EP3SE110F1152I4 vs EP3SE110F1152C3N 对比

详细并排对比 EP3SE110F1152I4 出自 Intel 和 EP3SE110F1152C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ 最后一次采购

规格对比

参数 EP3SE110F1152I4 EP3SE110F1152C3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 最后采购期
库存状态 有库存 有库存
单价(USD) $1,020.00 $1,560.00
Family Stratix III E Stratix III E
Logic Elements (LE) 107,500 107,500
Logic Array Blocks (LABs) 4300 4,300
DSP Blocks 744 Yes (embedded multipliers)
Embedded Memory (bits) 8,936,448 —
User I/Os 744 744
封装 1152-ball FCBGA (Flip-Chip BGA) —
工作温度 -40°C to +100°C (Industrial) 0 °C to 85 °C (commercial)
Process Node 40 nm —
Maximum User I/O Speed [DATA_NEEDED: maximum I/O toggle rate MHz] —
PLLs 24 —
Configuration Modes JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) —
Memory Interface Support DDR3, DDR2, QDRII+, RLDRAM II —
Transceiver Protocol Support PCIe Gen1/Gen2, Gbit Ethernet, XAUI, Serial RapidIO —
RoHS 状态 Compliant —
Lead-Free Yes Yes (per Altera/Intel datasheet family convention)
安装类型 Surface Mount (BGA) Surface Mount
MSL 等级 [DATA_NEEDED: MSL rating] —
Series — Stratix III
Total RAM Bits — 8,936,448
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Process Technology — 65 nm TSMC
Package Type — FC-FBGA-1152 (flip-chip BGA)
Speed Grade — C3
安装方式 — SMD/SMT (Tray)
存储器类型 — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]

数据手册与资源

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