10AS032H2F34E2LG - Arria 10 SX 320 SoC FPGA, 320K LE | Intel
料号： 10AS032H2F34E2LG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2070.09 | $2,070.09 |
| 10 | $1850 | $18,500.00 |
| 100 | $1650 | $165,000.00 |
| 250 | $1500 | $375,000.00 |
| 500 | $1380 | $690,000.00 |
10AS032H2F34E2LG 概述
A SoC FPGA is a heterogeneous compute device that combines a general-purpose processor subsystem (HPS) with programmable FPGA fabric on the same silicon die, connected by a wide high-bandwidth interconnect. The Arria 10 SX family is fabricated on Intel's 20 nm process and targets mid- to high-performance embedded applications where designers need both deterministic hardware acceleration (parallel DSP, custom I/O protocols) and a Linux-capable application processor on one chip, reducing board area, power, and BOM compared to a discrete FPGA-plus-microprocessor solution.
Key features include 320K logic elements, embedded M20K memory blocks totaling approximately 21 Mb of on-chip RAM, variable-precision DSP blocks supporting IEEE 754 single-precision floating-point at up to 1.5 GHz, transceivers rated up to 14.1 Gbps, and hard memory controllers for DDR4/DDR3/QDRII+/RLDRAM3. The HPS block includes dual 32-bit ARM Cortex-A9 cores, NEON media engine, single- and double-precision FPU, L1 cache per core, 512 KB shared L2 cache, and a rich peripheral set including USB 2.0, Gigabit Ethernet, NAND flash controller, and SD/SDIO/MMC interfaces.
Typical applications include wireless baseband processing (4G LTE small cells, CPRI front-haul), radar signal processing, video broadcast and studio equipment, medical imaging, and industrial machine vision. Designers select the 10AS032 over the smaller 10AS022 and larger 10AS066 to balance logic, DSP, and transceiver resources against cost and power for mid-density workloads.
Design considerations: 1152-ball FC-FBGA requires high-density PCB stack-up with microvia and HDI technology; route length matching must be enforced for DDR4 interfaces; heat dissipation at full transceiver utilization may require a heatsink or forced-air cooling; the HPS boot sequence requires a valid boot source (QSPI flash, SD card, or NAND).
This page synthesizes distributor pricing, family-level drop-in alternatives from the same Arria 10 SX tier, and design notes that complement the device datasheet.
直接替换替代料： 10AS032H2F34E2LG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AS032H2F34E2LG （相同外形与封装尺寸） ——差异在于 Package, Mounting Type, Configuration, Package Code, DSP Blocks.
快速对比工具——选择替代料号进行并排对比：
10AS032H1F34E1HG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1755 / 个
查看数据手册 →10AS032H2F34E1HG
✅ 直接替换✓ 有现货
$1227.9 / 个
查看数据手册 →10AS032H2F34E3LG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10AS032H1F35E1HG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2540 / 个
查看数据手册 →10AS032E4F34I3SG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10AS032H2F34E2LG 最大额定值与电气特性
| Family | Arria 10 SX |
| Device Tier | 10AS032 (mid-density) |
| Configuration | SoC FPGA (HPS + FPGA fabric) |
| Logic Elements | 320,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | 1.5 GHz |
| 封装 | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| Speed Grade | 2 |
| Temperature Grade | E2 (commercial/extended) |
| DSP Blocks | Variable-precision, IEEE 754 single-precision FP support |
| Memory Controller Hard IP | DDR4, DDR3, QDRII+, RLDRAM3 |
| Process Node | 20 nm |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
| Form of Terminal | Ball (BGA) |
| Terminal Pitch | 1 mm |
10AS032H2F34E2LG 1152-ball fc-fbga (f34), 35 x 35 mm 引脚配置指南
10AS032H2F34E2LG（1152-ball fc-fbga (f34), 35 x 35 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AS032H2F34E2LG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AS032H2F34E2LG 适用于 6 应用s: Wireless Baseband Processing (4G/LTE Small Cell), Radar Signal Processing, Video Broadcast and Studio Equipment, Medical Imaging (Ultrasound / MRI Receiver), Industrial Machine Vision, 5G fronthaul and CPRI/eCPRI Aggregation.
Wireless Baseband Processing (4G/LTE Small Cell)
The 10AS032H2F34E2LG fits mid-density 4G/LTE small-cell baseband processing because its 320K logic elements, 14.1 Gbps transceivers, and integrated dual-core ARM Cortex-A9 HPS handle CPRI front-haul, PHY layer DSP, and L2/L3 stack on one device. The HPS runs the protocol stack and OAM while the FPGA fabric accelerates FFT, channel coding, and crest-factor reduction with deterministic throughput. Designers place CPRI via transceivers to the radio unit, dedicating fabric DSP blocks to the baseband pipeline, and use the hard DDR4 controller for shared L2/L3 buffers. The Arria 10 architecture's variable-precision DSP and 20 nm process deliver a favorable performance-per-watt ratio for outdoor small-cell deployments where thermal headroom is limited. Compared with discrete FPGA-plus-CPU designs, the SoC integration eliminates a chip, reduces board area, and simplifies timing closure between the stack and accelerator.
推荐
Radar Signal Processing
The 10AS032H2F34E2LG supports phased-array radar signal processing where mid-density logic, fast transceivers, and a Linux-capable HPS accelerate the full chain: ADC deserialization, pulse compression, Doppler processing, and CFAR detection. Transceivers up to 14.1 Gbps interface directly to JESD204B/C ADCs at multi-GSPS rates, while the FPGA fabric runs FFT-based range-Doppler maps. The ARM Cortex-A9 HPS handles track formation, classification, and network uplink with deterministic latency. Designers typically allocate 60-70% of logic for the DSP pipeline and dedicate the HPS to control-plane tasks. The 20 nm process and on-chip M20K memory blocks keep per-channel power low, which is critical for airborne or vehicle-mounted radar where every watt raises thermal load. Compared to a pure FPGA design, the integrated HPS removes a separate SoM, reducing SWaP-C for size, weight, power, and cost.
推荐
Video Broadcast and Studio Equipment
The 10AS032H2F34E2LG targets broadcast video processing - SDI routing, up/down/cross conversion, HDR mapping, and IP-based SMPTE ST 2110 transport - where mid logic density, multi-rate transceivers, and an integrated HPS for network and control processing fit cleanly. The FPGA fabric handles 12G-SDI physical interfaces, frame-buffer memory, and lookup-table color transforms, while the HPS runs the control plane for NMOS IS-04/IS-05, PTP timing, and web UI. Hard DDR4 controllers feed large frame buffers needed for 4K/UHD upconversion, and the 14.1 Gbps transceivers drive 25G Ethernet for ST 2110-20 essence streams. The SoC integration reduces rack-unit count in studio equipment and shortens design cycles by consolidating processing onto one chip. Compared to a pure-FPGA design, the HPS lets broadcast engineers run Linux control software without a separate SBC.
推荐
Medical Imaging (Ultrasound / MRI Receiver)
The 10AS032H2F34E2LG supports mid-channel-count medical imaging where parallelism, deterministic latency, and regulatory compliance are essential. Transceivers capture raw data from JESD204B ADCs at high lane rates, while the FPGA fabric runs beamforming for ultrasound or FFT-based reconstruction pipelines for MRI receivers. The dual ARM Cortex-A9 HPS executes patient-interface software, network protocols, and DICOM upload, all on the same device. The 20 nm process and integrated DSP blocks achieve the throughput required for real-time imaging, while the SoC architecture simplifies IEC 62304 and FDA cybersecurity documentation by consolidating the processing chain. Designers typically dedicate most logic to the imaging pipeline and use the HPS for UI, storage, and network. Compared to discrete solutions, this part reduces PCB footprint, enabling more compact cart-based or handheld imaging systems.
推荐
Industrial Machine Vision
The 10AS032H2F34E2LG fits industrial machine vision lines where multiple cameras stream at high frame rates and the system must run both image processing and a Linux-based HMI/network stack. The FPGA fabric handles Bayer demosaic, lens correction, blob detection, and AI inference preprocessing, while the HPS runs the HMI, OPC-UA, and PLC protocols. Hard DDR4 controllers buffer multi-stream video, and the 14.1 Gbps transceivers drive CoaXPress or 10 GigE Vision cameras. The SoC architecture consolidates two-chip designs onto one device, cutting PCB area, BOM, and supply-chain risk for factory-floor deployments. Designers typically allocate 50-70% of logic to image processing and use the HPS for industrial protocol stacks. Compared to GPU-based vision systems, the Arria 10 SX delivers deterministic latency and lower power per channel for high-speed inspection.
推荐
5G fronthaul and CPRI/eCPRI Aggregation
The 10AS032H2F34E2LG suits 5G fronthaul aggregation where multiple remote-radio units converge through CPRI or eCPRI onto an aggregation switch. The 14.1 Gbps transceivers handle multiple CPRI Option 7-3 or eCPRI streams, the FPGA fabric performs packet aggregation, timing synchronization, and IQ data routing, while the HPS runs management-plane protocols including PTP, SyncE, and O-RAN M-plane. The 320K logic elements are sufficient for 8-12 aggregated radio streams, and the SoC integration collapses two-chip fronthaul designs onto one device. Compared to ASIC solutions, the Arria 10 SX accelerates time-to-market for new fronthaul splits and protocol revisions. Designers benefit from the deterministic latency of the FPGA pipeline and the Linux flexibility of the HPS for OAM and orchestration.
推荐
推荐产品汇总
工程参考数据： 10AS032H2F34E2LG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AS032H2F34E1HG | 10AS032H1F34E1HG | 10AS032H2F34E3LG | 10AS032E4F34I3SG |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-ball FC-FBGA (F34), 35x35 mm | 1152-ball FC-FBGA (F34), 35x35 mm - same | 1152-ball FC-FBGA (F34), 35x35 mm - same | 1152-ball FC-FBGA (F34), 35x35 mm - same | 1152-ball FC-FBGA (F34), 35x35 mm - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| SoC Variant | H2 (dual-core ARM Cortex-A9) | H2 (dual-core ARM Cortex-A9) | H1 (single-core) | H2 (dual-core ARM Cortex-A9) | E4 (no HPS, fabric-only) |
| Speed Grade | 2 | 1 | 1 | 3 | 3 |
| Temperature Grade | E2 (commercial/extended) | E1 (industrial) | E1 (industrial) | E2 (commercial/extended) | I3 (industrial) |
| Lifecycle Status | Active | Active | Active | Active | Active |
关键差异点
- Mid-density Arria 10 SX SoC FPGA with H2 dual-core HPS （对比 10AS066H2F34E2LG (higher-density sibling))
- H2 SoC variant (dual-core ARM Cortex-A9) over H1 single-core （对比 10AS032H1F34E1HG)
- Speed grade 2 timing performance over grade 3 （对比 10AS032H2F34E3LG)
设计说明
The 1152-ball FC-FBGA package at 1 mm pitch requires an HDI PCB stack-up with laser-drilled microvias. Use a minimum 12-layer stack with dedicated ground and power planes adjacent to the BGA fanout layer. Decoupling must include bulk caps on each voltage rail plus high-frequency 0402 ceramic caps placed within 2 mm of the balls. Length-matching is critical for DDR4 interfaces (target ±25 ps within byte lanes).
At full transceiver utilization (multiple 14.1 Gbps lanes) and high DSP block utilization, the Arria 10 SX can dissipate 15-20 W. A heatsink with thermal interface material or forced-air cooling is typically required. Estimate: with a 31 C/W junction-to-ambient thermal resistance on the 35x35 mm FC-FBGA, a 15 W load produces approximately 465 C junction temperature rise above ambient - so thermal management is non-optional. Always derive thermal design from the Quartus PowerPlay report for your actual design.
Place the HPS boot source (QSPI flash, SD card, or NAND) within 50 mm of the HPS boot pins to meet boot timing. Separate HPS and FPGA fabric power rails even though they share the same silicon - this allows independent power sequencing required by the boot ROM. Route the HPS-to-FPGA bridges (AXI) with length matching and keep the bridges on inner layers to avoid coupling with high-speed transceivers.
Do not assume the 10AS032H2 (H2 dual-core HPS) and 10AS032E4 (E4 fabric-only) are interchangeable - they share the same F34 ball map but E4 disables the HPS block, requiring full pin reassignment. Verify against the device pin-out file and the Arria 10 migration guide before swapping. Also confirm speed grade timing: speed grade 2 (this part) and speed grade 3 differ in achievable fMAX, so a grade-2 design may not meet timing on grade 3 silicon.
合规信息
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified - this is a commercial/industrial-grade FPGA. REACH and conflict-minerals compliance available from Intel's product compliance portal.
