EP2SGX60EF1152C3N vs EP2SGX60EF1152C5N 对比
详细并排对比 EP2SGX60EF1152C3N 出自 Intel 和 EP2SGX60EF1152C5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX60EF1152C3N | EP2SGX60EF1152C5N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2,195.00 | $3,300.00 |
| Family | Stratix II GX | Stratix II GX |
| Series | Stratix II | — |
| Logic Elements | 60,440 | — |
| Adaptive Logic Modules (ALMs) | 30,220 | — |
| Logic Array Blocks (LABs) | 3022 | 3022 |
| Embedded Memory (bits) | 2,544,192 | — |
| Maximum User I/Os | 534 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage (Vcc) | 1.2 V | — |
| Maximum Internal Frequency | 717 MHz | — |
| Propagation Delay | 0.40 ns | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: embedded multiplier count] | — |
| PLLs | 4 | — |
| Transceiver Data Rate | 3.125 Gbps per channel | — |
| 封装 | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch | 1152-ball FC-FBGA |
| Speed Grade | C3 (commercial, -3 bin) | -5 (mid) |
| 工作温度 | 0C to +85C (commercial) | Commercial (0C to +85C) |
| 安装类型 | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Logic Elements (LE) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 |
| User I/O Count | — | 534 |
| Core Voltage | — | 1.2 V |
| Maximum Operating Frequency | — | 609.76 MHz |
| RoHS 状态 | — | [DATA_NEEDED: RoHS status] |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |