10AX115R3F40E2SG vs 10AX090R3F40E2LG Comparación
Comparación detallada lado a lado de 10AX115R3F40E2SG por Intel y 10AX090R3F40E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115R3F40E2SG | 10AX090R3F40E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.925,00 | $5.750,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | 59,234,304 bits |
| M20K Memory Blocks | 2,738 | — |
| DSP Blocks | 1,518 (variable-precision, hard FP) | Hardened fixed/floating-point DSP blocks (on-die) |
| Maximum User I/O | 342 | — |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | — |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | 20 nm |
| Speed Grade | -2 | — |
| Temperature Grade | E2 (0C to +100C) | — |
| Encapsulado | 1517-ball FCBGA (F40), 1.0 mm pitch | 1517-Ball FCBGA |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| Estado RoHS | Compliant | Compliant |
| Logic Elements | — | 900,000 |
| User I/O Count | — | 342 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| Transceivers | — | Multi-gigabit serial transceivers (on-die) |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |