EP2S30F672C3N vs EP2S30F672I4 对比

详细并排对比 EP2S30F672C3N 出自 Altera 和 EP2S30F672I4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Altera
EP2S30F672C3N EP2S30F672C3N - 33,880 LEs Stratix II FPGA, 672-FBGA | Intel / Altera

EP2S30F672C3N - 33,880 LEs Stratix II FPGA, 672-FBGA | Intel / Altera

EP2S30F672C3N ⚠ 最后一次采购

规格对比

参数 EP2S30F672C3N EP2S30F672I4
品牌 Altera Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 Obsolete
库存状态 有库存 有库存
单价(USD) $55.00 $695.00
Family Stratix II —
Number of Logic Elements (LEs) 33,880 —
Logic Array Blocks (LABs) 1,694 1694
Embedded Memory (Bits) 1,369,728 —
Embedded Memory (Kbits) 500 Kbits —
Number of I/Os 500 —
输出数量 492 —
Core Voltage 1.2 V —
Process Technology 90 nm CMOS 90 nm CMOS
Maximum Internal Frequency 816.99 MHz (per published spec) —
封装 672-ball FineLine BGA (FC-FBGA) —
安装类型 Surface Mount Surface Mount
Operating Temperature Grade Commercial ("C") —
Speed Grade 3 —
Lead-Free / RoHS Pb-free (suffix "N") —
RoHS 状态 Compliant [DATA_NEEDED: confirm RoHS compliance on part label]
Series — Stratix II
Manufacturer — Intel (formerly Altera)
Logic Elements — 33880
Total RAM Bits — 1369728
Number of I/O — 500
DSP Blocks — 12 (per datasheet, family range)
Number of PLLs — 6
Voltage - Supply — 1.2 V core, separate I/O bank VCCIO
工作温度 — -40C to +100C (Industrial)
封装 / 外壳 — 672-BBGA, FCBGA (FBGA-672)
Package Dimensions — 35 x 35 mm
Ball Pitch — 1.0 mm
Configuration — JTAG, serial, parallel (Stratix II scheme)
MSL 等级 — 3 (per JEDEC J-STD-020)

数据手册与资源

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