EP20K600CF672C9N vs EP20K600CF672C8N 对比
详细并排对比 EP20K600CF672C9N 出自 Intel 和 EP20K600CF672C8N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP20K600CF672C9N | EP20K600CF672C8N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $175.00 | $108.00 |
| Family | APEX 20KC | APEX 20KC |
| Device Type | Loadable PLD / SRAM FPGA | SPLD |
| System Gates | 600,000 | — |
| Logic Elements | 24,320 | — |
| Maximum Operating Frequency | 250 MHz | — |
| Propagation Delay | 1.48 ns (per logic element) | 1.48 ns |
| Core Supply Voltage | 1.71 V to 1.89 V (1.8 V nominal) | — |
| User I/Os | 488 | — |
| Total Terminals | 672 | — |
| Package Type | FineLine BGA (FC-FBGA), 1.00 mm pitch, 45 x 45 mm | — |
| Process Technology | 0.15 µm all-layer copper | — |
| 工作温度 | 0 C to 85 C (commercial) | 0°C to 85°C |
| 安装类型 | Surface Mount | Surface mount |
| Configuration Interface | JTAG (IEEE 1149.1), passive serial, active serial | — |
| Embedded Memory | MultiCore EABs supporting up to 311,000 RAM bits | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | unknown |
| Product Type | — | FPGA / programmable logic device |
| Nominal Gate Capacity | — | 600K gates |
| Logic Elements or Cells | — | 24,320 |
| Macros | — | 2,432 |
| User I/O Count | — | 508 |
| Package Terminals | — | 652 pins |
| 封装 | — | BGA-652, 45 x 45 mm, 1.27 mm pitch |
| Package Description | — | 672-pin FC-FBGA |
| 电源电压 | — | 1.8 V |
| Listed Frequency | — | 301.21 MHz |
| Fabrication Process | — | 0.15 µm |
| Interconnect Metal | — | All-layer copper metal |
| I/O Configuration | — | 508 user I/O |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |
| Configuration Method | — | [DATA_NEEDED: configuration memory and programming method] |
| Core Current | — | [DATA_NEEDED: core supply current] |
| I/O Bank Voltage | — | [DATA_NEEDED: supported I/O voltage range] |
| Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| 热阻 | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |