EP1SGX10DF672I6 vs EP1SGX10DF672I6N 对比

详细并排对比 EP1SGX10DF672I6 出自 Intel 和 EP1SGX10DF672I6N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP1SGX10DF672I6N EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N ⚠ 最后一次采购

规格对比

参数 EP1SGX10DF672I6 EP1SGX10DF672I6N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 最后采购期
库存状态 有库存 有库存
单价(USD) $290.00 $85.20
Family Stratix GX Stratix GX (EP1SGX)
Logic Elements (LEs) 10,570 —
Embedded RAM 920,448 bits —
Embedded Multipliers Yes (DSP blocks) —
Transceiver Channels 12 (3.125 Gbps) —
Maximum User I/O 362 —
PLLs 4 —
Process Technology 130 nm CMOS —
Core Supply Voltage 1.5 V 1.5 V (1.425 V to 1.575 V)
工作温度 0 C to +85 C (commercial) 0 C to 85 C (Industrial, "I" grade)
封装 672-ball FC-FBGA (DF672) —
Package Body Size 33 x 33 mm, 1.0 mm pitch —
安装类型 Surface Mount Surface Mount
MSL 等级 [DATA_NEEDED: MSL Level] —
RoHS 状态 [DATA_NEEDED: RoHS Status] Compliant
Series — Stratix GX
Logic Elements — 10,570
Logic Cells — 10,570
CLBs (Logic Array Blocks) — 1,200 LABs / 1200 CLBs
Total RAM Bits — 920,448 bits
User I/O Pins — 362
Package Type — FBGA-672 (FineLine BGA)
Package Code — BGA, 672 balls
Package Dimensions — 33 x 33 mm (chipdig lists 33 x 33), 1 mm pitch
Logic Family — CMOS
Lead Free Status — Lead Free (FBGA-672, per Ampheo listing)

数据手册与资源

浏览全部产品 创建 BOM 获取报价