EP2SGX30CF780I3 vs EP2SGX30CF780I4N 对比
详细并排对比 EP2SGX30CF780I3 出自 Intel 和 EP2SGX30CF780I4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX30CF780I3 | EP2SGX30CF780I4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $171.00 | $138.00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Cells | 33,880 | — |
| Logic Array Blocks (LABs) | 33,880 | — |
| Maximum Internal Frequency | 622.08 MHz | 622.08 MHz |
| Number of User I/O Pins | 361 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | — |
| Transceivers | Embedded multi-gigabit transceivers (6.375 Gbps) | — |
| 封装 | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) | 780-ball FC-FBGA, 29 x 29 mm, 1.0 mm pitch |
| Terminal Pitch | 1.0 mm | — |
| 工作温度 | -40 °C to +85 °C (Industrial) | -40C to +85C (Industrial) |
| Temperature Grade Suffix | I3 (Industrial) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Total Terminals | 780 | — |
| Package Code | BGA, square shape | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status not confirmed in supplied data] | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements | — | 33,880 |
| Logic Cells / CLBs | — | 33,880 |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Embedded Transceivers | — | 4 channels (up to 3.125 Gbps at C4) |
| Pin / Terminal Count | — | 780 |
| Lead-Free | — | Yes |
| 存储器类型 | — | Embedded SRAM, external DDR/DDR2/QDR support |
| Configuration | — | JTAG / passive serial / fast passive parallel |