ATSAMA5D26A-CUR vs ATSAMA5D26B-CN 对比

详细并排对比 ATSAMA5D26A-CUR 出自 Microchip Technology 和 ATSAMA5D26B-CN 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
ATSAMA5D26A-CUR ATSAMA5D26A-CUR - 500MHz Cortex-A5 MPU, 289-LFBGA | Microchip

ATSAMA5D26A-CUR - 500MHz Cortex-A5 MPU, 289-LFBGA | Microchip

ATSAMA5D26A-CUR ✓ 量产中
Microchip Technology
ATSAMA5D26B-CN ATSAMA5D26B-CN - ARM Cortex-A5 MPU 500MHz | Microchip | 289-LFBGA

ATSAMA5D26B-CN - ARM Cortex-A5 MPU 500MHz | Microchip | 289-LFBGA

ATSAMA5D26B-CN ✓ 量产中

规格对比

参数 ATSAMA5D26A-CUR ATSAMA5D26B-CN
品牌 Microchip Technology Microchip Technology
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $14.20 $13.05
Core Architecture ARM Cortex-A5 (ARMv7-A) ARM Cortex-A5 (Armv7-A)
Maximum CPU Clock 500 MHz —
Core Count 1 —
Bit Width 32-bit —
Internal SRAM 128 KB —
Internal ROM 160 KB —
L1 Instruction Cache 32 KB 32 kbyte
L1 Data Cache 32 KB 32 kbyte
FPU / NEON Yes (single-precision FPU + NEON) —
Memory Interfaces DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC, NAND, NOR —
External Memory Bus 16-bit EBI —
Display Controller Integrated LCD controller up to WXGA (1366x768) —
Ethernet 2x 10/100 Mbps EMAC (GMII/RGMII/MII) —
USB 2x USB 2.0 High-Speed Host + 1x USB 2.0 Device/Host —
CAN 2x CAN-FD —
Crypto Accelerator AES, SHA, TRNG, secure boot —
ADC 12-bit, 1 Msps, up to 12 channels —
封装 289-LFBGA, 14x14 mm, 0.8 mm pitch 289-LFBGA (14x14 mm)
Supply Voltage (Core) 1.2 V (typ) —
工作温度 -40C to +85C (Industrial) —
安装类型 Surface Mount Surface Mount
MSL 等级 3 (per JEDEC J-STD-020) [DATA_NEEDED: MSL level]
RoHS 状态 Compliant Compliant
Number of Cores — 1
最大时钟频率 — 500 MHz
L2 Cache — 128 kbyte (configurable as SRAM)
Memory Management Unit — Yes (MMU)
NEON Media Processing Engine — Yes
Arm TrustZone — Yes
ETM/ETB Support — Yes
DDR Memory Interface — DDR2, DDR3L, LPDDR2, LPDDR3
Flash Memory Interface — QSPI, e.MMC
Backup Mode Current — 5 uA
Security Features — Secure boot, AES, SHA, TRNG, tamper pins
Peripheral Interfaces — I2C, SPI, USART, UART, QSPI, CAN, HSIC, SMC
Embedded Audio Subsystem — Yes
Ball Pitch — 0.8 mm
工作温度范围 — -40C to +85C (industrial, -CN grade)

数据手册与资源

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