EP1SGX25CF672I6N vs EP1SGX25CF672I7 对比

详细并排对比 EP1SGX25CF672I6N 出自 Intel 和 EP1SGX25CF672I7 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP1SGX25CF672I6N EP1SGX25CF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel

EP1SGX25CF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel

EP1SGX25CF672I6N ⚠ 最后一次采购

规格对比

参数 EP1SGX25CF672I6N EP1SGX25CF672I7
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 Obsolete
库存状态 有库存 有库存
单价(USD) $171.00 $198.50
Family Stratix GX Stratix GX
Logic Elements / Cells 25,660 —
Configurable Logic Blocks (CLBs) 2,852 —
Logic Array Blocks (LABs) 2,566 —
User I/Os 455 —
Process Technology 130 nm CMOS 130 nm CMOS
Core Supply Voltage 1.5 V —
封装 672-ball FBGA (FCBGA), 27 x 27 mm, 1 mm pitch 672-FBGA (FC-FBGA, FineLine BGA)
工作温度 -40 °C to +85 °C (industrial) —
Temperature Grade Industrial —
Speed Grade 6 —
安装类型 Surface Mount Surface Mount (BGA)
Lead-Free Yes —
RoHS 状态 Compliant unknown
Toolchain Quartus II (Stratix GX device support) —
Logic Elements — 25,660
Combinational Logic Blocks (CLBs) — 2,566
Total Memory Bits — 1,944,576
LAB/CLB Rows — 455
最大时钟频率 — 4385.97 MHz (one source: 4.7 MHz)
Combinatorial Delay (CLB) — 9.48 ns (sibling datasheet figure)
Nominal Core Voltage — 1.5 V
工作温度范围 — -65C to +135C (Military)
Ball Count — 672
Ball Pitch — 1.00 mm
Package Body Size — 27.00 x 27.00 mm
Programming Toolchain — Quartus II / Quartus Prime

数据手册与资源

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