10AS032H2F34E2LG vs 10AS032H3F34E2LG 对比

详细并排对比 10AS032H2F34E2LG 出自 Intel 和 10AS032H3F34E2LG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
10AS032H3F34E2LG 10AS032H3F34E2LG - Arria 10 SX SoC FPGA 320K LE | Intel

10AS032H3F34E2LG - Arria 10 SX SoC FPGA 320K LE | Intel

10AS032H3F34E2LG ✓ 量产中

规格对比

参数 10AS032H2F34E2LG 10AS032H3F34E2LG
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $1,380.00 $1,650.00
Family Arria 10 SX Arria 10 SX SoC FPGA
Device Tier 10AS032 (mid-density) —
Configuration SoC FPGA (HPS + FPGA fabric) —
Logic Elements 320,000 320,000
Processor Subsystem Dual ARM Cortex-A9 MPCore with CoreSight —
Maximum Operating Frequency 1.5 GHz —
封装 1152-ball FC-FBGA (F34), 35 x 35 mm —
Speed Grade 2 H3
Temperature Grade E2 (commercial/extended) E2 (Industrial)
On-chip Memory (M20K blocks) Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] —
DSP Blocks Variable-precision, IEEE 754 single-precision FP support [DATA_NEEDED: DSP block count]
Transceivers Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] [DATA_NEEDED: transceiver count and rate]
Memory Controller Hard IP DDR4, DDR3, QDRII+, RLDRAM3 —
Process Node 20 nm 20 nm
安装类型 Surface Mount (BGA) Surface Mount (Flip-Chip BGA)
RoHS 状态 Compliant Compliant (lead-free)
Form of Terminal Ball (BGA) —
Terminal Pitch 1 mm —
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Processor Clock — Up to 1.5 GHz
Package Code — F34 (FCBGA)
Pin/Ball Count — 1152
Package Size — 35 x 35 mm
Memory Interface — DDR3 / DDR4 with hard controllers
生命周期状态 — Active

数据手册与资源

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