EP2AGX125EF35C4G vs EP2AGX95EF35C4G 对比
详细并排对比 EP2AGX125EF35C4G 出自 Intel 和 EP2AGX95EF35C4G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2AGX125EF35C4G | EP2AGX95EF35C4G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,290.00 | $1,555.00 |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 118,143 | — |
| Embedded Memory Bits | 8,315,904 | 6,839,296 bits (~6.5 Mbit) |
| Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| Hardware Multipliers (18x18) | 452 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceiver Channels | 12 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| PCI Express Hard IP | Gen1/Gen2 x1/x4/x8 | — |
| Core Voltage | 0.9 V | 0.9 V nominal |
| User I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Process Technology | 40 nm | 40 nm TSMC low-power |
| 封装 | 1152-ball FC-FBGA (Flip-Chip) | 1152-ball FCBGA, 35 mm x 35 mm, 1.0 mm pitch |
| 工作温度 | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| 安装类型 | Surface Mount | — |
| Configuration Method | SRAM-based, PS/FPP/JTAG | — |
| RoHS 状态 | Compliant | Compliant |
| Speed Grade | C4 | -4 (mid-speed) |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 89,178 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count from datasheet] |
| Embedded Memory Blocks (M9K/M144K) | — | [DATA_NEEDED: block count from datasheet] |
| Embedded 18x18 Multipliers | — | 616 |
| User I/Os | — | 452 |
| Transceiver Blocks | — | 4 (up to 3.75 Gbps) |
| PCIe Hard IP | — | Gen1/Gen2 (x1/x2/x4) |
| PLLs | — | 4 |
| Global Clock Networks | — | [DATA_NEEDED: per Arria II family datasheet] |
| Configuration Mode | — | Passive Serial, Fast Passive Parallel, JTAG |