EP2AGZ300FF35I4 vs EP2AGZ300FF35I3G 对比
详细并排对比 EP2AGZ300FF35I4 出自 Intel 和 EP2AGZ300FF35I3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2AGZ300FF35I4 | EP2AGZ300FF35I3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,015.00 | $1,230.00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 298,000 | — |
| Configurable Logic Blocks (LABs/CLBs) | 11,920 | — |
| Maximum User I/O | 554 | — |
| Operating Frequency (Max) | 500 MHz | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| 封装 | 1152-ball FC-FBGA (FF35) | 1152-ball FBGA (FF35) |
| Temperature Grade | Industrial (-40 C to +100 C) | — |
| Number of Pins/Balls | 1152 | — |
| Terminal Form | Ball (BGA) | — |
| Transceivers | 12.5 Gbps integrated | — |
| Embedded Memory | M20K blocks (distributed) | — |
| DSP Blocks | Hard DSP columns (variable precision) | [DATA_NEEDED: number of DSP blocks] |
| PCIe Support | PCIe Gen2 hard IP | — |
| 安装类型 | Surface Mount (flip-chip BGA) | Surface Mount |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Logic Elements (LE) | — | 300000 |
| Number of User I/O | — | 554 (maximum) |
| Number of Transceivers | — | 8 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Process Node | — | 40 nm |
| 工作温度 | — | -40C to +100 C (I3 industrial) |
| 电源电压 | — | [DATA_NEEDED: core and I/O supply voltage values] |
| Embedded Memory (Mbits) | — | 16.4 |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| Memory Interfaces | — | DDR3, QDRII+, RLDRAM II |
| Configuration Method | — | Serial, Parallel, JTAG |
| MSL 等级 | — | 3 (168 hours) |