10AX115R3F40E2SG vs 10AX090R3F40E2LG 对比
详细并排对比 10AX115R3F40E2SG 出自 Intel 和 10AX090R3F40E2LG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | 10AX115R3F40E2SG | 10AX090R3F40E2LG |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $4,925.00 | $5,750.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | 59,234,304 bits |
| M20K Memory Blocks | 2,738 | — |
| DSP Blocks | 1,518 (variable-precision, hard FP) | Hardened fixed/floating-point DSP blocks (on-die) |
| Maximum User I/O | 342 | — |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | — |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | 20 nm |
| Speed Grade | -2 | — |
| Temperature Grade | E2 (0C to +100C) | — |
| 封装 | 1517-ball FCBGA (F40), 1.0 mm pitch | 1517-Ball FCBGA |
| 安装类型 | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| RoHS 状态 | Compliant | Compliant |
| Logic Elements | — | 900,000 |
| User I/O Count | — | 342 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| Transceivers | — | Multi-gigabit serial transceivers (on-die) |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |