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MC33289DWR2 - Dual High-Side Switch 40mOhm 27V | NXP SOIC-20
The NXP MC33289DWR2 is a Dual High-Side Switch (DHSS) optimized for automotive loads, integrating two 40 mOhm N-channel MOSFET high-side drivers in a 20-pin SOIC package. It operates across a 6 V to 27 V supply range, tolerates load-dump transients up to 40 V, and delivers continuous per-channel current suitable for solenoids, lamps, and DC motor half-bridge configurations. What is a high-side switch? A high-side switch is a semiconductor device that connects a load to the positive supply rail (in contrast to a low-side switch that switches the ground path). High-side switches are widely used in automotive body electronics because they offer inherent short-to-ground protection, simplify fault diagnosis with load-diagnostics, and eliminate the need for mechanical relays in many ECU-driven applications. Key features include integrated charge pump for gate drive, programmable current limiting, open-load detection in both on and off states, and thermal shutdown with auto-recovery. Each channel can be controlled independently through TTL-compatible CMOS inputs, supporting PWM operation for lamp dimming or solenoid proportional control. The device also includes fault feedback via a status flag for microcontroller-driven diagnostics. The MC33289DWR2 is built on NXP's SMARTMOS process technology, combining vertical DMOS power transistors with CMOS logic on a single die. This monolithic integration reduces PCB area, eliminates parasitic inductance between discrete stages, and provides consistent thermal coupling between the two switches for symmetric current sharing in dual-channel loads. Typical applications include automotive body control modules driving solenoid valves, relay coil drivers, DC motor half-bridges, and lamp driver circuits. The integrated protection features make it particularly suitable for under-hood and under-body ECU applications where harsh electrical environments demand robust fault handling. When designing with this device, ensure adequate decoupling at the VCC pin and place the reverse-battery protection diode as close to the connector as possible. Heat dissipation is dominated by RDS(on) and load current: at 5 A per channel, total dissipation is approximately 2 W, requiring copper-pour thermal management on the PCB. This page synthesizes distributor pricing, pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
MC33368D - High-Voltage Critical Conduction PFC | onsemi
The onsemi MC33368D is a high-voltage GreenLine power factor correction controller in a narrow-body 16-pin SOIC package. It operates as a critical-conduction-mode, or CRM, boost PFC controller for off-line power supplies, supporting low-power, high-density designs that emphasize reduced component count, reduced board area, and low power dissipation. The verified distributor data identifies the device as a critical-conduction PFC IC and the manufacturer datasheet identifies it as an active power-factor controller for boost preconverter applications. A power-factor controller is a power-management IC that shapes input current to improve the real-power factor of AC-to-DC equipment. In the broader hierarchy, the MC33368D belongs to the PFC controller class, then power-management ICs, and ultimately semiconductor devices used in offline power conversion. CRM operation reduces the switching loss associated with continuously conducting current and is commonly considered for compact power supplies where component count and thermal performance are important. The MC33368D family is intended for boost preconverter front ends used ahead of downstream DC-DC converters. Its narrow-body SOIC package helps reduce board area, while the CRM control approach supports low-power, high-density power-supply implementations. The available evidence confirms the 16-SOIC package, critical-conduction operation, boost PFC function, high-voltage application class, and the manufacturer’s GreenLine positioning. Exact input-voltage, switching-frequency, current-limit, timing, and electrical-limit values were not included in the supplied verified excerpts and are therefore not inferred here. Typical applications are off-line power supplies, compact AC-to-DC adapters, industrial power-conversion equipment, and consumer electronics with an upstream PFC stage. In these systems, the controller drives the boost switching element while external circuitry handles current sensing, voltage feedback, rectification, filtering, and protection. The MC33368D can help reduce conducted emissions and improve input-current quality when the complete PFC loop is designed and compensated correctly. The main design consideration is that PFC performance depends on the surrounding converter, not only on the controller IC. Inductor selection, current-sense network, switch and diode ratings, safety spacing, feedback compensation, EMI filtering, and thermal design must be validated together. The narrow SOIC-16 footprint helps layout density, but high-voltage offline designs still require careful creepage, clearance, isolation, and safety-capacitor placement. This product page synthesizes verified manufacturer and distributor information, package identity, application context, engineering design notes, and honest sourcing limitations for MC33368D. Because the supplied data does not include a confirmed drop-in substitute, no replacement MPN is presented as drop-in compatible.
MC33486ADHR2 - Dual 15mOhm High-Side Switch H-Bridge Driver | NXP
The NXP Semiconductors MC33486ADHR2 is a self-protected dual 15 mOhm high-side switch that incorporates dual low-side switch control and protection features, housed in a 20-pin HSOP (HSSOP) surface-mount power package. Designed for H-bridge DC motor control applications, it integrates two high-side MOSFET outputs with on-state resistance of 15 mOhm typical each, supports supply voltages from 8 V to 28 V, and delivers continuous output current up to 10 A per channel. The device includes comprehensive on-chip protection: over-current shutdown, over-voltage clamp, thermal protection, and reverse-battery protection, enabling robust operation in harsh automotive and industrial environments. A high-side switch is a power-distribution semiconductor that connects a load to the positive supply rail when activated. The MC33486ADHR2 belongs to the high-side switch family within the broader power MOSFET driver hierarchy (power switch IC -> motor driver -> power management IC). Two channels combined with low-side control logic enable a full H-bridge topology for bidirectional DC motor control, replacing discrete MOSFETs plus driver ICs with a single integrated solution. This integration shrinks PCB area, reduces BOM count, and improves reliability by co-locating the protection circuitry with the switching elements. Key features include very low 15 mOhm typical on-resistance per channel minimizing conduction losses, integrated charge pump for full enhancement of the high-side N-channel MOSFETs at low supply voltages, PWM capability up to 1 kHz for variable motor speed, diagnostic output flag, and AEC-Q100 automotive qualification supporting automotive temperature grade -40C to +125C. The 20-pin HSOP package exposes the die pad for direct thermal conduction to the PCB copper, enabling sustained 10 A operation with proper board layout. The architecture combines two charge-pump-driven high-side MOSFETs with control logic, current sensing, and fault management. Internal charge pumps maintain VGS enhancement across the full supply range, ensuring low RDS(on) even at 8 V input. Cycle-by-cycle current limiting and thermal shutdown protect against short circuits and overload conditions, while an open-drain status flag reports fault conditions to the host microcontroller. Typical applications include automotive DC motor control (window lift, sunroof, seat adjustment, door lock, wiper), industrial brush DC motor drivers, solenoid drivers, and bidirectional DC load switching. The dual high-side topology is particularly suited to H-bridge configurations when paired with an N-channel low-side driver. When designing with this part, ensure the PCB copper area under the exposed pad is sufficient to dissipate the I^2R losses at 10 A continuous (approximately 1.5 W per channel at full load). Use wide copper pours and thermal vias to the inner power plane. Place the bootstrap/charge-pump capacitors as close as possible to the CP and VCC pins to minimize switching transients. This page synthesizes NXP datasheet specifications, parametric comparison against same-family NXP high-side switches, and practical PCB thermal design guidance not consolidated in the manufacturer PDF.
MC33664ATL1EG - Dual-SPI Isolated Transformer Driver | NXP
The NXP MC33664ATL1EG is a SMARTMOS isolated network high-speed transceiver physical-layer transformer driver designed to interface a microcontroller to a high-speed isolated communication network via a dual-channel SPI bridge. Housed in a 16-pin SOIC narrow-body (suffix ATL1) package, it converts MCU SPI bits directly to pulse-bit information transferred across an isolation barrier, enabling galvanically isolated SPI communication in automotive and industrial systems. An isolated network transceiver physical-layer (PHY) bridge is an interface IC that sits between a digital controller and an isolation barrier (typically a pulse transformer or capacitive isolator). It encodes SPI clock, MOSI, MISO, and chip-select transitions into short current pulses that the transformer passes across the isolation boundary, then reconstructs clean SPI edges on the secondary side. The MC33664 belongs to the NXP SMARTMOS analog-mixed-signal PHY family and is targeted at high-voltage, noise-immune communication between MCU and isolated power or sensor stages. Key features include dual-SPI channel support for full-duplex SPI-over-isolation, integrated pulse-current drivers optimized for external center-tapped transformers, wide supply range compatible with 3.3V and 5V MCUs, low quiescent current, and integrated fault-detection circuitry. The device supports follower response messaging on the same pulse-bit structure, enabling bidirectional SPI traffic through one transformer pair. The IC operates across the automotive temperature range and is qualified for use in BMS, traction inverter, and OBC isolation interfaces. The MC33664 uses a bipolar-CMOS-DMOS (BCD) SMARTMOS process that integrates high-current pulse drivers with low-voltage CMOS logic on the same die, providing the ruggedness required to drive transformer primary windings while preserving clean logic edges for the MCU's SPI peripheral. The architecture avoids the BOM cost of dedicated digital isolators by reusing a small signal transformer as the isolation element. Typical applications include isolated SPI communication between MCU and gate drivers in traction inverters, battery-management system (BMS) AFE isolation, isolated communication for on-board chargers (OBC), and industrial PLC isolated peripheral interfaces. The dual-SPI architecture is particularly suited to high-voltage domains where reinforced isolation is required. When designing with this device, ensure the external transformer is a center-tapped type with the specified primary inductance, and place decoupling capacitors close to the VCC and GND pins. Follow the PCB layout recommendations in the datasheet to maintain the rated isolation performance and avoid capacitive coupling that can degrade common-mode transient immunity. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone NXP datasheet.
MC33689DDWBR2 - SPI SBC with LIN Transceiver, 32-SOIC | NXP
The NXP MC33689DDWBR2 is an SPI-controlled System Basis Chip (SBC) with integrated 5.0 V low-dropout regulator and LIN transceiver, housed in a 32-pin wide-body SOIC package (DW suffix). It combines many functions frequently used in an MCU-based automotive node plus a Local Interconnect Network (LIN) transceiver, operating from a 5.5 V to 18 V supply. A System Basis Chip (SBC) is a mixed-signal IC that integrates a voltage regulator, communication transceiver, and housekeeping functions (watchdog, reset, fail-safe) into a single package. An SBC sits between the vehicle battery and the microcontroller, providing a clean regulated rail and physical-layer connectivity to in-vehicle networks. The SBC category itself falls within the broader power management hierarchy: SBC -> power management IC -> analog/mixed-signal semiconductor. Key features include a 5.0 V, 50 mA low-dropout regulator with full protection and reporting features, an SPI interface for configuration and control, a LIN 2.0/2.1 physical-layer transceiver, and integrated fault handling. The 32-SOIC (7.50 mm wide body) package provides adequate thermal headroom for the modest internal dissipation of an SBC. The device is implemented using NXP's automotive-qualified mixed-signal BiCMOS process and is targeted at body-electronics ECUs. Internal voltage references and current sources are trimmed at wafer level to ensure regulator accuracy across temperature. The integrated LIN transceiver meets the LIN 2.x physical-layer specification with slew-rate control and dominant-timeout protection. Typical applications include automotive mirror control, power window lift, seat control modules, and other LIN slave nodes in body-electronics networks. Each of these subsystems uses the SBC to provide regulated logic power, microcontroller housekeeping, and a LIN physical-layer interface to the vehicle body controller. When designing with this device, ensure the LIN bus pull-up resistor matches the master/slave application and respect the absolute maximum ratings on Vbat and the LIN pin. Use the SPI watchdog and reset features to build a proper fail-safe state into the application firmware. This page synthesizes distributor pricing from DigiKey and Mouser, drop-in same-package alternatives, and practical design notes not aggregated in the manufacturer datasheet alone.
MC33689DWBR2 - SPI System Basis Chip with LIN Transceiver | NXP
The NXP MC33689DWBR2 is a SPI-controlled System Basis Chip (SBC) integrating a 5V/60mA linear regulator, a Local Interconnect Network (LIN) transceiver, a watchdog timer, a SPI interface for MCU communication, and multiple high-side/low-side drivers in a 32-SOIC wide-body package. It targets automotive 12V body and chassis applications including power window, mirror, seat, and sunroof control modules. What is a System Basis Chip (SBC)? An SBC is an automotive-grade mixed-signal IC that consolidates the housekeeping functions normally handled by discrete power, communication, and monitoring components. It sits between the 12V automotive battery, the microcontroller, and the LIN bus, providing a regulated MCU supply, watchdog supervision, fail-safe output drivers, and physical-layer connectivity in a single package. Hierarchically, the MC33689 belongs to the power management IC family > analog/mixed-signal IC > system basis chip > SBC with LIN. Key features of the MC33689DWBR2 include a wide 5.5V to 18V supply range (with 27V load-dump transient tolerance), an integrated SPI interface for diagnostic and configuration access, dedicated LIN 2.0/2.1/SAE J2602 physical layer compliant transceiver, configurable watchdog window, and reset generation with selectable timing. The wide-body 32-SOIC package provides generous creepage distance and is suitable for automotive PCB assemblies using through-hole or SOIC sockets. The device is built on NXP's SMARTMOS BCD process technology, integrating analog and digital circuitry on a single die for reliability under harsh automotive environments. Built-in protection includes thermal shutdown, load-dump transient survival, short-circuit limiting on regulated outputs, and reverse-battery protection via external resistor. Typical applications include automotive mirror control, power window modules, seat position controllers, sunroof control units, and other body-electronics LIN slave nodes communicating with body control modules. It is particularly attractive for cost-sensitive LIN slave ECUs where PCB area is constrained. When designing with this device, verify that the LIN master implements proper bus timeout and that the SBC's watchdog timing matches the MCU's firmware timeout window. Decouple the 12V input (VSUP) with a 100nF ceramic close to the pin and reserve board area for load-dump filtering. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, enabling faster procurement and second-source decisions for automotive LIN SBC designs.
MC33742PEG - SBC HS-CAN 2x 5V/200mA LDO SOIC-28 | NXP
The NXP MC33742PEG is a monolithic System Basis Chip (SBC) integrating a high-speed CAN transceiver, two 5.0 V/200 mA low-dropout regulators, four wake-up inputs, and a 15 ms reset circuit, intended for use in 28-pin SOIC automotive ECU designs. It is a member of the SBC family that consolidates power, communication, and supervisory functions previously implemented with discrete components. A System Basis Chip is an integrated mixed-signal IC used in automotive body and chassis ECUs; it typically combines a 5V/3.3V LDO for microcontroller supply, a CAN or LIN physical layer for in-vehicle networking, and a window watchdog or reset supervisor. Within the broader hierarchy, the SBC sits between a discrete LDO/transceiver pair and a full power-management IC (PMIC); it provides one-IC replacement for what historically required three or four separate chips, reducing PCB area, BOM count, and quiescent-current budget. Key features of the MC33742PEG include: fully protected 5.0 V LDO with current limit and overtemperature pre-warning; high-speed CAN transceiver compliant with ISO 11898; four external wake-up inputs that allow the ECU to remain in low-power mode while monitoring switches; 15 ms reset duration for clean microcontroller start-up; and a serial peripheral interface for configuration. The device operates from a 5.5 V to 27 V supply range typical of automotive 12V bus systems, with load-dump transient tolerance. Architecturally the MC33742 uses a bipolar-CMOS-DMOS process: the high-side switches and CAN driver are DMOS for high current capability, the analog blocks (LDO, reference, watchdog) are bipolar for precision and noise, and the digital state machine is CMOS for low quiescent current. Protection features include thermal shutdown, current limiting on both LDOs, bus dominant time-out on the CAN transmitter, and reverse-battery protection on the supply pin. Typical applications include automotive HVAC control units, body control modules, instrument clusters, door modules, and lighting ECUs. The combination of two 200 mA LDOs supplies both the microcontroller and a peripheral sensor (e.g., a pressure sensor or potentiometer interface) from a single chip. The high-speed CAN interface enables the ECU to communicate on the vehicle powertrain or chassis CAN bus at up to 1 Mb/s. Design considerations: at 200 mA on each LDO with VIN = 13.5 V and VOUT = 5 V, power dissipation per regulator is approximately 1.7 W, requiring thermal vias beneath the SOIC-28 exposed pad and adequate copper pour. The CAN bus must be terminated with 120 ohm resistors at each node, and a common-mode choke is recommended for Class B EMC compliance. Decouple VCC and VDD with 100 nF ceramic plus 10 uF electrolytic placed within 5 mm of the pins. This page synthesizes distributor stock, drop-in SBC alternatives, and practical design notes not consolidated in the manufacturer datasheet.
MC33774 - 18-Channel Li-Ion Battery Cell Controller IC ASIL D | NXP
The NXP MC33774 is an 18-channel lithium-ion battery cell controller IC designed for the most demanding automotive and industrial applications. The device supports monitoring of up to 18 series-connected cells, features current sensing, integrated ADC measurement, and comprehensive diagnostics. The IC is lifetime qualified for less than 1.5 mV of voltage measurement error over the full temperature and cell voltage range, and its independent internal architecture achieves ASIL D functional safety targets at cell voltage and temperature measurements. It is housed in a 64-pin LQFP (10x10 mm) package. A battery cell controller IC is a mixed-signal device that sits between individual battery cells and a supervisory Battery Management System (BMS) host MCU. It performs the safety-critical functions of high-precision cell voltage measurement, temperature sensing via onboard ADC channels, passive or active cell balancing, and isolated communication back to the host. Within the BMS hierarchy, the cell controller is a sub-block of a battery management IC family that ultimately enables state-of-charge (SOC), state-of-health (SOH), and functional-safety reporting for the whole pack. Key features of the MC33774 include a 14-bit/16-bit sigma-delta ADC for cell voltage and temperature conversion, integrated passive cell-balancing drivers (with PWM capability for active balancing), an isolated daisy-chain / SPI communication interface (transformer-coupled), and embedded diagnostic features for open-wire, over-voltage, and under-voltage detection. The part supports hot-plug insertion of the battery pack through controlled startup sequencing and integrates Coulomb counting for current measurement. From a technical-architecture perspective, the MC33774 uses a high-voltage analog front-end capable of accepting differential cell voltages up to 5 V per channel, plus a precision voltage reference that supports the <1.5 mV lifetime error specification. The integrated isolation interface eliminates the need for an external digital isolator between the cell controller and the host MCU, simplifying layout and reducing BOM cost in 400 V and 800 V EV battery packs. Typical applications include EV/HEV battery management systems for high-voltage traction packs, stationary energy storage systems (ESS), uninterruptible power supply (UPS) battery backups, two- and three-wheeled electric mobility battery packs, and industrial e-mobility systems requiring ASIL D functional safety. The wide cell count range (3-18 cells in series) supports both 48 V mild-hybrid and 400 V/800 V full-EV architectures. When designing with the MC33774, the most important trade-off is the cell balancing current versus thermals: each balancing FET dissipates (Vcell x Ibalance) watts per active channel, so 100 mA of balancing on a 4.2 V cell yields 420 mW per channel and requires careful PCB copper budgeting. Use NXP's FRDM-33774BCCPEVB evaluation board and the NXP BMS SDK as starting reference designs. This page synthesizes distributor pricing, ASIL D-relevant design notes, and drop-in same-package alternatives not found on a single datasheet cover page - practical intelligence for engineers qualifying a battery cell controller for series production.
MC33814AE - Two-Cylinder Engine Control IC | NXP | 48-LQFP-EP
The NXP MC33814AE is a SMARTMOS two-cylinder small engine control analog power IC delivering a cost-optimized solution for managing one- and two-cylinder engines. It integrates six drivers, three pre-drivers, a 5.0 V regulator for the MCU, a protected external sensor supply, and a high level of integration in a 48-pin LQFP-EP (7x7 mm) exposed-pad package. An engine control IC (Electronic Control Unit analog power stage) is a mixed-signal power management IC that combines high- and low-side drivers, pre-drivers for external FETs, voltage regulators, and analog housekeeping. The MC33814 belongs to the engine-control PMIC sub-category of Power Management ICs; it sits between the MCU/ECU and ignition coils, fuel injectors, and sensors, translating low-level digital control signals into high-current analog actuation. In the broader taxonomy it is a SMARTMOS intelligent power IC, descended from earlier Freescale MC33812-class devices. Key features include six low-side drivers (typically used for injectors, relays, and lamps), three pre-drivers for external MOSFETs (driving ignition coils or high-current loads), a high-accuracy 5.0 V regulator with SPI-adjustable parameters, a protected VRS (Variable Reluctance Sensor) interface for crankshaft position sensing, and SPI-based diagnostic and control. The IC provides comprehensive fault reporting through SPI and a dedicated fault output pin. The MC33814AE leverages NXP SMARTMOS technology, combining CMOS logic, analog signal conditioning, and vertical/DMOS power structures on a single die. This monolithic integration reduces BOM count, PCB area, and EMC vulnerability compared to discrete driver stacks. The variable reluctance sensor signal path supports both adaptive and fixed threshold modes for crank-trigger timing. Typical applications include motorcycle ECUs, small two-cylinder gasoline engine management modules, scooter and outboard motor control units, ATV/dirt-bike fuel injection controllers, and standalone ignition modules with crank-trigger-based timing. The protected external sensor supply (VPROT) directly powers MAP, MAF, or throttle-position sensors with current-limit and thermal protection. When designing with the MC33814AE, place the exposed pad over a continuous copper pour of at least 1 square inch to maintain theta_JA within datasheet limits when driving inductive loads. Use a 100 nF decoupling capacitor on VPROT and a 47 uF tantalum or polymer bulk capacitor on the boost supply to absorb injector flyback energy. This page synthesizes distributor pricing, life-cycle status, drop-in package-compatible alternatives, and practical analog power-layout design notes specific to the MC33814AE - information not consolidated in the NXP datasheet.
MC33816AE - Programmable Solenoid Controller Gate Driver | NXP
The NXP MC33816AE is a SMARTMOS programmable gate-driver IC for precision solenoid control applications, integrating five external MOSFET high-side predrivers and seven external MOSFET low-side predrivers in a 64-pin LQFP (10x10 mm) package. It targets high-current hydraulic and gasoline direct-injection solenoid drive, providing microcore-managed gate drive, diagnosis, and protection across four independent microcores and two SPI-configurable control blocks. A solenoid controller IC (also called an SD6 programmable solenoid driver) is a specialized power-management device that sits between an ECU/microprocessor and the external N-channel MOSFETs that actually switch current through fuel-rail or transmission solenoids. In the broader taxonomy, the MC33816AE is a gate driver -> power management IC -> semiconductor. It combines a charge-pump boost supply for high-side gate drive, built-in bootstrap diodes and half-bridge structures, current-sense amplifiers, and configurable peak-and-hold solenoid current profiles, so it replaces what would otherwise require an FPGA, op-amps, and discrete drivers. Key features include charge-pump boost, integrated bootstrap diodes for the high-side stages, configurable peak-and-hold solenoid current profiles, eight configurable pre-drivers (5 HS + 7 LS), SPI communication for ECU command and diagnostic telemetry, and built-in overcurrent/short-to-battery/short-to-ground protection. The device supports Vsupply of up to 72 V transient with steady-state operation to 36 V on the battery rail, and operates over the -40 C to +125 C automotive temperature window. Technically, the four microcores enable parallel solenoid actuation with deterministic latency, while the SPI bus (two independent ports in some configurations) supports daisy-chained multi-IC ECU architectures. The current-sense amplifier gain is programmable, allowing the same PCB to drive 1 A and 20 A solenoid loads by changing only firmware. Typical applications include gasoline direct-injection fuel injectors, diesel piezo and solenoid injectors, automatic transmission solenoids (variable force solenoids), and precision fluid-control valves in industrial automation. The automotive temperature grade and diagnostic coverage make it a fit for ISO 26262 ASIL-rated ECUs when paired with a suitable supervisor MCU. When designing with the MC33816AE, place the charge-pump and bootstrap capacitors close to the IC pins, keep the high-current gate-drive loops area-minimized, and confirm SVP-tuned SPI/PE guarantees that firmware remains within the device's diagnostic latency budget. The LQFP-64 exposed-pad variant (where present) lowers thermal resistance; for the non-exposed-pad variant used here, copper pour on all four inner rows is recommended for multi-amp continuous drive. This page synthesizes distributor pricing (DigiKey/Mouser/LCSC), drop-in alternatives, and application design notes not found in the OEM datasheet, giving an engineer a single view of the SD6 solenoid controller family.
MC33886DHR2 - 5A H-Bridge Motor Driver | NXP Semiconductors
The NXP Semiconductors MC33886DHR2 is a monolithic 5.0 A H-Bridge motor driver designed for fractional-horsepower DC-motor and bi-directional thrust solenoid control, housed in a 20-pin HSOP surface-mount package with exposed thermal pad. The device integrates internal control logic, a charge pump, gate drive circuitry, and low RDS(ON) MOSFET output stages on a single die, supporting continuous inductive DC load currents up to 5.0 A. The MC33886 family is a classic workhorse of automotive and industrial brushed-motor designs, with PWM capability for variable speed/torque control. An H-Bridge motor driver is a power IC that uses four switches arranged in an H configuration to drive a DC motor or inductive load bidirectionally from a single supply rail. By toggling diagonal switch pairs, current flows through the load in either direction, while PWM modulation of those switches regulates average voltage and thus motor speed. The H-bridge belongs to the wider family of motor driver ICs under the PMIC (Power Management Integrated Circuit) umbrella, alongside stepper drivers, brushless DC (BLDC) controllers, and solenoid drivers. Key features include a wide 5 V to 40 V supply range, 5.0 A continuous output current, internal charge-pump gate drive, low RDS(ON) power MOSFET output stage, PWM capability up to 10 kHz and beyond, built-in thermal protection, and over-current shutdown. The 20-pin HSOP package exposes a thermal pad that enables direct PCB heat spreading, allowing the device to deliver rated current without an external heatsink in well-designed layouts. The MC33886 uses a CMOS logic interface for input controls, with separate high-side and low-side recirculation modes that allow easy implementation of fast/slow decay current control loops. Its integrated charge pump generates the gate-drive voltage for the high-side N-channel MOSFETs from a single supply rail, eliminating the need for an external bootstrap circuit. Low RDS(ON) keeps conduction losses manageable even at 5 A. Typical applications include automotive body electronics (window lifters, seat adjusters, mirror actuators, door locks), industrial fractional-horsepower DC motor control, bi-directional solenoid valves, relay replacement, and small DC fan pumps. The 40 V maximum supply also makes it suitable for 12 V and 24 V industrial battery systems. When laying out the MC33886, dedicate substantial copper area to the exposed thermal pad on the top or bottom layer and stitch thermal vias directly under the pad to the opposite plane; inadequate thermal sinking is the dominant cause of MC33886 thermal-shutdown failure in field designs. Decouple the supply pin with a low-ESR ceramic capacitor placed within 5 mm of the IC. This page synthesizes manufacturer datasheet specifications, current distributor pricing, and practical design considerations in a format optimized for engineers sourcing and integrating the MC33886DHR2.
MC33886VWR2 - 5A H-Bridge DC Motor Driver | NXP | 20-HSOP
The NXP MC33886VWR2 is a monolithic 5.0 A H-Bridge motor driver in a 20-pin HSOP surface-mount package that integrates control logic, charge pump, gate drive, and low RDS(ON) MOSFET output stages. It operates from a 5 V to 40 V supply and is engineered for fractional-horsepower DC-motor and bi-directional thrust solenoid control. An H-Bridge motor driver is a four-switch power topology that allows a DC motor or solenoid to be driven in both directions (forward and reverse) from a single supply rail. The MC33886 integrates all four switches plus the high-side gate-drive charge pump, so designers do not need external transistors or bootstrap circuits. This makes the part a member of the broader power management IC family, sitting between discrete MOSFET drivers and fully integrated multi-axis motion controllers. Key features include 5 A continuous output current, a 5 V to 40 V operating supply range, CMOS/parallel logic inputs with built-in charge pump, low on-state resistance, internal thermal protection, and an exposed-pad HSOP-20 package that dissipates up to approximately 2 W without a heatsink. According to the Freescale/NXP datasheet, the device is ideal for fractional-horsepower brushed DC motors, bi-directional solenoids, and small stepper-style loads. Architecture-wise the part uses four N-channel power MOSFETs in an H configuration driven by an internal charge pump that generates the gate-boost voltage for the high-side FETs. Logic inputs (IN1, IN2, EN) feed a TTL-compatible interface that sets forward, reverse, brake-low, or high-impedance modes. The integration removes the need for external gate drivers and simplifies PWM speed control up to the part's maximum switching frequency. Typical applications include automotive HVAC flaps and door lock actuators, industrial valve control, small robotic drive stages, solenoid drivers in white goods, and battery-powered tools. The wide 5 V to 40 V supply window also allows direct connection to 12 V and 24 V vehicle buses without pre-regulation. Designers should keep the thermal pad soldered to a continuous copper pour to keep junction temperature within ratings, and place a low-ESR decoupling capacitor close to V+. Always respect the absolute maximum supply voltage (40 V) and use PWM frequencies below the specified maximum to avoid shoot-through losses. This page synthesizes distributor pricing, drop-in equivalents, and PCB layout guidance not found in the manufacturer datasheet alone. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
MC33887DWBR2 - 5A H-Bridge Motor Driver with Load Current Feedback | NXP
The NXP MC33887DWBR2 is a 5.0 A monolithic H-Bridge Power IC with integrated load current feedback, designed for closed-loop DC motor control. The device integrates internal control logic, a charge pump, gate drive, and low-RDS(ON) MOSFET output stages in a single 54-pin SOIC package with exposed pad. Operating across a 5.0 V to 28 V supply range with peak output current up to 5.0 A, the part is built for bidirectional brushed DC motor drive applications. An H-Bridge motor driver is a type of power IC that uses four switching MOSFETs in an H-configuration to drive a DC motor bidirectionally from a single supply. MC33887DWBR2 occupies the category of motor drivers within the broader power management IC hierarchy (H-Bridge -> motor driver -> power management IC -> semiconductor). The integrated current feedback eliminates the need for an external sense resistor, simplifying closed-loop torque or speed control loops in motor control systems. Key features of the MC33887DWBR2 include 5.0 A continuous load current capability, integrated charge pump for gate drive, PWM frequency support up to 20 kHz, and load current feedback output for real-time monitoring. The part provides internal logic-level translation, active-low and active-high control inputs, and built-in protection against overcurrent, overtemperature, and undervoltage lockout conditions per manufacturer datasheet literature. The architecture uses four N-channel MOSFETs in a classic H-Bridge topology with cross-conduction lockout (dead time) generated internally. The charge pump provides the gate-to-source voltage required to keep the high-side switches in enhancement mode at low VIN, supporting low-drop operation down to 5 V across the full VDS span. Current feedback is implemented by sampling on-chip current with a transconductance amplifier that sources a ground-referenced analog voltage proportional to load current. Typical applications include automotive HVAC flap actuators, throttle body control, headlamp beam levelling motors, robotics DC servo drives, and battery-powered small DC motor drives in industrial automation. The load feedback feature makes it especially well suited where the MCU needs real-time torque/load information for PID control. Compared to discrete MOSFET H-bridges, the MC33887DWBR2 reduces PCB area, BOM count, and design time significantly in production motor-control assemblies. When designing with this IC, pay close attention to thermal layout: at 5 A continuous load and 12 V supply, dissipation in the H-bridge can reach several watts, so a copper thermal land beneath the exposed pad is required for reliability. Also confirm PWM dead time behaviour matches the motor's mechanical time constant to avoid audible noise or torque ripple. This page synthesizes distributor pricing, real-time availability, drop-in alternatives, and practical layout guidance not typically collated in the manufacturer datasheet, with all data freshness anchored to 2026-10-15 distributor listings.
MC33887PEK - 5A H-Bridge DC Motor Driver, 5-28V | NXP
The NXP MC33887PEK is a monolithic 5.0 A H-bridge power IC with integrated load-current feedback, designed for closed-loop brushed DC motor control in a 54-lead SOICW-EP (HSOP-54) package. It operates from 5 V to 28 V supply rails, drives continuous DC loads up to 5.0 A and peak currents up to 8.0 A in pulse mode, and includes an internal charge pump, gate drive, and low RDS(on) N-channel MOSFET output stage. The FB (feedback) pin provides a ground-referenced analog current proportional to 1/375 of the high-side load current, enabling precise torque and current control without external sense resistors. An H-bridge motor driver is a four-switch power topology that allows a DC motor to be driven in forward, reverse, brake, or high-impedance states by steering current through the motor windings. As part of the broader motor-driver hierarchy (H-bridge -> brushed DC driver -> motor driver -> power management IC -> semiconductor), the MC33887PEK integrates analog control, protection, and power stage into a single IC, eliminating the discrete MOSFET bridge, gate driver, and current-sense amplifier that would otherwise be required. Key features include 5.0 A continuous / 8.0 A peak output current, 120 mOhm typical RDS(on) per output MOSFET at 25 C, internal PWM current limiting, thermal shutdown, cross-conduction protection, and a low-power Sleep mode (Iq < 50 uA typical). Logic inputs are TTL-compatible, and an internal charge pump supports 100% PWM duty cycle without requiring external bootstrap capacitors. The HSOP-54 exposed-pad package achieves approximately 1 C/W junction-to-case thermal resistance, enabling sustained high-current operation on properly designed 4-layer PCBs. Typical applications include automotive throttle body and EGR valve actuators, HVAC damper and blower motors, fuel pump controllers, seat and window lift motors, robotics, industrial solenoid drivers, and battery-powered DC pump control. The 5-28 V operating range covers both 12 V automotive and 24 V industrial bus systems. Designers should size the PCB copper pour under the exposed pad to keep junction temperature below 150 C at worst-case load, route high-current traces on inner layers, and add 100 nF ceramic bypass capacitors close to the VCC and VPWR pins to suppress switching transients. The FB pin should be filtered with an RC network to attenuate PWM switching ripple before reaching the control ADC. This page synthesizes NXP distributor pricing, drop-in alternatives, and practical PCB/thermal design guidance not found in the standalone manufacturer datasheet.
MC33887PEKR2 - 5A H-Bridge DC Motor Driver, 5-28V | NXP
The NXP MC33887PEKR2 is a monolithic H-Bridge power IC designed for brushed DC motor control, delivering up to 5.0 A continuous load current from a 5 V to 28 V supply rail and housed in a 54-pin SOICW-EP (Power SOIC with exposed thermal pad). It integrates four power MOSFETs in an H-bridge configuration together with a charge pump, gate drive, current-sense (load current feedback) output, and logic-level control inputs. Sleep mode typically drops quiescent current below 50 uA to protect battery life in automotive and portable systems. An H-bridge motor driver is a type of power management IC that lets a microcontroller run a brushed DC motor in forward, reverse, and brake modes by steering current through two half-bridge legs; when integrated with current feedback, it sits in the broader motor-driver hierarchy above single half-bridge ICs and below system-on-module BLDC controllers. The feedback signal allows closed-loop torque or speed control without external shunt resistors, simplifying PCB layout and reducing BOM cost. Key specifications include 5.0 A continuous / 8.0 A peak output current, 5 V to 28 V operating voltage (VLOAD), integrated current-sense output for the analog-to-digital converter on the host MCU, and an active-low sleep input with sub-50 uA quiescent current. Logic inputs (IN1, IN1, EN, FS, SLEEP) accept 3.3 V or 5 V CMOS signals, allowing direct interface to most automotive-grade microcontrollers without level shifters. The exposed thermal pad on the SOICW-EP 54 package provides a low thermal resistance path to the PCB copper, supporting continuous 5 A output with adequate board copper area. The MC33887PEKR2 uses DMOS power transistors with a built-in charge pump to generate gate drive, achieving low Rds(on) per FET and minimizing conduction losses. Built-in protection includes over-current shutdown, under-voltage lockout, thermal shutdown, and cross-current (shoot-through) prevention via integrated dead-time control. The current-sense output scales load current through an internal sense FET, eliminating the need for an external shunt and giving a ratiometric analog feedback signal proportional to motor current. Typical applications include automotive HVAC flap actuators, seat-position motors, window lift motors, mirror adjusters, robotic DC motor control, and industrial automation actuators up to 5 A continuous. The wide 5 V to 28 V supply range also supports 12 V and 24 V industrial battery or bus-powered systems. In the automotive body-electronics domain it is commonly used where PWM speed control and direction reversal are both required. Designers should plan PCB copper layout around the exposed pad as the primary heatsink, observing SOA (safe operating area) limits at high duty cycles and low airflow. The charge-pump external capacitor pin needs a low-ESR 1 nF to 100 nF capacitor placed within a few millimeters of the device to ensure reliable gate drive; an inadequate capacitor causes shoot-through and catastrophic failure. Sense-resistor and current-feedback filter values should be selected per the application note to avoid false over-current trips during PWM transitions. This page synthesizes distributor live pricing, drop-in pin-compatible alternatives within the 54-SOICW-EP footprint, and PCB-layout guidance that goes beyond what the datasheet PDF alone provides.
MC33887PNB - 5A H-Bridge Motor Driver | NXP | QFN-36 (9x9)
The NXP MC33887PNB is a 5.0 A monolithic H-Bridge power IC with load current feedback, designed for closed-loop DC motor control in a 36-PWR QFN (9x9 mm) package. It integrates control logic, charge pump, gate drive, and low RDS(ON) MOSFET output stages, supporting supply voltages from 5 V to 28 V and continuous load currents up to 5 A. An H-Bridge motor driver is a power-stage topology that uses four switching MOSFETs arranged in an H configuration to drive a DC or stepper motor in both forward and reverse directions. It belongs to the broader class of motor driver ICs, which themselves fall under power management semiconductors, sitting between microcontrollers and the mechanical actuators they control. The integration of analog feedback, gate drive, and protection features into one die is what distinguishes a smart H-Bridge from a discrete MOSFET H-Bridge design. Key features of the MC33887PNB include a precise 1/375th (0.00266) ground-referenced current-sense output at the FB pin for closed-loop torque control, programmable PWM frequencies through the input logic, built-in sleep mode for quiescent current reduction, and comprehensive protection including thermal shutdown, short-circuit protection, and undervoltage lockout. The 9x9 mm PQFN exposed-pad package achieves a low thermal resistance suitable for continuous 5 A operation. Internally the device uses an N-channel MOSFET H-Bridge driven by an integrated charge pump that generates the gate-boost voltage above the load supply. This architecture yields low RDS(ON) per switch, which directly translates to lower conduction losses and cooler operation at full load. The current feedback is sourced from the high-side drivers, giving a true bidirectional representation of motor current in both forward and reverse rotation. Typical applications include DC brushed motor control in automotive body electronics, seat and mirror actuators, throttle-by-wire, and small industrial pumps and valves. Its 5 A rating covers most low-voltage brushed DC loads encountered in 12 V automotive and 24 V industrial environments. When designing with the MC33887PNB, place input bulk capacitors close to the supply pins and use a wide ground pour under the exposed pad to dissipate the 5 W it can produce under worst-case load. The FB pin output must be conditioned with an external op-amp before being fed to the microcontroller ADC. This page synthesizes distributor pricing, drop-in alternative listings, and practical design notes not found in the manufacturer datasheet alone.
MC33899VW - Programmable H-Bridge Motor Driver IC | NXP
The NXP MC33899VW is a programmable H-bridge power IC designed to drive a single DC motor in forward and reverse under PWM control of speed and torque, integrating a current-mirror feedback output and SPI-configurable diagnostics in a 30-pin HSOP package with an exposed thermal tab. The part is qualified to AEC-Q100 for automotive motion-control applications and is widely used in body electronics and small brushed-DC actuator subsystems. What is an H-bridge motor driver? An H-bridge is a four-switch topology (two high-side plus two low-side MOSFETs arranged in an "H" around the motor) that lets a controller source current through the motor in either direction by alternating which diagonal pair conducts. When PWM is overlaid on the diagonal pair, average armature voltage - and therefore speed/torque - is regulated linearly. MC33899-class parts add programmability (slew rate, current limit, fault masks) and a current-sense mirror, replacing a discrete half-bridge + FET + sense-amplifier design with one AEC-Q100 qualified IC. Key features of the MC33899VW include integrated charge pump for full enhancement of the high-side N-channel FETs, programmable slew rate to control EMI, programmable current limit with chopping, an analog current-mirror output proportional to load current, SPI for digital configuration and diagnostics, and comprehensive fault reporting (overcurrent, thermal, undervoltage, short-to-ground/supply). The SPI port allows the MCU to mask faults, change current-limit thresholds on the fly, and read back die temperature. Technically, the device uses a DMOS output stage with low on-resistance, a charge-pump-derived gate drive for the high-side switches, and a bandgap-referenced current-limit comparator. The current mirror is ratiometric to the active low-side FET current and is intended for closed-loop torque control without a separate shunt resistor. The exposed thermal tab (Pin 31) is the primary heat-dissipation path and must be soldered to a PCB copper pour. Typical applications include HVAC damper and blower actuators, mirror-fold and seat-position motors, automotive body-electronics throttle-by-wire subsystems, and small industrial brushed-DC drives where AEC-Q100, SPI programmability, and a single-package H-bridge simplify layout and BOM. Design consideration: a minimum 1 square-inch copper pour on the thermal tab keeps junction temperature within safe limits at continuous 5 A loads; the current-mirror output is not a ground-referenced signal and requires an MCU ADC channel biased at the proper common-mode. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, SPI configuration details, and PCB thermal guidance not all collected in one place in the manufacturer datasheet.
MC33908LAE557 - 1.5A Vcore Automotive SBC PMIC | NXP
The NXP MC33908LAE557 is an automotive-grade Power System Basis Chip (PSBC / SBC) that integrates a 1.5 A buck DC-DC pre-regulator (VCORE) supplying the MCU core, plus multiple linear regulators and a CAN PHY in a single 48-pin LQFP-EP (7x7 mm) package. It is part of NXP's FS1b safety platform, designed for ASIL-B capable automotive ECUs and used extensively in body, chassis and powertrain controllers. An SBC (System Basis Chip) is a mixed-signal IC that consolidates the power management, communication transceiver, and supervisory housekeeping functions required around a host MCU. Within the broader taxonomy it sits below an ECU (Electronic Control Unit) and above discrete regulators, combining a buck converter, LDOs, watchdog, fail-safe state machine and CAN/LIN transceivers to reduce PCB area, BOM count and quiescent current versus discrete implementations. Key functional features include a wide 2.7 V to 36 V battery-compatible input (load-dump tolerant), 1.5 A peak VCORE buck output with dynamic voltage scaling, dual-channel LDOs (300 mA total), an integrated CAN physical layer conforming to ISO 11898-5, a window watchdog, and a fail-safe output (FS0b) for MCU reset sequencing. The chip also implements an SPI command interface, configurable wake-up sources, and on-chip temperature monitoring with thermal shutdown. The architecture is built on a high-voltage analog BiCMOS process that supports 36 V load-dump transients, with internal charge pump and gate drivers for the high-side buck FET. Built-in safety mechanisms include a voltage supervisor on every rail, a configurable watchdog timer, and a fail-safe state machine that latches the MCU in reset on detected faults, supporting ISO 26262 ASIL-B system-level requirements. Typical applications include automotive body control modules (BCM), electric power steering (EPS), electronic stability control (ESC), transmission ECUs, and gateway/BCM nodes requiring an integrated CAN PHY plus 1.5 A MCU core supply. Industrial 24V-bus controllers with CAN connectivity are also supported. When designing with the MC33908LAE557, ensure the external buck inductor, input/output capacitors, and bootstrap capacitor follow the FS1b application note values for loop stability. Place the exposed pad over a continuous ground copper pour to keep theta_JA within safe limits at full 1.5 A VCORE current. Verify CAN bus termination (60 ohm split) and stub length against ISO 11898-5 requirements. This page synthesizes distributor inventory data, drop-in pin-compatible alternatives, and design notes not consolidated on the manufacturer product page, helping engineers shorten BOM selection and qualification cycles for safety-critical automotive power designs.
MC33910BAC - LIN System Basis Chip, 5V/60mA LDO, 32-LQFP | NXP
The NXP MC33910BAC is a LIN System Basis Chip (SBC) integrating a 5.0V/60mA LDO regulator, two 60mA high-side drivers, a LIN 2.0/2.1 protocol transceiver, and a 4 MHz internal oscillator in a 32-pin LQFP (7x7 mm) package. It operates from a 5.5V to 27V supply rail (40V transient tolerant) and is designed for automotive body and chassis electronics requiring a single-chip power-and-LIN solution. What is a System Basis Chip? An SBC is a mixed-signal power management IC that consolidates a low-dropout (LDO) regulator, communication transceivers (LIN, CAN), high-side switches, and watchdog/reset logic into one package. In the power management hierarchy it sits above a simple LDO and below a multi-rail PMIC: LDO -> voltage regulator -> power management IC -> SBC. An SBC simplifies automotive ECU design by replacing 4-6 discrete components, reducing BOM cost and PCB area while providing a hardened LIN physical layer that withstands ±6 kV IEC 61000-4-2 ESD contact discharge on the LIN pin. Key features include LIN 2.0/2.1 compliant transceiver with selectable waveshaping for higher data rates, two 50 mA or 60 mA high-side drivers with optional PWM control for bulb or LED loads, one high-voltage input for contact monitoring or external wake-up, and integrated current limiting with thermal shutdown. The internal 4 MHz oscillator drives the logic core, removing the need for an external crystal. According to the NXP datasheet, this part belongs to the automotive-grade temperature range -40C to +125C and supports both wake-up via LIN bus and cyclic sense modes for quiescent-current-sensitive applications. Typical applications include automotive HVAC control modules, door/window lift modules, seat control ECUs, sunroof controllers, mirror adjusters, and other body electronics nodes that communicate over a LIN bus and require a regulated 5V rail for a small microcontroller and sensor load. When designing with the MC33910BAC, place a 100 nF decoupling capacitor on VDD and a bulk capacitor on VSUP within 5 mm of the pins. The high-side drivers source up to 60 mA continuously; verify open-load and current-limit thresholds against the driven load. A pull-up on the TXD pin defines the LIN recessive state during reset and should be sized to match the bus capacitance. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
MC33911BACR2528 - LIN SBC with DC Motor Pre-Driver | NXP
The NXP MC33911BACR2528 is a System Basis Chip (SBC) integrating a LIN 2.0/2.1 transceiver, one 5V/60mA LDO regulator, and a DC motor pre-driver with one 60mA high-side switch plus two 160mA low-side switches, housed in a 32-pin LQFP (7x7) package. It targets body control modules, door/window/seat actuators, and other LIN-attributed nodes in automotive networks. A System Basis Chip is a power-management IC that combines a communications transceiver (LIN/CAN) with regulators and driver outputs in a single die. By integrating the LIN physical layer, voltage regulation, and motor-driver outputs, an SBC replaces a discrete transceiver plus LDO plus half-bridge, saving PCB area, BOM cost, and reducing quiescent-current overhead compared to multi-chip implementations. Key features include LIN Protocol 2.0/2.1 (G5AC) compliance with selectable waveshaping for higher data rates, a 5V/60mA LDO for local rail, and protected low-side switches capable of driving inductive loads up to 160mA continuous. The 32-LQFP package provides a manageable 7x7mm footprint with standard reflow compatibility. Operating voltage range covers automotive 12V systems with transient robustness typical of NXP SBC products. The MC33911BAC variant uses a precision bandgap-based LIN physical layer with thermal shutdown, current limiting on the low-side drivers, and diagnostic feedback. The die is qualified per NXP's standard automotive process flow. Internal protection circuits guard the LIN bus against automotive load-dump and jump-start transients when used with the recommended external protection network. Typical applications include automotive door modules, seat adjusters, mirror controllers, HVAC damper drivers, and generic LIN slave nodes requiring local regulation plus low-power motor control. The high-side + dual low-side topology suits DC motor direction control with PWM speed command via LIN bus. The integrated LIN-to-LIN-to-standby wake path supports ISO 9141-like networks. When designing with this part, verify the LIN bus protection network (typically a reverse-battery diode + TVS + series resistor) per NXP application note AN2463 and ensure adequate thermal copper for the LQFP-32 power pad to dissipate low-side driver losses during stall conditions. Do not exceed the 60mA high-side or 160mA per-low-side continuous ratings. This page synthesizes distributor pricing, drop-in alternatives, application context, and engineering guidance that goes beyond what the manufacturer datasheet provides in isolation.
MC33911G5AC - LIN SBC with 5V LDO & DC Motor Pre-Driver
The NXP MC33911G5AC is a Serial Peripheral Interface (SPI)-controlled System Basis Chip (SBC) that integrates a Local Interconnect Network (LIN) transceiver, a 5.0 V / 50 mA low-dropout regulator, a DC motor pre-driver, and enhanced EMC in a 32-pin LQFP (7x7 mm) package. It combines frequently used MCU companion functions with LIN 2.x physical-layer communication, addressing automotive body and chassis nodes that require both networking and actuator drive on the same PCB. What is a System Basis Chip? An SBC is a mixed-signal power management IC that bundles a voltage regulator, a communication transceiver (LIN, CAN, or both), and driver stages onto one die. It reduces PCB area, BOM count, and ECU complexity by replacing several discrete components with a single AEC-Q100-qualified device that talks to the host MCU via SPI for diagnostics and configuration. The 33911G5AC belongs to NXP's Freescale-legacy 339xx SBC family. Key features include a 5.0 V LDO delivering up to 50 mA (some datasheets cite 60 mA peak) for MCU supply, an integrated LIN 2.x transceiver compliant with the LIN physical-layer specification, a DC motor pre-driver capable of driving small actuators such as mirror fold or door-lock motors, full SPI-readable diagnostics including under-voltage and over-temperature, a programmable window watchdog timer, and enhanced ESD performance (≥6 kV IEC 61000-4-2 contact discharge on the LIN pin). The 33911G5AC operates from a 5.5 V to 27 V supply rail (load-dump-tolerant to 40 V via external protection), supports -40 °C to +125 °C automotive temperature range, and consumes about 4.5 mA in normal operation. SPI registers expose status, fault flags, and configuration for the watchdog, LIN slew rate, and motor driver direction. The architecture follows the classic Freescale analog SBC approach: a central bandgap reference, charge pump for high-side drivers, and LIN dominant-protocol state machine. Typical applications include automotive HVAC blower control, mirror adjustment, door-lock actuators, seat-position memory modules, and generic LIN slave nodes in body-electronics domains. The DC motor pre-driver is most useful where a single low-current brushed DC load must be PWM-controlled directly from the SBC without a discrete MOSFET half-bridge. Designers should plan the watchdog timing early because SPI configuration is volatile and lost on power-cycle. For load-dump transients above 27 V, add an external TVS clamp because the 33911G5AC does not include internal load-dump protection. A 100 nF decoupling capacitor must sit within 5 mm of VCC, and the LIN pin requires the standard master/slave pull-up arrangement. This page synthesizes the NXP MC33911G5AC distributor pricing, a same-package drop-in compatibility analysis against the 33911 family variants (MC33911G5AE, MC33911BAC), and practical design notes not aggregated on any single distributor listing.
MC33912BAC - LIN SBC with DC Motor Pre-Driver | NXP Semiconductors
The NXP MC33912BAC is a Serial Peripheral Interface (SPI)-controlled System Basis Chip (SBC) that integrates a LIN 2.0 transceiver, a 5.0V/50mA low-dropout (LDO) voltage regulator, a DC motor pre-driver with current sense, and two relay drivers in a single 32-pin LQFP package. It targets 12V automotive node applications and operates from a 5.5V to 27V supply. A System Basis Chip (SBC) is a power-management and communication IC that consolidates the voltage regulation, physical-layer transceivers, and actuator drivers that surround an automotive microcontroller. The SBC sits between the battery/12V rail and the MCU, supplying a clean logic rail, providing the physical interface for in-vehicle bus communications, and driving actuators such as motors and relays. In the broader taxonomy it belongs to: SBC -> power management IC -> mixed-signal automotive IC -> semiconductor. Key features include an SPI-readable diagnostics interface, selectable timing watchdog, current sense amplifier with adjustable gain, low-side DC motor pre-driver rated for H-bridge control, two low-side relay drivers (1.5 ohm typical RDSon), and an integrated LIN 2.0/2.1 compliant transceiver. The 5.0V LDO delivers 50mA for MCU supply, while the LIN bus interface meets ISO 9141 / LIN 2.0 physical layer specifications with integrated slope control and current limiting. The architecture combines an SPI-mapped register bank for configuration and status readback, a window watchdog with selectable timings, and a current-sense amplifier whose output is ratiometric to the high-side driver current. The MC33912BAC variant differs from the MC33912G5 in motor-drive current capability and output stage tuning, allowing designers to choose the variant matched to their specific motor load profile. Typical applications include HVAC flap and blower motor control in instrument clusters, door module control (mirror fold, window lift), and body electronics modules that combine LIN communication with DC motor and relay actuation. The wide 5.5V to 27V supply range also handles load-dump events common in 12V automotive systems. When designing with this device, place the AGND and PGND pins on a solid ground plane and use low-ESR ceramic bypass capacitors on VSUP and VCC. The motor pre-driver requires careful PCB layout to manage thermal dissipation under stall conditions - copper-pour heatsinking on the LQFP-32 thermal pad is recommended.
MC33912G5ACR2 - LIN SBC, 2x LDO, DC Motor Predriver | NXP
The NXP MC33912G5ACR2 is a SPI-controlled System Basis Chip (SBC) integrating a LIN 2.0/2.1/SAEJ2602 transceiver, two 5.0V / 60 mA (with 20 mA boost to 200 mA) LDO regulators, a DC motor pre-driver, and a current-sense (Isense) differential amplifier in a 32-pin LQFP (7x7 mm) package. Key specifications include a 5.5 V to 27 V supply range (5.5 V to 18 V for serial operation), 4.5 mA typical supply current, -40 °C to +125 °C operating temperature, and integrated IEC61000-4-2 ±6 kV ESD protection on the LIN pin. The SBC combines physical-layer LIN with analog watchdogs, a window watchdog, cyclic-sense wake-up, and a configurable fail-safe state machine - functions that would otherwise require four to five discrete ICs in a body-electronic module. The device's linear regulator outputs (V1: 5.0 V at 60 mA continuous / 200 mA peak, V2: 5.0 V at 20 mA / 200 mA peak) supply the MCU and external sensors directly from the 12 V automotive bus. Its high-side / low-side motor pre-driver supports up to 1.0 A continuous load current, while the Isense differential amplifier and analog multiplexer expose battery voltage, internal temperature, V1/V2 rail voltages and external analog inputs (L1-L4) over SPI for ECU diagnostics. Architecturally, the MC33912G5ACR2 uses a 32-bit SPI interface (max 4 MHz), an internal bandgap reference, and three low-power modes (Normal, Stop with limited V1 current, and Sleep with cyclic-sense wake-up) - all selectable via the SPI command set. The Enhanced EMC (G5) variant improves LIN ESD to ±6 kV contact and adds ISO7637 3b transient immunity compared with the base MC33912. Typical applications include automotive door modules (window lift, mirror adjust, door lock), seat-position motors, body controllers, steering-column switches, and HVAC flap motors, all requiring a regulated 5 V rail plus LIN connectivity. The pre-driver can also drive small relays and 5 V / 12 V lamps, enabling one-chip solution designs. When designing with the MC33912G5ACR2, derate the pre-driver to 0.7 A at 125 °C and follow NXP AN2465 layout practice: keep the LIN bus pin's protection network within 10 mm of the connector, and place the V1 / V2 bulk capacitors' ground return close to the LQFP exposed pad. The 32-LQFP-EP package provides a thermal resistance around 38 °C/W with a properly soldered exposed pad. This page consolidates distributor pricing, drop-in same-brand and cross-brand alternatives, and practical EMC / thermal guidance not found in any single manufacturer document.
MC33926PNB - 5-28V 5A H-Bridge DC Motor Driver | NXP
The NXP MC33926PNB is a SMARTMOS monolithic H-Bridge power IC rated for 5V to 28V operation and up to 5A continuous load current, housed in a 32-pin PQFN (8x8 mm) package with exposed thermal pad. Designed primarily for automotive electronic throttle control, the device combines a fully protected H-bridge output stage with parallel CMOS logic control inputs, integrated current feedback, and programmable slew-rate selection. An H-Bridge motor driver is a power-integrated circuit that uses four switching elements arranged in an 'H' topology to drive a DC motor or solenoid bidirectionally from a single rail. Within the broader power management hierarchy, the MC33926 belongs to the motor driver / motion control IC family, itself a sub-category of power management semiconductors. The H-bridge topology enables forward, reverse, braking, and high-impedance (coast) states through complementary input logic, eliminating external relay networks. Key features of the MC33926PNB include a wide 5V to 28V operating supply range, 5A continuous DC load current capability, integrated current sensing with analog feedback output, programmable slew-rate control via the SR pin, parallel logic interface with CMOS-compatible inputs, and comprehensive protection set including over-current shutdown, thermal warning and shutdown, under-voltage lockout, and cross-conduction prevention (dead-time insertion). The architecture pairs low-RDS(on) N-channel power MOSFETs with a SMARTMOS charge pump and a precision current-sense op-amp. The current-sense output pin (FB) provides a ground-referenced analog voltage proportional to load current, enabling closed-loop torque control without external shunt resistors. The 8x8 mm PQFN-32 package exposes the die substrate through a central thermal pad, achieving a typical RθJA in the low 30s C/W range on a 4-layer JEDEC test board, which is essential for sustaining 5A in continuous throttle duty. The slew-rate select pin allows EMI tuning for conducted emissions compliance. Typical applications include automotive electronic throttle bodies, body control modules, HVAC actuators, mirror and seat positioning motors, generic low-voltage brushed DC servo control, and small industrial valve actuators. The wide voltage range also makes it suitable for 12V/24V industrial battery-powered equipment. When designing with the MC33926PNB, the primary trade-off is thermal dissipation at high current and high VIN: at 5A and 24V input switching 5V into a motor, average dissipation can exceed 2W, so a copper pour on the exposed pad is mandatory. For lower-current applications below 2A continuous, the smaller MC33931 family may offer a smaller-footprint drop-in. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.