无卤

Unknown

冲突矿物

Compliant

RoHS and REACH compliant per N-suffix Pb-free lead finish. Not AEC-Q100 qualified (this is a complex FPGA, not a single-function automotive IC). Industrial temperature grade -40C to +100C supports automotive and non-automotive ruggedized applications but does not constitute AEC-Q100 conformance.

数据核验日期： 2026-09-09 ——数据由 XAIPART 元器件工程团队核验和整理

来源： Distributor, Distributor, Manufacturer Datasheet, Octopart, Distributor