EP3SE260F1152I4LN vs EP3SE260F1152I3N 对比

详细并排对比 EP3SE260F1152I4LN 出自 Intel 和 EP3SE260F1152I3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260F1152I3N EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N ⚠ 最后一次采购

规格对比

参数 EP3SE260F1152I4LN EP3SE260F1152I3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 最后采购期
库存状态 有库存 有库存
单价(USD) $3,520.00 $3,360.00
Family Stratix III E —
Process Node 65 nm CMOS —
Logic Elements (LE) 255,000 —
Logic Array Blocks (LAB) 10,200 —
Embedded Memory Bits 16,672,640 —
User I/Os 744 —
封装 FCBGA-1152 (1517-ball) —
Package Dimensions 35 x 35 mm —
Core Voltage 0.9 V (supports 1.05-1.15 V variant) 0.9 V to 1.1 V selectable
工作温度 -40 C to +100 C (Industrial) -40C to +100C (industrial)
Operating Frequency Up to 717 MHz —
安装类型 Surface Mount Surface Mount
Supply Voltage Range 0.9 V core, 1.05 V-1.15 V supported —
Series Stratix III Stratix III E
RoHS 状态 Compliant [DATA_NEEDED: RoHS status]
Design Tool Quartus II —
Family Name — Stratix III E
Logic Elements / Cells — 255000
Logic Array Blocks (LABs) — 10200
Total RAM Bits — 16672768
Number of I/Os — 744
Number of Gates — [DATA_NEEDED: number of gates]
封装 / 外壳 — 1152-BBGA, FCBGA (FC-FBGA)
Process Technology — 65 nm CMOS
Max Internal Frequency — 500 MHz
Supplier Temperature Grade — Industrial
MSL 等级 — [DATA_NEEDED: MSL level]

数据手册与资源

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