EP1SGX10DF672I6N vs EP1SGX25CF672I6N 对比

详细并排对比 EP1SGX10DF672I6N 出自 Intel 和 EP1SGX25CF672I6N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP1SGX10DF672I6N EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N - Stratix GX FPGA, 10K LEs, 362 I/O | Intel

EP1SGX10DF672I6N ⚠ 最后一次采购
Intel
EP1SGX25CF672I6N EP1SGX25CF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel

EP1SGX25CF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel

EP1SGX25CF672I6N ⚠ 最后一次采购

规格对比

参数 EP1SGX10DF672I6N EP1SGX25CF672I6N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $85.20 $171.00
Series Stratix GX —
Family Stratix GX (EP1SGX) Stratix GX
Logic Elements 10,570 —
Logic Cells 10,570 —
CLBs (Logic Array Blocks) 1,200 LABs / 1200 CLBs —
Total RAM Bits 920,448 bits —
User I/O Pins 362 —
Package Type FBGA-672 (FineLine BGA) —
Package Code BGA, 672 balls —
Package Dimensions 33 x 33 mm (chipdig lists 33 x 33), 1 mm pitch —
安装类型 Surface Mount Surface Mount
Core Supply Voltage 1.5 V (1.425 V to 1.575 V) 1.5 V
工作温度 0 C to 85 C (Industrial, "I" grade) -40 °C to +85 °C (industrial)
Logic Family CMOS —
Lead Free Status Lead Free (FBGA-672, per Ampheo listing) —
RoHS 状态 Compliant Compliant
Logic Elements / Cells — 25,660
Configurable Logic Blocks (CLBs) — 2,852
Logic Array Blocks (LABs) — 2,566
User I/Os — 455
Process Technology — 130 nm CMOS
封装 — 672-ball FBGA (FCBGA), 27 x 27 mm, 1 mm pitch
Temperature Grade — Industrial
Speed Grade — 6
Lead-Free — Yes
Toolchain — Quartus II (Stratix GX device support)

数据手册与资源

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