10AX115R3F40E2SG vs 10AX090R3F40E2LG 비교
다음의 상세 나란히 비교: 10AX115R3F40E2SG 제조: Intel 및 10AX090R3F40E2LG 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 10AX115R3F40E2SG | 10AX090R3F40E2LG |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $4,925.00 | $5,750.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | 59,234,304 bits |
| M20K Memory Blocks | 2,738 | — |
| DSP Blocks | 1,518 (variable-precision, hard FP) | Hardened fixed/floating-point DSP blocks (on-die) |
| Maximum User I/O | 342 | — |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | — |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | 20 nm |
| Speed Grade | -2 | — |
| Temperature Grade | E2 (0C to +100C) | — |
| 패키지 | 1517-ball FCBGA (F40), 1.0 mm pitch | 1517-Ball FCBGA |
| 실장 유형 | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| RoHS 상태 | Compliant | Compliant |
| Logic Elements | — | 900,000 |
| User I/O Count | — | 342 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| Transceivers | — | Multi-gigabit serial transceivers (on-die) |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |