EP3SE260F1152C3N vs EP3SE260F1152I3 对比

详细并排对比 EP3SE260F1152C3N 出自 Intel 和 EP3SE260F1152I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SE260F1152C3N EP3SE260F1152I3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 Obsolete
库存状态 有库存 有库存
单价(USD) $7,500.00 $16,500.00
Series Stratix III E Stratix III E (EP3SE260)
Logic Elements / Cells 255,000 —
Embedded Memory Bits 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 —
User I/O Count 744 744
封装 1152-BBGA, FCBGA 1152-BBGA, FC-FBGA (Flip-Chip)
安装类型 Surface Mount Surface Mount
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 1.1 V
工作温度 0 C to +85 C (Commercial) -40C to +100C (Industrial)
Transceivers Integrated high-speed transceivers —
DSP Blocks Yes (dedicated multiplier/accumulator) —
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) —
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II —
Configuration Modes AS, AP, PS, FPP, JTAG —
Partial Reconfiguration Supported —
Programmable Power Technology Yes (up to 50% dynamic power reduction) —
RoHS 状态 Compliant [DATA_NEEDED: RoHS status]
Logic Elements — 255,000
Number of LABs/CLBs — 10,200
Total RAM Bits — 16,672,768
Number of Embedded Multipliers (DSP blocks) — 768
Maximum Fabric Frequency — 500 MHz
Speed Grade — I3 (Industrial, speed bin 3)
MSL 等级 — [DATA_NEEDED: MSL level]
Product Status — Obsolete (per Xecor comparator)

数据手册与资源

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