EP2C8F256I8N vs EP2C8F256CXNAA 对比
详细并排对比 EP2C8F256I8N 出自 Intel 和 EP2C8F256CXNAA 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2C8F256I8N | EP2C8F256CXNAA |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $21.95 | $11.05 |
| Series | Cyclone II | — |
| Logic Elements (LEs) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits | — |
| Total RAM Bits | 165,888 | — |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | — |
| User I/O Pins | 182 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| Embedded 18x18 Multipliers | Up to 36 | 18 |
| PLLs | 2 | 4 |
| Global Clock Networks | 16 | — |
| Core Supply Voltage | 1.2 V | 1.15 V to 1.25 V |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | — |
| 工作温度 | -40C to +85C (industrial) | — |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | — |
| RoHS 状态 | Compliant (Pb-free, lead-free reflow compatible) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Cyclone II |
| Logic Elements | — | 8,256 |
| Embedded Memory (M4K blocks) | — | 36 blocks (162 Kbits total) |
| Maximum User I/O Pins | — | 182 |
| User Flash Memory | — | 0 Kbits |
| I/O Standards | — | LVCMOS, LVTTL (3.3V, 2.5V, 1.8V, 1.5V) |
| 封装 | — | 256-ball FineLine BGA (F256), 1.0 mm pitch, 17x17 mm |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |
| Operating Temperature (Industrial) | — | -40C to +85C (N suffix) |
| RoHS Compliance | — | Yes (lead-free) |
| MSL 等级 | — | 3 |