LCMXO2-4000HC-5BG332I
LCMXO2-4000HC-5BG332I - MachXO2 4320 LUT FPGA | Lattice
The Lattice Semiconductor LCMXO2-4000HC-5BG332I is a non-volatile, instant-on Field Programmable Gate Array (FPGA) from the MachXO2 family with 4320 Look-Up Tables (LUTs), 274 user I/Os, and 94,208 bits of embedded block RAM plus 32 Kbits of distributed SRAM, housed in a 332-ball 0.8mm pitch CABGA (BG332) package. Built on an advanced 65nm low-power CMOS process, it combines logic, embedded memory, and hardened peripherals in a single ultra-low-power device.
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (LUTs), programmable interconnect, and I/O cells that can be re-programmed after manufacture to implement arbitrary digital functions. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLDs), alongside CPLDs. They are widely used for glue logic, bus bridging, sensor aggregation, and control-plane functions, complementing microprocessors and microcontrollers in modern embedded systems. The MachXO2 family specifically targets low-power, high-volume applications such as I/O expansion, configuration management, and power-sequencing where traditional CPLDs or discrete logic are insufficient but a large FPGA is overkill.
Key features of the LCMXO2-4000HC-5BG332I include 4320 LUT4s, up to 240 Kbits of sysMEM embedded block RAM, dedicated FIFO control logic per device, programmable low-swing differential I/Os, and a standby power figure as low as 22 µW. The device integrates a hardened I2C, SPI, and UART controller block for system management, supports 1.0V, 1.2V, 1.8V, 2.5V, and 3.3V I/O standards, and provides TransFR (field reconfiguration) and dual-boot image capability for in-system updates without external flash.
Architecturally, the MachXO2 HC (High Capacity) variant sits between the ultra-low-power ZE series and the high-performance HE series. It shares the same LUT fabric, sysMEM blocks, and hardened peripherals, but is optimized for higher logic utilization at moderate power. The 65nm process node enables both the low static leakage and the integration of large amounts of SRAM, while the dedicated PLL block supports up to four clock outputs with frequency synthesis and phase shifting.
Typical applications include LED display control boards, industrial sensor hubs, camera image-pipeline pre-processing, PCIe/USB endpoint glue logic, and consumer device I/O expansion. The wide I/O count (274) and generous block RAM make it particularly well suited to applications requiring many parallel interfaces plus moderate on-chip buffering. The wide operating temperature range and on-chip flash configuration memory further support automotive, industrial, and white-goods designs.
When designing with the LCMXO2-4000HC-5BG332I, plan JTAG and SPI programming access early so that dual-boot and TransFR flows remain available post-production. The 332-ball CABGA package demands careful PCB fan-out and via-in-pad design; thermal performance is excellent thanks to the low standby power, but engineers should still provide a continuous ground plane beneath the BGA to control supply-impedance and EMI.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes for the LCMXO2-4000HC-5BG332I that go beyond the manufacturer datasheet alone, helping engineers select and qualify this part with confidence.
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