A3PE3000-2FG324I vs A3PE3000-2FGG324I 对比

详细并排对比 A3PE3000-2FG324I 出自 Microchip Technology 和 A3PE3000-2FGG324I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
A3PE3000-2FG324I A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip

A3PE3000-2FG324I ✓ 量产中
Microchip Technology
A3PE3000-2FGG324I A3PE3000-2FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip

A3PE3000-2FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip

A3PE3000-2FGG324I ✓ 量产中

规格对比

参数 A3PE3000-2FG324I A3PE3000-2FGG324I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $0.00 $1.00
Manufacturer Microchip Technology (Microsemi) —
Family ProASIC3E ProASIC3E (Flash FPGA)
Logic Elements (LEs) 35000 LEs —
System Gates 3M gates 3000000
Maximum System Performance 310 MHz —
Process Technology 130 nm flash —
Core Supply Voltage 1.5 V —
Number of I/Os 221 I/O 221
封装 / 外壳 324-Ball FBGA —
安装方式 SMD/SMT —
Operating Temperature (Min) -40 C —
Operating Temperature (Max) +85 C —
Speed Grade -2 -2
Temperature Grade Industrial (I) —
Configuration Memory Non-volatile Flash (single chip) —
Packaging Tray Tray
Product Series A3PE3000 —
Logic Elements — [DATA_NEEDED: logic element count]
Embedded Memory — 516096 bit
电源电压 — 1.425 V to 1.575 V
工作温度 — -40C to +100C (TJ)
Grade — Industrial
封装 — 324-BGA (FBGA, 19x19 mm)
安装类型 — Surface Mount
Technology — 130 nm Flash CMOS
Configuration — On-chip flash (nonvolatile, single chip)
Programmability — Reprogrammable (In-circuit)
RoHS 状态 — ROHS3 Compliant
Product Status — Active
Manufacturer Lead Time — 8 weeks

数据手册与资源

浏览全部产品 创建 BOM 获取报价