EP2S30F672I4 - Stratix II FPGA, 33.88K LE, 672-BGA | Intel / Altera
料号： EP2S30F672I4 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $986.27 | $986.27 |
| 10 | $895.5 | $8,955.00 |
| 100 | $812 | $81,200.00 |
| 500 | $730 | $365,000.00 |
| 1,000 | $695 | $695,000.00 |
EP2S30F672I4 概述
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that lets engineers implement arbitrary digital circuits in silicon. FPGAs sit at the top of the programmable logic hierarchy: FPGA -> programmable logic device (PLD) -> digital IC -> semiconductor. Compared to fixed-function ASICs, FPGAs offer rapid prototyping, in-field re-programmability, and parallel hardware execution, making them ideal for communications, video processing, and high-speed DSP.
Key features of the EP2S30F672I4 include 1,369,728 total RAM bits arranged in TriMatrix memory blocks, support for external memory interfaces (DDR, DDR2, QDR, RLDRAM) through dedicated PHY circuitry, 4 corner PLLs plus 2 additional PLLs, and JTAG-based configuration via the IEEE 1149.1 boundary-scan interface. The device is configured via serial or parallel configuration schemes supported by the Stratix II configuration architecture, with encryption via the 128-bit AES block.
The EP2S30F672I4 uses Altera's ALM (Adaptive Logic Module) architecture combined with TriMatrix memory (three block sizes per column) and dedicated 18x18 multipliers. This architecture delivers higher logic utilization per area than look-up-table-only predecessors and integrates DSP blocks optimized for multiply-accumulate workloads such as FFT engines and digital filters. The 672-FBGA package exposes 500 user I/Os through Altera's High-Speed I/O standard support.
Typical applications include high-speed digital communication equipment, ASIC prototyping, video and image processing pipelines, software-defined radio (SDR), test and measurement instrumentation, and DSP-acceleration cards. The combination of high logic density and embedded multipliers makes it especially suitable for processing-intensive tasks in industrial automation, defense, and broadcast video.
When designing with this device, pay attention to power-rail sequencing for the 1.2 V core and I/O banks, thermal management on the 35 x 35 mm BGA, and pin-compatible migration paths within the Stratix II family. Quartus II software is required for design entry, synthesis, place-and-route, and timing closure - legacy toolchain support is available via Intel FPGA support.
This page consolidates distributor pricing, Stratix II drop-in alternatives in the same FBGA-672 footprint, and practical design notes not found in the manufacturer datasheet, giving engineers a faster selection path than raw distributor listings.
直接替换替代料： EP2S30F672I4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2S30F672I4 （相同外形与封装尺寸） ——差异在于 Speed Grade, Package, Operating Temperature, Total RAM Bits, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP2S30F672C5N
✅ 直接替换✓ 有现货
$450 / 个
查看数据手册 →EP2S30F672C5NGC
✅ 直接替换✓ 有现货
$171 / 个
查看数据手册 →EP2S30F672C5NRB
✅ 直接替换✓ 有现货
$180 / 个
查看数据手册 →EP2S30F672C4N
✅ 直接替换✓ 有现货
$121 / 个
查看数据手册 →EP2S30F672C3N
✅ 直接替换✓ 有现货
$55 / 个
查看数据手册 →EP2S30F672I4 最大额定值与电气特性
| Series | Stratix II |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 33880 |
| Logic Array Blocks (LABs) | 1694 |
| Total RAM Bits | 1369728 |
| Number of I/O | 500 |
| DSP Blocks | 12 (per datasheet, family range) |
| Number of PLLs | 6 |
| Voltage - Supply | 1.2 V core, separate I/O bank VCCIO |
| 工作温度 | -40C to +100C (Industrial) |
| 安装类型 | Surface Mount |
| 封装 / 外壳 | 672-BBGA, FCBGA (FBGA-672) |
| Package Dimensions | 35 x 35 mm |
| Ball Pitch | 1.0 mm |
| Process Technology | 90 nm CMOS |
| Configuration | JTAG, serial, parallel (Stratix II scheme) |
| MSL 等级 | 3 (per JEDEC J-STD-020) |
EP2S30F672I4 35 x 35 mm 引脚配置指南
EP2S30F672I4（35 x 35 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2S30F672I4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2S30F672I4 适用于 6 应用s: ASIC Prototyping, Software Defined Radio (SDR), Video and Image Processing, Test and Measurement Instrumentation, Industrial Automation and Control, Military and Aerospace Systems.
ASIC Prototyping
The EP2S30F672I4 is well-suited for ASIC prototyping because of its 33,880 logic elements and 1,369,728 bits of embedded RAM, which provide enough capacity to implement medium-complexity ASIC netlists as one-to-one gate-level equivalents. The Stratix II ALM architecture preserves design timing behavior, allowing engineers to validate RTL before committing to mask tooling. The 500 user I/Os through the FBGA-672 expose ample external connections for prototype bring-up, and the 12 embedded DSP blocks handle multiply-accumulate sections of the ASIC. Industrial temperature support means prototypes can be validated in harsh lab and field environments.
推荐
Software Defined Radio (SDR)
The EP2S30F672I4's parallel logic fabric and 12 dedicated DSP blocks make it a strong fit for software-defined radio baseband processing - FFT engines, channelizers, and digital filters all map efficiently onto ALM + DSP block primitives. The 1,369,728 bits of TriMatrix memory serve as coefficient buffers and FFT working memory. Industrial temperature rating supports outdoor and vehicular deployments. Combined with external ADC/DAC companion parts, the FPGA implements complete IF processing chains for tactical radio, public-safety, and cellular infrastructure applications where Stratix II was historically deployed.
推荐
Video and Image Processing
The EP2S30F672I4 handles video and image processing workloads including real-time video scaling, format conversion, and pixel-level transformations. Its 33,880 logic elements accommodate multi-pipeline pixel processors, while 500 user I/Os expose enough bandwidth for parallel video busses (BT.656, BT.1120, Camera Link). The embedded memory can hold multiple frame buffers at reduced resolutions. Broadcast video equipment, medical imaging pre-processors, and surveillance DVRs deployed Stratix II in this role; designers targeting these applications today can drop in the EP2S30F672I4 as a form-fit replacement on existing boards.
推荐
Test and Measurement Instrumentation
The EP2S30F672I4 supports digital pattern generation, protocol analysis, and arbitrary waveform synthesis in test and measurement instruments. The ALM-based logic delivers deterministic timing for protocol state machines, and the DSP blocks accelerate FFT-based spectrum analysis. Industrial temperature ensures instrument reliability in laboratory and field environments. The 500 user I/Os in the FBGA-672 package provide connection points for instrument front-ends; designers can use the FPGA as the central timing engine of oscilloscopes, logic analyzers, and protocol testers from the 2005-2015 generation.
推荐
Industrial Automation and Control
The EP2S30F672I4 implements deterministic real-time control loops for industrial automation systems, where its industrial temperature range (-40C to +100C) and high logic density combine to provide PLC, motion controller, and machine vision front-end functions. The 500 user I/Os accept multi-axis encoder feedback, opto-isolated digital I/O, and high-speed analog I/O bus connections. Stratix II-based controllers were deployed in semiconductor wafer-handling robots and CNC machines; legacy board repairs today still rely on like-for-like Stratix II inventory.
推荐
Military and Aerospace Systems
The EP2S30F672I4 supports military and aerospace embedded computing platforms, including avionics data concentrators, radar pre-processors, and electronic warfare subsystems. Its industrial temperature rating and the availability of military-screening variants (NGC suffix) made it acceptable for many legacy defense programs. The 500 user I/Os and embedded DSP blocks enable radar pulse compression, signal intelligence demodulation, and sensor fusion pipelines. New programs must consult current MIL-PRF and DLA sourcing rules; legacy boards in deployed systems continue to source this part through authorized channels.
推荐
推荐产品汇总
工程参考数据： EP2S30F672I4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2S30F672C5N | EP2S30F672C5NGC | EP2S30F672C5NRB | EP2S30F672C4N | EP2S30F672C3N |
|---|---|---|---|---|---|---|
| Package | 672-BBGA FCBGA (FBGA-672) | 672-BBGA FCBGA (FBGA-672) - same | 672-BBGA FCBGA (FBGA-672) - same | 672-BBGA FCBGA (FBGA-672) - same | 672-BBGA FCBGA (FBGA-672) - same | 672-BBGA FCBGA (FBGA-672) - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Total RAM Bits | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 |
| User I/O Count | 500 | 500 | 500 | 500 | 500 | 500 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial / military screened | Commercial | Commercial | Commercial |
| Speed Grade | I4 | C5 | C5 | C5 | C4 | C3 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Industrial temperature grade (I4) vs commercial (C5/C4/C3) （对比 EP2S30F672C5N)
- Faster speed grade (I4) versus the C3/C4/C5 family （对比 EP2S30F672C4N)
- Same-density drop-in migration path across the entire Stratix II family （对比 EP2S60F672C5)
设计说明
The EP2S30F672I4 requires multiple power rails: 1.2 V core, 2.5 V analog PLL supply, and per-bank VCCIO (1.5 V / 1.8 V / 2.5 V / 3.3 V depending on I/O standard). Power-rail sequencing must follow Altera's recommended order - VCC before VCCPD before VCCIO - to avoid latch-up on power-up. Decoupling should include 0.1 uF X7R MLCCs adjacent to every VCC pin and bulk capacitors at the regulator outputs. Total device power at full toggle rate can exceed 5 W; thermal analysis via the Stratix II PowerPlay Early Power Estimator is mandatory before final layout.
The FBGA-672 package has a theta_JA around 12 C/W with appropriate PCB thermal via array under the central GND balls; without thermal vias, junction temperature can exceed 100C in still-air at moderate toggle rates. Recommended practice: stitch GND balls to internal GND planes with 0.3 mm via-in-pad, add 6 x 6 thermal via array under the die shadow, and ensure airflow of at least 200 LFM in enclosed chassis. Industrial-temperature boards should be validated with thermocouples on the package top center under worst-case workload.
Use a minimum 8-layer PCB stack-up with dedicated ground and 1.2 V power planes adjacent to the signal layers. 1.0 mm BGA pitch requires laser-drilled microvias (stacked or staggered) for breakout routing; ensure the PCB vendor supports 4-mil line/space rules on outer layers for fanout. Length-match clock traces within 25 mils; route differential pairs (LVDS) with 100-ohm differential impedance and skew under 20 ps. All configuration, JTAG, and JTAG-pullup nets should be brought to a header for in-system programming access.
Common Stratix II design pitfalls: (1) leaving JTAG TCK floating can prevent configuration - tie to a defined state via 1-10 kohm resistor; (2) MSEL pins must be set to the correct configuration mode (AS, PS, JTAG) and pulled to the right logic level; (3) missing CONF_DONE pull-up prevents configuration completion; (4) using Quartus Prime (newer tool) instead of Quartus II will fail because Stratix II support ended at Quartus II v9.0; (5) ignore the configuration data width warning at your own peril - incorrect DATA[7:0] bus sizing bricks the device. Always validate the .sof/.pof on a development board before committing to production programming files.
合规信息
EP2S30F672I4 was released before RoHS was mandatory for all electronics. RoHS status depends on the specific lot/date code and supplier - request documentation from the distributor. The part is not AEC-Q100 qualified (automotive-grade FPGAs in this family were EP4CE and later generations).
