10AS032H2F34E2LG vs 10AS032H2F35E1HG 对比
详细并排对比 10AS032H2F34E2LG 出自 Intel 和 10AS032H2F35E1HG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10AS032H2F34E2LG | 10AS032H2F35E1HG |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,380.00 | $1,293.00 |
| Family | Arria 10 SX | — |
| Device Tier | 10AS032 (mid-density) | — |
| Configuration | SoC FPGA (HPS + FPGA fabric) | Serial (E1 suffix) |
| Logic Elements | 320,000 | 320,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Operating Frequency | 1.5 GHz | — |
| 封装 | 1152-ball FC-FBGA (F34), 35 x 35 mm | 1152-ball FCBGA (35 x 35 mm) |
| Speed Grade | 2 | — |
| Temperature Grade | E2 (commercial/extended) | — |
| On-chip Memory (M20K blocks) | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] | — |
| DSP Blocks | Variable-precision, IEEE 754 single-precision FP support | — |
| Transceivers | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] | — |
| Memory Controller Hard IP | DDR4, DDR3, QDRII+, RLDRAM3 | — |
| Process Node | 20 nm | 20 nm [DATA_NEEDED: exact process geometry per Intel datasheet] |
| 安装类型 | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| RoHS 状态 | Compliant | Compliant [DATA_NEEDED: per specific PCN or compliance certificate] |
| Form of Terminal | Ball (BGA) | — |
| Terminal Pitch | 1 mm | — |
| Device Family | — | Arria 10 SX SoC FPGA |
| Product Type | — | System-on-Chip (SoC) FPGA |
| Processor Core | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| User I/Os | — | 384 |
| Maximum Transceiver Data Rate | — | 1.5 GHz [DATA_NEEDED: actual Gbps line rate per protocol] |
| Operating Temperature Grade | — | Industrial (E1) |
| 电源电压 | — | [DATA_NEEDED: core/aux/HPS voltage rails per datasheet] |
| MSL 等级 | — | [DATA_NEEDED: MSL rating from JEDEC J-STD-020] |
| Hard Processor System | — | HPS with Cortex-A9 dual core, L1/L2 cache, peripherals |