A3PE3000-2FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
料号： A3PE3000-2FGG324I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1 | $1.00 |
| 10 | $1 | $10.00 |
| 100 | $1 | $100.00 |
| 500 | $1 | $500.00 |
| 1,000 | $1 | $1,000.00 |
A3PE3000-2FGG324I 概述
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that implements digital logic through configurable logic blocks and programmable interconnect. The ProASIC3E family belongs to the flash-based FPGA category, distinct from SRAM FPGAs because configuration is stored in on-chip nonvolatile flash cells, removing the need for an external boot flash and improving single-chip security and instant-on behavior.
Key features of the A3PE3000-2FGG324I include its flash-based single-chip architecture (low total cost of ownership, no configuration PROM), 221 user I/Os supporting single-ended and differential standards, embedded 516,096-bit flash memory, and reprogrammability with secure design storage. The -2 speed grade and industrial temperature range make it suitable for harsh-environment deployments.
Technically, the device is fabricated in 130nm flash CMOS process technology with a 1.5V core. The ProASIC3E fabric combines VersaTiles (logic modules), embedded RAM blocks, and flash configuration cells, supporting the Cortex-M1 soft processor and typical FPGA design flows in Libero SoC.
Typical applications include industrial automation and motor control, aerospace and defense subsystems, communications and networking line cards, and secure single-chip control logic where nonvolatile, tamper-resistant configuration is required.
A key design consideration is power: the 1.425V-1.575V core rail must be tightly regulated, and the 324-ball BGA requires careful PCB fanout and a dedicated power/ground ball pattern for signal integrity.
This page synthesizes verified distributor data, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A3PE3000-2FGG324I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE3000-2FGG324I （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Family, System Gates, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
A3PE3000-FGG324I
✅ 直接替换✓ 有现货
$198 / 个
查看数据手册 →A3PE3000-2FGG324
✅ 直接替换✓ 有现货
$216 / 个
查看数据手册 →A3PE3000-2FG324I
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A3PE3000L-FGG324I
✅ 直接替换✓ 有现货
$62.65 / 个
查看数据手册 →A3PE3000-FG324I
✅ 直接替换✓ 有现货
$1 / 个
查看数据手册 →A3PE3000-2FGG324I 最大额定值与电气特性
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 3000000 |
| Number of I/Os | 221 |
| Embedded Memory | 516096 bit |
| Speed Grade | -2 |
| 电源电压 | 1.425 V to 1.575 V |
| 工作温度 | -40C to +100C (TJ) |
| Grade | Industrial |
| 封装 | 324-BGA (FBGA, 19x19 mm) |
| 安装类型 | Surface Mount |
| Technology | 130 nm Flash CMOS |
| Configuration | On-chip flash (nonvolatile, single chip) |
| Programmability | Reprogrammable (In-circuit) |
| Packaging | Tray |
| RoHS 状态 | ROHS3 Compliant |
| Product Status | Active |
| Manufacturer Lead Time | 8 weeks |
A3PE3000-2FGG324I 324-bga (fbga, 19x19 mm) 引脚配置指南
A3PE3000-2FGG324I（324-bga (fbga, 19x19 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE3000-2FGG324I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE3000-2FGG324I 适用于 6 应用s: Industrial Automation and Motor Control, Aerospace and Defense Subsystems, Communications and Networking Line Cards, Secure Embedded Control, Test and Measurement Instrumentation, Battery-Powered and Low-Power Portable Systems.
Industrial Automation and Motor Control
The A3PE3000-2FGG324I fits industrial automation because its 3M-gate fabric integrates state machines, PWM generators, and encoder interfaces in one chip, while its -40C to +100C industrial rating survives factory-floor thermal extremes. Its 221 user I/Os drive multiple motor-drive axes, and instant-on flash configuration means drives and PLC I/O modules are ready at power-up with no configuration controller. Used as the glue-logic and sequencing hub between an MCU or the Cortex-M1 soft core and IGBT gate drivers, it processes encoder feedback and generates gate-timing signals with deterministic latency. The trade-off versus an MCU is higher power at the 1.5V core rail, so budget switching activity in Libero SoC power analysis.
推荐
Aerospace and Defense Subsystems
Aerospace and defense designs choose the A3PE3000-2FGG324I because flash-based configuration resists readback and bit-flip-induced reconfiguration of the kind that affects SRAM FPGAs, and the single-chip nonvolatile architecture eliminates a boot PROM that would add failure modes. The -40C to +100C industrial junction range covers most avionics bay environments, and the 19x19 mm FGG324 BGA supports vibration-tolerant, high-usage solder attachment. Typical roles include sensor-interface formatting, bus bridging, and payload sequencing with the 516 kbit embedded flash storing calibration or mission data. Verify program-level qualification and radiation requirements directly with Microchip, as standard industrial grading does not by itself imply TID or SEE character.
推荐
Communications and Networking Line Cards
In networking line cards, the A3PE3000-2FGG324I bridges backplane buses, implements framing and statistics logic, and sequences PHYs, leveraging the -2 speed grade's roughly 310 MHz system performance for high-throughput paths. Its 221 I/Os support LVDS and other differential standards for high-speed interconnect, and nonvolatile startup means a line card initializes immediately when hot-plugged without waiting for a configuration download. The 516 kbit flash stores board serials and microcode. Design consideration: the FGG324's 221 I/O must be budgeted across banks to match VCCI rails of attached PHYs, and signal-integrity simulation is recommended for edges faster than 500 MHz.
推荐
Secure Embedded Control
Secure control applications - encryption key storage lifecycles, authentication nodes, anti-tamper logic - benefit from the A3PE3000-2FGG324I's on-chip flash configuration: the bitstream is not externally readable at power-up the way SRAM FPGA bitstreams are, and no external flash device exposes the design on a readable bus. The 516,096-bit embedded flash provides on-chip nonvolatile storage for keys or IDs, and the 3M-gate fabric implements cryptographic cores such as AES or SHA engines with margin. The industrial temperature range suits unattended field equipment. Trade-off: flash FPGAs offer fewer hard security primitives than newer families, so layer board-level tamper detection alongside the FPGA logic.
推荐
Test and Measurement Instrumentation
Bench and automated test equipment uses the A3PE3000-2FGG324I as timing-controller and pattern-generator logic: the -2 speed grade and 130nm fabric deliver precise, deterministic trigger and sampling strobes, while 221 I/Os interface with relays, ADC front-ends, and host backplanes. Instant-on flash configuration lets an instrument be ready within milliseconds of power-up - a measurable advantage in rack systems that power-cycle channels frequently. The embedded flash stores calibration constants per unit. Design note: use Libero SoC timing constraints to keep trigger-path skew under 1 ns and route trigger I/O on matched-length traces from the FGG324 balls.
推荐
Battery-Powered and Low-Power Portable Systems
For portable and battery-backed systems needing programmable logic, the A3PE3000-2FGG324I offers flash FPGAs' hallmark advantage over SRAM parts: zero configuration current at power-up and no boot device. The 1.5V core with 1.425V-1.575V tolerance suits efficient point-of-load regulation from a single-cell Li-ion via a buck converter. Where battery budget is dominant, the pin-compatible low-power variant A3PE3000L-FGG324I runs at reduced core voltage for further savings. Use the 516 kbit flash for event logs and the fabric for sensor-fusion preprocessing. Estimated: at 100 MHz with moderate utilization, core dynamic power is typically in the hundreds of milliwatts - run Libero power analysis with your actual toggle rates.
推荐
推荐产品汇总
工程参考数据： A3PE3000-2FGG324I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3PE3000-FGG324I | A3PE3000-2FGG324 | A3PE3000-2FG324I | A3PE3000L-FGG324I | A3PE3000-FG324I |
|---|---|---|---|---|---|---|
| Package | 324-FBGA (FGG324, 19x19 mm) | 324-FBGA (FGG324) - same footprint | 324-FBGA (FGG324) - same footprint | 324-BGA (FG324, standard pitch) | 324-FBGA (FGG324) - same footprint | 324-BGA (FG324, standard pitch) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 221 | 221 | 221 | 221 | 221 | 221 |
| Embedded Flash | 516,096 bit | 516,096 bit | 516,096 bit | 516,096 bit | 516,096 bit | 516,096 bit |
| Operating Temperature | -40C to +100C (TJ, industrial) | Industrial (-40C to +100C) | Commercial | Industrial (-40C to +100C) | Industrial | Industrial (-40C to +100C) |
| RoHS | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
关键差异点
- Fastest -2 speed grade in the FGG324 industrial family （对比 A3PE3000-FGG324I)
- Industrial temperature rating on the fine-pitch FGG324 footprint （对比 A3PE3000-2FGG324)
- Single-chip flash configuration （对比 SRAM-based competitor FPGAs)
- Trade-off: higher power than the L low-power variant （对比 A3PE3000L-FGG324I)
设计说明
The 1.5V core rail must stay within 1.425V-1.575V under all load transients. Use a point-of-load buck converter with at least 3 A headroom and bulk capacitance local to the FGG324 power balls; I/O bank VCCI rails must be sequenced with or before the core per the ProASIC3E datasheet (DS0098) power-up specification. Verify per-bank I/O standards early in Libero SoC because bank VCCI choices (2.5V/3.3V) constrain which standards can be placed in each bank.
The 324-ball 19x19 mm FGG324 uses fine-pitch balls: design your land pattern strictly per the DS0098 mechanical drawing and confirm whether your footprint is FGG (fine pitch) or FG (standard pitch) - the A3PE3000-2FGG324I will NOT fit an FG324 pattern. Plan fanout with via-in-pad or dog-bone escapes, and reserve solid power/ground ball grids for low-inductance return paths. Do not route high-speed signals under the package without a reference plane.
For differential I/O pairs (LVDS and similar standards), maintain matched intra-pair lengths within a few millimeters and observe the datasheet note that each used differential I/O pair reduces available single-ended I/Os by two - budget your 221 I/Os accordingly. Note the DS0098 limitation that on A3PE1500/A3PE3000 devices usage of certain I/O standards is restricted; check the standards table before committing your pin assignment.
Lead time is 8 weeks from the manufacturer, so qualify a drop-in alternative (e.g., A3PE3000-FGG324I at standard speed grade) as a supply-risk hedge and verify timing closure at the slower grade in Libero SoC before approving the swap. Also confirm temperature grade codes: the non-'I' suffix part (A3PE3000-2FGG324) is commercial grade and must not be used in -40C industrial systems despite identical footprint.
合规信息
ROHS3 Compliant per Microchip USA product data. Lead-free consistent with ROHS3. REACH, halogen-free, and conflict-minerals status not stated in provided data.
