EP3SE260F1517C2N vs EP3SE260F1517C3N 对比

详细并排对比 EP3SE260F1517C2N 出自 Intel 和 EP3SE260F1517C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260F1517C2N EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel

EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel

EP3SE260F1517C2N ⚠ 最后一次采购
Intel
EP3SE260F1517C3N EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N ⚠ 最后一次采购

规格对比

参数 EP3SE260F1517C2N EP3SE260F1517C3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $4,750.00 $9,850.00
Family Stratix III E Stratix III E
Logic Elements 255,000 254,400
Logic Array Blocks (LABs) 10,200 —
Total Memory Bits 16,672,768 —
Maximum User I/Os 976 —
Core Voltage 1.1 V —
Process Technology 65 nm 65 nm TSMC low-power CMOS
Maximum Core Frequency 600 MHz —
封装 1517-ball FC-BGA 1517-BBGA (FCBGA)
安装类型 Surface Mount Surface Mount
Operating Temperature Grade Commercial (0C to +85C) —
Configuration Interface Passive Serial, Fast Passive Parallel, JTAG, Active Serial —
Lead Free Yes —
RoHS 状态 Compliant Compliant
Speed Grade C2 C3 (commercial)
Embedded Memory — 16,672,768 bits (16.7 Mbits)
User I/Os — 976
DSP Blocks (18x18 Multipliers) — 816
M9K Memory Blocks — 1,040
Maximum Transceiver Data Rate — 600 Mbps
PLLs — 4
Global Clock Networks — 16
工作结温 — 0 C to +85 C (commercial)
External Memory Interfaces — DDR3, DDR2, QDRII+, RLDRAM2

数据手册与资源

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