10M02DCV36C8G vs 10M02DCU324A7G 对比

详细并排对比 10M02DCV36C8G 出自 Intel 和 10M02DCU324A7G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 10M02DCV36C8G 10M02DCU324A7G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $5.10 $6.30
Family MAX 10 MAX 10
Logic Elements (LE) 2,000 2,000
Total RAM Bits 110,592 bits (~108 Kbits) —
User I/O Count 27 160
Configuration Memory Internal flash (non-volatile, on-die) —
封装 36-UFBGA WLCSP —
Speed Grade C8 —
Temperature Grade Industrial (G suffix) —
工作温度 -40C to +100C —
安装类型 Surface Mount Surface Mount
电源电压 [DATA_NEEDED: core/IO voltage] —
PLL Count [DATA_NEEDED: PLL count for 10M02] —
DSP Blocks [DATA_NEEDED: DSP/multiplier block count] —
RoHS 状态 Compliant Compliant
MSL 等级 [DATA_NEEDED: MSL rating] —
Embedded Memory — 110,592 bits
Embedded 18x18 Multipliers — 16
PLLs — [DATA_NEEDED: PLL count]
Global Clock Networks — [DATA_NEEDED: global clock count]
User Flash Memory — Integrated (on-chip flash configuration)
Integrated ADC — 12-bit, 1 Msps+, successive approximation
Core Voltage — 1.15 V to 1.25 V
Supply Voltage (VCCIO) — [DATA_NEEDED: VCCIO range]
工作结温 — -40 C to +125 C (TJ)
Package Type — 324-UBGA (Ultra FineLine BGA)
Package Dimensions — 15 x 15 mm
Process Technology — 55 nm embedded flash (TSMC)
Lead-Free / Halogen-Free — [DATA_NEEDED: lead-free status]

数据手册与资源

浏览全部产品 创建 BOM 获取报价