EP2SGX60DF780C3N vs EP2SGX60DF780C4N 对比

详细并排对比 EP2SGX60DF780C3N 出自 Intel 和 EP2SGX60DF780C4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP2SGX60DF780C3N EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N ✗ 停产

规格对比

参数 EP2SGX60DF780C3N EP2SGX60DF780C4N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 停产 Obsolete
库存状态 有库存 有库存
单价(USD) $188.00 $365.00
Family Stratix II GX Stratix II GX
Device Type FPGA —
Logic Elements 60,440 60,440
LABs/CLBs 3,022 —
Total Memory Bits 2,544,192 —
User I/Os 364 364
Package Type 780-pin FC-FBGA (DF780) —
Package Dimensions 23 x 23 mm —
Pitch 1 mm —
Core Voltage 1.2 V 1.2 V
Process Technology 90 nm —
Internal Frequency 717 MHz —
Propagation Delay [DATA_NEEDED: propagation delay ns] —
工作温度 [DATA_NEEDED: operating temperature range C] Commercial 0C to +85C
安装类型 Surface Mount (BGA) —
RoHS 状态 Compliant (per distributor listing) Lead-free (per part suffix N)
Logic Array Blocks (LABs) — 3,022
Adaptive Logic Modules (ALMs) — 24,176
Total RAM Bits — 2,544,192
Embedded Multipliers (18x18) — 144
DSP Blocks — 36
Transceivers — Up to 20 (up to 6.375 Gbps)
PLLs — 4
Global Clock Networks — 16
Process Node — 90 nm CMOS
封装 — 780-ball FBGA (29 x 29 mm, 1.0 mm pitch)
Maximum Internal Frequency — 717 MHz
Speed Grade — C4

数据手册与资源

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