EP2C8F256I8N vs EP2C8F256CXNAA Comparison
Detailed side-by-side comparison of EP2C8F256I8N by Intel and EP2C8F256CXNAA by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2C8F256I8N | EP2C8F256CXNAA |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $21.95 | $11.05 |
| Series | Cyclone II | β |
| Logic Elements (LEs) | 8,256 | β |
| Embedded Memory Bits | 165,888 bits | β |
| Total RAM Bits | 165,888 | β |
| Logic Blocks / Logic Cells | 540 (Logic Cells) | β |
| User I/O Pins | 182 | β |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | β |
| Embedded 18x18 Multipliers | Up to 36 | 18 |
| PLLs | 2 | 4 |
| Global Clock Networks | 16 | β |
| Core Supply Voltage | 1.2 V | 1.15 V to 1.25 V |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | β |
| Process Technology | 90 nm CMOS (SRAM-based) | 90 nm |
| Package Type | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch | β |
| Operating Temperature | -40C to +85C (industrial) | β |
| Configuration Method | SRAM, loaded from external EPCS flash at power-up | β |
| RoHS Status | Compliant (Pb-free, lead-free reflow compatible) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | β | Cyclone II |
| Logic Elements | β | 8,256 |
| Embedded Memory (M4K blocks) | β | 36 blocks (162 Kbits total) |
| Maximum User I/O Pins | β | 182 |
| User Flash Memory | β | 0 Kbits |
| I/O Standards | β | LVCMOS, LVTTL (3.3V, 2.5V, 1.8V, 1.5V) |
| Package | β | 256-ball FineLine BGA (F256), 1.0 mm pitch, 17x17 mm |
| Configuration Modes | β | Active Serial (AS), Passive Serial (PS), JTAG |
| Operating Temperature (Industrial) | β | -40C to +85C (N suffix) |
| RoHS Compliance | β | Yes (lead-free) |
| MSL Level | β | 3 |