EP2SGX90EF1152C3 vs EP2SGX90EF1152I3 对比
详细并排对比 EP2SGX90EF1152C3 出自 Intel 和 EP2SGX90EF1152I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP2SGX90EF1152C3 | EP2SGX90EF1152I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,180.00 | $1,480.00 |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements (LEs) | 90,960 | — |
| Total RAM Bits | 4,520,448 (4.5 Mbit) | 4,520,448 |
| User I/O Count | 558 | — |
| Number of LABs/CLBs | 4548 | — |
| 封装 | 1152-FBGA (FineLine BGA) | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate | 3.125 - 6.375 Gbps | — |
| Number of PLLs | 4 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Speed Grade | C3 | — |
| 工作温度 | 0C to +85C (commercial) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Logic Elements | — | 90,960 |
| Adaptive Logic Modules (ALMs) | — | 558 |
| Equivalent Logic Cells (CLBs) | — | 90,960 |
| Maximum Operating Frequency | — | 622.08 MHz |
| Core Supply Voltage (VCCINT) | — | 1.2 V nominal (1.15 V to 1.25 V) |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Package Type | — | 1152-ball FC-FBGA (flip-chip) |
| Terminal Form | — | Ball |
| Terminal Pitch | — | [DATA_NEEDED: ball pitch] |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Configuration Architecture | — | Enhanced Configuration (EPC) devices supported |