EP2SGX30CF780I3 vs EP2SGX30CF780C3 对比
详细并排对比 EP2SGX30CF780I3 出自 Intel 和 EP2SGX30CF780C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX30CF780I3 | EP2SGX30CF780C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $171.00 | $175.50 |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | 1,694 |
| Maximum Internal Frequency | 622.08 MHz | — |
| Number of User I/O Pins | 361 | — |
| Process Technology | 90 nm CMOS | — |
| Core Voltage | 1.2 V | — |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) | Embedded (GX family, up to 3.125 Gbps per channel) |
| 封装 | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-ball FineLine BGA |
| Terminal Pitch | 1.0 mm | — |
| 工作温度 | -40 °C to +85 °C (Industrial) | 0C to +85C (commercial) |
| Temperature Grade Suffix | I3 (Industrial) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Total Terminals | 780 | — |
| Package Code | BGA, square shape | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status not confirmed in supplied data] | Compliant |
| Logic Elements | — | 33,880 |
| Embedded RAM Bits | — | 1,369,728 |
| User I/Os | — | 361 |
| Process Node | — | 90 nm |
| Speed Grade | — | -3 |
| Memory Interfaces | — | DDR / DDR2 / QDRII PHY |
| Lead-Free | — | Yes |
| 无卤 | — | [DATA_NEEDED: halogen-free status] |