ATSAMA5D22B-CNR vs ATSAMA5D225C-D1M-CU 对比
详细并排对比 ATSAMA5D22B-CNR 出自 Microchip Technology 和 ATSAMA5D225C-D1M-CU 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Microchip Technology
ATSAMA5D22B-CNR - 500MHz Cortex-A5 MPU 196-TFBGA | Microchip
ATSAMA5D22B-CNR ✓ 量产中Microchip Technology
ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip
ATSAMA5D225C-D1M-CU ✓ 量产中规格对比
| 参数 | ATSAMA5D22B-CNR | ATSAMA5D225C-D1M-CU |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $7.21 | $12.60 |
| Architecture | ARM Cortex-A5 (ARMv7-A) | — |
| Core Count | 1 | — |
| Data Width | 32-bit | — |
| 最大时钟频率 | 500 MHz | — |
| Core Supply Voltage | 1.2 V | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache | 128 KB (configurable as SRAM) | — |
| NEON Media Processing Engine | Yes | — |
| Floating Point Unit | Yes | — |
| ARM TrustZone | Yes | — |
| Peripheral Touch Controller (PTC) | Yes | — |
| Embedded Audio Subsystem | Yes (I2S/TDM) | — |
| 封装 | 196-TFBGA (11x11x1.2 mm) | 196-ball TFBGA 11x11 mm, 0.8 mm pitch |
| Ball Pitch | 0.8 mm | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| 工作温度 | -40C to +105C (extended) | -40C to +85C (Industrial, IND TEMP) |
| Packaging | Tape & Reel (T&R) | — |
| RoHS 状态 | Compliant | Compliant (Green, lead-free) |
| Core Processor | — | ARM Cortex-A5 |
| Number of Cores | — | 1 Core, 32-Bit |
| Maximum CPU Clock | — | 500 MHz |
| Integrated DRAM | — | 128 Mbit DDR2 SDRAM (SiP) |
| ROM / Boot Code | — | 160 KB ROM |
| Graphics Acceleration | — | Yes (LCD controller up to WXGA 1366x768) |
| RAM Controllers | — | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI |
| Ethernet | — | 10/100/1000 GMAC |
| USB | — | 1x HSIC, 1x USB 2.0 HS Host/Device |
| CAN | — | CAN-FD |
| Security | — | Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG |
| Touch Controller | — | Peripheral Touch Controller (PTC) integrated |
| Audio | — | Embedded audio subsystem (I2S, Class-D amplifier) |
| 电源电压 | — | 1.2 V core (per typical SiP) |